½ÃÀ庸°í¼­
»óǰÄÚµå
1662836

¼¼°èÀÇ I/O Ä¿³ØÅÍ ½ÃÀå ¿¹Ãø(-2030³â) : Á¦Ç°, À¯Çü, µ¥ÀÌÅÍ Àü¼Û ¼Óµµ, ÃÖÁ¾ »ç¿ëÀÚ, Áö¿ªº° ºÐ¼®

I/O Connector Market Forecasts to 2030 - Global Analysis by Product (USB Connectors, HDMI Connectors, D-Sub Connectors, RJ45 Connectors (Ethernet Connectors) and RF Coaxial Connectors), Type, Data Transmit Speed, End User and By Geography

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: Stratistics Market Research Consulting | ÆäÀÌÁö Á¤º¸: ¿µ¹® 200+ Pages | ¹è¼Û¾È³» : 2-3ÀÏ (¿µ¾÷ÀÏ ±âÁØ)

    
    
    



¡Ø º» »óǰÀº ¿µ¹® ÀÚ·á·Î Çѱ۰ú ¿µ¹® ¸ñÂ÷¿¡ ºÒÀÏÄ¡ÇÏ´Â ³»¿ëÀÌ ÀÖÀ» °æ¿ì ¿µ¹®À» ¿ì¼±ÇÕ´Ï´Ù. Á¤È®ÇÑ °ËÅ並 À§ÇØ ¿µ¹® ¸ñÂ÷¸¦ Âü°íÇØÁֽñ⠹ٶø´Ï´Ù.

Stratistics MRC¿¡ µû¸£¸é ¼¼°èÀÇ I/O Ä¿³ØÅÍ ½ÃÀåÀº 2024³â 76¾ï ´Þ·¯ ±Ô¸ðÀ̸ç, ¿¹Ãø ±â°£ µ¿¾È 11.9%ÀÇ ¿¬Æò±Õ ¼ºÀå·ü·Î 2030³â¿¡´Â 149¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î Àü¸ÁµË´Ï´Ù.

I/O(ÀÔÃâ·Â) Ä¿³ØÅÍ´Â Àü¿ø, µ¥ÀÌÅÍ ¶Ç´Â ½ÅÈ£¸¦ Àü¼ÛÇÏ¿© ÀüÀÚ ÀåÄ¡ °£ÀÇ Åë½ÅÀ» ¿ëÀÌÇÏ°Ô ÇÏ´Â Çϵå¿þ¾î ÀÎÅÍÆäÀ̽ºÀÔ´Ï´Ù. ÄÄÇ»ÅÍ, »ê¾÷ Àåºñ, °¡ÀüÁ¦Ç°, ÀÚµ¿Â÷ ½Ã½ºÅÛ¿¡¼­ ³»ºÎ ±¸¼º ¿ä¼Ò¿Í ¿ÜºÎ ±¸¼º ¿ä¼Ò »çÀÌÀÇ ´Ù¸® ¿ªÇÒÀ» ÇÕ´Ï´Ù. I/O Ä¿³ØÅÍ´Â USB, HDMI, ÀÌ´õ³Ý, Á÷·Ä Ä¿³ØÅÍ µî ´Ù¾çÇÑ À¯ÇüÀ¸·Î Á¦°øµÇ¸ç, °¢ Ä¿³ØÅʹ ƯÁ¤ µ¥ÀÌÅÍ Àü¼Û ¿ä±¸ »çÇ׿¡ ¸Â°Ô ¼³°èµÇ¾ú½À´Ï´Ù. ÀÌ·¯ÇÑ Ä¿³ØÅÍ´Â ¾ÈÁ¤ÀûÀÎ ¿¬°á, ½ÅÈ£ ¹«°á¼º ¹× ÀåÄ¡ °£ ȣȯ¼ºÀ» º¸ÀåÇÕ´Ï´Ù.

