정전기 방지 폼 포장 시장 예측(-2030년) : 재료별, 포장 유형별, 두께별, 최종사용자별, 지역별 세계 분석

According to Stratistics MRC, the Global Anti-Static Foam Packaging Market is accounted for $4553.90 million in 2024 and is expected to reach $7927.72 million by 2030 growing at a CAGR of 9.68% during the forecast period. Anti-static foam packaging is a specialized type of protective material designed to safeguard sensitive electronic components and devices from electrostatic discharge (ESD) during storage, handling, and transportation. In order to protect sensitive parts like circuit boards, semiconductors, and microchips from damage caused by static electricity, it is made with materials that inhibit the accumulation of static electricity.

According to the Journal of Materials Science, the development of biodegradable and recyclable anti-static foam packaging materials is gaining traction.

Market Dynamics:

Driver:

Growing consumer electronics demand

The demand for anti-static foam packaging has increased dramatically due to the growing penetration of consumer electronics, which is being driven by technological advancements and rising disposable incomes. Devices that contain extremely sensitive electronic components that are susceptible to electrostatic discharge (ESD) include smartphones, tablets, gaming consoles, smart watches, and home automation systems. Moreover, manufacturers are giving ESD-safe packaging solutions top priority in order to preserve the integrity and functionality of their products, as consumers expect high-quality, defect-free devices.

Restraint:

Expensive anti-static foam substances

The comparatively high production costs of anti-static foam packaging in comparison to conventional packaging materials are one of the main obstacles facing the market. Using conductive or dissipative additives and specific manufacturing techniques, anti-static foam stops static electricity from building up. As a result, the material becomes less appealing to cost-sensitive industries, particularly small and medium-sized businesses (SMEs), as its overall cost rises. Additionally, the use of anti-static foam may also be restricted as a result of manufacturers being pressured to cut costs due to the growing demand for sophisticated electronics worldwide.

Opportunity:

Growing use of electric cars (EVs)

The global shift to electric vehicles (EVs) has opened up new markets for packaging made of anti-static foam. Advanced electronics used in EVs, such as sensors, battery management systems, and in-car connectivity options, are all vulnerable to electrostatic discharge. The production of EVs is expected to increase rapidly as governments and consumers place a higher priority on environmentally friendly transportation, necessitating the use of anti-static foam to safeguard vital components across the supply chain. Furthermore, there are more chances for protective packaging solutions in this market due to the growth of EV battery recycling programs.

Threat:

Tough competition from other packaging substances

Alternative ESD-safe materials like conductive plastics, anti-static bubble wraps, and anti-static bags pose a serious threat to the market for anti-static foam packaging. These substitutes are frequently thought to be more affordable and adaptable, especially for uses involving smaller or lighter electronic components. Price wars brought on by this fierce competition might lower anti-static foam producers' profit margins. Additionally, consumers might switch to these substitutes, endangering anti-static foam packaging's market share even more.

Covid-19 Impact:

The COVID-19 pandemic had a major impact on the market for anti-static foam packaging, with varying effects on various industries. ESD-safe packaging solutions became necessary due to the spike in demand for electronics during periods of remote work and online learning, which accelerated market expansion. Schedules for production and delivery were complicated, though, by manufacturing halts, shortages of raw materials, and disruptions in global supply chains. However, there was a brief drop in demand at the same time due to decreased industrial activity and economic uncertainty in industries like aerospace and automotive.

The Bags segment is expected to be the largest during the forecast period

The market for anti-static foam packaging is expected to be dominated by the bags segment because of their cost-effectiveness, versatility, and extensive use in a variety of industries. When it comes to shielding delicate electronic parts from electrostatic discharge (ESD) during storage and transit, such as circuit boards, semiconductors, and hard drives, anti-static foam bags are especially well-liked. Manufacturers and suppliers prefer them because of their lightweight design, ease of customization, and capacity to offer both physical cushioning and ESD protection. Moreover, the market dominance of anti-static foam bags has been cemented by the growing demand for consumer electronics and improvements in e-commerce logistics.

The 31 mm -60 mm segment is expected to have the highest CAGR during the forecast period

Due to the expanding use in industries needing medium-density protection for larger or moderately delicate components, the 31 mm to 60 mm segment is anticipated to have the highest CAGR in the anti-static foam packaging market. This thickness range is perfect for packaging industrial equipment, automobile parts, and mid-sized electronic devices because it strikes the perfect balance between flexibility and durability. Additionally, protecting components like batteries, controllers, and sensitive sensors is becoming more popular in this market as a result of the growing demand for consumer electronics, renewable energy devices, and electric vehicles.

Region with largest share:

Due to the strong electronics manufacturing sector, especially in nations like China, Japan, South Korea, and Taiwan, the Asia Pacific region is expected to hold the largest share of the anti-static foam packaging market. Along with the fast expansion of the automotive and renewable energy industries, the region's dominance is supported by the presence of significant semiconductor and consumer electronics manufacturers. A robust export-oriented market, cost-effective production capabilities, and rising investments in advanced manufacturing technologies are further advantages for the region. Furthermore, Asia-Pacific's market leadership is cemented as the demand for anti-static foam packaging to ensure the safe transportation of electronic goods is further increased by the expanding e-commerce sector in nations like India and Southeast Asia.

Region with highest CAGR:

The market for anti-static foam packaging is anticipated to grow at the highest CAGR in the South American region. Rapid industrialization is taking place in the area, with an increasing emphasis on the production of automobiles, electronics, and e-commerce. The growth in electronic exports, especially from the consumer electronics and automotive industries, is driving up demand for anti-static foam packaging solutions in nations like Brazil and Mexico. The establishment of manufacturing hubs in the area and the use of cutting-edge packaging technologies both contribute to the market expansion for anti-static foam packaging. Additionally, the need for protective packaging solutions is being driven by growing awareness of electrostatic discharge (ESD) risks, which is helping to fuel the robust market growth in South America.

