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3D 집적회로(3D IC) : 향후 시장 기회

Future Opportunites for 3D Integrated Circuits

리서치사 Frost & Sullivan
발행일 2016년 12월 상품 코드 410405
페이지 정보 영문 68 Pages
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3D 집적회로(3D IC) : 향후 시장 기회 Future Opportunites for 3D Integrated Circuits
발행일 : 2016년 12월 페이지 정보 : 영문 68 Pages

3D 집적회로(3D IC) 기술의 향후 전망에 대해 조사했으며, 3D IC 개요, 기술 성장 촉진요인과 저해요인, 3D 집적의 각종 실현 기술 개요, 특허 및 자금 조달, Si 관통 전극(TSV) 기술 동향, 3D IC 제품 및 용도, 기술 로드맵, 성장 기회 등의 정보를 전해드립니다.

제1장 주요 요약

제2장 기술 및 시장 상황

  • 3D IC : 서론
  • 주요 시장 성장 촉진요인
  • 주요 시장 성장 저해요인
  • 기술적 촉진요인과 과제 등

제3장 3D IC 기술 개요

  • 3D IC 패키징 기술이 수직 통합을 가능하게
  • 3D 모놀리식 집적
  • 3D 집적 : 다이 싱귤레이션
  • 3D 집적 : 스태킹
  • 3D 집적 : 본딩 기술
  • 3D 집적 : TSV
  • 3D 집적 : 웨이퍼 종류

제4장 특허 및 자금 조달 분석

  • 아시아태평양 및 북미 지역 : 3D 집적 기술의 R&D에 적극적으로 주력
  • TSV에 대한 연구 : 세계적으로 추구되는 테마
  • 기술 및 시장의 리더십과 자금 조달 동향

제5장 TSV 인터커넥트 기술에 의한 3D 집적

  • TSV 기술 개요
  • TSV에 의한 3D IC : 3D 집적 기술의 다음 분야
  • 코어 TSV 인터커넥트 프로세스 기술에 의한 인터커넥트 드릴링, 웨이퍼 박화 및 스태킹
  • 주요 혁신 개요 : Allvia Inc.
  • 주요 혁신 개요 : Amkor Technologies
  • 주요 혁신 개요 : Novati Technologies
  • 주요 혁신 개요 : Aveni
  • 주요 혁신 개요 : STATS ChipPAC
  • 주요 기업

제6장 3D IC 제품 및 용도 상황

  • 메모리, MEMS 시스템, 이미지 센서 : 주요 제품
  • CE제품, ICT, 항공우주 : 주요 도입 분야
  • 도입 분야에 대한 제품의 영향 설명

제7장 전략적 분석

  • 집적 기술 로드맵
  • 성장 기회
  • 전략적 플래닝을 위한 주요 과제

제8장 주요 특허

제9장 주요 연락처

제10장 Frost & Sullivan 소개

KSM 17.01.24

3D Stacked Memory and 3D MEMS Driving Opportunities in Consumer Electronics and Communication Markets

3D Integrated Circuit technology enables the development of high performing microchips with small form factor and low-power consumption capability. With the growing demand for miniaturization in industries like consumer electronics and information and communication technology, 3D ICs are actively being considered as the ideal solution. The key requirements of modern day electronic devices are enhanced storage capability, low power requirements, efficient thermal management components, high-speed data transmission, high-speed data processing, high brightness lighting, connected and smart devices. These requirements from the consumer end of the supply chain are the key driving forces behind growth in 3D IC technology and its inherent market.

A notable feature of the 3D IC market ecosystem is that the vendor side of the supply chain is highly fragmented. This is mainly because of the numerous options available for 3D Integration. Also, the business models adopted by 3D IC fabrication companies are constantly evolving. The core technology is constantly being updated to the next-generation technology, foundries transitioning to end-to-end product developers, fabless designers venturing into software-based 3D designing and so on.

This technology and innovation report highlights through silicon vias (TSV) as the key technology in 3D IC technology. The report discusses the market and technological drivers and restraints for the 3D IC market and identifies the various technologies enabling 3D integration. TSV interconnect technology is analyzed exhaustively by evaluating key participants and their strategies in the TSV-enabled 3D integration sector. An Integrated Technology Roadmap (ITR) is developed by tracking the developments in the 3D integration technology. The ITR outlines the various industries that has been and is expected to witness moderate to high impact of these innovative products presently and in the in future. The growth opportunities for 3D IC are exhaustively analyzed through the ITR lens.

