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첨단 포장 기술 : 세계 시장 전망(2017-2026년)

Advanced Packaging Technologies - Global Market Outlook (2017-2026)

리서치사 Stratistics Market Research Consulting
발행일 2019년 05월 상품 코드 860145
페이지 정보 영문 168 Pages
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첨단 포장 기술 : 세계 시장 전망(2017-2026년) Advanced Packaging Technologies - Global Market Outlook (2017-2026)
발행일 : 2019년 05월 페이지 정보 : 영문 168 Pages

본 상품은 영문 자료로 한글과 영문목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문목차를 참고해주시기 바랍니다.

세계의 첨단 포장 기술 시장은 2017-2026년간 8.6%의 CAGR로 성장할 것으로 예측됩니다. 신선한 고품질 포장 식품 수요 증가, 전자기기 소형화의 임박한 요건, 식품 장기 보존에 관한 제조업체의 우려 등이 시장 성장을 촉진하고 있습니다.

세계의 첨단 포장 기술(Advanced Packaging Technologies) 시장을 조사했으며, 시장 개요, 종류·기술·최종사용자·지역별 시장 규모 추정과 예측, 시장 성장 촉진요인 및 저해요인 분석, 경쟁 상황, 주요 기업 개요 등의 정보를 제공합니다.

목차

제1장 주요 요약

제2장 서론

제3장 시장 동향 분석

  • 서론
  • 성장 촉진요인
  • 성장 저해요인
  • 시장 기회
  • 위협
  • 기술 분석
  • 최종사용자 분석
  • 신흥 시장
  • 향후 시장 시나리오

제4장 Porters Five Force 분석

  • 구매자의 협상력
  • 공급 기업의 협상력
  • 신규 참여업체의 위협
  • 대체품의 위협
  • 경쟁 기업간 경쟁 관계

제5장 세계의 첨단 포장 기술 시장 : 종류별

  • 서론
  • 플립 칩
  • 2.5차원 집적회로
  • 팬아웃(FO) 실리콘
  • 2차원 집적회로
  • 3차원 집적회로
  • 플립 칩
  • 웨이퍼 레벨 칩 스케일 패키지
  • 기타

제6장 세계의 첨단 포장 기술 시장 : 기술별

  • 서론
  • 스마트 및 인텔리전트 포장
    • RFID
    • 선도 지표
    • TTI 태그 및 라벨
    • 산소 및 이산화탄소 지표
    • 기타
  • 활성 포장
    • 온도 제어 포장
    • MA 포장
    • 활성 포장 시스템
    • 능동적 방출 시스템

제7장 세계의 첨단 포장 기술 시장 : 최종사용자별

  • 서론
  • 항공우주 및 방위
  • 가전
  • IT 및 통신
  • 산업
  • 헬스케어
  • 자동차 및 운송
  • 기타

제8장 세계의 첨단 포장 기술 시장 : 지역별

  • 서론
  • 북미
    • 미국
    • 캐나다
    • 멕시코
  • 유럽
    • 독일
    • 영국
    • 이탈리아
    • 프랑스
    • 스페인
    • 기타
  • 아시아태평양
    • 일본
    • 중국
    • 인도
    • 호주
    • 뉴질랜드
    • 한국
    • 기타
  • 남미
    • 아르헨티나
    • 브라질
    • 칠레
    • 기타
  • 중동 및 아프리카
    • 사우디아라비아
    • 아랍에미리트
    • 카타르
    • 남아프리카공화국
    • 기타

제9장 시장의 주요 동향

  • 계약, 파트너십, 협업, 합작투자
  • 인수합병
  • 신제품 발매
  • 사업 확장
  • 기타 전략

제10장 기업 개요

  • 3M Company
  • Crown Holdings, Inc.
  • Amcor Limited
  • PakSense Inc.
  • Thin Film Electronics ASA
  • CCL Industries Inc.
  • Sealed Air Corporation
  • Vitsab International AB
  • Landec Corporation
  • Timestrip U.K. Ltd.
  • LCR Hallcrest LLC
  • Bemis Company, Inc.
  • Temptime Corporation
  • Cryolog S.A.
  • SYSCO Corporation
KSM 19.06.20