°í¼Ó µ¥ÀÌÅÍ Àü¼Û ¼ö¿ä Áõ°¡

°í¼Ó µ¥ÀÌÅÍ Àü¼Û¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϸ鼭 I/O ¿¬°á ½ÃÀåÀÇ Çõ½ÅÀÌ ÃËÁøµÇ°í ÀÖÀ¸¸ç, ±× °á°ú °íÁÖÆÄ, ÀúÁö¿¬, °í´ë¿ªÆøÀÇ Ä¿³ØÅͰ¡ ź»ýÇϰí ÀÖ½À´Ï´Ù. ¼ÒºñÀÚ °¡Àü, µ¥ÀÌÅÍ ¼¾ÅÍ, Åë½Å µîÀÇ »ê¾÷¿¡¼­´Â ´õ ºü¸¥ µ¥ÀÌÅÍ ¼Óµµ¸¦ ±¸ÇöÇϱâ À§ÇØ USB-C, Thunderbolt, ±¤¼¶À¯ ÀÎÅÍÆäÀ̽º¿Í °°Àº °í±Þ Ä¿³ØÅͰ¡ ÇÊ¿äÇÕ´Ï´Ù. Ä¿³ØÅÍ ¼³°èÀÇ ¼ÒÇüÈ­, ½ÅÈ£ ¹«°á¼º Çâ»ó, ³»±¸¼º °­È­´Â ÀÌ·¯ÇÑ ¼ö¿ä¿¡ ÈûÀÔ¾î ½ÃÀå È®´ë¿Í ±â¼ú ¹ßÀüÀ» ´õ¿í ÃËÁøÇϰí ÀÖ½À´Ï´Ù.

³ôÀº Á¦Á¶ ºñ¿ë

³ôÀº Á¦Á¶ ºñ¿ëÀº Á¦Ç° °¡°ÝÀ» ÀλóÇϰí ÀÌÀ±À» ³·Ãß¸ç °æÀï·ÂÀ» Á¦ÇÑÇÔÀ¸·Î½á ½ÃÀå¿¡ ¾Ç¿µÇâÀ» ¹ÌĨ´Ï´Ù. °ªºñ½Ñ ¿øÀÚÀç, Á¤±³ÇÑ »ý»ê ±â¼ú, ±î´Ù·Î¿î ǰÁú ¿ä°ÇÀº ¼Ò±Ô¸ð »ý»ê¾÷üÀÇ ½ÃÀå ÁøÀÔÀ» ¹æÇØÇÕ´Ï´Ù. ƯÈ÷ °¡ÀüÁ¦Ç°°ú °°ÀÌ °¡°Ý¿¡ ¹Î°¨ÇÑ ºÐ¾ß¿¡¼­´Â ³ôÀº ºñ¿ëÀ¸·Î ÀÎÇØ Çõ½Å°ú µµÀÔÀÌ ´õµ®Áý´Ï´Ù. ÀÌ´Â ¼ö¿ä °¨¼Ò¿Í °ø±Þ¸Á Á¦ÇÑÀ¸·Î À̾îÁ® ÀüüÀûÀÎ ½ÃÀå È®´ë¸¦ ÀúÇØÇÒ ¼ö ÀÖ½À´Ï´Ù.

¼ÒºñÀÚ °¡Àü ºÐ¾ßÀÇ ¼ºÀå

½º¸¶Æ®Æù, ³ëÆ®ºÏ ÄÄÇ»ÅÍ, °ÔÀÓ ÄܼÖ, ½º¸¶Æ® Ȩ ±â±â µî ¼ÒºñÀÚ °¡ÀüÁ¦Ç°ÀÇ ºü¸¥ È®ÀåÀ¸·Î ÀÎÇØ I/O Ä¿³ØÅÍ¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ±â±âÀÇ ¼ÒÇüÈ­ ¹× ´Ù±â´ÉÈ­ Áõ°¡·Î ÀÎÇØ USB-C, HDMI, Thunderbolt¿Í °°Àº °í±Þ Ä¿³ØÅͰ¡ ÇÊ¿äÇÕ´Ï´Ù. IoT, 5G, AI ±â¹Ý Á¦Ç°ÀÇ »ç¿ë Áõ°¡·Î ÀÎÇØ ½ÃÀåÀÌ È®´ëµÇ°í ÀÖ½À´Ï´Ù. ¶ÇÇÑ Ä¿³ØÅÍ ±â¼úÀÇ Çõ½ÅÀ» ÃËÁøÇÏ´Â ¹«¼± ÃæÀü ¹× ¼ÒÇü µðÀÚÀÎ Æ®·»µå·Î ÀÎÇØ ½ÃÀåÀº ±Ô¸ð, ¸ÂÃãÈ­, ±â¼ú °³¹ß Ãø¸é¿¡¼­ ¼ºÀåÇϰí ÀÖ½À´Ï´Ù.

