½ÃÀ庸°í¼­
»óǰÄÚµå
1803120

¼¼°èÀÇ Ç÷º¼­ºí ÀüÀÚÀç·á ½ÃÀå ¿¹Ãø(-2032³â) : Àç·áº°, ¿ëµµº°, ÃÖÁ¾»ç¿ëÀÚº°, Áö¿ªº° ºÐ¼®

Flexible Electronics Materials Market Forecasts to 2032 - Global Analysis By Material (Conductors, Substrates, Dielectric Materials and Encapsulation Materials), Application, End User and By Geography

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: Stratistics Market Research Consulting | ÆäÀÌÁö Á¤º¸: ¿µ¹® 200+ Pages | ¹è¼Û¾È³» : 2-3ÀÏ (¿µ¾÷ÀÏ ±âÁØ)

    
    
    



¡Ø º» »óǰÀº ¿µ¹® ÀÚ·á·Î Çѱ۰ú ¿µ¹® ¸ñÂ÷¿¡ ºÒÀÏÄ¡ÇÏ´Â ³»¿ëÀÌ ÀÖÀ» °æ¿ì ¿µ¹®À» ¿ì¼±ÇÕ´Ï´Ù. Á¤È®ÇÑ °ËÅ並 À§ÇØ ¿µ¹® ¸ñÂ÷¸¦ Âü°íÇØÁֽñ⠹ٶø´Ï´Ù.

Stratistics MRC¿¡ µû¸£¸é ¼¼°èÀÇ Ç÷º¼­ºí ÀüÀÚÀç·á ½ÃÀåÀº 2025³â¿¡ 434¾ï 4,000¸¸ ´Þ·¯¸¦ Â÷ÁöÇϰí, ¿¹Ãø ±â°£ µ¿¾È CAGR 10.01%·Î ¼ºÀåÇÏ¿© 2032³â¿¡´Â 847¾ï 1,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

Ç÷º¼­ºí ÀüÀÚÀç·á´Â ¼º´É ÀúÇÏ ¾øÀÌ °¡º±°í ±¸ºÎ¸®°Å³ª ´Ã¸± ¼ö ÀÖÀ¸¸ç, ´Ù¾çÇÑ ÇüÅ¿¡ ÀûÀÀÇÒ ¼ö ÀÖ´Â ÀüÀÚ±â±â¸¦ °³¹ßÇÒ ¼ö ÀÖµµ·Ï °í¾ÈµÈ ÷´Ü Àç·á±ºÀ» ¸»ÇÕ´Ï´Ù. ÀÌ·¯ÇÑ Àç·á¿¡´Â Àüµµ¼º °íºÐÀÚ, ±Ý¼Ó¹Ú, ³ª³ë¼ÒÀç, ÇÃ¶ó½ºÆ½°ú °°Àº Ç÷º¼­ºí ±âÆÇ, À¯±â ¹ÝµµÃ¼ µîÀÌ Æ÷ÇԵ˴ϴÙ. ÀÌ·¯ÇÑ ¼ÒÀç´Â À¯¿¬ÇÑ Ç¥¸é¿¡ ÀüÀÚ È¸·Î¸¦ ÅëÇÕÇÒ ¼ö ÀÖ¾î ¿þ¾î·¯ºí ±â±â, Á¢ÀÌ½Ä µð½ºÇ÷¹ÀÌ, ÀÇ·á¿ë ¼¾¼­, ¿¡³ÊÁö ÀúÀå ¼Ö·ç¼ÇÀÇ Çõ½ÅÀ» °¡´ÉÇÏ°Ô ÇÕ´Ï´Ù.

°¡º±°í ÈÞ´ë °¡´ÉÇÑ ±â±â¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡

¼ÒºñÀÚµéÀº ÈÞ´ë°¡ Æí¸®ÇÑ ½º¸¶Æ®Çϰí ÄÄÆÑÆ®ÇÑ °¡Á¬À» ¼±È£Çϱ⠶§¹®¿¡ Á¦Á¶¾÷üµéÀº À¯¿¬ÇÏ°í ¾ã°í ³»±¸¼ºÀÌ ¶Ù¾î³­ ¼ÒÀ縦 äÅÃÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ¼ÒÀç´Â Á¢À» ¼ö ÀÖ´Â µð½ºÇ÷¹ÀÌ, Á¢À» ¼ö ÀÖ´Â ½º¸¶Æ®Æù, ¿þ¾î·¯ºí ±â±â °³¹ßÀ» °¡´ÉÇÏ°Ô ÇÕ´Ï´Ù. ÀÌ·¯ÇÑ Ãß¼¼´Â ÀÇ·á¿ë ¼¾¼­, ½º¸¶Æ® ¼¶À¯, IoT ¾ÖÇø®ÄÉÀ̼ÇÀÇ Çõ½Åµµ µÞ¹ÞħÇϰí ÀÖ½À´Ï´Ù. ¼º´É ÀúÇÏ ¾øÀÌ °æ·®È­¸¦ ½ÇÇöÇÏ´Â Ç÷º¼­ºí ÀÏ·ºÆ®·Î´Ð½º´Â Çö´ëÀÇ ¸ðºô¸®Æ¼ ´ÏÁî¿¡ ºÎÀÀÇÕ´Ï´Ù. ÀÌ·¯ÇÑ Ã¤ÅÃÀÇ Áõ°¡´Â ¿©·¯ »ê¾÷¿¡ °ÉÃÄ ½ÃÀå ±âȸ¸¦ Áö¼ÓÀûÀ¸·Î È®´ëÇϰí ÀÖ½À´Ï´Ù.

