레이저 및 마이크로파 보조 박리 시장 예측(-2032년) : 기술별, 용도별, 지역별 세계 분석

According to Stratistics MRC, the Global Laser & Microwave Assisted Delamination Market is accounted for $2.63 billion in 2025 and is expected to reach $5.54 billion by 2032 growing at a CAGR of 11.2% during the forecast period. Laser & Microwave Assisted Delamination involves advanced separation technologies enabling efficient recovery of semiconductor materials, chips, and layered components from used electronic assemblies. Utilizing high-precision laser and microwave processes, this method minimizes damage, reduces chemical usage, and supports eco-friendly recycling of valuable materials. The market is expanding as industries prioritize sustainable electronics manufacturing, resource recovery, and reduced e-waste. Growing adoption across consumer electronics, automotive, and renewable energy applications is fueling demand, positioning this technology as a cornerstone for circular economy-driven semiconductor processing solutions.

Market Dynamics:

Driver:

Precision and Efficiency

Unlike traditional mechanical methods, these advanced techniques enable targeted, non-contact material separation, drastically minimizing damage to valuable underlying components. This is critical in sectors like electronics recycling and semiconductor manufacturing, where preserving the integrity of reclaimed materials or delicate circuits is paramount for profitability. The resulting higher yield rates and reduced waste translate directly into significant operational cost savings and enhanced process reliability, compelling manufacturers to adopt these technologies.

Restraint:

High Initial Investment

Market expansion is tempered by the substantial capital expenditure required for laser and microwave delamination equipment. These systems incorporate sophisticated components, including high-power lasers and precise control units, which incur significant manufacturing costs. For small and medium-sized enterprises, this high entry cost presents a major financial barrier to adoption. Furthermore, the total cost of ownership extends beyond the initial purchase to include specialized operator training and maintenance, making the return-on-investment calculation a considerable hurdle that can slow down widespread market penetration, particularly in cost-sensitive regions.

Opportunity:

Growth in Electric Vehicle (EV) Market

Market expansion is tempered by the substantial capital expenditure required for laser and microwave delamination equipment. These systems incorporate sophisticated components, including high-power lasers and precise control units, which incur significant manufacturing costs. For small and medium-sized enterprises, this high entry cost presents a major financial barrier to adoption. Furthermore, the total cost of ownership extends beyond the initial purchase to include specialized operator training and maintenance, making the return-on-investment calculation a considerable hurdle that can slow down widespread market penetration, particularly in cost-sensitive regions.

Threat:

Competition from Alternative Technologies

Competing technologies, such as advanced chemical processes or improved mechanical separation techniques, are constantly being refined to become more cost-effective and efficient. If these alternatives achieve performance parity at a significantly lower cost, they could capture market share, especially in applications where ultra-high precision is less critical. This competitive pressure forces laser and microwave technology providers to continuously innovate and justify their premium value proposition to maintain relevance.

Covid-19 Impact:

The pandemic initially disrupted the market through severe supply chain bottlenecks and temporary shutdowns in key end-use industries like automotive and electronics manufacturing. This led to project delays and a short-term decline in capital equipment purchases. However, the crisis also accelerated the adoption of automation, highlighting the value of contactless, efficient processes. As global markets recovered, pent-up demand and a renewed focus on high-tech recycling and advanced electronics manufacturing spurred a strong rebound, positioning the market for post-pandemic growth.

The laser-assisted delamination segment is expected to be the largest during the forecast period

The laser-assisted delamination segment is expected to account for the largest market share during the forecast period attributed to its superior precision and established application history in high-value industries. It is the technology of choice for intricate tasks such as semiconductor wafer reclamation and the delicate repair of electronic displays, where absolute control is non-negotiable. Furthermore, its ability to be seamlessly integrated into automated production and recycling lines enhances its appeal for large-scale industrial applications. This widespread applicability and technological maturity ensure its leading position.

The automotive (EV Battery Disassembly) segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the automotive (EV Battery Disassembly) segment is predicted to witness the highest growth rate. This is a direct consequence of the global push towards electrification, creating an urgent need for efficient and safe battery recycling solutions. Laser delamination is uniquely suited for this task, as it allows for the precise separation of battery cells and modules without causing short circuits or thermal runaway. Moreover, stringent new environmental regulations mandating battery recycling are compelling automakers and recyclers to invest in this advanced technology, fueling its remarkable growth rate.

