½ÃÀ庸°í¼­
»óǰÄÚµå
1813273

ÀÓº£µðµå ¸ÖƼ¹Ìµð¾î Ä«µå(eMMC) ½ÃÀå ¿¹Ãø(-2032³â) : À¯Çüº°, ½ºÅ丮Áö ¿ë·®º°, ÀÎÅÍÆäÀ̽ºº°, ÆÐŰÁö À¯Çüº°, ¿ëµµº°, ÃÖÁ¾»ç¿ëÀÚº°, Áö¿ªº° ¼¼°è ºÐ¼®

Embedded Multimedia Card Market Forecasts to 2032 - Global Analysis By Type (NAND Flash, DRAM and eMMC), Storage Capacity, Interface, Packaging Type, Application, End User and By Geography

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: Stratistics Market Research Consulting | ÆäÀÌÁö Á¤º¸: ¿µ¹® 200+ Pages | ¹è¼Û¾È³» : 2-3ÀÏ (¿µ¾÷ÀÏ ±âÁØ)

    
    
    



¡Ø º» »óǰÀº ¿µ¹® ÀÚ·á·Î Çѱ۰ú ¿µ¹® ¸ñÂ÷¿¡ ºÒÀÏÄ¡ÇÏ´Â ³»¿ëÀÌ ÀÖÀ» °æ¿ì ¿µ¹®À» ¿ì¼±ÇÕ´Ï´Ù. Á¤È®ÇÑ °ËÅ並 À§ÇØ ¿µ¹® ¸ñÂ÷¸¦ Âü°íÇØÁֽñ⠹ٶø´Ï´Ù.

Stratistics MRC¿¡ ÀÇÇϸé, ¼¼°è ÀÓº£µðµå ¸ÖƼ¹Ìµð¾î Ä«µå(eMMC) ½ÃÀåÀº 2025³â¿¡ 123¾ï ´Þ·¯¿¡ À̸£°í, ¿¹Ãø ±â°£ Áß ¿¬Æò±Õ º¹ÇÕ ¼ºÀå·ü(CAGR)Àº 3.5%·Î ¼ºÀåÇÏ¿© 2032³â¿¡´Â 174¾ï ´Þ·¯¿¡ À̸¦ Àü¸ÁÀÔ´Ï´Ù.

³»ÀåÇü ¸ÖƼ¹Ìµð¾î Ä«µå´Â ½º¸¶Æ®Æù, ÅÂºí¸´, Àú°¡Çü ³ëÆ®ºÏ¿¡¼­ ÈçÈ÷ º¼ ¼ö ÀÖ´Â ºñÈֹ߼º Ç÷¡½Ã ½ºÅ丮ÁöÀÇ ÀÏÁ¾ÀÔ´Ï´Ù. eMMC ĨÀº NAND Ç÷¡½Ã ¸Þ¸ð¸® ºÎǰ°ú ÄÁÆ®·Ñ·¯¸¦ ÇϳªÀÇ ½Ç¸®ÄÜ¿¡ ÅëÇÕÇÑ Ä¨ÀÔ´Ï´Ù. ÀÌ ÅëÇÕ ¼³°è´Â ÄÁÆ®·Ñ·¯°¡ ¿þ¾î ·¹º§¸µ ¹× ¿À·ù ¼öÁ¤°ú °°Àº º¹ÀâÇÑ µ¥ÀÌÅÍ °ü¸® ÀÛ¾÷À» ó¸®Çϱ⠶§¹®¿¡ È£½ºÆ® ÀåºñÀÇ ¸¶´õº¸µå¸¦ ´Ü¼øÈ­ÇÕ´Ï´Ù. À̵¿½Ä SD Ä«µå¿Í ´Þ¸® eMMC´Â ±â±âÀÇ ¸¶´õº¸µå¿¡ Á÷Á¢ ³³¶«µÇ¾î ¿µ±¸ÀûÀÌ°í ³»±¸¼ºÀÌ ¶Ù¾î³­ ½ºÅ丮Áö ¼Ö·ç¼ÇÀÔ´Ï´Ù.

¼ÒºñÀÚ±â¼úÇùȸ(CTA)¿¡ µû¸£¸é, ½ÅÈï±¹¿¡¼­´Â Àú·ÅÇÑ °¡°Ý´ëÀÇ IoT ±â±â ¹× ½º¸¶Æ® °¡ÀüÁ¦Ç°ÀÌ ²ÙÁØÈ÷ ¼ºÀåÇϰí ÀÖÀ¸¸ç, ºñ¿ë È¿À²ÀûÀÎ °í¹Ðµµ ³½µåÇ÷¡½Ã ½ºÅ丮Áö ¼Ö·ç¼Ç¿¡ ´ëÇÑ ¼ö¿ä°¡ Áö¼ÓµÇ°í ÀÖ½À´Ï´Ù.