³»±¸¼º°ú ½Å·Ú¼ºÀÇ ¹®Á¦

À¯¿¬ÇÑ ¼ÒÀç´Â ¹Ýº¹ÀûÀ¸·Î ±¸ºÎ¸®°Å³ª Æì´Â °úÁ¤¿¡¼­ ±Õ¿­, ¹Ú¸®, Àüµµ¼º ÀúÇÏ µîÀÇ ¹®Á¦¿¡ Á÷¸éÇÏ´Â °æ¿ì°¡ ¸¹½À´Ï´Ù. ÀÌ·¯ÇÑ ¾àÁ¡Àº ÀÇ·á±â±â, Ç×°ø¿ìÁÖ, ÀÚµ¿Â÷ ÀüÀå µî °í¼º´É ÀÀ¿ë ºÐ¾ß¿¡¼­ÀÇ Ã¤ÅÃÀ» Á¦ÇÑÇϰí ÀÖ½À´Ï´Ù. Á¦Á¶¾÷ü´Â ¾ÈÁ¤¼º¿¡ ´ëÇÑ ¾÷°è Ç¥ÁØÀ» ÃæÁ·½Ã۱â À§ÇØ °í±ººÐÅõÇϰí ÀÖÀ¸¸ç, ÀÌ´Â ÃÖÁ¾»ç¿ëÀÚÀÇ ½Å·Ú¸¦ ¶³¾î¶ß¸®°í ÀÖ½À´Ï´Ù. ÀæÀº ±³Ã¼¿Í ¼º´É ºÒÀÏÄ¡´Â ±â¾÷°ú ¼ÒºñÀÚÀÇ ºñ¿ëÀ» Áõ°¡½Ãŵ´Ï´Ù. °á°úÀûÀ¸·Î ÀÌ·¯ÇÑ ¹®Á¦µéÀº ´ë±Ô¸ð »ó¿ëÈ­¸¦ Áö¿¬½ÃŰ°í ½ÃÀå ¼ºÀåÀ» Á¦ÇÑÇϰí ÀÖ½À´Ï´Ù.

Á¤ºÎ Áö¿ø ¹× ¿¬±¸°³¹ß ÅõÀÚ

°³¹ß ÀÌ´Ï¼ÅÆ¼ºê¿Í À¯¸®ÇÑ Á¤Ã¥Àº ±â¾÷ÀÌ °¡º±°í ³»±¸¼ºÀÌ ¶Ù¾î³ª¸ç ¿¡³ÊÁö È¿À²ÀÌ ³ôÀº ¼ÒÀ縦 °³¹ßÇϵµ·Ï Àå·ÁÇÕ´Ï´Ù. ¹Î°ü ÆÄÆ®³Ê½ÊÀº »ó¾÷È­¸¦ °¡¼ÓÈ­ÇÏ°í ³ôÀº °³¹ß ºñ¿ë¿¡ µû¸¥ ¸®½ºÅ©¸¦ ÁÙÀÏ ¼ö ÀÖ½À´Ï´Ù. Áö¼ÓÀûÀÎ ¿¬±¸°³¹ß ÅõÀÚ´Â Àç·á Ư¼ºÀÇ È¹±âÀûÀÎ ¹ßÀüÀ» °¡Á®¿Í ÀÇ·á, °¡Àü, ÀÚµ¿Â÷ ºÐ¾ß¿¡ Æø³Ð°Ô Àû¿ëµÉ ¼ö ÀÖµµ·Ï ÇÕ´Ï´Ù. Á¤ºÎ Áö¿ø ¿¬±¸ ÇÁ·Î±×·¥µµ Áö¼Ó°¡´ÉÇϰí ģȯ°æÀûÀÎ ¼ÒÀç °³¹ßÀ» ÃËÁøÇÕ´Ï´Ù. Àü¹ÝÀûÀ¸·Î ÀÌ·¯ÇÑ ³ë·ÂÀº ½ÃÀåÀÇ ¼ºÀå°ú °æÀï·ÂÀ» ÃËÁøÇÏ´Â °­·ÂÇÑ »ýŰ踦 Á¶¼ºÇϰí ÀÖ½À´Ï´Ù.