ȣȯ¼º ¹× Ç¥ÁØÈ­ ¹®Á¦

ȣȯ¼º ¹× Ç¥ÁØÈ­ ¹®Á¦´Â µð¹ÙÀ̽º »óÈ£ ¿î¿ë¼ºÀ» Á¦ÇÑÇÏ°í ¼³°è º¹À⼺À» ³ôÀ̸ç Á¦Á¶¾÷ü¿Í °í°´ ¸ðµÎÀÇ ºñ¿ëÀ» Áõ°¡½ÃÄÑ ½ÃÀå ¼ºÀåÀ» ÀúÇØÇÕ´Ï´Ù. ±â¾÷µéÀº ¹ü¿ë Ç¥ÁØÀÇ ºÎÀç·Î ÀÎÇÑ ÆÄÆíÈ­·Î ÀÎÇØ ¿©·¯ Ä¿³ØÅÍ ¹öÀüÀ» Á¦Á¶ÇÒ ¼ö¹Û¿¡ ¾ø½À´Ï´Ù. ÄÄÇ»ÆÃ, Åë½Å, ÀÚµ¿Â÷ µîÀÇ ºÐ¾ß¿¡¼­ ÀÌ´Â Çõ½ÅÀ» ÀúÇØÇÏ°í °ø±Þ¸ÁÀ» ´õ¿í ¾î·Æ°Ô ¸¸µé¸ç ÅëÇÕÀ» ´õ¿í ¾î·Æ°Ô ¸¸µé¾î °á±¹ ½ÃÀå È®ÀåÀ» Á¦ÇÑÇÕ´Ï´Ù.

COVID-19ÀÇ ¿µÇâ

Äڷγª19 ÆÒµ¥¹ÍÀº °ø±Þ¸Á ¹®Á¦, °øÀå °¡µ¿ Áß´Ü, »ê¾÷ »ý»ê °¨¼Ò·Î ÀÎÇØ I/O Ä¿³ØÅÍ ½ÃÀåÀ» È¥¶õ¿¡ ºü¶ß·È½À´Ï´Ù. ±×·¯³ª ¿ø°Ý ±Ù¹«¿Í µðÁöÅÐÈ­·Î ÀÎÇØ Åë½Å, ÀÇ·á, µ¥ÀÌÅÍ ¼¾ÅÍ¿Í °°Àº ºÐ¾ß¿¡¼­´Â ¼ö¿ä°¡ ±ÞÁõÇß½À´Ï´Ù. ÀÚµ¿Â÷ ¹× °¡ÀüÁ¦Ç° ½ÃÀåÀº óÀ½¿¡´Â Ç϶ô¼¼¸¦ º¸¿´Áö¸¸ °æÁ¦°¡ Àç°³µÇ¸é¼­ ȸº¹¼¼¸¦ º¸¿´½À´Ï´Ù. ÀÌ À§±â´Â ÀÚµ¿È­, IoT, °í¼Ó ¿¬°á¿¡ ´ëÇÑ ÅõÀÚ¸¦ °¡¼ÓÈ­ÇÏ¿© ´Ü±âÀûÀΠȥ¶õ¿¡µµ ºÒ±¸Çϰí Àå±âÀûÀÎ ¼ºÀåÀ» À̲ø¾ú½À´Ï´Ù.

¿¹Ãø ±â°£ µ¿¾È ¿øÇü Ä¿³ØÅÍ ºÎ¹®ÀÌ ÃÖ´ë°¡ µÉ Àü¸Á

¿øÇü Ä¿³ØÅÍ ºÎ¹®Àº ¶Ù¾î³­ ³»±¸¼º, EMI Â÷Æó ¹× ¿­¾ÇÇÑ È¯°æ¿¡ ´ëÇÑ ³»¼ºÀ» Á¦°øÇÏ¿© Ç×°ø¿ìÁÖ, ¹æÀ§, »ê¾÷ ÀÚµ¿È­ ¹× ÀÇ·á ¾ÖÇø®ÄÉÀ̼ǿ¡ ÀÌ»óÀûÀ̹ǷΠ¿¹Ãø ±â°£ µ¿¾È °¡Àå Å« ½ÃÀå Á¡À¯À²À» Â÷ÁöÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. Àü·Â, ½ÅÈ£ ¹× µ¥ÀÌÅ͸¦ Àü¼ÛÇÏ´Â µ¥ ÀÖ¾î ´Ù¾çÇÑ ±â´ÉÀ» °®Ãß°í ÀÖ¾î ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ¼ÒÇüÈ­ ¹× °í¼Ó ¿¬°áÀÇ ¹ßÀüÀº äÅÃÀ» ´õ¿í ÃËÁøÇÕ´Ï´Ù. ¾÷°è¿¡¼­ ½Å·Ú¼º°ú È¿À²¼ºÀ» ¿ì¼±½ÃÇÔ¿¡ µû¶ó ¿øÇü Ä¿³ØÅÍ´Â ½ÃÀå È®´ë¿¡ ÇÙ½ÉÀûÀÎ ¿ªÇÒÀ» Çϰí ÀÖ½À´Ï´Ù.