½º¸¶Æ®Æù ¹× ÅÂºí¸´¿¡¼­ÀÇ Ã¤Åà Ȯ´ë

ÀÓº£µðµå ¸ÖƼ¹Ìµð¾î Ä«µå(eMMC) ½ÃÀåÀº ÄÄÆÑÆ®ÇÑ µðÀÚÀΰú ³ôÀº ºñ¿ë È¿À²¼ºÀ¸·Î ÀÎÇØ ½º¸¶Æ®Æù ¹× ÅÂºí¸´¿¡ eMMC ½ºÅ丮Áö°¡ žÀçµÇ±â ½ÃÀÛÇÑ °ÍÀÌ ÁÖ¿ä ¿äÀÎÀ¸·Î ÀÛ¿ëÇϰí ÀÖ½À´Ï´Ù. ¸ð¹ÙÀÏ ±â±â¿¡¼­ ´õ ºü¸¥ µ¥ÀÌÅÍ ¾×¼¼½º¿Í ÃÖÀûÈ­µÈ ½ºÅ丮Áö ¼Ö·ç¼Ç¿¡ ´ëÇÑ ¿ä±¸°¡ Á¡Á¡ ´õ ³ô¾ÆÁö°í ÀÖ´Â °¡¿îµ¥, eMMC´Â ¼º´É°ú °æÁ¦¼º »çÀÌ¿¡¼­ ½Å·ÚÇÒ ¼ö ÀÖ´Â ±ÕÇüÀ» ÀÌ·ç°í ÀÖ½À´Ï´Ù. ¸ð¹ÙÀÏ ÀÎÅÍ³Ý ÀÌ¿ë, ¾Û ´Ù¿î·Îµå, ¸ÖƼ¹Ìµð¾î ¼Òºñ°¡ ±Þ°ÝÈ÷ Áõ°¡Çϰí ÀÖÀ¸¸ç, ¸ð¹ÙÀÏ ÀÎÅͳÝÀÇ Ã¤ÅÃÀÌ ´õ¿í °¡¼ÓÈ­µÇ°í ÀÖ½À´Ï´Ù. ½ÅÈï±¹¿¡¼­ ¼ö¿ä ±ÞÁõ¿¡ ÈûÀÔ¾î ½º¸¶Æ®Æù ¹× ÅÂºí¸´Àº ¿©ÀüÈ÷ eMMC ±â¼úÀÇ °¡Àå Å« ¼ö¿äó°¡ µÇ°í ÀÖ½À´Ï´Ù.

SSD ¼Ö·ç¼Ç¿¡ ºñÇØ È®À强ÀÌ ³·½À´Ï´Ù.

eMMC ½ÃÀåÀÇ °¡Àå Å« Á¦¾à ¿äÀÎÀº °í±Þ SSD(SSD) ¼Ö·ç¼Ç¿¡ ºñÇØ È®À强ÀÌ Á¦ÇÑÀûÀ̶ó´Â Á¡ÀÔ´Ï´Ù. eMMC´Â ºñ¿ë È¿À²¼º°ú °ø°£ È¿À²¼ºÀÌ ¶Ù¾î³ªÁö¸¸, SSD°¡ Á¦°øÇÏ´Â ³ôÀº ÀúÀå ¿ë·®°ú ºü¸¥ Àбâ/¾²±â ¼Óµµ¿¡´Â ¹ÌÄ¡Áö ¸øÇÕ´Ï´Ù. °ÔÀÓ ¹× 4K ºñµð¿À ½ºÆ®¸®¹Ö°ú °°Àº µ¥ÀÌÅÍ ºÎÇϰ¡ ³ôÀº ¿ëµµÀÌ Áõ°¡ÇÔ¿¡ µû¶ó Á¦Á¶¾÷ü´Â ±â´ëµÇ´Â ¼º´ÉÀ» ÃæÁ·½ÃÄÑ¾ß ÇÏ´Â °úÁ¦¿¡ Á÷¸éÇØ ÀÖ½À´Ï´Ù. ¶ÇÇÑ, SSDÀÇ Àú°¡È­°¡ ÁøÇàµÇ¸é¼­ eMMCÀÇ ºñ¿ë ¿ìÀ§°¡ Á¼¾ÆÁö°í ÀÖ½À´Ï´Ù. ±× °á°ú, È®À强ÀÇ ÇѰè·Î ÀÎÇØ ÇÏÀÌ¿£µå ¼ÒºñÀÚ ¹× ¿£ÅÍÇÁ¶óÀÌÁî ½ºÅ丮Áö ¿ëµµ¿¡¼­ eMMCÀÇ °æÀï·ÂÀÌ ¶³¾îÁö°í ÀÖ½À´Ï´Ù.