Á¦ÇÑµÈ Ç¥ÁØÈ­

ÀϰüµÈ Å×½ºÆ® ¹× ÀÎÁõ ÀýÂ÷ÀÇ °³¹ßÀº ¾î·Æ°í, ÃÖÁ¾»ç¿ëÀÚÀÇ ½Å·Ú¸¦ ¶³¾î¶ß¸± ¼ö ÀÖ½À´Ï´Ù. ÅëÀÏµÈ Ç¥ÁØÀÌ ¾ø±â ¶§¹®¿¡ Àç·á¿Í ÀåÄ¡ °£ ȣȯ¼º¿¡ ¹®Á¦°¡ ¹ß»ýÇÏ¿© ´ë±Ô¸ð äÅÃÀÌ Áö¿¬µÇ°í ÀÖ½À´Ï´Ù. »ê¾÷°è°¡ µµÀÔ ½Ã Å« À§Çè°ú ºÒÈ®½Ç¼º¿¡ Á÷¸éÇϰí Àֱ⠶§¹®¿¡ ´ë·® µµÀÔÀº ¿©ÀüÈ÷ Á¦ÇÑÀûÀÔ´Ï´Ù. ±â¾÷ÀÌ µ¶ÀÚÀûÀÎ ¼Ö·ç¼Ç¿¡ ÀÇÁ¸ÇÒ ¼ö ¹Û¿¡ ¾ø¾î »ý»ê ºñ¿ëÀÌ »ó½ÂÇÕ´Ï´Ù.

COVID-19ÀÇ ¿µÇâ

COVID-19ÀÇ ´ëÀ¯ÇàÀº Ç÷º¼­ºí ÀüÀÚÀç·á ½ÃÀå¿¡ ´Ù¾çÇÑ ¿µÇâÀ» ¹ÌÃÆ½À´Ï´Ù. °ø±Þ¸ÁÀÇ È¥¶õ°ú °øÀå °¡µ¿ Áß´ÜÀ¸·Î ÀÎÇØ Ãʱ⿡´Â »ý»ê ¼Óµµ°¡ ´À·ÁÁö°í °¡Àü, ÀÚµ¿Â÷, ÀÇ·á ºÐ¾ß¿¡¼­ Á¦Ç° Ãâ½Ã°¡ Áö¿¬µÇ¾ú½À´Ï´Ù. ºÒÇÊ¿äÇÑ ÀüÀÚÁ¦Ç°¿¡ ´ëÇÑ ¼ö¿ä °¨¼Ò´Â ¼ºÀåÀ» ´õ¿í ¾ïÁ¦Çß½À´Ï´Ù. ±×·¯³ª ÀÌ À§±â´Â ¶ÇÇÑ µðÁöÅÐ ±â±â, ¿þ¾î·¯ºí ¹× ÀÇ·á¿ë ¼¾¼­ÀÇ Ã¤ÅÃÀ» °¡¼ÓÈ­ÇÏ¿© °Ç°­ ¸ð´ÏÅ͸µ ¹× ¿ø°ÝÀÇ·á ºÐ¾ß¿¡¼­ À¯¿¬ÇÑ Àç·áÀÇ »õ·Î¿î ±âȸ¸¦ ÃËÁøÇß½À´Ï´Ù. Àü¹ÝÀûÀ¸·Î, ÆÒµ¥¹ÍÀº ¼ö¿ä ÆÐÅÏÀ» ÀçÆíÇÏ°í ½ÃÀå¿¡¼­ÀÇ È¸º¹·Â°ú Çõ½ÅÀÇ Á߿伺À» ºÎ°¢½ÃÄ×½À´Ï´Ù.

¿¹Ãø ±â°£ µ¿¾È, µµÃ¼ ºÐ¾ß°¡ ÃÖ´ë°¡ µÉ °ÍÀ¸·Î ¿¹»ó

ÀüµµÃ¼ ºÎ¹®Àº µð½ºÇ÷¹ÀÌ, ¼¾¼­, ¿þ¾î·¯ºí°ú °°Àº Ç÷º¼­ºí µð¹ÙÀ̽ºÀÇ È¿À²ÀûÀÎ Àü±âÀû ¿¬°áÀ» °¡´ÉÇϰÔÇÔÀ¸·Î½á ¿¹Ãø ±â°£ µ¿¾È °¡Àå Å« ½ÃÀå Á¡À¯À²À» Â÷ÁöÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. Àº³ª³ë¿ÍÀ̾î, ±×·¡ÇÉ, Àüµµ¼º °íºÐÀÚ µîÀÇ °íÀüµµ¼º ¼ÒÀç´Â À¯¿¬¼ºÀ» À¯ÁöÇϸ鼭 ¼ÒÀÚÀÇ ¼º´ÉÀ» Çâ»ó½Ãŵ´Ï´Ù. Á¢Èû, Á¢Èû, ½ÅÃà¿¡ ´ëÇÑ ÀûÀÀ¼ºÀº Á¢ÀÌ½Ä ½º¸¶Æ®Æù°ú ½º¸¶Æ® ¼¶À¯ÀÇ Çõ½ÅÀ» µÞ¹ÞħÇϰí ÀÖ½À´Ï´Ù. °¡º±°í ¿¡³ÊÁö È¿À²ÀûÀ̸ç ÄÄÆÑÆ®ÇÑ ÀüÀÚÁ¦Ç°¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡ÇÔ¿¡ µû¶ó Àüµµ¼º ¼ÒÀçÀÇ Ã¤ÅÃÀÌ ´õ¿í Ȱ¹ßÇØÁö°í ÀÖ½À´Ï´Ù.