ÀÇ·á ¹× ÀÇ·á ±â±â ºÎ¹®Àº ¿¹Ãø ±â°£ µ¿¾È °¡Àå ³ôÀº CAGRÀ» º¸ÀÏ °ÍÀ¸·Î Àü¸Á

¿¹Ãø ±â°£ µ¿¾È ÀÇ·á ¹× ÀÇ·á ±â±â ºÎ¹®Àº Áø´Ü Àåºñ, À̹Ì¡ ½Ã½ºÅÛ ¹× ¼ö¼ú ±â±âÀÇ ¾ÈÁ¤ÀûÀÎ °í¼º´É Ä¿³ØÅÍ¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡·Î ÀÎÇØ °¡Àå ³ôÀº ¼ºÀå·üÀ» º¸ÀÏ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ¿ø°Ý ÀÇ·á, ¿þ¾î·¯ºí ÀÇ·á ±â±â, ÷´Ü ÀÇ·á ¿µ»óÀÌ ºÎ»óÇϸ鼭 ¼ÒÇüÈ­, °í¼Ó, ³»±¸¼ºÀÌ ¶Ù¾î³­ Ä¿³ØÅÍ¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ¸ê±Õ ¹× »ýü ÀûÇÕ¼º¿¡ ´ëÇÑ ±ÔÁ¦ ¿ä°Çµµ Ä¿³ØÅÍ ¼³°è¿¡ ¿µÇâÀ» ¹ÌĨ´Ï´Ù. ÀÇ·á ±â¼úÀÌ ¹ßÀüÇÔ¿¡ µû¶ó Ư¼ö I/O Ä¿³ØÅÍ¿¡ ´ëÇÑ ¼ö¿ä°¡ °è¼Ó Áõ°¡ÇÏ¿© ½ÃÀå È®´ë¿Í Çõ½Å¿¡ ¹ÚÂ÷¸¦ °¡Çϰí ÀÖ½À´Ï´Ù.

ÃÖ´ë Á¡À¯À² Áö¿ª

¿¹Ãø ±â°£ µ¿¾È ¾Æ½Ã¾ÆÅÂÆò¾ç Áö¿ªÀº IoT, 5G ³×Æ®¿öÅ© ¹× Àü±â ÀÚµ¿Â÷ÀÇ Ã¤Åà Áõ°¡·Î ÀÎÇØ ½ÃÀå È®´ë°¡ ´õ¿í °¡¼ÓÈ­µÇ¾î °¡Àå Å« ½ÃÀå Á¡À¯À²À» Â÷ÁöÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. Áß±¹, Àεµ, ÀϺ»ÀÇ Á¦Á¶ Ȱµ¿ Áõ°¡·Î Ä¿³ØÅÍ »ý»ê·®ÀÌ Áõ°¡ÇÕ´Ï´Ù. ¶ÇÇÑ AI ¹× Ŭ¶ó¿ìµå ÄÄÇ»ÆÃÀ» À§ÇÑ ¼ÒÇü °í¼Ó Ä¿³ØÅÍÀÇ ¹ßÀüµµ ½ÃÀå ¼ºÀåÀ» ÃËÁøÇÕ´Ï´Ù. µðÁöÅÐÈ­ ¹× ½º¸¶Æ® ÀÎÇÁ¶ó °³¹ßÀ» Áö¿øÇÏ´Â Á¤ºÎ ÀÌ´Ï¼ÅÆ¼ºê´Â ½Å·ÚÇÒ ¼ö ÀÖ´Â °í¼º´É I/O Ä¿³ØÅÍ¿¡ ´ëÇÑ ¼ö¿ä¸¦ ´õ¿í ÃËÁøÇÕ´Ï´Ù.