»ê¾÷ ÀÚµ¿È­ Àåºñ¿¡¼­ äÅà Áõ°¡

eMMC ½ÃÀåÀº »ê¾÷ ÀÚµ¿È­ Àåºñ ¹× ÀÓº£µðµå ½Ã½ºÅÛ¿¡¼­ äÅÃÀÌ Áõ°¡ÇÔ¿¡ µû¶ó À¯¸ÁÇÑ ±âȸ¸¦ ¸ñ°ÝÇϰí ÀÖ½À´Ï´Ù. »ê¾÷ Àåºñ´Â ¿­¾ÇÇÑ È¯°æ¿¡¼­µµ ÀÛµ¿ÇÒ ¼ö ÀÖ´Â ½Å·Ú¼º°ú ³»±¸¼ºÀÌ ¶Ù¾î³­ ÄÄÆÑÆ®ÇÑ ¸Þ¸ð¸® ¼Ö·ç¼ÇÀÌ ÇÊ¿äÇѵ¥, eMMC´Â ÀÌ¿¡ ÀûÇÕÇÑ ¼Ö·ç¼ÇÀÔ´Ï´Ù. Àδõ½ºÆ®¸® 4.0ÀÇ ¹ßÀü¿¡ ÈûÀÔ¾î ·Îº¿ °øÇÐ, Á¦¾î ½Ã½ºÅÛ, IoT ±â±â¿¡¼­ ÀÓº£µðµå ½ºÅ丮Áö¿¡ ´ëÇÑ ¼ö¿ä°¡ ºü¸£°Ô Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, eMMCÀÇ ÀúÀü·Â ¼Òºñ¿Í »ê¾÷¿ë ¿öÅ©·Îµå¿¡¼­ °ß°íÇÑ ¼º´ÉÀº eMMCÀÇ ¸Å·ÂÀ» ´õ¿í ³ô¿©ÁÝ´Ï´Ù. ÀÌó·³ »ê¾÷¿ëÀ¸·ÎÀÇ Ã¤ÅÃÀÌ È®´ëµÇ¸é ¹Î¼ö¿ë ÀüÀÚ±â±â ¿ëµµ ¿Ü¿¡µµ À¯¸®ÇÑ ±æÀ» ¿­ ¼ö ÀÖ½À´Ï´Ù.

½ÅÈï Ç÷¡½Ã ¸Þ¸ð¸® ±â¼ú°úÀÇ °æÀï

ÀÓº£µðµå ¸ÖƼ¹Ìµð¾î Ä«µå(eMMC) ½ÃÀåÀº UFS(Universal Flash Storage), NVMe µî ½ÅÈï Ç÷¡½Ã ¸Þ¸ð¸® ±â¼úÀÇ À§Çù¿¡ Á÷¸éÇØ ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Ã·´Ü ¼Ö·ç¼ÇÀº µ¥ÀÌÅÍ Àü¼Û ¼Óµµ¸¦ ´ëÆø Çâ»ó½ÃŰ°í °í¼º´ÉÀ» ½ÇÇöÇÏ¿© Ç÷¡±×½Ê ±â±â¿¡ äÅõǰí ÀÖ½À´Ï´Ù. Á¦Á¶¾÷ü°¡ ¿ì¼öÇÑ ´ëü Á¦Ç°À¸·Î ÀüȯÇÔ¿¡ µû¶ó eMMC´Â ÇÁ¸®¹Ì¾ö ¿ëµµ¿¡¼­ °ü·Ã¼ºÀ» ÀÒÀ» À§ÇèÀÌ ÀÖ½À´Ï´Ù. ¶ÇÇÑ, Ç÷¡½Ã ½ºÅ丮ÁöÀÇ ºü¸¥ ±â¼ú Çõ½Å ¼Óµµ´Â °æÀï ¾Ð·ÂÀ» °¡¼ÓÈ­Çϰí ÀÖ½À´Ï´Ù. ±â¼úÀû ¾÷±×·¹À̵尡 ¾ø´Ù¸é eMMC´Â ÁßÀú°¡ µð¹ÙÀ̽º¿¡ ¸Ó¹°·¯ ½ÃÀåÀÇ Àå±âÀûÀÎ Áö¼Ó°¡´É¼ºÀ» À§ÇùÇÒ ¼ö ÀÖ½À´Ï´Ù.

Äڷγª19ÀÇ ¿µÇâ:

Äڷγª19 »çÅ´ eMMC ½ÃÀå¿¡ ´Ù¾çÇÑ ¿µÇâÀ» ¹ÌÃÆ½À´Ï´Ù. ÇÑÆíÀ¸·Î´Â ¹ÝµµÃ¼ °ø±Þ¸ÁÀÇ È¥¶õ°ú Á¦Á¶ Áö¿¬À¸·Î ÀÎÇØ ÀϽÃÀûÀ¸·Î »ý»ê¿¡ Á¦¾àÀÌ ¹ß»ýÇß½À´Ï´Ù. ÇÑÆíÀ¸·Î´Â ¿ø°Ý ±Ù¹«, ¿Â¶óÀÎ ÇнÀ, °¡ÀüÁ¦Ç°¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡·Î eMMC ±â¹Ý ±â±âÀÇ ¼Òºñ°¡ ²ÙÁØÈ÷ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ÆÒµ¥¹Í ÀÌÈÄ µðÁöÅÐ ÀÎÇÁ¶ó¿¡ ´ëÇÑ ÅõÀÚ°¡ Àç°³µÇ°í, Ä¿³ØÆ¼µå µð¹ÙÀ̽ºÀÇ µµÀÔÀÌ °¡¼ÓÈ­µÇ¸é¼­ ¼ºÀå¼¼°¡ Áö¼ÓµÇ°í ÀÖ½À´Ï´Ù. ÀÌ À§±â´Â ºñ¿ë È¿À²ÀûÀÎ ½ºÅ丮Áö ¼Ö·ç¼ÇÀÇ Á߿伺À» ºÎ°¢½ÃÄ×°í, eMMC¸¦ °¡°Ý¿¡ ¹Î°¨ÇÑ ÀüÀÚÁ¦Ç° ºÐ¾ß¿¡¼­ ¾ÈÁ¤ÀûÀÎ ¼±ÅÃÀ¸·Î ÀÚ¸®¸Å±èÇÏ°Ô Çß½À´Ï´Ù.