¿¹Ãø ±â°£ µ¿¾È ¿¡³ÊÁö ÀúÀå ºÐ¾ß´Â °¡Àå ³ôÀº CAGRÀ» º¸ÀÏ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

¿¹Ãø ±â°£ µ¿¾È ÷´Ü ¹èÅ͸® ¹× ½´ÆÛÄ¿ÆÐ½ÃÅÍ¿¡ »ç¿ëµÇ´Â °¡º±°í ¾ã°í À¯¿¬ÇÑ ¼ÒÀç¿¡ ´ëÇÑ ¼ö¿ä¸¦ ÃËÁøÇÏ¿© ¿¡³ÊÁö ÀúÀå ºÐ¾ß°¡ °¡Àå ³ôÀº ¼ºÀå·üÀ» º¸ÀÏ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ¿þ¾î·¯ºí ±â±â, Ç÷º¼­ºí µð½ºÇ÷¹ÀÌ, ÈÞ´ë¿ë ÀüÀÚÁ¦Ç°ÀÇ Ã¤ÅÃÀÌ È®´ëµÊ¿¡ µû¶ó È¿À²ÀûÀÌ°í ±¸ºÎ¸± ¼ö ÀÖ´Â ¿¡³ÊÁö ÀúÀå ¼Ö·ç¼Ç¿¡ ´ëÇÑ ¿ä±¸°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. À¯¿¬ÇÑ ¼ÒÀç´Â Â÷¼¼´ë ÃàÀü ½Ã½ºÅÛ¿¡¼­ ¿¡³ÊÁö ¹Ðµµ, ³»±¸¼º, ¼³°è ÀûÀÀ¼ºÀ» Çâ»ó½Ãų ¼ö ÀÖ½À´Ï´Ù. Àü±âÀÚµ¿Â÷¿Í Àç»ý¿¡³ÊÁö ÅëÇÕÀÇ ºÎ»óÀº À¯¿¬ÇÑ ¿¡³ÊÁö ÀúÀå ±â¼úÀÇ ±â¼ú Çõ½ÅÀ» ´õ¿í ÃËÁøÇÒ °ÍÀÔ´Ï´Ù. Àü¹ÝÀûÀ¸·Î ÀÌ ºÎ¹®Àº Ç÷º¼­ºí ÀÏ·ºÆ®·Î´Ð½ºÀÇ ¼º´É, ´Ù¿ëµµ¼º, Àû¿ë ¹üÀ§°¡ °­È­µÇ¸é¼­ ½ÃÀå ¼ºÀåÀ» °¡¼ÓÈ­Çϰí ÀÖ½À´Ï´Ù.

°¡Àå Å« Á¡À¯À²À» Â÷ÁöÇÏ´Â Áö¿ª:

¿¹Ãø ±â°£ µ¿¾È ¾Æ½Ã¾ÆÅÂÆò¾çÀº ¼ÒºñÀÚ ÀüÀÚÁ¦Ç°, ¿þ¾î·¯ºí ±â±âÀÇ ¹ßÀü, Á¦Á¶ ÀÎÇÁ¶ó¿¡ ´ëÇÑ ´ë±Ô¸ð ÅõÀÚ·Î ÀÎÇØ °¡Àå Å« ½ÃÀå Á¡À¯À²À» Â÷ÁöÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ±Þ¼ÓÇÑ µµ½ÃÈ­, ¹ÝµµÃ¼ ¹× µð½ºÇ÷¹ÀÌ ÆÐ³Î »ê¾÷ÀÇ Á¸Àç°¨ÀÌ Ã¤¿ëÀ» ÃËÁøÇϰí ÀÖ½À´Ï´Ù. Áß±¹, Çѱ¹, ÀϺ» µîÀÇ ±¹°¡µéÀº Ç÷º¼­ºí µð½ºÇ÷¹ÀÌ, ¼¾¼­, ž籤¹ßÀü ±â¼úÀÇ ±â¼ú Çõ½ÅÀ» ÃßÁøÇϰí ÀÖ½À´Ï´Ù. ±â¼ú µµÀÔ¿¡ ´ëÇÑ Á¤ºÎÀÇ Áö¿ø°ú ¿¬±¸ Çù·ÂÀº ½ÃÀåÀ» ´õ¿í °­È­Çϰí ÀÖ½À´Ï´Ù. Àü¹ÝÀûÀ¸·Î ¾Æ½Ã¾ÆÅÂÆò¾çÀº À¯¿¬ÇÑ ÀüÀÚ Àç·á »ý»ê, ±â¼ú Çõ½Å ¹× ÅëÇÕÀÇ Çãºê°¡ µÇ°í ÀÖ½À´Ï´Ù.

