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Printed and Embedded Sensor Electronics Market Forecasts to 2032 - Global Analysis By Component, Sensor, Printing & Manufacturing Process, Application, End User and By Geography

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  • Samsung Electronics Co., Ltd.
  • LG Display Co., Ltd.
  • DuPont de Nemours, Inc.
  • BASF SE
  • Agfa-Gevaert Group
  • Molex, LLC
  • E Ink Holdings Inc.
  • NovaCentrix
  • Nissha Co., Ltd.
  • Palo Alto Research Center Incorporated(PARC)
  • Renesas Electronics Corporation
  • ISORG SA
  • Canatu Oy
  • Optomec, Inc.
  • GSI Technologies LLC
  • Thin Film Electronics ASA
  • Honeywell International Inc.
  • TE Connectivity
  • Bosch Sensortec
  • STMicroelectronics
KTH 25.09.30

According to Stratistics MRC, the Global Printed and Embedded Sensor Electronics Market is accounted for $12.92 billion in 2025 and is expected to reach $20.52 billion by 2032 growing at a CAGR of 6.83% during the forecast period. Printed and embedded sensor electronics are compact, integrable systems fabricated using additive manufacturing techniques on flexible or rigid substrates. These sensors are directly deposited or embedded into surfaces, enabling real-time monitoring of environmental, structural, or physiological parameters. Utilizing conductive inks, thin films, and microfabrication methods, they offer lightweight, low-cost, and scalable solutions for smart packaging, wearables, and industrial automation. Their seamless integration enhances data acquisition, system responsiveness, and design versatility across consumer, healthcare, and IoT applications.

According to the journal Sensors published by MDPI, over 72,000 papers have been published since its inception in 2001, with more than 35,000 papers cited at least 10 times, reflecting the growing academic and industrial relevance of sensor electronics across instrumentation, analytical chemistry, and electrical engineering domains.

Market Dynamics:

Driver:

Growth of the internet of things (IoT) and connected devices

The proliferation of IoT ecosystems across industries is significantly boosting demand for printed and embedded sensor electronics. These sensors enable real-time data acquisition and seamless communication between devices, supporting applications in smart homes, industrial automation, and healthcare monitoring. The miniaturization of electronics and the rise of edge computing are further accelerating sensor integration into everyday objects. As connectivity standards evolve, embedded sensors are becoming central to predictive analytics and autonomous systems.

Restraint:

Performance and durability issues

Factors such as humidity, mechanical stress, and temperature fluctuations can compromise sensor accuracy and lifespan. Manufacturers must invest in robust encapsulation techniques and advanced substrates to overcome these challenges. Additionally, ensuring long-term reliability in dynamic applications like automotive or aerospace remains a technical hurdle. These durability concerns may slow adoption in mission-critical sectors where precision and resilience are non-negotiable.

Opportunity:

Emerging applications in smart textiles and fashion

Printed sensors embedded in fabrics can monitor physiological parameters such as heart rate, hydration, and posture, offering real-time feedback for fitness and healthcare. Designers are experimenting with conductive inks and flexible substrates to create garments that are both functional and aesthetically appealing. This convergence of fashion and technology is also gaining traction in sportswear, military gear, and adaptive clothing for medical use.

Threat:

Intellectual property fragmentation

The rapid pace of innovation in printed and embedded sensor technologies has led to a fragmented intellectual property landscape, with overlapping patents and unclear licensing frameworks. This fragmentation can hinder collaboration, delay product development, and expose companies to legal disputes. Startups and SMEs may struggle to navigate the complex IP terrain, especially when integrating multi-functional sensors into proprietary platforms. Without cohesive IP governance, market growth could be stifled by litigation risks and restricted access to critical technologies.

Covid-19 Impact:

The pandemic catalyzed demand for contactless sensing and remote diagnostics, propelling the adoption of printed and embedded sensors in healthcare and consumer electronics. Supply chain disruptions initially slowed production, but the urgency for scalable, low-cost monitoring solutions revived investment in flexible sensor platforms. Additionally, the shift toward telemedicine and digital health accelerated the integration of sensors into wearable devices and home-based diagnostic kits.

The devices segment is expected to be the largest during the forecast period

The devices segment is expected to account for the largest market share during the forecast period owing to its widespread deployment across industrial, consumer, and medical applications. From smart meters and fitness trackers to environmental monitors and diagnostic tools, sensor-enabled devices are becoming ubiquitous. Their scalability, low power consumption, and adaptability to various form factors make them indispensable in connected ecosystems.

The piezoelectric sensors segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the piezoelectric sensors segment is predicted to witness the highest growth rate due to their unique ability to convert mechanical stress into electrical signals, making them ideal for dynamic sensing environments. These sensors are increasingly used in applications such as structural health monitoring, wearable motion tracking, and energy harvesting systems. Advancements in printable piezoelectric materials and flexible substrates are enabling their integration into curved surfaces and lightweight devices.

Region with largest share:

During the forecast period, the North America region is expected to hold the largest market share driven by robust R&D infrastructure, early technology adoption, and strong demand across healthcare, defense, and consumer electronics. Additionally, the presence of advanced semiconductor and materials research institutions fosters continuous development of high-performance sensor platforms. The region's emphasis on sustainability and automation is also encouraging adoption in packaging and industrial IoT applications.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR fueled by expanding electronics manufacturing hubs, rising healthcare investments, and growing consumer demand for smart devices. Countries like China, South Korea, and India are witnessing rapid adoption of wearable technologies, smart textiles, and embedded sensor solutions in agriculture and environmental monitoring. Government-backed initiatives promoting digital transformation and local innovation are accelerating market penetration.