¿¹Ãø ±â°£ µ¿¾È NAND Ç÷¡½Ã ºÎ¹®ÀÌ °¡Àå Ŭ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

³½µåÇ÷¡½Ã ºÎ¹®Àº ÀúÀü·ÂÀ¸·Î °í¹Ðµµ ½ºÅ丮Áö¸¦ Á¦°øÇÒ ¼ö ÀÖ´Ù´Â Á¡¿¡¼­ ¿¹Ãø ±â°£ µ¿¾È °¡Àå Å« ½ÃÀå Á¡À¯À²À» Â÷ÁöÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. NAND Ç÷¡½Ã´Â ½º¸¶Æ®Æù, ÅÂºí¸´, Ä«¸Þ¶ó, Â÷·®¿ë ÀüÀÚ±â±â¿¡ ±¤¹üÀ§ÇÏ°Ô Å¾ÀçµÇ¾î eMMC ¼Ö·ç¼ÇÀÇ ±Ù°£ÀÌ µÇ°í ÀÖ½À´Ï´Ù. Àú·ÅÇÑ °¡°Ý°ú ÄÄÆÑÆ®ÇÑ µðÀÚÀΰúÀÇ È£È¯¼ºÀº ÈÞ´ë¿ë ±â±â¿¡¼­ÀÇ ¿ìÀ§¸¦ °­È­Çϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ¸ÖƼ ·¹º§ ¼¿ ¹× 3D NAND ±â¼úÀÇ ¹ßÀüÀ¸·Î ÀúÀå ¿ë·®ÀÌ Çâ»óµÇ¾î eMMC ½ÃÀå¿¡¼­ NAND Ç÷¡½ÃÀÇ ¸®´õ½ÊÀÌ ´õ¿í °­È­µÇ°í ÀÖ½À´Ï´Ù.

¿¹Ãø ±â°£ µ¿¾È °í¼Ó ÀÎÅÍÆäÀ̽º ºÎ¹®ÀÌ °¡Àå ³ôÀº CAGRÀ» ³ªÅ¸³¾ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

¿¹Ãø ±â°£ µ¿¾È °í¼Ó ÀÎÅÍÆäÀ̽º ºÐ¾ß°¡ °¡Àå ³ôÀº ¼ºÀå·üÀ» º¸ÀÏ °ÍÀ¸·Î ¿¹»óµÇ¸ç, ÀÌ´Â ºü¸¥ ºÎÆÃ ½Ã°£ ¹× ¿ëµµ ¼º´É Çâ»ó¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡¿¡ ÈûÀÔÀº °ÍÀÔ´Ï´Ù. ¿þ¾î·¯ºí, ÀÎÆ÷Å×ÀÎ¸ÕÆ® ½Ã½ºÅÛ, ¹Ìµå ·¹ÀÎÁö ½º¸¶Æ®Æù°ú °°Àº Ãֽбâ±â´Â ¿øÈ°ÇÑ »ç¿ëÀÚ °æÇèÀ» º¸ÀåÇϱâ À§ÇØ °í¼Ó eMMC ÀÎÅÍÆäÀ̽º¿¡ Å©°Ô ÀÇÁ¸Çϰí ÀÖ½À´Ï´Ù. IoT¿Í AI¸¦ Áö¿øÇÏ´Â ÀüÀÚ±â±âÀÇ µîÀåÀº ÀÌ·¯ÇÑ Ãß¼¼¸¦ ´õ¿í °¡¼ÓÈ­½Ã۰í ÀÖ½À´Ï´Ù. Á¦Á¶¾÷üµéÀº ºü¸¥ ÀÀ´ä¼º¿¡ ´ëÇÑ ¼ÒºñÀÚÀÇ ±â´ë¿¡ ºÎÀÀÇϱâ À§ÇØ ³ë·ÂÇϰí ÀÖÀ¸¸ç, °í¼Ó ÀÎÅÍÆäÀ̽º´Â ¾÷°è Àü¹Ý¿¡ °ÉÃÄ ±Þ¼ÓÇÑ º¸±ÞÀ» ±â·ÏÇÒ °ÍÀ¸·Î º¸ÀÔ´Ï´Ù.

°¡Àå Å« Á¡À¯À²À» Â÷ÁöÇÏ´Â Áö¿ª

¿¹Ãø ±â°£ µ¿¾È ¾Æ½Ã¾ÆÅÂÆò¾çÀÌ °¡Àå Å« ½ÃÀå Á¡À¯À²À» Â÷ÁöÇÒ °ÍÀ¸·Î ¿¹»óµÇ¸ç, ±× ¿øµ¿·ÂÀº ¹ÝµµÃ¼ Á¦Á¶ ¹× °¡ÀüÁ¦Ç° »ý»ê¿¡¼­ÀÇ ¿ìÀ§¿¡ ±âÀÎÇÕ´Ï´Ù. Áß±¹, Çѱ¹, ´ë¸¸, ÀϺ»°ú °°Àº ±¹°¡µéÀº ÁÖ¿ä ¸Þ¸ð¸® Ä¨ Á¦Á¶¾÷ü¸¦ º¸À¯Çϰí ÀÖ¾î °­·ÂÇÑ °ø±Þ ´É·ÂÀ» È®º¸Çϰí ÀÖ½À´Ï´Ù. ½º¸¶Æ®ÆùÀÇ ±Þ¼ÓÇÑ º¸±Þ, Â÷·®¿ë ÀüÀÚÁ¦Ç°ÀÇ È®´ë, Àúºñ¿ë ½ºÅ丮Áö¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡°¡ ¼ºÀåÀ» ´õ¿í ÃËÁøÇϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ±¹³» ¹ÝµµÃ¼ »ê¾÷À» °­È­Çϱâ À§ÇÑ Á¤ºÎÀÇ ÀÌ´Ï¼ÅÆ¼ºêÀÌ ÀÌ Áö¿ªÀÇ ¸®´õ½ÊÀ» °­È­Çϰí ÀÖ½À´Ï´Ù. ¾Æ½Ã¾ÆÅÂÆò¾çÀº ¿©ÀüÈ÷ eMMC ¼ö¿ä ¹× °ø±ÞÀÇ Áß½ÉÀÌ µÇ°í ÀÖ½À´Ï´Ù.