CAGRÀÌ °¡Àå ³ôÀº Áö¿ª:

¿¹Ãø ±â°£ µ¿¾È ºÏ¹Ì°¡ °¡Àå ³ôÀº CAGRÀ» º¸ÀÏ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ÀÌ´Â ¿¬±¸ Ȱµ¿ÀÌ È°¹ßÇϰí ÀÇ·á, ÀÚµ¿Â÷, Ç×°ø¿ìÁÖ »ê¾÷¿¡¼­ ä¿ëÀÌ È®´ëµÇ°í Àֱ⠶§¹®ÀÔ´Ï´Ù. ´ëÇаú ÁÖ¿ä ±â¾÷ÀÇ °­·ÂÇÑ R&D ÅõÀÚ°¡ Àüµµ¼º À×Å©, Ç÷º¼­ºí ±âÆÇ, Æú¸®¸Ó µî ÷´Ü ¼ÒÀç °³¹ßÀ» ÃËÁøÇϰí ÀÖ½À´Ï´Ù. ÀÌ Áö¿ª¿¡¼­´Â ÀÇ·á¿ë ¿þ¾î·¯ºí, Ç÷º¼­ºí ¼¾¼­, ±¹¹æ¿ë ¾ÖÇø®ÄÉÀ̼ǿ¡ ÁßÁ¡À» µÎ°í ½Å·Ú¼º°ú ³»±¸¼º¿¡ ÁßÁ¡À» µÎ°í ÀÖ½À´Ï´Ù. ¼ö¿ä´Â Ãʱ⠵µÀÔ µ¿Çâ, Â÷¼¼´ë µð¹ÙÀ̽º¿¡ ´ëÇÑ ¼ÒºñÀÚÀÇ °ü½É, Áö¼Ó°¡´É¼º¿¡ ´ëÇÑ Á߿伺 µî¿¡ ¿µÇâÀ» ¹Þ½À´Ï´Ù.

¹«·á Ä¿½ºÅ͸¶ÀÌ¡ ¼­ºñ½º

º» º¸°í¼­¸¦ ±¸µ¶ÇÏ´Â °í°´Àº ´ÙÀ½°ú °°Àº ¹«·á ¸ÂÃãÈ­ ¿É¼Ç Áß Çϳª¸¦ ÀÌ¿ëÇÒ ¼ö ÀÖ½À´Ï´Ù:

  • ±â¾÷ ¼Ò°³
    • Ãß°¡ ±â¾÷ Á¾ÇÕ ÇÁ·ÎÆÄÀϸµ(ÃÖ´ë 3°³»ç±îÁö)
    • ÁÖ¿ä ±â¾÷ SWOT ºÐ¼®(3°³»ç±îÁö)
  • Áö¿ª ±¸ºÐ
    • °í°´ÀÇ °ü½É¿¡ µû¸¥ ÁÖ¿ä ±¹°¡º° ½ÃÀå ÃßÁ¤, ¿¹Ãø, CAGR(ÁÖ: Ÿ´ç¼º °ËÅä¿¡ µû¸¥)
  • °æÀï»ç º¥Ä¡¸¶Å·
    • Á¦Ç° Æ÷Æ®Æú¸®¿À, Áö¸®Àû ÀÔÁö, Àü·«Àû Á¦ÈÞ¸¦ ±â¹ÝÀ¸·Î ÇÑ ÁÖ¿ä ±â¾÷ º¥Ä¡¸¶Å·

¸ñÂ÷

Á¦1Àå ÁÖ¿ä ¿ä¾à

Á¦2Àå ¼­·Ð

  • °³¿ä
  • ÀÌÇØ°ü°èÀÚ
  • ºÐ¼® ¹üÀ§
  • ºÐ¼® ¹æ¹ý
    • µ¥ÀÌÅÍ ¸¶ÀÌ´×
    • µ¥ÀÌÅÍ ºÐ¼®
    • µ¥ÀÌÅÍ °ËÁõ
    • ºÐ¼® Á¢±Ù¹ý
  • ºÐ¼® ÀÚ·á
    • 1Â÷ Á¶»ç ÀÚ·á
    • 2Â÷ Á¶»ç Á¤º¸ Ãâó
    • °¡Á¤

Á¦3Àå ½ÃÀå µ¿Ç⠺м®

  • ¼ºÀå ÃËÁø¿äÀÎ
  • ¼ºÀå ¾ïÁ¦¿äÀÎ
  • ½ÃÀå ±âȸ
  • À§Çù
  • ¿ëµµ ºÐ¼®
  • ÃÖÁ¾»ç¿ëÀÚ ºÐ¼®
  • ½ÅÈï ½ÃÀå
  • ½ÅÁ¾ Äڷγª¹ÙÀÌ·¯½º °¨¿°Áõ(COVID-19)ÀÇ ¿µÇâ