Region with largest share:

During the forecast period, the North America region is expected to hold the largest market share driven by a strong confluence of advanced R&D infrastructure, the early adoption of automation technologies, and the presence of major electronics and aerospace industry players. Additionally, well-defined regulatory frameworks promoting electronics waste recycling and a robust electric vehicle ecosystem create a fertile ground for the deployment of laser and microwave delamination systems. The region's significant investment in technological innovation and its mature industrial base provide a stable and high-value market, ensuring its dominant position in the global landscape.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR fueled by its position as the global hub for electronics manufacturing and its rapidly expanding electric vehicle production, particularly in China, South Korea, and Japan. Governments in these countries are actively supporting the development of domestic EV and semiconductor supply chains, which includes investing in advanced recycling technologies. This massive industrial base, combined with increasing environmental awareness and supportive policies, creates an exceptionally high-growth environment for the adoption of laser and microwave delamination systems.

Key players in the market

Some of the key players in Laser & Microwave Assisted Delamination Market include TRUMPF, Laserax, Laser Photonics, IPG Photonics, Coherent, nLIGHT, Han's Laser, HGLASER, Adapt Laser, Laser Technologies Inc., Sairem, GR3N, Resynergi, ScanCAD Intl., and Hymson Laser.

Key Developments:

In June 2025, IPG Photonics launched new high-power rack-integrated (RI) fiber lasers requiring 60% less floor space. These lasers provide consistent processing results, reduced setup time, and robust operation in humid environments.

In April 2025, TRUMPF introduced a new AI-driven "Cutting Assistant" application that improves laser cutting edge quality by optimizing parameters based on edge photos, targeting better productivity and precision in laser manufacturing.

In November 2024, nLIGHT announced the global launch of a 2 kW dynamic beam-shaping laser (Corona(TM) AFX-2000) designed for significantly faster laser powder bed fusion metal printing with high stability and multiple beam profiles.

Technologies Covered:

• Laser-Assisted Delamination
• Microwave-Assisted Delamination

Applications Covered:

• Electronics Manufacturing & Semiconductor Packaging
• Electronics Recycling (E-Waste)
• Automotive (EV Battery Disassembly)
• Aerospace & Defense (Composite Repair)
• Other Applications

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Technology Type
• 3.7 Application Analysis
• 3.8 Emerging Markets
• 3.9 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Laser & Microwave Assisted Delamination Market, By Technology

• 5.1 Introduction
• 5.2 Laser-Assisted Delamination
• 5.3 Microwave-Assisted Delamination

6 Global Laser & Microwave Assisted Delamination Market, By Application

• 6.1 Introduction
• 6.2 Electronics Manufacturing & Semiconductor Packaging
• 6.3 Electronics Recycling (E-Waste)
• 6.4 Automotive (EV Battery Disassembly)
• 6.5 Aerospace & Defense (Composite Repair)
• 6.6 Other Applications

7 Global Laser & Microwave Assisted Delamination Market, By Geography

• 7.1 Introduction
• 7.2 North America
  • 7.2.1 US
  • 7.2.2 Canada
  • 7.2.3 Mexico
• 7.3 Europe
  • 7.3.1 Germany
  • 7.3.2 UK
  • 7.3.3 Italy
  • 7.3.4 France
  • 7.3.5 Spain
  • 7.3.6 Rest of Europe
• 7.4 Asia Pacific
  • 7.4.1 Japan
  • 7.4.2 China
  • 7.4.3 India
  • 7.4.4 Australia
  • 7.4.5 New Zealand
  • 7.4.6 South Korea
  • 7.4.7 Rest of Asia Pacific
• 7.5 South America
  • 7.5.1 Argentina
  • 7.5.2 Brazil
  • 7.5.3 Chile
  • 7.5.4 Rest of South America
• 7.6 Middle East & Africa
  • 7.6.1 Saudi Arabia
  • 7.6.2 UAE
  • 7.6.3 Qatar
  • 7.6.4 South Africa
  • 7.6.5 Rest of Middle East & Africa

8 Key Developments

• 8.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 8.2 Acquisitions & Mergers
• 8.3 New Product Launch
• 8.4 Expansions
• 8.5 Other Key Strategies

9 Company Profiling

• 9.1 TRUMPF
• 9.2 Laserax
• 9.3 Laser Photonics
• 9.4 IPG Photonics
• 9.5 Coherent
• 9.6 nLIGHT
• 9.7 Han's Laser
• 9.8 HGLASER
• 9.9 Adapt Laser
• 9.10 Laser Technologies Inc.
• 9.11 Sairem
• 9.12 GR3N
• 9.13 Resynergi
• 9.14 ScanCAD Intl.
• 9.15 Hymson Laser