CAGRÀÌ °¡Àå ³ôÀº Áö¿ª

¿¹Ãø ±â°£ µ¿¾È ºÏ¹Ì Áö¿ªÀº °¡ÀüÁ¦Ç°ÀÇ ¹ßÀüÀ¸·Î ÀÎÇØ °¡Àå ³ôÀº CAGRÀ» º¸ÀÏ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ÀÚµ¿Â÷ ÀüÀÚÁ¦Ç°, Ç×°ø¿ìÁÖ ¹× Åë½Å ºÎ¹®ÀÇ ¼ºÀåÀº ¼ö¿ä¸¦ ´õ¿í ÃËÁøÇÕ´Ï´Ù. µ¥ÀÌÅÍ ¼¾ÅÍ¿Í IoT ¾ÖÇø®ÄÉÀ̼ÇÀÇ È®Àåµµ ½ÃÀå ±âȸ¸¦ ³ôÀ̰í ÀÖ½À´Ï´Ù. ¶ÇÇÑ ¼ÒÇüÈ­ ¹× ³»±¸¼º °­È­¿Í °°Àº ¾ö°ÝÇÑ »ê¾÷ Ç¥Áذú ±â¼ú Çõ½ÅÀÌ ½ÃÀå Æ®·»µå¸¦ Çü¼ºÇϰí ÀÖ½À´Ï´Ù.

¹«·á ¸ÂÃãÇü ¼­ºñ½º

ÀÌ º¸°í¼­ÀÇ ¸ðµç °í°´¿¡°Ô´Â ´ÙÀ½ ¹«·á »ç¿ëÀÚ ÁöÁ¤ ¿É¼Ç Áß Çϳª¸¦ ¹ÞÀ» ¼ö ÀÖ´Â ÀÚ°ÝÀÌ ÁÖ¾îÁý´Ï´Ù

  • ±â¾÷ ÇÁ·ÎÆÄÀÏ
    • Ãß°¡ ½ÃÀå ÁøÃâ±â¾÷ÀÇ Á¾ÇÕÀû ÇÁ·ÎÆÄÀϸµ(ÃÖ´ë 3°³»ç)
    • ÁÖ¿ä ±â¾÷ÀÇ SWOT ºÐ¼®(ÃÖ´ë 3°³»ç)
  • Áö¿ª ¼¼ºÐÈ­
    • °í°´ÀÇ °ü½É¿¡ ÀÀÇÑ ÁÖ¿ä±¹ ½ÃÀå ÃßÁ¤, ¿¹Ãø ¹× CAGR(Ÿ´ç¼º È®Àο¡ µû¸§)
  • °æÀï º¥Ä¡¸¶Å·
    • Á¦Ç° Æ÷Æ®Æú¸®¿À, Áö¸®Àû Á¸Àç, Àü·«Àû Á¦ÈÞ¸¦ ÅëÇÑ ÁÖ¿ä ±â¾÷ º¥Ä¡¸¶Å·

¸ñÂ÷

Á¦1Àå ÁÖ¿ä ¿ä¾à

Á¦2Àå ¼­¹®

  • °³¿ä
  • ÀÌÇØ°ü°èÀÚ
  • Á¶»ç ¹üÀ§
  • Á¶»ç ¹æ¹ý
    • µ¥ÀÌÅÍ ¸¶ÀÌ´×
    • µ¥ÀÌÅÍ ºÐ¼®
    • µ¥ÀÌÅÍ °ËÁõ
    • Á¶»ç Á¢±Ù
  • Á¶»ç Ãâó
    • 1Â÷ Á¶»ç Ãâó
    • 2Â÷ Á¶»ç Ãâó
    • ÀüÁ¦ Á¶°Ç

Á¦3Àå ½ÃÀå µ¿Ç⠺м®

  • ¼Ò°³
  • ¼ºÀå ÃËÁø¿äÀÎ
  • ¾ïÁ¦¿äÀÎ
  • ±âȸ
  • À§Çù
  • Á¦Ç°ºÐ¼®
  • ÃÖÁ¾ »ç¿ëÀÚ ºÐ¼®
  • ½ÅÈï ½ÃÀå
  • COVID-19ÀÇ ¿µÇâ

Á¦4Àå Porter's Five Forces ºÐ¼®

  • °ø±Þ±â¾÷ÀÇ Çù»ó·Â
  • ±¸¸ÅÀÚÀÇ Çù»ó·Â
  • ´ëüǰÀÇ À§Çù
  • ½Å±Ô Âü°¡¾÷üÀÇ À§Çù
  • °æÀï ±â¾÷°£ °æÀï °ü°è

Á¦5Àå ¼¼°èÀÇ I/O Ä¿³ØÅÍ ½ÃÀå : Á¦Ç°º°

  • ¼Ò°³
  • USB Ä¿³ØÅÍ
  • HDMI Ä¿³ØÅÍ
  • D-Sub Ä¿³ØÅÍ
  • RJ45 Ä¿³ØÅÍ(ÀÌ´õ³Ý Ä¿³ØÅÍ)
  • ¿Àµð¿À/ºñµð¿À Ä¿³ØÅÍ(RCA, XLR, 3.5mm Àè)
  • ±¤¼¶À¯ Ä¿³ØÅÍ
  • Àü¿ø Ä¿³ØÅÍ
  • RF µ¿Ãà Ä¿³ØÅÍ

