Global Information
회사소개 | 문의 | 위시리스트

3D 프린트 금속 : 특허 상황 분석(2019년)

3D Printed Metals: A Patent Landscape Analysis 2019

리서치사 SmarTech Analysis
발행일 2019년 07월 상품 코드 666886
페이지 정보 영문
가격
US $ 4,995 ₩ 5,913,000 PDF by E-mail (Single User License)
US $ 5,995 ₩ 7,096,000 PDF by E-mail (Group User license - Up To Five Computers)
US $ 6,995 ₩ 8,280,000 PDF by E-mail (Enterprise User license)


3D 프린트 금속 : 특허 상황 분석(2019년) 3D Printed Metals: A Patent Landscape Analysis 2019
발행일 : 2019년 07월 페이지 정보 : 영문

3D 프린트 금속(3D Printed Metals)과 제조 프로세스에 관한 특허 동향을 조사했으며, 특허 출원인, 현재 양수인, 출원 동향, 인용 동향, 지역별 상황, 특허 품질 평가 등의 정보를 정리했습니다.

제1장 3D 프린트 금속 : 결론 및 제안

  • 조사 범위
  • 결론 및 제안
    • 서론
    • 특허의 지리적 분포
    • 주요 기업

제2장 특허 데이터베이스

제3장 조사 방법

제4장 특허 그레이드 및 스코어 설명

제5장 기술 환경 분석

제6장 차트 및 그래프

  • 현재 양수인 : 특허/특허 출원
  • 동향 : 특허/특허 출원
  • 소송
  • 특허 인용
  • 특허/발명자 스코어
  • 발명자 활동도

제7장 특허 품질 평가

제8장 피인용

제9장 기술 키워드 맵

제10장 결론

LSH 19.08.29

이 페이지에 게재되어 있는 내용은 최신판과 약간 차이가 있을 수 있으므로 영문목차를 함께 참조하여 주시기 바랍니다. 기타 자세한 사항은 문의 바랍니다.

Metals-based 3D printing is one of the fastest growing sectors of the 3D printing industry. SmarTech has already published widely on the growing market opportunities available in this space. Building on our extensive knowledge and understanding of this area, we are now offering an updated and revamped report on the patent landscape for 3D-printed metals. This report will be one of a series of reports on the 3D printing patent landscape.

This report includes an Excel database containing 1,381 worldwide patent references for 3D printing metals and processes used to make them. This database will be a valuable resource to anyone researching the worldwide patent landscape for 3D printing metals. It enables them to determine the top cited patents in their field, how many patents are being filed each year, what patent families are already claimed and where new patent rights may be available. SmarTech's research covers both granted patents and published applications. The information is drawn from U.S., EP, WIPO PCT, Chinese, and Japanese sources.

Companies covered in this report include: 3D Systems, Arcam, Arconic, Batelle, Boeing, Desktop Metal, EOS, ExOne, GE, HC Starck, Halliburton, HP, Honeywell, Johnson Matthey, Raytheon, Ricoh, Sciaky, Siemens, United Technologies, Velo3D and Xerox.

In addition to institutional coverage, this report identifies the leading inventors in the 3D-printed metals field, who they work for, and the value of their patented inventions. SmarTech's patent analysis also reveals the degree to which the public corporate strategy of major firms in the 3D printing metals space is backed up (or not) by patent strategy.

Table of Contents

Section 1: 3D Printed Metals: Conclusions and Recommendations

  • 1.1. Coverage of this Report
  • 1.2. Conclusions and Recommendations
    • 1.2.1. Introduction
    • 1.2.2. The Geography of 3D Printing Metals Patents
    • 1.2.3. Companies in this Sector