List of Tables

  • Table 1 Global Advanced Packaging Technologies Market Outlook, By Region (2016-2026) ($MN)
  • Table 2 Global Advanced Packaging Technologies Market Outlook, By Type (2016-2026) ($MN)
  • Table 3 Global Advanced Packaging Technologies Market Outlook, By Flip Chip (2016-2026) ($MN)
  • Table 4 Global Advanced Packaging Technologies Market Outlook, By 2.5D Integrated Circuit (2016-2026) ($MN)
  • Table 5 Global Advanced Packaging Technologies Market Outlook, By Fan Out Silicon in Package (2016-2026) ($MN)
  • Table 6 Global Advanced Packaging Technologies Market Outlook, By 2D Integrated Circuit (2016-2026) ($MN)
  • Table 7 Global Advanced Packaging Technologies Market Outlook, By 3D Integrated Circuit (2016-2026) ($MN)
  • Table 8 Global Advanced Packaging Technologies Market Outlook, By Flip Chip (2016-2026) ($MN)
  • Table 9 Global Advanced Packaging Technologies Market Outlook, By Wafer Level Chip Scale Package (2016-2026) ($MN)
  • Table 10 Global Advanced Packaging Technologies Market Outlook, By Other Types (2016-2026) ($MN)
  • Table 11 Global Advanced Packaging Technologies Market Outlook, By Technology (2016-2026) ($MN)
  • Table 12 Global Advanced Packaging Technologies Market Outlook, By Smart and Intelligent Packaging (2016-2026) ($MN)
  • Table 13 Global Advanced Packaging Technologies Market Outlook, By Radio Frequency Identification (RFID) (2016-2026) ($MN)
  • Table 14 Global Advanced Packaging Technologies Market Outlook, By Freshness Indicators (2016-2026) ($MN)
  • Table 15 Global Advanced Packaging Technologies Market Outlook, By TTI Tags & Labels (2016-2026) ($MN)
  • Table 16 Global Advanced Packaging Technologies Market Outlook, By Oxygen and CO2 Indicators (2016-2026) ($MN)
  • Table 17 Global Advanced Packaging Technologies Market Outlook, By Other Technologies (2016-2026) ($MN)
  • Table 18 Global Advanced Packaging Technologies Market Outlook, By Active Packaging (2016-2026) ($MN)
  • Table 19 Global Advanced Packaging Technologies Market Outlook, By Temperature Control Packaging (2016-2026) ($MN)
  • Table 20 Global Advanced Packaging Technologies Market Outlook, By Modified Atmosphere Packaging (2016-2026) ($MN)
  • Table 21 Global Advanced Packaging Technologies Market Outlook, By Active Packaging Systems (2016-2026) ($MN)
  • Table 22 Global Advanced Packaging Technologies Market Outlook, By Active Releasing Systems (2016-2026) ($MN)
  • Table 23 Global Advanced Packaging Technologies Market Outlook, By End User (2016-2026) ($MN)
  • Table 24 Global Advanced Packaging Technologies Market Outlook, By Aerospace & Defense (2016-2026) ($MN)
  • Table 25 Global Advanced Packaging Technologies Market Outlook, By Consumer Electronics (2016-2026) ($MN)
  • Table 26 Global Advanced Packaging Technologies Market Outlook, By IT & Telecommunication (2016-2026) ($MN)
  • Table 27 Global Advanced Packaging Technologies Market Outlook, By Industrial (2016-2026) ($MN)
  • Table 28 Global Advanced Packaging Technologies Market Outlook, By Healthcare (2016-2026) ($MN)
  • Table 29 Global Advanced Packaging Technologies Market Outlook, By Automotive & Transport (2016-2026) ($MN)
  • Table 30 Global Advanced Packaging Technologies Market Outlook, By Other End Users (2016-2026) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.

According to Stratistics MRC, the Advanced Packaging Technology Market is growing at a CAGR of 8.6% from 2017 to 2026. The growth factors include increasing demand for fresh and quality packaged food, manufacturer concern for the longer shelf life of the food products, imminent requirement for size reduction in electronic devices, less power consumption. However, the heating problem in devices restrains the market growth.

Advanced packaging technology is intended to the commercial reality for most integrated-circuit (IC) manufacturers is that node migrations and changes in wafer sizes are slowing down even as capital expenditures are increasing. One way for manufacturers to preserve their edge on their circuits' small sizes, low costs, and high performance is to incorporate newer chip-packaging options such as 2.5-D integrated circuits (2.5DICs) and 3-D integrated circuits (3.0DICs) into their production processes.

Based on Technology, the active packaging technologies systems anticipated with foods, pharmaceuticals, and several other types of products. They help extend shelf life, monitor freshness, display information on quality, improve safety, and improve convenience. Active packaging involves in having active functions beyond the inert passive containment and protection of the product. Intelligent and smart packaging usually involves the ability to sense or measure an attribute of the product, the inner atmosphere of the package, or the shipping environment.

By Geography, Asia-Pacific is expected to grow at a healthy rate, being a major revenue provoking region during the forecast period, primarily owing to the growing population and the customer-side demand.

Some of the key players include in this market 3M Company, Crown Holdings, Inc., Amcor Limited, PakSense Inc., Thin Film Electronics ASA, CCL Industries Inc., Sealed Air Corporation, Vitsab International AB, Landec Corporation, Timestrip U.K. Ltd., LCR Hallcrest LLC, Bemis Company, Inc., Temptime Corporation, Cryolog S.A., SYSCO Corporation.