Á¦6Àå ¼¼°èÀÇ I/O Ä¿³ØÅÍ ½ÃÀå : À¯Çüº°

  • ¼Ò°³
  • ±âÆÇ °£ Ä¿³ØÅÍ
  • Àü¼± ±âÆÇ °£ Ä¿³ØÅÍ
  • Àü¼± °£ Ä¿³ØÅÍ
  • ¿øÇü Ä¿³ØÅÍ
  • Á÷»ç°¢Çü Ä¿³ØÅÍ
  • ¿§Áö Ä«µå Ä¿³ØÅÍ

Á¦7Àå ¼¼°èÀÇ I/O Ä¿³ØÅÍ ½ÃÀå : µ¥ÀÌÅÍ Àü¼Û ¼Óµµº°

  • ¼Ò°³
  • 1.5Mbit/ÃÊ
  • 12Mbit/ÃÊ
  • 60Mbit/ÃÊ
  • 480Mbit/ÃÊ
  • 60Mbit/ÃÊ
  • 5Gbit/ÃÊ ÀÌ»ó

Á¦8Àå ¼¼°èÀÇ I/O Ä¿³ØÅÍ ½ÃÀå : ÃÖÁ¾ »ç¿ëÀÚº°

  • ¼Ò°³
  • IT ¹× Åë½Å
  • ÀÚµ¿Â÷ ¹× ¿î¼Û
  • ÀÇ·á ¹× ÀÇ·á±â±â
  • ¼ÒºñÀÚ °¡Àü
  • »ê¾÷ ¹× Á¦Á¶
  • Ç×°ø¿ìÁÖ ¹× ¹æÀ§
  • ¿¡³ÊÁö ¹× Àü·Â
  • ±âŸ

Á¦9Àå ¼¼°èÀÇ I/O Ä¿³ØÅÍ ½ÃÀå : Áö¿ªº°

  • ¼Ò°³
  • ºÏ¹Ì
    • ¹Ì±¹
    • ij³ª´Ù
    • ¸ß½ÃÄÚ
  • À¯·´
    • µ¶ÀÏ
    • ¿µ±¹
    • ÀÌÅ»¸®¾Æ
    • ÇÁ¶û½º
    • ½ºÆäÀÎ
    • ±âŸ À¯·´
  • ¾Æ½Ã¾ÆÅÂÆò¾ç
    • ÀϺ»
    • Áß±¹
    • Àεµ
    • È£ÁÖ
    • ´ºÁú·£µå
    • Çѱ¹
    • ±âŸ ¾Æ½Ã¾ÆÅÂÆò¾ç
  • ³²¹Ì
    • ¾Æ¸£ÇîÆ¼³ª
    • ºê¶óÁú
    • Ä¥·¹
    • ±âŸ ³²¹Ì
  • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«
    • »ç¿ìµð¾Æ¶óºñ¾Æ
    • ¾Æ¶ø¿¡¹Ì¸®Æ®(UAE)
    • īŸ¸£
    • ³²¾ÆÇÁ¸®Ä«
    • ±âŸ Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«

Á¦10Àå ÁÖ¿ä °³¹ß

  • °è¾à, ÆÄÆ®³Ê½Ê, Çù¾÷, ÇÕÀÛÅõÀÚ(JV)
  • Àμö¿Í ÇÕº´
  • ½ÅÁ¦Ç° ¹ß¸Å
  • »ç¾÷ È®´ë
  • ±âŸ ÁÖ¿ä Àü·«

Á¦11Àå ±â¾÷ ÇÁ·ÎÆÄÀϸµ

  • 3M
  • Amphenol Corporation
  • AVX Corporation
  • Control Technology Inc.
  • Cvilux Corporation
  • FCI Electronics
  • Halytech
  • HARTING Technology Group
  • Hirose Electric Co., Ltd.
  • Japan Aviation Electronics Industry, Ltd.
  • Laird Technologies
  • Meritec
  • Molex LLC
  • Moxa Inc.
  • OMRON Corporation
  • Royal DSM
  • SilverStone Technology Co., Ltd.
  • TE Connectivity
  • WERNER WIRTH GmbH
HBR 25.03.25

According to Stratistics MRC, the Global I/O Connector Market is accounted for $7.6 billion in 2024 and is expected to reach $14.9 billion by 2030 growing at a CAGR of 11.9% during the forecast period. An I/O (Input/Output) Connector is a hardware interface that facilitates communication between electronic devices by transmitting power, data, or signals. It serves as a bridge between internal and external components in computers, industrial equipment, consumer electronics, and automotive systems. I/O connectors come in various types, including USB, HDMI, Ethernet, and serial connectors, each designed for specific data transmission needs. They ensure reliable connectivity, signal integrity, and compatibility between devices.