CAGRÀÌ °¡Àå ³ôÀº Áö¿ª:

¿¹Ãø ±â°£ µ¿¾È ºÏ¹Ì°¡ °¡Àå ³ôÀº CAGRÀ» º¸ÀÏ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ÀÌ´Â Ä¿³ØÆ¼µå µð¹ÙÀ̽º, »ê¾÷ ÀÚµ¿È­, ÀÚµ¿Â÷¿ë ÀÏ·ºÆ®·Î´Ð½ºÀÇ Ã¤ÅÃÀÌ Áõ°¡Çϰí Àֱ⠶§¹®ÀÔ´Ï´Ù. ¹Ì±¹Àº °­·ÂÇÑ R&D ÅõÀÚ¿Í ¼ÒºñÀÚ ¹× ±â¾÷¿ë ¿ëµµ¿¡¼­ ÷´Ü ÀÓº£µðµå ¸Þ¸ð¸®¿¡ ´ëÇÑ ¼ö¿ä¸¦ ÁÖµµÇϰí ÀÖ½À´Ï´Ù. µðÁöÅÐ ÇコÄÉ¾î ¹× ½º¸¶Æ® ¿þ¾î·¯ºíÀÇ ³ôÀº äÅ÷ü°ú ÇÔ²² IoT È®»êÀÇ ¼ºÀåÀº Áö¿ªÀû È®ÀåÀ» ÃËÁøÇϰí ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ÇÏÀÌÅ×Å© ´ë±â¾÷°ú ¹ÝµµÃ¼ Á¦Á¶¾÷üÀÇ Çù¾÷Àº ½ÃÀå ±âȸ¸¦ °­È­ÇÏ¿© ºÏ¹Ì¸¦ °¡Àå ºü¸£°Ô ¼ºÀåÇÏ´Â Áö¿ªÀ¸·Î ¸¸µé°í ÀÖ½À´Ï´Ù.

¹«·á Ä¿½ºÅ͸¶ÀÌ¡ ¼­ºñ½º:

º» º¸°í¼­¸¦ ±¸µ¶ÇÏ´Â °í°´Àº ´ÙÀ½°ú °°Àº ¹«·á ¸ÂÃãÈ­ ¿É¼Ç Áß Çϳª¸¦ ÀÌ¿ëÇÒ ¼ö ÀÖ½À´Ï´Ù.

  • ±â¾÷¼Ò°³
    • Ãß°¡ ½ÃÀå ±â¾÷ÀÇ Á¾ÇÕÀûÀÎ ÇÁ·ÎÆÄÀϸµ(ÃÖ´ë 3°³»ç±îÁö)
    • ÁÖ¿ä ±â¾÷ÀÇ SWOT ºÐ¼®(3°³»ç±îÁö)
  • Áö¿ª ¼¼ºÐÈ­
    • °í°´ÀÇ °ü½É¿¡ µû¸¥ ÁÖ¿ä ±¹°¡º° ½ÃÀå ÃßÁ¤, ¿¹Ãø, CAGR(ÁÖ: Ÿ´ç¼º È®Àο¡ µû¶ó ´Ù¸§)
  • °æÀï»ç º¥Ä¡¸¶Å·
    • Á¦Ç° Æ÷Æ®Æú¸®¿À, Áö¸®Àû ÀÔÁö, Àü·«Àû Á¦ÈÞ¸¦ ±â¹ÝÀ¸·Î ÇÑ ÁÖ¿ä ±â¾÷ º¥Ä¡¸¶Å·

¸ñÂ÷

Á¦1Àå ÁÖ¿ä ¿ä¾à

Á¦2Àå ¼­¹®

  • °³¿ä
  • ÀÌÇØ°ü°èÀÚ
  • Á¶»ç ¹üÀ§
  • Á¶»ç ¹æ¹ý
    • µ¥ÀÌÅÍ ¸¶ÀÌ´×
    • µ¥ÀÌÅÍ ºÐ¼®
    • µ¥ÀÌÅÍ °ËÁõ
    • Á¶»ç Á¢±Ù
  • Á¶»ç ÀÚ·á
    • 1Â÷ Á¶»ç ÀÚ·á
    • 2Â÷ Á¶»ç Á¤º¸¿ø
    • ÀüÁ¦Á¶°Ç

Á¦3Àå ½ÃÀå µ¿Ç⠺м®

  • ¼ºÀå ÃËÁø¿äÀÎ
  • ¼ºÀå ¾ïÁ¦¿äÀÎ
  • ±âȸ
  • À§Çù
  • ¿ëµµ ºÐ¼®
  • ÃÖÁ¾»ç¿ëÀÚ ºÐ¼®
  • ½ÅÈï ½ÃÀå
  • COVID-19ÀÇ ¿µÇâ

