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재분배층 재료 시장 규모 및 예측, 세계 및 지역 점유율, 동향, 성장 기회 분석 리포트 대상 범위 : 유형별, 용도별

Redistribution Layer Material Market Size and Forecasts (2020 - 2030), Global and Regional Share, Trends, and Growth Opportunity Analysis Report Coverage: By Type and Application
발행일: | 리서치사: The Insight Partners | 페이지 정보: 영문 161 Pages | 배송안내 : 즉시배송

    
    
    



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재분배층 재료 시장 규모는 2022년에 1억 9,239만 달러로 평가되며 2030년에는 4억 6,015만 달러에 달할 것으로 예측되고 있습니다.

첨단 포장 프로세스는 다이 레벨에서 시작되며, 그 목적은 항상 입출력(I/O) 밀도를 손상시키지 않으면서 다이 크기를 줄이는 것입니다. 디바이스 이종 집적에서 몇 가지 다른 신진 포장 기술이 중요한 역할을 하고 있습니다. 웨이퍼 레벨 팬아웃 포장(WLFO)은 종합적인 포장 공정으로 등장한 중요한 포장 기술 중 하나로, 이전에는 단일 다이 설계, 즉 재구성된 웨이퍼의 한 면에 단일 재분배층(RDL)만이 존재했습니다.

재분배층은 첨단 웨이퍼 포장에서 중요한 역할을 하며, RDL은 I/O 레이아웃의 재배치 역할을 하여 더 높은 I/O 수를 가능하게 합니다. 일반적으로 I/O 밀도가 높을수록 전기적 성능이 향상됩니다. 출력 수가 많을수록 다이 사이의 전기 신호가 더 빨라져 전기적 단락으로 인한 위험을 최소화할 수 있기 때문입니다. 또한 I/O 밀도가 높을수록 패키지는 동시에 더 나은 성능을 달성할 수 있습니다. 또한 아시아의 전략적 위치는 경쟁력 있는 제조 비용과 함께 세계 제조 거점으로서 공급망 최적화를 추구하는 다국적 기업을 끌어들이고 있습니다. 이로 인해 재분배층 소재 시장에는 다양한 공급업체와 제조업체가 이 지역에서 존재감을 드러내며 탄탄한 생태계를 형성하고 있습니다.

재분배층 재료 시장은 유형별로 폴리이미드(PI), 폴리벤조옥사졸(PBO), 벤조실로부텐(BCB), 기타로 구분되며, 2022년에는 폴리이미드(PI) 부문이 가장 큰 시장 점유율을 차지할 것으로 예상됩니다. 폴리이미드는 고분자 기반 열가소성 플라스틱으로 용융 점도가 높고 성형 부품을 형성하기 위해 높은 압력을 필요로 합니다. 폴리이미드는 우수한 내화학성, 높은 기계적 강도, 높은 열 안정성 및 우수한 전기적 특성을 가지고 있으며, IC 포장 방법에서 폴리이미드는 고온 접착제, 기계적 응력 완충재 및 마이크로 크기의 회로를 지원하는 필름으로 사용됩니다. 폴리이미드는 높은 경화 온도를 필요로 하는데, 이는 포장에서 더 낮은 경화 온도를 요구하기 때문에 큰 단점이 됩니다. 따라서 일부 재료 제조업체는 더 낮은 경화 온도의 폴리이미드를 제공하는데 주력하고 있으며, PI는 플립칩 웨이퍼 범핑 및 WLP의 모든 용도에서 주로 사용됩니다. 용도별로 보면 재분배층 재료 시장은 팬아웃 웨이퍼 레벨 포장(FOWLP)과 2.5D/3D IC 포장(고대역폭 메모리(HBM), 멀티칩 집적화, 패키지 온 패키지(FOPOP), 기타)으로 구분되며, 2022년에는 2.5D/3D IC 포장 부문이 2.5 D/3D IC 포장 부문의 재분배층 재료 시장 점유율이 주목됩니다. 차세대 실리콘 노드에서 리소그래피 공정과 웨이퍼 가공 전반의 비용 증가로 인해 업계는 전자 장비의 성능과 기능을 향상시킬 수 있는 대안을 모색하고 있습니다. 또한 로직, 메모리, RF, 센서와 같은 이종 기술을 소형 폼팩터에 통합해야 할 필요성이 반도체 업계가 3D 통합을 솔루션으로 채택하도록 유도하고 있습니다.

2022년 아시아태평양은 세계 재분배층 재료 시장에서 가장 큰 점유율을 차지할 것으로 예상됩니다. 이 지역은 다양한 제조업이 존재하기 때문에 세계 제조업의 중심지로 여겨지고 있습니다. 중국이 고기술 제조 허브로 진화하는 가운데, 인도, 한국, 대만, 베트남 등 신흥 국가들은 인건비 절감을 위해 저기술 및 중기술 제조 시설을 인근 국가로 이전하려는 여러 기업을 끌어들이고 있습니다. 반도체산업협회의 조사에 따르면 세계 반도체 생산능력의 75%가 동아시아에 집중되어 있습니다. 반도체 기업은 이 지역에서 제조 활동을 시작하면 25-50%의 비용 우위 혜택을 누릴 수 있습니다.

SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, Dupont De Nemours Inc, Fujifilm Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd, NXP Semiconductors NV, JCET Group Co Ltd, Shin-Etsu Chemical Co Ltd는 세계 재분배층 재료 시장에서 활동하는 주요 기업입니다. 시장 진출기업은 고객 수요를 충족시키기 위해 고품질 제품을 제공하는데 주력하고 있습니다. 또한 이들은 연구개발 활동에 투자하고 신제품을 출시하는 전략을 채택하고 있습니다.