Á¦4Àå Porter's Five Forces ºÐ¼®

  • °ø±Þ¾÷üÀÇ Çù»ó·Â
  • ±¸¸ÅÀÚÀÇ Çù»ó·Â
  • ´ëü Á¦Ç°ÀÇ À§Çù
  • ½Å±Ô ÁøÃâ ±â¾÷ÀÇ À§Çù
  • ±â¾÷°£ °æÀï

Á¦5Àå ¼¼°èÀÇ Ç÷º¼­ºí ÀüÀÚÀç·á ½ÃÀå : Àç·áº°

  • µµÃ¼(ÄÁ´öÅÍ)
    • ±×·¡ÇÉ
    • Àº ³ª³ë¿ÍÀ̾î
    • ±¸¸® À×Å©
  • ±âÆÇ
    • ÇÃ¶ó½ºÆ½ ±âÆÇ
    • Á¾ÀÌ ±âÆÇ
    • ±Ý¼Ó¹Ú ±âÆÇ
  • À¯Àüü Àç·á
    • Æú¸®À̵̹å
    • Æú¸®¿¡Æ¿·» Å×·¹ÇÁÅ»·¹ÀÌÆ®
    • Æú¸®¿¡Æ¿·» ³ªÇÁÅ»·¹ÀÌÆ®
  • ºÀÀÔ Àç·á

Á¦6Àå ¼¼°èÀÇ Ç÷º¼­ºí ÀüÀÚÀç·á ½ÃÀå : ¿ëµµº°

  • µð½ºÇ÷¹ÀÌ
  • Á¶¸í
  • ž籤¹ßÀü
  • ¿¡³ÊÁö ÀúÀå
  • ¼¾¼­
  • ±âŸ ¿ëµµ

Á¦7Àå ¼¼°èÀÇ Ç÷º¼­ºí ÀüÀÚÀç·á ½ÃÀå : ÃÖÁ¾»ç¿ëÀÚº°

  • °¡Àü
  • ÀǷᡤÀÇ·á±â±â
  • ÀÚµ¿Â÷
  • Ç×°ø¿ìÁÖ ¹× ¹æÀ§
  • ¿¡³ÊÁö¡¤Àü·Â
  • »ê¾÷ ¿ëµµ
  • Æ÷À塤¹°·ù
  • ±âŸ ÃÖÁ¾»ç¿ëÀÚ

Á¦8Àå ¼¼°èÀÇ Ç÷º¼­ºí ÀüÀÚÀç·á ½ÃÀå : Áö¿ªº°

  • ºÏ¹Ì
    • ¹Ì±¹
    • ij³ª´Ù
    • ¸ß½ÃÄÚ
  • À¯·´
    • µ¶ÀÏ
    • ¿µ±¹
    • ÀÌÅ»¸®¾Æ
    • ÇÁ¶û½º
    • ½ºÆäÀÎ
    • ±âŸ À¯·´
  • ¾Æ½Ã¾ÆÅÂÆò¾ç
    • ÀϺ»
    • Áß±¹
    • Àεµ
    • È£ÁÖ
    • ´ºÁú·£µå
    • Çѱ¹
    • ±âŸ ¾Æ½Ã¾ÆÅÂÆò¾ç
  • ³²¹Ì
    • ¾Æ¸£ÇîÆ¼³ª
    • ºê¶óÁú
    • Ä¥·¹
    • ±âŸ ³²¹Ì
  • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«
    • »ç¿ìµð¾Æ¶óºñ¾Æ
    • ¾Æ¶ø¿¡¹Ì¸®Æ®
    • īŸ¸£
    • ³²¾ÆÇÁ¸®Ä«°øÈ­±¹
    • ±âŸ Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«

Á¦9Àå ÁÖ¿ä µ¿Çâ

  • °è¾à, »ç¾÷ Á¦ÈÞ¡¤Çù·Â, ÇÕÀÛÅõÀÚ
  • ±â¾÷ ÀμöÇÕº´(M&A)
  • ½ÅÁ¦Ç° ¹ß¸Å
  • »ç¾÷ È®Àå
  • ±âŸ ÁÖ¿ä Àü·«

Á¦10Àå ±â¾÷ °³¿ä

  • LG Chem
  • Samsung SDI
  • BASF SE
  • DuPont de Nemours, Inc.
  • 3M Company
  • Henkel AG & Co. KGaA
  • Arkema S.A.
  • Solvay S.A.
  • Covestro AG
  • Sumitomo Chemical Co., Ltd.
  • Toray Industries, Inc.
  • Mitsubishi Chemical Group Corporation
  • Hitachi Chemical Co., Ltd.
  • Heraeus Holding GmbH
  • Eastman Chemical Company
  • Panasonic Corporation
  • Taiyo Ink Mfg. Co., Ltd.
KSM 25.09.09

According to Stratistics MRC, the Global Flexible Electronics Materials Market is accounted for $43.44 billion in 2025 and is expected to reach $84.71 billion by 2032 growing at a CAGR of 10.01% during the forecast period. Flexible electronics materials refer to a class of advanced materials designed to enable the development of electronic devices that are lightweight, bendable, stretchable, and adaptable to various shapes without compromising performance. These materials include conductive polymers, metal foils, nanomaterials, flexible substrates such as plastics, and organic semiconductors. They allow integration of electronic circuits into flexible surfaces, enabling innovations in wearable devices, foldable displays, medical sensors, and energy storage solutions.