Á¦4Àå PorterÀÇ Five Forces ºÐ¼®

  • °ø±Þ ±â¾÷ÀÇ ±³¼··Â
  • ¹ÙÀ̾îÀÇ ±³¼··Â
  • ´ëüǰÀÇ À§Çù
  • ½Å±Ô ÁøÃâ¾÷üÀÇ À§Çù
  • °æÀï ±â¾÷°£ °æÀï °ü°è

Á¦5Àå ¼¼°èÀÇ ÀÓº£µðµå ¸ÖƼ¹Ìµð¾î Ä«µå(eMMC) ½ÃÀå : À¯Çüº°

  • ³½µåÇ÷¡½Ã
  • ¸Þ¸ð¸®
  • ÀüÀÚ MMC

Á¦6Àå ¼¼°èÀÇ ÀÓº£µðµå ¸ÖƼ¹Ìµð¾î Ä«µå(eMMC) ½ÃÀå : ½ºÅ丮Áö ¿ë·®º°

  • 8GB ¹Ì¸¸
  • 8GB-16GB
  • 16GB-64GB
  • 64GB-128GB
  • 128GB ÀÌ»ó

Á¦7Àå ¼¼°èÀÇ ÀÓº£µðµå ¸ÖƼ¹Ìµð¾î Ä«µå(eMMC) ½ÃÀå : ÀÎÅÍÆäÀ̽ºº°

  • °í¼Ó ÀÎÅÍÆäÀ̽º
  • Ç¥ÁØ ÀÎÅÍÆäÀ̽º

Á¦8Àå ¼¼°èÀÇ ÀÓº£µðµå ¸ÖƼ¹Ìµð¾î Ä«µå(eMMC) ½ÃÀå : ÆÐŰÁö À¯Çüº°

  • º¼ ±×¸®µå ¾î·¹ÀÌ(BGA)
  • ÆÐŰÁö ¿Â ÆÐŰÁö(PoP)
  • Ĩ ¿Âº¸µå(CoB)

Á¦9Àå ¼¼°èÀÇ ÀÓº£µðµå ¸ÖƼ¹Ìµð¾î Ä«µå(eMMC) ½ÃÀå : ¿ëµµº°

  • ½º¸¶Æ®Æù
  • ÅÂºí¸´
  • µðÁöÅÐ Ä«¸Þ¶ó
  • GPS ½Ã½ºÅÛ
  • E-reader
  • ±âŸ ¿ëµµ

Á¦10Àå ¼¼°èÀÇ ÀÓº£µðµå ¸ÖƼ¹Ìµð¾î Ä«µå(eMMC) ½ÃÀå : ÃÖÁ¾»ç¿ëÀÚº°

  • °¡Àü
  • ÀÚµ¿Â÷
  • Ç×°ø¿ìÁÖ ¹× ¹æÀ§
  • »ê¾÷
  • ±âŸ ÃÖÁ¾»ç¿ëÀÚ

Á¦11Àå ¼¼°èÀÇ ÀÓº£µðµå ¸ÖƼ¹Ìµð¾î Ä«µå(eMMC) ½ÃÀå : Áö¿ªº°

  • ºÏ¹Ì
    • ¹Ì±¹
    • ij³ª´Ù
    • ¸ß½ÃÄÚ
  • À¯·´
    • µ¶ÀÏ
    • ¿µ±¹
    • ÀÌÅ»¸®¾Æ
    • ÇÁ¶û½º
    • ½ºÆäÀÎ
    • ±âŸ À¯·´
  • ¾Æ½Ã¾ÆÅÂÆò¾ç
    • ÀϺ»
    • Áß±¹
    • Àεµ
    • È£ÁÖ
    • ´ºÁú·£µå
    • Çѱ¹
    • ±âŸ ¾Æ½Ã¾ÆÅÂÆò¾ç
  • ³²¹Ì
    • ¾Æ¸£ÇîÆ¼³ª
    • ºê¶óÁú
    • Ä¥·¹
    • ±âŸ ³²¹Ì
  • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«
    • »ç¿ìµð¾Æ¶óºñ¾Æ
    • ¾Æ¶ø¿¡¹Ì¸®Æ®(UAE)
    • īŸ¸£
    • ³²¾ÆÇÁ¸®Ä«°øÈ­±¹
    • ±âŸ Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«

Á¦12Àå ÁÖ¿ä ¹ßÀü

  • °è¾à, ÆÄÆ®³Ê½Ê, Çù¾÷ ¹× ÇÕÀÛÅõÀÚ(JV)
  • Àμö¿Í ÇÕº´
  • ½ÅÁ¦Ç° ¹ß¸Å
  • »ç¾÷ È®´ë
  • ±âŸ ÁÖ¿ä Àü·«

Á¦13Àå ±â¾÷ ÇÁ·ÎÆÄÀϸµ

  • Samsung Electronics
  • SK Hynix
  • KIOXIA Corporation
  • Western Digital
  • Micron Technology
  • Phison Electronics
  • Kingston Technology
  • Longsys
  • Silicon Motion Technology
  • BIWIN Storage Technology
  • SMART Global Holdings
  • Transcend Information
  • Swissbit
  • Flexxon
  • Greenliant Systems
  • ADATA Technology
LSH

According to Stratistics MRC, the Global Embedded Multimedia Card Market is accounted for $12.3 billion in 2025 and is expected to reach $17.4 billion by 2032 growing at a CAGR of 3.5% during the forecast period. Embedded Multimedia Cards are a type of non-volatile flash storage commonly found in smartphones, tablets, and budget laptops. An eMMC chip combines a NAND flash memory component and a controller onto a single piece of silicon. This integrated design simplifies the host device's motherboard, as the controller handles complex data management tasks like wear-leveling and error correction. Unlike removable SD cards, an eMMC is soldered directly onto the device's motherboard, making it a permanent and durable storage solution. eMMCs offer a balance of affordability, compact size, and decent performance.

