다이렉트 칩 재사용 시장 예측(-2032년) : 칩 유형별, 공급원별, 프로세스별, 최종 사용자별, 지역별 세계 분석

According to Stratistics MRC, the Global Direct Chip Reuse Market is accounted for $2.5 billion in 2025 and is expected to reach $9.1 billion by 2032 growing at a CAGR of 20.2% during the forecast period. Direct Chip Reuse emphasizes sustainable semiconductor practices by reclaiming, reprocessing, and reusing chips directly from discarded electronics without full remanufacturing. This approach reduces electronic waste, conserves raw materials, and lowers production costs while maintaining performance. Adoption is driven by the growing demand for circular economy models and regulatory pressures toward greener technology solutions. Key sectors include consumer electronics, industrial systems, and automotive sectors. With rising focus on eco-friendly supply chains, the market is gaining traction as manufacturers embrace sustainability alongside cost optimization strategies.

Market Dynamics:

Driver:

Cost Efficiency

Cost efficiency is the primary driver for the Direct Chip Reuse market. By recovering and revalidating memory and logic components, manufacturers can materially reduce raw-material and fabrication expenses, protecting margins when wafer supply or lead times are constrained. Reuse shortens procurement cycles and lowers capital tied up in replacement inventory, benefits that appeal to OEMs, EMS providers and aftermarket refurbishers. Furthermore, these cost advantages make refurbished components attractive to price-sensitive segments and encourage service-provider ecosystems that lower the barrier to entry for smaller players.

Restraint:

Quality Assurance Challenges

The mechanical and thermal stresses introduced during removal, cleaning and rework can produce latent defects that are difficult to detect with legacy test regimes, creating reliability uncertainty for system integrators. Fragmented qualification standards, inconsistent provenance tracking and limited warranty frameworks increase validation costs and post-deployment liability for buyers. Consequently, many OEMs insist on extensive retesting, conservative usage policies, or prefer new parts for safety-critical applications, which slows large-scale commercial uptake.

Opportunity:

Advancements in Testing Technologies

Automated optical inspection, X-ray tomography, and scalable electrical testers now detect subtle interconnect and packaging defects more reliably. When combined with machine-learning analysis of multi-modal test data and improved digital traceability, these techniques raise usable yields from recovered components and reduce false rejects. Additionally, standardized test protocols and platformed quality records build buyer confidence and lower re-qualification costs, enabling reuse to move from niche refurbishing into validated supply-chain roles for many end markets.

Threat:

Intellectual Property Risks

Activities such as probing, decapsulation or detailed electrical characterization can inadvertently reveal layout hints, embedded firmware or other proprietary elements that designers wish to safeguard. Unauthorized reverse-engineering or unregulated redistribution of recovered components could erode competitive advantages and result in legal exposure, particularly across jurisdictions with uneven IP enforcement. As a result, many fabless companies and IP owners demand strict contractual controls, audited reuse partners and secure handling processes before consenting to reuse programs.

Covid-19 Impact:

The COVID-19 pandemic had a twofold impact on direct chip reuse, short-term operational disruption and longer-term strategic acceleration. Lockdowns and restricted facility access reduced collection and refurbishment throughput and delayed cross-site certification, creating immediate capacity and logistics setbacks. Conversely, pandemic-era shortages of new semiconductors and supply-chain fragility prompted manufacturers and buyers to explore alternative sources including recovered components and to invest in reuse capability to improve resilience. The net effect was initial operational strain followed by increased strategic interest and targeted investment in reuse programs.

The memory chips segment is expected to be the largest during the forecast period

The memory chips segment is expected to account for the largest market share during the forecast period because DRAM and NAND devices combine high production volumes with standardized packages and well-understood electrical behaviours that simplify recovery and retesting. These attributes reduce per-unit qualification cost and permit high-throughput retesting flows, making memory an economical target for reuse programs. Memory's ubiquity across servers, PCs, consumer devices and industrial systems also provides a steady feedstock of end-of-life modules for harvest. Moreover, because memory often constitutes a meaningful portion of a system's BOM cost, validated reuse delivers tangible savings that accelerate commercial adoption.

The consumer electronics segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the consumer electronics segment is predicted to witness the highest growth rate. Smartphones, tablets, wearables and smart-home devices are replaced rapidly, producing steady streams of end-of-life hardware that secondary markets and refurbishers can harvest at scale. Brands and retailers are also increasingly promoting circular-economy credentials, providing commercial incentives to integrate reuse into refurbishment and buy-back programs. The combination of high volumes, evolving business models and sustainability pressure drives rapid growth in reuse activity in this segment.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share. The region's dominance in electronics manufacturing and dense refurbishment ecosystems ensures abundant feedstock of end-of-life consumer and industrial electronics. Proximity to major OEMs and contract manufacturers shortens reverse-logistics cycles and simplifies qualification workflows, while established component trading hubs and competitive operating costs support scaling of reuse services. Furthermore, the region's long-standing role in global electronics assembly positions it as a natural centre for industrializing chip recovery and validated reuse at scale.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR as consumption of electronic devices grows and policy attention to circularity and supply-chain resilience increases. Rapid device turnover produces accelerating volumes of recoverable components, and regional investment in testing automation, refurbishment startups and digital traceability enhances recovery yields. Additionally, government incentives, evolving e-waste regulation and industry consortia focused on resource efficiency are likely to stimulate new reuse business models, driving faster growth in the region.