Section 2: Patent Database

Section 3: Search Methodology

Section 4: Explanation of Patent Grades and Scores

Section 5: Technology Landscape Analysis

Section 6: Charts and Graphs

  • 6.1. Current Assignee: Patents and Applications
    • 6.1.1. Current Assignee U.S. Patents (Top 20)
    • 6.1.2. Current Assignee U.S. Applications (Top 20)
    • 6.1.3. Original Assignee European Patents (Top 20)
    • 6.1.4. Original Assignee European Applications (Top 10)
    • 6.1.5. Original Assignee WIPO Publications
    • 6.1.6. Original Assignee China Patents
    • 6.1.7. Original Assignee China Applications
    • 6.1.8. Original Assignee Japan Patents
  • 6.2. Trends: Patents and Applications
    • 6.2.1. Trends: U.S. Patents
    • 6.2.2. Trends: U.S. Applications
    • 6.2.3. Trends: European Patents
    • 6.2.4. Trends: European Applications
    • 6.2.5. Trends: WIPO Publications
    • 6.2.6. Trends: China Patents
    • 6.2.7. Trends: China Applications
    • 6.2.8. Trends: Japan Patents
  • 6.3. Litigation Involving Patents Covered by This Report
  • 6.4. Patent Citation
    • 6.4.1. Current Assignee Domestic Citation Count U.S. Patents (Top 10)
    • 6.4.2. Current Assignee Domestic Cited-By US Patents (Top 10)
    • 6.4.3. Original Assignee Domestic Citation Count China Patents (Top 20)
    • 6.4.4. Current Assignee Domestic Cited-By China Patents (Top 20)
  • 6.5. Patent and Inventor Scores
    • 6.5.1. Current Assignee Patent Score U.S. (Top 10)
    • 6.5.2. Current Assignee Inventor Score U.S. (Top 10)
    • 6.5.3. Inventor Patent Score U.S. (Top 10)
    • 6.5.4. Original Assignee Patent Score EP (Top 20)
    • 6.5.5. Inventor Patent Score EP (Top 20)
    • 6.5.6. Original Assignee Patent Score China (Top 20)
    • 6.5.7. Original Assignee Inventor Score China (Top 20)
    • 6.5.8. Inventor Patent Score Japan (Top 10)
  • 6.6. Degree of Inventor Activity
    • 6.6.1. Inventor by Current Assignee U.S. Patents (Top 10)
    • 6.6.2. Inventor by Current Assignee U.S. Applications (Top 10)
    • 6.6.3. Inventor U.S. Patents (Top 20)
    • 6.6.4. Inventor U.S. Applications (Top 20)
    • 6.6.5. Inventor by Original Assignee European Patents (Top 10)
    • 6.6.6. Inventor by Original Assignee European Applications (Top 10)
    • 6.6.7. Inventor European Patents (Top 20)
    • 6.6.8. Inventor European Applications (Top 20)
    • 6.6.9. Inventor by Original Assignee WIPO Publications
    • 6.6.10. Inventor: WIPO Publications
    • 6.6.11. Inventor by Original Assignee China Patents (Top 10)
    • 6.6.12. Inventor: China Applications (Top 10)
    • 6.6.13. Inventor by Original Assignee Japan (Top 10)
    • 6.6.14. Inventor Japan (Top 10)

Section 7: Patent Quality Evaluation

Section 8: Forward Citation

Section 9: Technology Keyword Maps

Section 10: Closing Commentary

  • About SmarTech Analysis

List of Exhibits and PowerPoint Presentations

  • PScores are the representation of the letter grades in the following numerical format
  • Referencing PowerPoints Folder
  • [Presentation 1: TECHNOLOGY LANDSCAPE REPORT]
  • This report and the accompanying Excel database cover the following patents and applications:
  • Top 10 Plaintiffs in 3D Metal Printing Sector
  • List of most recent infringement cases filed in [3D Printing Metals] sector. Click patent numbers to review patent details in full-text.
  • Patent Quality Evaluations by Company [ Referencing PowerPoints folder.]
    • 3D SYSTEMS
    • AHMR GmbH
    • Airbus Defence
    • Arcam
    • Arconic
    • BAM Bundesanstalt
    • Battelle Memorial Institute
    • Boeing
    • California Institute of Technology
    • CC3D LLC
    • Cobra Golf Inc
    • Daido Steel Co Ltd
    • Dartmouth College
    • Delvan Inc
    • Desktop Metal
    • DuPuy Synthes Products Inc
    • EADS Deutschland GmbH
    • Endress & Hauser GmbH
    • EOS
    • A. Raymond et Cie
    • ExOne
    • General Electric Co
    • Georgia Tech Research Corp
    • Glassimetal Technology Inc
    • GM Global Technology Operations
    • HC Starck Inc
    • Halliburton Energy Services
    • Hamilton Sundstrand
    • HP
    • Hilco Patent Acquisition 56 LLC
    • Honeywell International
    • Illinois Tool Works
    • Individual Inventor: Deborah Duen Ling Chung
    • Individual Inventor: Ronald Jones
    • Individual Inventor: William George Struve
    • JIANGSU BOQIAN NEW MATERIALS CO. LTD
    • Johnson Matthey PLC
    • Kennametal Inc
    • Made in Space
    • Massachusetts Institute of Technology
    • MTU Aero Engines
    • Nanocore Technologies
    • Norsk Titanium
    • Raytheon
    • Ricoh
    • Sciaky
    • Siemens Energy Inc
    • Solidica Inc
    • South China University
    • Tekna Plasma Systems Inc
    • Texas A&M University
    • Tundra Composites
    • United Technologies
    • University of Texas System
    • University of Queensland
    • Velo3D Inc
    • Washington State University
    • Xerox
Back to Top
전화 문의
F A Q