Key players in the market

Some of the key players in Anti-Static Foam Packaging market include Surmount Industries, Battle Foam Inc, UFP Technologies, Inc., Dow Inc., ACH Foam Technologies, Sealed Air Corporation, Kamatchi Packing Works, Pregis LLC., Deluxe Packaging, Inc., Bollore Group, Sonoco Products Company, Mahasach India Pvt Ltd., Polymer Packaging, Inc., Raghav Industries and NSJ Automotive Polyplastics.

Key Developments:

In December 2024, Sonoco Products Company announced that it has inked a deal with TOPPAN Holdings Inc. to sell its Thermoformed and Flexibles Packaging ("TFP") business. This move will accelerate Sonoco's portfolio optimization strategy and help it focus on core industrial paper and consumer packaging businesses.

In July 2024, UFP Technologies, Inc. announced the acquisition of AJR Enterprises, LLC, a manufacturer of single-use patient handling systems. The purchase, valued at $110 million, aims to enhance UFP's offerings in the medical market, particularly in patient surfaces and transfer devices. AJR Enterprises with a manufacturing presence in the Dominican Republic, specializes in 'cut and sew' manufacturing services and advanced fabric technologies.

In June 2024, Dow Inc. announced an agreement to acquire Circulus, a prominent recycler of plastic waste into post-consumer resin (PCR). This transaction encompasses two facilities located in Ardmore, OK, and Arab, AL, which collectively have a capacity of 50,000 metric tons per year. The acquisition is expected to close in third-quarter 2024, pending customary regulatory approval.

Materials Covered:

• Polyethylene Foam
• Polyurethane Foam
• Polystyrene Foam
• Polyvinyl Chloride Foam

Packaging Types Covered:

• Bags
• Trays
• Sheets
• Rolls
• Custom Shapes

Thicknesses Covered:

• 10 mm- 30 mm
• 31 mm -60 mm
• 61 mm- 100 mm
• Above 100 mm

End Users Covered:

• Electronic
• Aerospace & Defense
• Automotive
• Industrial Goods
• Food & Beverage
• Healthcare
• Cosmetics
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 End User Analysis
• 3.7 Emerging Markets
• 3.8 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Anti-Static Foam Packaging Market, By Material

• 5.1 Introduction
• 5.2 Polyethylene Foam
  • 5.2.1 High-Density Polyethylene (HDPE)
  • 5.2.2 Middle-Density Polyethylene (MDPE)
  • 5.2.3 Low-Density Polyethylene (LDPE)
  • 5.2.4 Linear Low-Density Polyethylene (LLDPE)
• 5.3 Polyurethane Foam
• 5.4 Polystyrene Foam
• 5.5 Polyvinyl Chloride Foam

6 Global Anti-Static Foam Packaging Market, By Packaging Type

• 6.1 Introduction
• 6.2 Bags
• 6.3 Trays
• 6.4 Sheets
• 6.5 Rolls
• 6.6 Custom Shapes

7 Global Anti-Static Foam Packaging Market, By Thickness

• 7.1 Introduction
• 7.2 10 mm- 30 mm
• 7.3 31 mm -60 mm
• 7.4 61 mm- 100 mm
• 7.5 Above 100 mm

8 Global Anti-Static Foam Packaging Market, By End User

• 8.1 Introduction
• 8.2 Electronic
• 8.3 Aerospace & Defense
• 8.4 Automotive
• 8.5 Industrial Goods
• 8.6 Food & Beverage
• 8.7 Healthcare
• 8.8 Cosmetics
• 8.9 Other End Users

9 Global Anti-Static Foam Packaging Market, By Geography

• 9.1 Introduction
• 9.2 North America
  • 9.2.1 US
  • 9.2.2 Canada
  • 9.2.3 Mexico
• 9.3 Europe
  • 9.3.1 Germany
  • 9.3.2 UK
  • 9.3.3 Italy
  • 9.3.4 France
  • 9.3.5 Spain
  • 9.3.6 Rest of Europe
• 9.4 Asia Pacific
  • 9.4.1 Japan
  • 9.4.2 China
  • 9.4.3 India
  • 9.4.4 Australia
  • 9.4.5 New Zealand
  • 9.4.6 South Korea
  • 9.4.7 Rest of Asia Pacific
• 9.5 South America
  • 9.5.1 Argentina
  • 9.5.2 Brazil
  • 9.5.3 Chile
  • 9.5.4 Rest of South America
• 9.6 Middle East & Africa
  • 9.6.1 Saudi Arabia
  • 9.6.2 UAE
  • 9.6.3 Qatar
  • 9.6.4 South Africa
  • 9.6.5 Rest of Middle East & Africa

10 Key Developments

• 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 10.2 Acquisitions & Mergers
• 10.3 New Product Launch
• 10.4 Expansions
• 10.5 Other Key Strategies

11 Company Profiling

• 11.1 Surmount Industries
• 11.2 Battle Foam Inc
• 11.3 UFP Technologies, Inc.
• 11.4 Dow Inc.
• 11.5 ACH Foam Technologies
• 11.6 Sealed Air Corporation
• 11.7 Kamatchi Packing Works
• 11.8 Pregis LLC.
• 11.9 Deluxe Packaging, Inc.
• 11.10 Bollore Group
• 11.11 Sonoco Products Company
• 11.12 Mahasach India Pvt Ltd.
• 11.13 Polymer Packaging, Inc.
• 11.14 Raghav Industries
• 11.15 NSJ Automotive Polyplastics