Market Dynamics:

Driver:

Growing demand for lightweight and portable devices

Consumers prefer sleek, compact gadgets that are easy to carry, pushing manufacturers to adopt flexible, thin, and durable materials. These materials enable the development of bendable displays, foldable smartphones, and wearable devices. The trend also supports innovations in medical sensors, smart textiles, and IoT applications. By reducing weight without compromising performance, flexible electronics meet modern mobility needs. This rising adoption continues to expand market opportunities across multiple industries.

Restraint:

Durability and reliability issues

Flexible materials often face challenges such as cracking, delamination, or loss of conductivity when repeatedly bent or stretched. These weaknesses limit their adoption in high-performance applications like medical devices, aerospace, and automotive electronics. Manufacturers struggle to meet industry standards for stability, which reduces confidence among end users. Frequent replacements and performance inconsistencies increase costs for businesses and consumers. As a result, these challenges slow down large-scale commercialization and restrict market growth.

Opportunity:

Government support and R&D investments

Funding initiatives and favourable policies encourage companies to develop lightweight, durable, and energy-efficient materials. Public-private partnerships accelerate commercialization and reduce the risks associated with high development costs. Continuous R&D investments lead to breakthroughs in material properties, enabling wider applications in healthcare, consumer electronics, and automotive sectors. Government-backed research programs also promote sustainable and eco-friendly material development. Overall, these efforts create a strong ecosystem that drives growth and competitiveness in the market.

Threat:

Limited standardization

Developing consistent testing and certification procedures becomes challenging, leading to reduced confidence among end users. The absence of unified standards results in compatibility problems between materials and devices, delaying large-scale adoption. Mass adoption remains limited as industries encounter greater risks and uncertainties during implementation. Production expenses rise as companies are forced to rely on proprietary solutions.

Covid-19 Impact

The Covid-19 pandemic had a mixed impact on the flexible electronics materials market. Supply chain disruptions and factory shutdowns initially slowed production, delaying product launches across consumer electronics, automotive, and healthcare sectors. Reduced demand for non-essential electronics further constrained growth. However, the crisis also accelerated the adoption of digital devices, wearables, and medical sensors, driving new opportunities for flexible materials in health monitoring and remote care. Overall, the pandemic reshaped demand patterns, highlighting the importance of resilience and innovation in the market.

The conductor's segment is expected to be the largest during the forecast period

The conductor's segment is expected to account for the largest market share during the forecast period by enabling efficient electrical connectivity in flexible devices such as displays, sensors, and wearables. High conductivity materials like silver nanowires, graphene, and conductive polymers enhance device performance while maintaining flexibility. Their adaptability to bending, folding, and stretching supports innovations in foldable smartphones and smart textiles. Growing demand for lightweight, energy-efficient, and compact electronic products further boosts the adoption of conductive materials.

The energy storage segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the energy storage segment is predicted to witness the highest growth rate by driving demand for lightweight, thin, and flexible materials used in advanced batteries and supercapacitors. Growing adoption of wearable devices, flexible displays, and portable electronics increases the need for efficient, bendable energy storage solutions. Flexible materials enable improved energy density, durability, and design adaptability in next-generation storage systems. The rise of electric vehicles and renewable energy integration further boosts innovations in flexible energy storage technologies. Overall, the segment accelerates market growth by enhancing performance, versatility, and application scope of flexible electronics.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share due to advancements in consumer electronics, wearable devices, and large-scale investments in manufacturing infrastructure. Rapid urbanization and strong presence of semiconductor and display panel industries are fueling adoption. Countries like China, South Korea, and Japan are driving innovation in flexible displays, sensors, and photovoltaic technologies. Government support for technology adoption and research collaborations further strengthen the market. Overall, Asia Pacific remains a hub for production, innovation, and integration of flexible electronics materials.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, due to high research activities, and growing adoption across healthcare, automotive, and aerospace industries. Strong R&D investments by universities and leading companies foster advanced material development, including conductive inks, flexible substrates, and polymers. The region focuses on medical wearables, flexible sensors, and defense-grade applications, emphasizing reliability and durability. Demand is influenced by early adoption trends, consumer interest in next-generation devices, and emphasis on sustainability.