Key players in the market

Some of the key players in Printed and Embedded Sensor Electronics Market include Samsung Electronics Co., Ltd., LG Display Co., Ltd., DuPont de Nemours, Inc., BASF SE, Agfa-Gevaert Group, Molex, LLC, E Ink Holdings Inc., NovaCentrix, Nissha Co., Ltd., Palo Alto Research Center Incorporated (PARC), Renesas Electronics Corporation, ISORG SA, Canatu Oy, Optomec, Inc., GSI Technologies LLC, Thin Film Electronics ASA, Honeywell International Inc., TE Connectivity, Bosch Sensortec, and STMicroelectronics.

Key Developments:

In August 2025, LG Display announced new OLED panel showcases and technology roadmaps at K-Display 2025, positioning its 4th-generation OLED and automotive displays as the company's near-term focus. The release described product exhibits, demonstrations and LGD's emphasis on OLED leadership for consumer and vehicle displays.

In June 2025, Molex launched TrackLabel BLE printable asset labels to provide real-time asset tracking and visibility for supply chains, improving operational efficiency and security. The announcement positioned the product for wide industrial/commercial deployment and included technical and use-case details.

In March 2025, DuPont announced new circuit materials (e.g., Circuposit(TM) SAP8000 electroless copper and Microfill(TM) SFP-II-M) at the International Electronic Circuits (Shanghai) Exhibition, targeting fine-line, high-performance electronics. The release framed these materials as enabling improved signal integrity and thermal management for next-gen electronics.

Components Covered:

  • Devices
  • Materials

Sensors Covered:

  • Temperature Sensors
  • Piezoelectric Sensors
  • Pressure Sensors
  • Touch/Capacitive Sensors
  • Humidity Sensors
  • Gas Sensors
  • Biosensors
  • Optical Sensors
  • Other Sensors

Printing & Manufacturing Processes Covered:

  • Inkjet Printing
  • Screen Printing
  • Gravure Printing
  • Flexographic Printing
  • Roll-to-roll (R2R) Manufacturing
  • Additive Manufacturing

Applications Covered:

  • Smartphones & Tablets
  • Wearable Devices
  • Gaming & Entertainment
  • Medical Wearables & Patches
  • In-vehicle Sensors & Controls
  • Smart Surfaces & Displays
  • Smart Packaging & RFID Labels
  • Other Applications

End Users Covered:

  • Consumer Electronics
  • Healthcare
  • Automotive & Transportation
  • Aerospace & Defense
  • Building & Construction
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Printed and Embedded Sensor Electronics Market, By Component

  • 5.1 Introduction
  • 5.2 Devices
    • 5.2.1 Displays
    • 5.2.2 Sensors
    • 5.2.3 RFID Tags
    • 5.2.4 Batteries
    • 5.2.5 Lighting
    • 5.2.6 Photovoltaic Cells
    • 5.2.7 Printed Circuit Boards
  • 5.3 Materials
    • 5.3.1 Inks
    • 5.3.2 Substrates
    • 5.3.3 Nanomaterials
    • 5.3.4 Encapsulation & Laminates

6 Global Printed and Embedded Sensor Electronics Market, By Sensor

  • 6.1 Introduction
  • 6.2 Temperature Sensors
  • 6.3 Piezoelectric Sensors
  • 6.4 Pressure Sensors
  • 6.5 Touch/Capacitive Sensors
  • 6.6 Humidity Sensors
  • 6.7 Gas Sensors
  • 6.8 Biosensors
  • 6.9 Optical Sensors
  • 6.10 Other Sensors

7 Global Printed and Embedded Sensor Electronics Market, By Printing & Manufacturing Process

  • 7.1 Introduction
  • 7.2 Inkjet Printing
  • 7.3 Screen Printing
  • 7.4 Gravure Printing
  • 7.5 Flexographic Printing
  • 7.6 Roll-to-roll (R2R) Manufacturing
  • 7.7 Additive Manufacturing

8 Global Printed and Embedded Sensor Electronics Market, By Application

  • 8.1 Introduction
  • 8.2 Smartphones & Tablets
  • 8.3 Wearable Devices
  • 8.4 Gaming & Entertainment
  • 8.5 Medical Wearables & Patches
  • 8.6 In-vehicle Sensors & Controls
  • 8.7 Smart Surfaces & Displays
  • 8.8 Smart Packaging & RFID Labels
  • 8.9 Other Applications

9 Global Printed and Embedded Sensor Electronics Market, By End User

  • 9.1 Introduction
  • 9.2 Consumer Electronics
  • 9.3 Healthcare
  • 9.4 Automotive & Transportation
  • 9.5 Aerospace & Defense
  • 9.6 Building & Construction
  • 9.7 Other End Users

10 Global Printed and Embedded Sensor Electronics Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Samsung Electronics Co., Ltd.
  • 12.2 LG Display Co., Ltd.
  • 12.3 DuPont de Nemours, Inc.
  • 12.4 BASF SE
  • 12.5 Agfa-Gevaert Group
  • 12.6 Molex, LLC
  • 12.7 E Ink Holdings Inc.
  • 12.8 NovaCentrix
  • 12.9 Nissha Co., Ltd.
  • 12.10 Palo Alto Research Center Incorporated (PARC)
  • 12.11 Renesas Electronics Corporation
  • 12.12 ISORG SA
  • 12.13 Canatu Oy
  • 12.14 Optomec, Inc.
  • 12.15 GSI Technologies LLC
  • 12.16 Thin Film Electronics ASA
  • 12.17 Honeywell International Inc.
  • 12.18 TE Connectivity
  • 12.19 Bosch Sensortec
  • 12.20 STMicroelectronics
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