세계의 유리 강화 기판 시장 예측(-2032년) : 기판 유형별, 두께별, 용도별, 최종 사용자별, 지역별 분석

According to Stratistics MRC, the Global Glass-reinforced Substrate Market is accounted for $1.18 billion in 2025 and is expected to reach $1.75 billion by 2032 growing at a CAGR of 5.8% during the forecast period. A glass-reinforced substrate is a composite material combining glass fibers with a resin base to improve strength, durability, and heat resistance. It is widely used in electronics, particularly for printed circuit boards, due to its excellent insulation properties, stability, and resistance to environmental factors, ensuring reliability and performance in demanding electronic and industrial environments.

Market Dynamics:

Driver:

Superior electrical properties for high-frequency applications

The substrates offer enhanced dimensional stability and mechanical strength, supporting miniaturization and multilayer designs in advanced printed circuit boards (PCBs). The growing use of 5G communication systems, radar modules, and high-frequency sensors is amplifying demand for these materials. Emerging trends such as embedded passive components and flexible circuit integration are also boosting adoption. Manufacturers are developing advanced glass-fiber compositions and resin systems to improve performance at GHz frequencies. Continuous R&D in low-loss materials and hybrid laminates is expanding their utility across telecom, aerospace, and automotive electronics.

Restraint:

Lack of established industry process

Variations in glass weave patterns, resin compatibility, and curing parameters affect consistency and yield, posing challenges for mass production. Equipment calibration and handling procedures differ across manufacturers, hindering interoperability and cross-supplier sourcing. The need for specialized etching and lamination processes increases operational complexity. Emerging technologies such as laser-assisted drilling and precision lamination are being explored to standardize fabrication. However, without a unified industry framework or clear qualification standards, large-scale commercialization remains constrained.

Opportunity:

Adoption in next-generation display tech

The growing adoption of advanced display technologies, including OLED, MicroLED, and quantum-dot displays, presents a strong growth opportunity for glass-reinforced substrates. Their superior thermal stability, transparency, and mechanical strength make them ideal for high-resolution, flexible, and curved displays. Advancements in ultra-thin glass composites and hybrid substrates are enabling integration with transparent conductors and flexible circuits. Key developments include collaborations between display manufacturers and material innovators to optimize substrate architecture. The trend toward smart and wearable displays is expected to further expand market penetration in the coming years.

Threat:

Competition from alternative substrate materials

Ceramics offer superior thermal conductivity and mechanical robustness, while organic laminates provide flexibility and cost advantages for consumer electronics. Continuous innovation in polymer-based materials, such as polyimide and liquid crystal polymers (LCPs), is challenging the dominance of glass composites in certain high-frequency applications. To maintain competitiveness, manufacturers are focusing on hybrid glass materials that combine dielectric performance with mechanical resilience. The ongoing shift toward lightweight and thermally efficient substrates is intensifying rivalry among material classes.

Covid-19 Impact:

The pandemic initially disrupted production and supply chains of glass-reinforced substrates due to lockdowns and raw material shortages. However, recovery was accelerated by rising demand for electronic components in medical devices, data centers, and communication infrastructure. The surge in remote working and digital transformation boosted consumption of high-frequency PCBs in consumer and networking electronics. Manufacturers adopted automation, predictive maintenance, and digital quality control to enhance operational resilience. Post-pandemic strategies focus on regionalized manufacturing and sustainable material sourcing to reduce future disruptions.

The printed circuit boards (PCBs) segment is expected to be the largest during the forecast period

The printed circuit boards (PCBs) segment is expected to account for the largest market share during the forecast period, owing to its extensive use in communication, computing, and automotive electronics. Glass-reinforced substrates are essential for high-frequency PCBs due to their superior dielectric stability and reduced signal distortion. The shift toward multilayer and high-density interconnect (HDI) boards is further driving adoption. Technological advancements such as laser drilling, embedded components, and microvia structures are enhancing substrate utilization. Manufacturers are integrating glass-fiber composites with advanced resins to optimize signal performance and heat dissipation.

The aerospace & defense segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the aerospace & defense segment is predicted to witness the highest growth rate, due to the increasing demand for lightweight, durable, and high-performance materials. Glass-reinforced substrates offer excellent mechanical stability and radiation resistance, essential for avionics, radar, and satellite communication systems. The adoption of advanced composites in electronic packaging and control systems is boosting segment growth. Emerging trends include the use of nanocomposite glass fibers and hybrid laminates for enhanced signal reliability under extreme conditions. Defense modernization programs and space exploration projects are further accelerating material innovation.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, due to its strong electronics manufacturing ecosystem and expanding semiconductor production. Countries like China, Japan, South Korea, and Taiwan are leading in PCB fabrication and high-frequency component assembly. Government initiatives supporting local substrate manufacturing and technological self-reliance are enhancing regional capacity. Emerging trends include the development of eco-friendly resins and advanced glass composites for 5G and IoT infrastructure. Major players are investing in automation, cleanroom facilities, and material recycling to improve yield and sustainability.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by rapid innovation in advanced electronics and defense applications. The U.S. leads in R&D for next-generation substrates supporting high-speed data transfer and aerospace technologies. Key developments include integration of low-loss glass composites in AI computing modules, satellite communication, and electric vehicle systems. The region's focus on supply chain resilience and onshoring of PCB production is strengthening local manufacturing. Collaborations between material science firms and OEMs are fostering breakthroughs in hybrid substrate technologies.