Key players in the market

Some of the key players profiled in the Flexible Electronics Materials Market include LG Chem, Samsung SDI, BASF SE, DuPont de Nemours, Inc., 3M Company, Henkel AG & Co. KGaA, Arkema S.A., Solvay S.A., Covestro AG, Sumitomo Chemical Co., Ltd., Toray Industries, Inc., Mitsubishi Chemical Group Corporation, Hitachi Chemical Co., Ltd., , Heraeus Holding GmbH, Eastman Chemical Company, Panasonic Corporation and Taiyo Ink Mfg. Co., Ltd.

Key Developments:

In December 2024, LG Chem extended its joint development agreement with Gevo Inc., a U.S.-based renewable chemicals company. The collaboration focuses on commercializing Ethanol-to-Olefins (ETO) technology, which enables the production of sustainable feedstocks for advanced polymers.

In August 2024, Samsung SDI finalized a major joint venture agreement with General Motors (GM) to build a new EV battery manufacturing plant in New Carlisle, Indiana, USA. While the primary focus is electric vehicles, the technologies involved particularly prismatic NCA-based batteries are highly relevant to flexible electronics due to their compact form factor, high energy density, and safety features.

Materials Covered:

  • Conductors
  • Substrates
  • Dielectric Materials
  • Encapsulation Materials

Applications Covered:

  • Displays
  • Lighting
  • Photovoltaics
  • Energy Storage
  • Sensors
  • Other Applications

End Users Covered:

  • Consumer Electronics
  • Healthcare & Medical Devices
  • Automotive
  • Aerospace & Defense
  • Energy & Power
  • Industrial Applications
  • Packaging & Logistics
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Flexible Electronics Materials Market, By Material

  • 5.1 Introduction
  • 5.2 Conductors
    • 5.2.1 Graphene
    • 5.2.2 Silver Nanowires
    • 5.2.3 Copper Inks
  • 5.3 Substrates
    • 5.3.1 Plastic Substrates
    • 5.3.2 Paper Substrates
    • 5.3.3 Metal Foil Substrates
  • 5.4 Dielectric Materials
    • 5.4.1 Polyimide
    • 5.4.2 Polyethylene Terephthalate
    • 5.4.3 Polyethylene Naphthalate
  • 5.5 Encapsulation Materials

6 Global Flexible Electronics Materials Market, By Application

  • 6.1 Introduction
  • 6.2 Displays
  • 6.3 Lighting
  • 6.4 Photovoltaics
  • 6.5 Energy Storage
  • 6.6 Sensors
  • 6.7 Other Applications

7 Global Flexible Electronics Materials Market, By End User

  • 7.1 Introduction
  • 7.2 Consumer Electronics
  • 7.3 Healthcare & Medical Devices
  • 7.4 Automotive
  • 7.5 Aerospace & Defense
  • 7.6 Energy & Power
  • 7.7 Industrial Applications
  • 7.8 Packaging & Logistics
  • 7.9 Other End Users

8 Global Flexible Electronics Materials Market, By Geography

  • 8.1 Introduction
  • 8.2 North America
    • 8.2.1 US
    • 8.2.2 Canada
    • 8.2.3 Mexico
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 UK
    • 8.3.3 Italy
    • 8.3.4 France
    • 8.3.5 Spain
    • 8.3.6 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 Japan
    • 8.4.2 China
    • 8.4.3 India
    • 8.4.4 Australia
    • 8.4.5 New Zealand
    • 8.4.6 South Korea
    • 8.4.7 Rest of Asia Pacific
  • 8.5 South America
    • 8.5.1 Argentina
    • 8.5.2 Brazil
    • 8.5.3 Chile
    • 8.5.4 Rest of South America
  • 8.6 Middle East & Africa
    • 8.6.1 Saudi Arabia
    • 8.6.2 UAE
    • 8.6.3 Qatar
    • 8.6.4 South Africa
    • 8.6.5 Rest of Middle East & Africa

9 Key Developments

  • 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 9.2 Acquisitions & Mergers
  • 9.3 New Product Launch
  • 9.4 Expansions
  • 9.5 Other Key Strategies

10 Company Profiling

  • 10.1 LG Chem
  • 10.2 Samsung SDI
  • 10.3 BASF SE
  • 10.4 DuPont de Nemours, Inc.
  • 10.5 3M Company
  • 10.6 Henkel AG & Co. KGaA
  • 10.7 Arkema S.A.
  • 10.8 Solvay S.A.
  • 10.9 Covestro AG
  • 10.10 Sumitomo Chemical Co., Ltd.
  • 10.11 Toray Industries, Inc.
  • 10.12 Mitsubishi Chemical Group Corporation
  • 10.13 Hitachi Chemical Co., Ltd.
  • 10.14 Heraeus Holding GmbH
  • 10.15 Eastman Chemical Company
  • 10.16 Panasonic Corporation
  • 10.17 Taiyo Ink Mfg. Co., Ltd.
»ùÇà ¿äû ¸ñ·Ï
0 °ÇÀÇ »óǰÀ» ¼±Åà Áß
¸ñ·Ï º¸±â
Àüü»èÁ¦