Types Covered:

  • Flip Chip
  • 2.5D Integrated Circuit
  • Fan Out Silicon in Package
  • 2D Integrated Circuit
  • 3D Integrated Circuit
  • Flip Chip
  • Wafer Level Chip Scale Package
  • Other Type

Technologies Covered:

  • Smart and Intelligent Packaging
  • Active Packaging

End-Users Covered:

  • Aerospace & Defense
  • Consumer Electronics
  • IT & Telecommunication
  • Industrial
  • Aerospace & Defense
  • Healthcare
  • Automotive & Transport
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa
  • What our report offers:
    • - Market share assessments for the regional and country level segments
    • - Strategic recommendations for the new entrants
    • - Market forecasts for a minimum of 9 years of all the mentioned segments, sub segments and the regional markets
    • - Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
    • - Strategic analysis: Drivers and Constraints, Product/Technology Analysis, Porter's five forces analysis, SWOT analysis etc.
    • - Strategic recommendations in key business segments based on the market estimations
    • - Competitive landscaping mapping the key common trends
    • - Company profiling with detailed strategies, financials, and recent developments
    • - Supply chain trends mapping the latest technological advancements
  • Free Customization Offerings:
    • All the customers of this report will be entitled to receive one of the following free customization options:
    • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
    • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the clients interest (Note: Depends of feasibility check)
    • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances.

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Futuristic Market Scenario

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Advanced Packaging Technologies Market, By Type

  • 5.1 Introduction
  • 5.2 Flip Chip
  • 5.3 2.5D Integrated Circuit
  • 5.4 Fan Out Silicon in Package
  • 5.5 2D Integrated Circuit
  • 5.6 3D Integrated Circuit
  • 5.7 Flip Chip
  • 5.8 Wafer Level Chip Scale Package
  • 5.9 Other Types

6 Global Advanced Packaging Technologies Market, By Technology

  • 6.1 Introduction
  • 6.2 Smart and Intelligent Packaging
    • 6.2.1 Radio Frequency Identification (RFID)
    • 6.2.2 Freshness Indicators
    • 6.2.3 TTI Tags & Labels
    • 6.2.4 Oxygen and CO2 Indicators
    • 6.2.5 Other Technologies
  • 6.3 Active Packaging
    • 6.3.1 Temperature Control Packaging
    • 6.3.2 Modified Atmosphere Packaging
    • 6.3.3 Active Packaging Systems
      • 6.3.3.1 Ethylene Absorbers
      • 6.3.3.2 Moisture Scavengers/Absorbers
      • 6.3.3.3 Oxygen Scavengers
    • 6.3.4 Active Releasing Systems
      • 6.3.4.1 Carbon Dioxide Emitters
      • 6.3.4.2 Antioxidant Releasers

7 Global Advanced Packaging Technologies Market, By End User

  • 7.1 Introduction
  • 7.2 Aerospace & Defense
  • 7.3 Consumer Electronics
  • 7.4 IT & Telecommunication
  • 7.5 Industrial
  • 7.6 Healthcare
  • 7.7 Automotive & Transport
  • 7.8 Other End Users

8 Global Advanced Packaging Technologies Market, By Geography

  • 8.1 Introduction
  • 8.2 North America
    • 8.2.1 US
    • 8.2.2 Canada
    • 8.2.3 Mexico
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 UK
    • 8.3.3 Italy
    • 8.3.4 France
    • 8.3.5 Spain
    • 8.3.6 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 Japan
    • 8.4.2 China
    • 8.4.3 India
    • 8.4.4 Australia
    • 8.4.5 New Zealand
    • 8.4.6 South Korea
    • 8.4.7 Rest of Asia Pacific
  • 8.5 South America
    • 8.5.1 Argentina
    • 8.5.2 Brazil
    • 8.5.3 Chile
    • 8.5.4 Rest of South America
  • 8.6 Middle East & Africa
    • 8.6.1 Saudi Arabia
    • 8.6.2 UAE
    • 8.6.3 Qatar
    • 8.6.4 South Africa
    • 8.6.5 Rest of Middle East & Africa

9 Key Developments

  • 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 9.2 Acquisitions & Mergers
  • 9.3 New Product Launch
  • 9.4 Expansions
  • 9.5 Other Key Strategies

10 Company Profiling

  • 10.1 3M Company
  • 10.2 Crown Holdings, Inc.
  • 10.3 Amcor Limited
  • 10.4 PakSense Inc.
  • 10.5 Thin Film Electronics ASA
  • 10.6 CCL Industries Inc.
  • 10.7 Sealed Air Corporation
  • 10.8 Vitsab International AB
  • 10.9 Landec Corporation
  • 10.10 Timestrip U.K. Ltd.
  • 10.11 LCR Hallcrest LLC
  • 10.12 Bemis Company, Inc.
  • 10.13 Temptime Corporation
  • 10.14 Cryolog S.A.
  • 10.15 SYSCO Corporation
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