According to the Consumer Technology Association (CTA), the robust growth of affordable IoT devices and smart home appliances in emerging economies continues to sustain demand for cost-effective, high-density NAND flash storage solutions.

Market Dynamics:

Driver:

Growing adoption in smartphones and tablets

The embedded multimedia card market is primarily driven by the rising integration of eMMC storage in smartphones and tablets, owing to its compact design and cost-effectiveness. As mobile devices increasingly demand faster data access and optimized storage solutions, eMMC provides a reliable balance between performance and affordability. The exponential growth of mobile internet usage, app downloads, and multimedia consumption further strengthens adoption. Fueled by surging demand in emerging economies, smartphones and tablets remain the largest consumers of eMMC technology.

Restraint:

Limited scalability compared to SSD solutions

A significant restraint for the eMMC market is its limited scalability compared to advanced solid-state drive (SSD) solutions. While eMMC is cost-effective and space-efficient, it lacks the higher storage capacities and faster read/write speeds offered by SSDs. As data-intensive applications like gaming and 4K video streaming rise, manufacturers face challenges in meeting performance expectations. Furthermore, SSDs are becoming more affordable, narrowing the cost advantage of eMMC. Consequently, limited scalability constrains eMMC's competitiveness in high-end consumer and enterprise storage applications.

Opportunity:

Rising adoption in industrial automation equipment

The eMMC market is witnessing promising opportunities with increasing adoption in industrial automation equipment and embedded systems. Industrial devices require reliable, durable, and compact memory solutions capable of operating in harsh environments, where eMMC fits well. Spurred by Industry 4.0 advancements, demand for embedded storage in robotics, control systems, and IoT devices is growing rapidly. Moreover, eMMC's low power consumption and robust performance under industrial workloads strengthen its appeal. This expanding industrial adoption opens lucrative pathways beyond consumer electronics applications.

Threat:

Competition from emerging flash memory technologies

The embedded multimedia card market faces threats from emerging flash memory technologies such as UFS (Universal Flash Storage) and NVMe. These advanced solutions offer significantly faster data transfer speeds and higher performance, attracting adoption in flagship devices. As manufacturers transition to superior alternatives, eMMC risks losing relevance in premium applications. Furthermore, the rapid pace of innovation in flash storage accelerates competitive pressure. Without technological upgrades, eMMC may remain confined to low-to-mid-tier devices, threatening its long-term market sustainability.

Covid-19 Impact:

The COVID-19 pandemic had a mixed impact on the eMMC market. On one hand, disruptions in semiconductor supply chains and manufacturing delays temporarily constrained production. On the other, remote work, online learning, and rising demand for consumer electronics fueled strong consumption of eMMC-based devices. Post-pandemic, renewed investments in digital infrastructure, combined with accelerated adoption of connected devices, have sustained growth. The crisis highlighted the importance of cost-efficient storage solutions, positioning eMMC as a stable choice in price-sensitive electronics segments.

The NAND flash segment is expected to be the largest during the forecast period

The NAND flash segment is expected to account for the largest market share during the forecast period, owing to its ability to deliver high-density storage with low power consumption. NAND flash is widely integrated into smartphones, tablets, cameras, and automotive electronics, making it the backbone of eMMC solutions. Its affordability and compatibility with compact designs strengthen dominance in portable devices. Additionally, advancements in multi-level cell and 3D NAND technologies enhance storage capacities, further consolidating NAND flash's leadership in the eMMC market.

The high-speed interface segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the high-speed interface segment is predicted to witness the highest growth rate, impelled by increasing demand for faster boot times and enhanced application performance. Modern devices such as wearables, infotainment systems, and mid-range smartphones rely heavily on high-speed eMMC interfaces to ensure smooth user experiences. The rise of IoT and AI-enabled electronics further accelerates this trend. With manufacturers striving to meet consumer expectations for quick responsiveness, high-speed interfaces are set to record rapid adoption across industries.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, driven by its dominance in semiconductor manufacturing and consumer electronics production. Countries like China, South Korea, Taiwan, and Japan host leading memory chip makers, ensuring strong supply capabilities. Rapid smartphone adoption, expanding automotive electronics, and rising demand for low-cost storage further support growth. Additionally, government initiatives to strengthen domestic semiconductor industries amplify regional leadership. Asia Pacific remains the central hub for eMMC demand and supply.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, attributed to increasing adoption of connected devices, industrial automation, and automotive electronics. The U.S. leads with strong R&D investments and demand for advanced embedded memory in consumer and enterprise applications. Growth in IoT deployments, combined with high adoption of digital healthcare and smart wearables, drives regional expansion. Moreover, collaborations between tech giants and semiconductor manufacturers reinforce market opportunities, making North America the fastest-growing region.