Key players in the market

Some of the key players in Direct Chip Reuse Market include TSMC, Intel, Samsung Electronics, AMD, NVIDIA, Arm, Synopsys, Cadence Design Systems, ASE Technology Holding, Amkor Technology, JCET Group, GlobalFoundries, IC Recovery, Xtreme Semiconductor (Chip Recovery(TM)), ChipsRecycle, and Veolia.

Key Developments:

In September 2025, NVIDIA is innovating in GPUs tailored for more efficient data center workloads. Mentioned is a platform that supports reuse of existing GPU systems (Vera Rubin NVL144) with a new Rubin CPX GPU compute tray, indicating reuse of hardware platforms.

In September 2022, Samsung Electronics Co., Ltd. announced its new environmental strategy, a comprehensive effort to join global efforts to tackle climate change. It includes commitments to achieve enterprise-wide net zero carbon emissions and plans to use more renewable energy, as well as to invest in and research new technologies to develop energy-efficient products, increase water reuse and develop carbon capture technology.

Chip Types Covered:

• Processors
• Memory Chips
• Power Management ICs (PMICs)
• Analog & Mixed-Signal Ics
• Microcontrollers (MCUs) & Microprocessors (MPUs)
• Programmable Logic Devices
• RF and Wireless Ics

Sources Covered:

• Consumer Electronics
• Industrial Electronics
• Automotive Electronics
• IT & Telecom Equipment
• Aerospace & Defense Equipment
• Other Sources

Processes Covered:

• Testing, Sorting, and Verification
• De-soldering and Re-balling
• Re-programming
• Re-packaging

End Users Covered:

• Consumer Electronics Manufacturers
• Automotive Industry
• Industrial Automation and Control Systems
• IT & Networking Equipment Providers
• Internet of Things (IoT) and Edge Computing Device Manufacturers
• Medical Device Manufacturers
• Aerospace and Defense (A&D) Contractors
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 End User Analysis
• 3.7 Emerging Markets
• 3.8 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Direct Chip Reuse Market, By Chip Type

• 5.1 Introduction
• 5.2 Processors
• 5.3 Memory Chips
• 5.4 Power Management ICs (PMICs)
• 5.5 Analog & Mixed-Signal Ics
• 5.6 Microcontrollers (MCUs) & Microprocessors (MPUs)
• 5.7 Programmable Logic Devices
• 5.8 RF and Wireless Ics

6 Global Direct Chip Reuse Market, By Source

• 6.1 Introduction
• 6.2 Consumer Electronics
• 6.3 Industrial Electronics
• 6.4 Automotive Electronics
• 6.5 IT & Telecom Equipment
• 6.6 Aerospace & Defense Equipment
• 6.7 Other Sources

7 Global Direct Chip Reuse Market, By Process

• 7.1 Introduction
• 7.2 Testing, Sorting, and Verification
• 7.3 De-soldering and Re-balling
• 7.4 Re-programming
• 7.5 Re-packaging

8 Global Direct Chip Reuse Market, By End User

• 8.1 Introduction
• 8.2 Consumer Electronics Manufacturers
• 8.3 Automotive Industry
• 8.4 Industrial Automation and Control Systems
• 8.5 IT & Networking Equipment Providers
• 8.6 Internet of Things (IoT) and Edge Computing Device Manufacturers
• 8.7 Medical Device Manufacturers
• 8.8 Aerospace and Defense (A&D) Contractors
• 8.9 Other End Users

9 Global Direct Chip Reuse Market, By Geography

• 9.1 Introduction
• 9.2 North America
  • 9.2.1 US
  • 9.2.2 Canada
  • 9.2.3 Mexico
• 9.3 Europe
  • 9.3.1 Germany
  • 9.3.2 UK
  • 9.3.3 Italy
  • 9.3.4 France
  • 9.3.5 Spain
  • 9.3.6 Rest of Europe
• 9.4 Asia Pacific
  • 9.4.1 Japan
  • 9.4.2 China
  • 9.4.3 India
  • 9.4.4 Australia
  • 9.4.5 New Zealand
  • 9.4.6 South Korea
  • 9.4.7 Rest of Asia Pacific
• 9.5 South America
  • 9.5.1 Argentina
  • 9.5.2 Brazil
  • 9.5.3 Chile
  • 9.5.4 Rest of South America
• 9.6 Middle East & Africa
  • 9.6.1 Saudi Arabia
  • 9.6.2 UAE
  • 9.6.3 Qatar
  • 9.6.4 South Africa
  • 9.6.5 Rest of Middle East & Africa

10 Key Developments

• 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 10.2 Acquisitions & Mergers
• 10.3 New Product Launch
• 10.4 Expansions
• 10.5 Other Key Strategies

11 Company Profiling

• 11.1 TSMC
• 11.2 Intel
• 11.3 Samsung Electronics
• 11.4 AMD
• 11.5 NVIDIA
• 11.6 Arm
• 11.7 Synopsys
• 11.8 Cadence Design Systems
• 11.9 ASE Technology Holding
• 11.10 Amkor Technology
• 11.11 JCET Group
• 11.12 GlobalFoundries
• 11.13 IC Recovery
• 11.14 Xtreme Semiconductor (Chip Recovery(TM))
• 11.15 ChipsRecycle
• 11.16 Veolia