Key players in the market

Some of the key players in Glass-reinforced Substrate Market include AGC Inc., Ibiden Co., Corning Inc., Saint-Gobain, Schott AG, Taiwan Gl, Nippon Ele, Toray Indu, NEG, Toppan Inc., Ohara Inc., LG Chem, Plan Optik, HOYA Corp., and Tecnisco.

Key Developments:

In October 2025, Saint-Gobain has signed a definitive agreement with the Brazilian group GG10, owner of the G-Haus brand, for the sale of Tumelero, a retail chain specializing in construction materials, with a strong presence in southern Brazil. Tumelero is currently operating 16 stores and 1 logistic center in Rio Grande do Sul, employs around 580 people and generated revenues of around €40 million in 2024.

In June 2024, Corning Incorporated announced the launch of Corning(R) Gorilla(R) Glass 7i, a new cover glass engineered to deliver improved durability for intermediate and value-segment mobile devices. Gorilla Glass 7i broadens Corning's renowned tough cover glass portfolio, offering better drop and scratch performance compared to competitive lithium aluminosilicate glasses from other manufacturers.

Substrate Types Covered:

• Glass-reinforced Polyimide
• Glass-reinforced Cyanate Ester
• Glass-reinforced BT Resin
• Glass-reinforced PTFE
• Glass-reinforced Epoxy Laminates
• Other Substrate Types

Thicknesses Covered:

• <= 0.1 mm
• 0.1 mm - 0.5 mm
• 0.5 mm - 1 mm
• Above 1 mm

Applications Covered:

• Printed Circuit Boards (PCBs)
• IC Packaging Substrates
• RF & Microwave Components
• Automotive Electronic Modules
• Display Panels
• Other Applications

End Users Covered:

• Consumer Electronics
• Telecommunications
• Aerospace & Defense
• Automotive
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Application Analysis
• 3.7 End User Analysis
• 3.8 Emerging Markets
• 3.9 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Glass-reinforced Substrate Market, By Substrate Type

• 5.1 Introduction
• 5.2 Glass-reinforced Polyimide
• 5.3 Glass-reinforced Cyanate Ester
• 5.4 Glass-reinforced BT Resin
• 5.5 Glass-reinforced PTFE
• 5.6 Glass-reinforced Epoxy Laminates
• 5.7 Other Substrate Types

6 Global Glass-reinforced Substrate Market, By Thickness

• 6.1 Introduction
• 6.2 <= 0.1 mm
• 6.3 0.1 mm - 0.5 mm
• 6.4 0.5 mm - 1 mm
• 6.5 Above 1 mm

7 Global Glass-reinforced Substrate Market, By Application

• 7.1 Introduction
• 7.2 Printed Circuit Boards (PCBs)
• 7.3 IC Packaging Substrates
• 7.4 RF & Microwave Components
• 7.5 Automotive Electronic Modules
• 7.6 Display Panels
• 7.7 Other Applications

8 Global Glass-reinforced Substrate Market, By End User

• 8.1 Introduction
• 8.2 Consumer Electronics
• 8.3 Telecommunications
• 8.4 Aerospace & Defense
• 8.5 Automotive
• 8.6 Other End Users

9 Global Glass-reinforced Substrate Market, By Geography

• 9.1 Introduction
• 9.2 North America
  • 9.2.1 US
  • 9.2.2 Canada
  • 9.2.3 Mexico
• 9.3 Europe
  • 9.3.1 Germany
  • 9.3.2 UK
  • 9.3.3 Italy
  • 9.3.4 France
  • 9.3.5 Spain
  • 9.3.6 Rest of Europe
• 9.4 Asia Pacific
  • 9.4.1 Japan
  • 9.4.2 China
  • 9.4.3 India
  • 9.4.4 Australia
  • 9.4.5 New Zealand
  • 9.4.6 South Korea
  • 9.4.7 Rest of Asia Pacific
• 9.5 South America
  • 9.5.1 Argentina
  • 9.5.2 Brazil
  • 9.5.3 Chile
  • 9.5.4 Rest of South America
• 9.6 Middle East & Africa
  • 9.6.1 Saudi Arabia
  • 9.6.2 UAE
  • 9.6.3 Qatar
  • 9.6.4 South Africa
  • 9.6.5 Rest of Middle East & Africa

10 Key Developments

• 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 10.2 Acquisitions & Mergers
• 10.3 New Product Launch
• 10.4 Expansions
• 10.5 Other Key Strategies

11 Company Profiling

• 11.1 AGC Inc.
• 11.2 Ibiden Co., Ltd.
• 11.3 Corning Incorporated
• 11.4 Saint-Gobain
• 11.5 Schott AG
• 11.6 Taiwan Glass Ind. Corp.
• 11.7 Nippon Electric Glass Co., Ltd.
• 11.8 Toray Industries, Inc.
• 11.9 NEG
• 11.10 Toppan Inc.
• 11.11 Ohara Inc.
• 11.12 LG Chem
• 11.13 Plan Optik AG
• 11.14 HOYA Corporation
• 11.15 Tecnisco Ltd.