Market Dynamics:

Driver:

Rising Demand for High-Speed Data Transmission

The growing demand for high-speed data transmission is pushing innovation in the I/O connection market, resulting in the creation of connectors with high frequency, low latency, and high bandwidth. Advanced connectors like USB-C, Thunderbolt, and fiber-optic interfaces are necessary for industries including consumer electronics, data centers, and telecommunications to enable greater data speeds. Miniaturization, improved signal integrity, and durability in connector designs are being driven by this demand, further propelling market expansion and technological advancements.

Restraint:

High Manufacturing Costs

High production costs have a detrimental influence on the market by raising product prices, lowering profit margins, and limiting competitiveness. Costly raw materials, sophisticated production techniques, and exacting quality requirements deter small producers from entering the market. Innovation and uptake are also slowed by higher costs, especially in price-sensitive sectors like consumer electronics. This may result in diminished demand and supply chain limitations, which would hinder market expansion as a whole.

Opportunity:

Growth in Consumer Electronics

The fast expansion of consumer electronics, such as smartphones, laptop computers, gaming consoles, and smart home devices, is boosting demand for I/O connectors. Advanced connectors like USB-C, HDMI, and Thunderbolt are necessary due to the growing miniaturization of devices and increased multifunctionality. The market is expanding as a result of growing usage of IoT, 5G, and AI-powered products. Furthermore, the market is growing in terms of volume, customisation, and technological developments due to trends in wireless charging and small designs that spur innovation in connector technology.

Threat:

Compatibility & Standardization Issues

Compatibility and standardization difficulties impede market growth by limiting device interoperability, increasing design complexity, and rising costs for both makers and customers. Companies are forced to manufacture several connector versions due to fragmentation caused by the absence of universal standards. In sectors like computing, telecommunications, and automobiles, this hinders innovation, makes supply chains more difficult, and makes integration more difficult, all of which eventually limit market expansion.

Covid-19 Impact:

The COVID-19 pandemic disrupted the I/O Connector Market through supply chain challenges, factory shutdowns, and reduced industrial production. However, demand surged in sectors like telecommunications, healthcare, and data centers due to remote work and digitalization. Automotive and consumer electronics markets initially declined but recovered as economies reopened. The crisis accelerated investments in automation, IoT, and high-speed connectivity, driving long-term growth despite short-term disruptions.

The circular connectors segment is expected to be the largest during the forecast period

The circular connectors segment is expected to account for the largest market share during the forecast period as these connectors offer superior durability, EMI shielding, and resistance to harsh environments, making them ideal for aerospace, defense, industrial automation, and medical applications. Their versatility in transmitting power, signals, and data enhances demand. Advancements in miniaturization and high-speed connectivity further boost adoption. As industries prioritize reliability and efficiency, circular connectors play a key role in shaping market expansion.

The healthcare & medical devices segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the healthcare & medical devices segment is predicted to witness the highest growth rate due to increasing demand for reliable, high-performance connectors in diagnostic equipment, imaging systems and surgical instruments. The rise of telemedicine, wearable health devices, and advanced medical imaging boosts the need for miniaturized, high-speed, and durable connectors. Regulatory requirements for sterilization and biocompatibility also influence connector designs. As healthcare technology advances, the demand for specialized I/O connectors continues to grow, fueling market expansion and innovation.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share because of rising adoption of IoT, 5G networks, and electric vehicles further accelerates market expansion. Increasing manufacturing activities in China, India, and Japan boost connector production. Additionally, advancements in miniaturized, high-speed connectors for AI and cloud computing enhance market growth. Government initiatives supporting digitalization and smart infrastructure development further propel demand for reliable, high-performance I/O connectors.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR owing to advancements in consumer electronics. Growth in automotive electronics, aerospace, and telecommunications sectors further fuels demand. The expansion of data centers and IoT applications also boosts market opportunities. Additionally, stringent industry standards and technological innovations, such as miniaturization and enhanced durability, shape market trends.