Table of Contents

1.0. EXECUTIVE SUMMARY

  • 1.1. Research Scope
  • 1.2. Research Methodology
  • 1.3. Research Methodology Explained
  • 1.4. 3D Integration Technology Categorization
  • 1.5. Key Findings - Significance, R&D Focus Areas, and Applications
  • 1.6. Key Findings - Global Challenges and Scenario, Industry Initiatives

2.0. TECHNOLOGICAL AND MARKET LANDSCAPE

  • 2.1. Three-dimensional Integrated Circuits - An Introduction
  • 2.2. High Bargaining Power of Suppliers and Threat of New Entrants Impacting Attractiveness of 3D IC Industry
  • 2.3. Continuing Demand for Smartphones and Expected Increase in Cost Currently Driving Opportunities in 3D ICs
  • 2.4. Key Drivers Explained
  • 2.5. High Cost and Technological and Process Challenges Currently Limiting Opportunities for 3D ICs
  • 2.6. Key Market Restraints Explained
  • 2.7. Technological Drivers and Challenges
  • 2.8. Technological Drivers
  • 2.9. Technological Challenges

3.0. TECHNOLOGY SNAPSHOT OF 3D INTEGRATED CIRCUITS

  • 3.1. 3D IC Packaging Techniques Enable Vertical Integration
  • 3.2. 3D Monolithic Integration
  • 3.3. 3D Integration - Die Singulation
  • 3.4. 3D Integration - Stacking Orientation
  • 3.5. 3D Integration - Bonding Technique
  • 3.6. 3D Integration - Through Silicon Vias
  • 3.7. 3D Integration - Wafer Type

4.0. PATENT AND FUNDING ANALYSIS

  • 4.1. APAC and NA Actively Focusing on R&D in 3D Integration Technology
  • 4.2. Research on Through Silicon Via is Actively Pursued Across the Globe
  • 4.3. Pursuit of Technological and Market Leadership Outlines Funding Trends

5.0. 3D INTEGRATION WITH TSV INTERCONNECT TECHNOLOGY

  • 5.1. Introduction to TSV Technology
  • 5.2. 3D IC Enabled with TSV is the Next Frontier in 3D Integration Technology
  • 5.3. Interconnect Drilling, Wafer Thinning and Stacking form Core TSV Interconnect Process Technology
  • 5.4. Key Innovation Profile - Allvia Inc.
  • 5.5. Key Innovation Profile - Amkor Technologies
  • 5.6. Key Innovation Profile - Novati Technologies
  • 5.7. Key Innovation Profile - Aveni
  • 5.8. Key Innovation Profile - STATS ChipPAC
  • 5.9. Key Players in 3D IC Industry

6.0. 3D IC PRODUCT AND APPLICATION LANDSCAPE

  • 6.1. Memory, Microelectromechanical Systems, and Image Sensors are Key Products Enabled with 3D IC
  • 6.2. Consumer Electronics, ICT, and Aerospace are Major Application Areas of 3D IC
  • 6.3. Product - Application Impact Matrix
  • 6.4. Impact of Products on Application Areas Explained

7.0. STRATEGIC INSIGHTS ON 3D ICINDUSTRY

  • 7.1. Integrated Technology Roadmap
  • 7.2. Integrated Technology Roadmap Explained - 3D Integration Enabled Products Driving Futuristic Innovations in Major industries
  • 7.3. Growth Opportunities
  • 7.4. Key Questions for Strategic Planning

8.0. KEY PATENTS

  • 8.1. Key Patents
  • 8.1. Key Patents (continued)

9.0. KEY INDUSTRY CONTACTS

  • 9.1. Industry Contacts
  • Legal Disclaimer

10.0. THE FROST & SULLIVAN STORY

  • 10.1. The Frost & Sullivan Story
  • 10.2. Value Proposition: Future of Your Company & Career
  • 10.3. Global Perspective
  • 10.4. Industry Convergence
  • 10.5. 360° Research Perspective
  • 10.6. Implementation Excellence
  • 10.7. Our Blue Ocean Strategy
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