Key players in the market

Some of the key players in Embedded Multimedia Card Market include Samsung Electronics, SK Hynix, KIOXIA Corporation, Western Digital, Micron Technology, Phison Electronics, Kingston Technology, Longsys, Silicon Motion Technology, BIWIN Storage Technology, SMART Global Holdings, Transcend Information, Swissbit, Flexxon, Greenliant Systems, and ADATA Technology.

Key Developments:

In August 2025, Samsung Electronics launched its next-generation Embedded Multimedia Card featuring enhanced data transfer speeds and improved reliability. The product targets automotive and industrial applications requiring durable and high-performance storage solutions.

In July 2025, SK Hynix introduced an advanced eMMC product with increased capacity and optimized power efficiency. This was designed to meet rising demands in mobile devices and Internet of Things (IoT) applications.

In June 2025, KIOXIA Corporation rolled out new eMMC solutions incorporating advanced error correction and security features, addressing critical data integrity and protection requirements in consumer electronics and automotive markets.

Types Covered:

  • NAND Flash
  • DRAM
  • eMMC

Storage Capacities Covered:

  • Less Than 8GB
  • 8GB To 16GB
  • 16GB To 64GB
  • 64GB To 128GB
  • More Than 128GB

Interfaces Covered:

  • High-Speed Interface
  • Standard Interface

Packaging Types Covered:

  • Ball Grid Array (BGA)
  • Package On Package (PoP)
  • Chip On Board (CoB)

Applications Covered:

  • Smartphones
  • Tablets
  • Digital Cameras
  • GPS Systems
  • E-readers
  • Other Applications

End Users Covered:

  • Consumer Electronics
  • Automotive
  • Aerospace & Defense
  • Industrial
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Embedded Multimedia Card Market, By Type

  • 5.1 Introduction
  • 5.2 NAND Flash
  • 5.3 DRAM
  • 5.4 eMMC

6 Global Embedded Multimedia Card Market, By Storage Capacity

  • 6.1 Introduction
  • 6.2 Less Than 8GB
  • 6.3 8GB To 16GB
  • 6.4 16GB To 64GB
  • 6.5 64GB To 128GB
  • 6.6 More Than 128GB

7 Global Embedded Multimedia Card Market, By Interface

  • 7.1 Introduction
  • 7.2 High-Speed Interface
  • 7.3 Standard Interface

8 Global Embedded Multimedia Card Market, By Packaging Type

  • 8.1 Introduction
  • 8.2 Ball Grid Array (BGA)
  • 8.3 Package On Package (PoP)
  • 8.4 Chip On Board (CoB)

9 Global Embedded Multimedia Card Market, By Application

  • 9.1 Introduction
  • 9.2 Smartphones
  • 9.3 Tablets
  • 9.4 Digital Cameras
  • 9.5 GPS Systems
  • 9.6 E-readers
  • 9.7 Other Applications

10 Global Embedded Multimedia Card Market, By End User

  • 10.1 Introduction
  • 10.2 Consumer Electronics
  • 10.3 Automotive
  • 10.4 Aerospace & Defense
  • 10.5 Industrial
  • 10.6 Other End Users

11 Global Embedded Multimedia Card Market, By Geography

  • 11.1 Introduction
  • 11.2 North America
    • 11.2.1 US
    • 11.2.2 Canada
    • 11.2.3 Mexico
  • 11.3 Europe
    • 11.3.1 Germany
    • 11.3.2 UK
    • 11.3.3 Italy
    • 11.3.4 France
    • 11.3.5 Spain
    • 11.3.6 Rest of Europe
  • 11.4 Asia Pacific
    • 11.4.1 Japan
    • 11.4.2 China
    • 11.4.3 India
    • 11.4.4 Australia
    • 11.4.5 New Zealand
    • 11.4.6 South Korea
    • 11.4.7 Rest of Asia Pacific
  • 11.5 South America
    • 11.5.1 Argentina
    • 11.5.2 Brazil
    • 11.5.3 Chile
    • 11.5.4 Rest of South America
  • 11.6 Middle East & Africa
    • 11.6.1 Saudi Arabia
    • 11.6.2 UAE
    • 11.6.3 Qatar
    • 11.6.4 South Africa
    • 11.6.5 Rest of Middle East & Africa

12 Key Developments

  • 12.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 12.2 Acquisitions & Mergers
  • 12.3 New Product Launch
  • 12.4 Expansions
  • 12.5 Other Key Strategies

13 Company Profiling

  • 13.1 Samsung Electronics
  • 13.2 SK Hynix
  • 13.3 KIOXIA Corporation
  • 13.4 Western Digital
  • 13.5 Micron Technology
  • 13.6 Phison Electronics
  • 13.7 Kingston Technology
  • 13.8 Longsys
  • 13.9 Silicon Motion Technology
  • 13.10 BIWIN Storage Technology
  • 13.11 SMART Global Holdings
  • 13.12 Transcend Information
  • 13.13 Swissbit
  • 13.14 Flexxon
  • 13.15 Greenliant Systems
  • 13.16 ADATA Technology
»ùÇà ¿äû ¸ñ·Ï
0 °ÇÀÇ »óǰÀ» ¼±Åà Áß
¸ñ·Ï º¸±â
Àüü»èÁ¦