Key players in the market

Some of the key players in I/O Connector Market include 3M, Amphenol Corporation, AVX Corporation, Control Technology Inc., Cvilux Corporation, FCI Electronics, Halytech, HARTING Technology Group, Hirose Electric Co., Ltd., Japan Aviation Electronics Industry, Ltd., Laird Technologies, Meritec, Molex LLC, Moxa Inc., OMRON Corporation, Royal DSM, SilverStone Technology Co., Ltd., TE Connectivity and WERNER WIRTH GmbH.

Key Developments:

In December 2024, 3M and US Conec Ltd. announced a strategic licensing agreement for 3M Expanded Beam Optical Interconnect technology, a solution to meet the performance and scalability needs of next-generation data centers and advanced network architectures.

In March 2024, 3M and HD Hyundai Korea Shipbuilding & Marine Engineering (KSOE) announced a joint research project to develop large liquid hydrogen storage tanks utilizing 3M's Glass Bubbles.

In March 2023, 3M expanded its ongoing commitment to materials science-based climate tech solutions by working with BC-based Svante Technologies, Inc. (Svante) to develop material that can trap carbon dioxide (CO2) found in the atmosphere and permanently remove it.

Products Covered:

  • USB Connectors
  • HDMI Connectors
  • D-Sub Connectors
  • RJ45 Connectors (Ethernet Connectors)
  • Audio/Video Connectors (RCA, XLR, 3.5mm Jack)
  • Fiber Optic Connectors
  • Power Connectors
  • RF Coaxial Connectors

Types Covered:

  • Board-to-Board Connectors
  • Wire-to-Board Connectors
  • Wire-to-Wire Connectors
  • Circular Connectors
  • Rectangular Connectors
  • Edge Card Connectors

Data Transmit Speeds Covered:

  • 1.5 Mbit/S
  • 12Mbit/S
  • 60 Mbit/S
  • 480 Mbit/S
  • 60 Mb/S
  • 5 Gbit/S and Above

End Users Covered:

  • IT & Telecommunications
  • Automotive & Transportation
  • Healthcare & Medical Devices
  • Consumer Electronics
  • Industrial & Manufacturing
  • Aerospace & Defense
  • Energy & Power
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global I/O Connector Market, By Product

  • 5.1 Introduction
  • 5.2 USB Connectors
  • 5.3 HDMI Connectors
  • 5.4 D-Sub Connectors
  • 5.5 RJ45 Connectors (Ethernet Connectors)
  • 5.6 Audio/Video Connectors (RCA, XLR, 3.5mm Jack)
  • 5.7 Fiber Optic Connectors
  • 5.8 Power Connectors
  • 5.9 RF Coaxial Connectors

6 Global I/O Connector Market, By Type

  • 6.1 Introduction
  • 6.2 Board-to-Board Connectors
  • 6.3 Wire-to-Board Connectors
  • 6.4 Wire-to-Wire Connectors
  • 6.5 Circular Connectors
  • 6.6 Rectangular Connectors
  • 6.7 Edge Card Connectors

7 Global I/O Connector Market, By Data Transmit Speed

  • 7.1 Introduction
  • 7.2 1.5 Mbit/S
  • 7.3 12Mbit/S
  • 7.4 60 Mbit/S
  • 7.5 480 Mbit/S
  • 7.6 60 Mb/S
  • 7.7 5 Gbit/S and Above

8 Global I/O Connector Market, By End User

  • 8.1 Introduction
  • 8.2 IT & Telecommunications
  • 8.3 Automotive & Transportation
  • 8.4 Healthcare & Medical Devices
  • 8.5 Consumer Electronics
  • 8.6 Industrial & Manufacturing
  • 8.7 Aerospace & Defense
  • 8.8 Energy & Power
  • 8.9 Other End Users

9 Global I/O Connector Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 3M
  • 11.2 Amphenol Corporation
  • 11.3 AVX Corporation
  • 11.4 Control Technology Inc.
  • 11.5 Cvilux Corporation
  • 11.6 FCI Electronics
  • 11.7 Halytech
  • 11.8 HARTING Technology Group
  • 11.9 Hirose Electric Co., Ltd.
  • 11.10 Japan Aviation Electronics Industry, Ltd.
  • 11.11 Laird Technologies
  • 11.12 Meritec
  • 11.13 Molex LLC
  • 11.14 Moxa Inc.
  • 11.15 OMRON Corporation
  • 11.16 Royal DSM
  • 11.17 SilverStone Technology Co., Ltd.
  • 11.18 TE Connectivity
  • 11.19 WERNER WIRTH GmbH
ºñ±³¸®½ºÆ®
0 °ÇÀÇ »óǰÀ» ¼±Åà Áß
»óǰ ºñ±³Çϱâ
Àüü»èÁ¦