세계 재분배층 재료의 전체 시장 규모는 1차 및 2차 정보를 모두 사용하여 도출되었습니다. 연구 과정을 시작하면서 시장과 관련된 질적, 양적 정보를 얻기 위해 내부 및 외부 출처를 통해 철저한 2차 조사를 실시했습니다. 또한 데이터를 검증하고 주제에 대한 보다 심층적인 분석적 인사이트을 얻기 위해 업계 관계자들을 대상으로 여러 차례의 1차 인터뷰를 진행했습니다. 이 과정에 참여한 기업에는 부사장, 사업 개발 관리자, 시장 정보 관리자, 국내 영업 관리자와 같은 업계 전문가와 재분배층 재료 시장을 전문으로 하는 평가 전문가, 연구 분석가, 주요 오피니언 리더와 같은 외부 컨설턴트가 포함됩니다.

목차

제1장 서론

제2장 주요 요약

  • 주요 인사이트
  • 시장의 매력
    • 시장의 매력

제3장 조사 방법

  • 조사 범위
  • 2차 조사
  • 1차 조사

제4장 세계의 재분배층 재료 시장 상황

  • 서론
  • Porter's Five Forces 분석
    • 공급 기업의 교섭력
    • 구매자의 교섭력
    • 신규 진출업체의 위협
    • 경쟁 기업간 경쟁 관계
    • 대체품의 위협
  • 에코시스템 분석
    • 원재료 공급업체
    • 제조업체
    • 최종 용도
    • 밸류체인 벤더 리스트
      • 밸류체인의 원재료 공급업체 리스트
      • 밸류체인 제조업체 리스트

제5장 세계의 재분배층 재료 시장 : 주요 시장 역학

  • 시장 촉진요인
    • AI 기반 기기와 툴에 대한 주목의 증가
    • 자동차 산업과 통신 산업으로부터의 수요 증가
  • 시장 억제요인
    • 원재료 가격의 변동
  • 시장 기회
    • 업계별 IoT와 커넥티드 디바이스의 보급
  • 향후 동향
    • 첨단 포장 기술
  • 영향 분석

제6장 세계의 재분배층 재료 시장 - 세계 시장 분석

  • 세계의 재분배층 재료 시장 규모
  • 세계의 재분배층 재료 시장 매출
  • 세계의 재분배층 재료 시장 예측·분석

제7장 재분배층 재료 세계 시장 분석 - 유형

  • 폴리이미드(PI)
  • Polybenzoxazole(PBO)
  • Benzocylobutene(BCB)
  • 기타

제8장 세계의 재분배층 재료 시장 분석 - 용도

  • FOWLP(Fan-Out Wafer Level Packaging)
    • FOWLP(Fan-Out Wafer Level Packaging) 시장, 매출, 2030년까지의 예측
  • 2.5D/3D IC 포장
    • 2.5D/3D IC 패키지 시장 매출과 2030년까지의 예측
    • 고대역폭 메모리(HBM)
    • 멀티칩 통합
    • 패키지·온·패키지(FOPOP)
    • 기타

제9장 세계의 재분배층 재료 시장 : 지역별 분석

  • 북미
      • 미국
      • 캐나다
      • 멕시코
  • 유럽
    • 기타 유럽
  • 아시아태평양
    • 기타 아시아태평양
  • 세계의 기타 중동 및 아프리카

제10장 세계의 재분배층 재료 시장에 대한 COVID-19 팬데믹의 영향

  • COVID-19 전후의 영향

제11장 경쟁 구도

  • 주요 참여 기업에 의한 히트맵 분석
  • 기업의 포지셔닝과 집중도

제12장 업계 상황

  • 서론
  • 시장 구상
  • 신제품 개발
  • 합병과 인수

제13장 기업 개요

  • SK Hynix Inc
  • Samsung Electronics Co Ltd
  • Infineon Technologies AG
  • DuPont de Nemours Inc
  • FUJIFILM Holdings Corp
  • Amkor Technology Inc
  • ASE Technology Holding Co Ltd
  • NXP Semiconductors NV
  • JCET Group Co Ltd
  • Shin-Etsu Chemical Co Ltd

제14장 부록

KSA 23.11.09

The redistribution layer material market size was valued at US$ 192.39 million in 2022 and is expected to reach US$ 460.15 million by 2030; it is estimated to register a CAGR of 11.5% from 2022 to 2030.

The advanced packaging process starts at the die level, where the objective is always to lessen the die sizes without compromising the input-output (I/O) density. Several other budding packaging technologies play a key role in the heterogeneous integration of devices. Wafer-level fan-out packaging (WLFO) is one of the key packaging technologies that has emerged as a comprehensive packaging process. The WLFO process earlier had only single-die designs, i.e., a single redistribution layer (RDL) on one side of a reconstituted wafer.

The redistribution layer acts as a crucial step in the advanced wafer packaging. RDL serves as a rerouting of the I/O layout and allows a higher I/O number. A high I/O density usually creates better electrical performance, as more outputs result in faster electrical signals between the die and minimize the risk posed by electrical shorts. Besides, a higher I/O density enables the package to achieve better performance simultaneously. Moreover, the Asia's strategic location as a global manufacturing hub, coupled with competitive production costs, has attracted multinational corporations looking to optimize their supply chains. This has created a robust ecosystem for the redistribution layer material market, with various suppliers and manufacturers establishing a presence in the region.

Based on type, the redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held the largest market share in 2022. Polyimides are polymer-based thermoplastics with a high melt viscosity and require higher pressures for forming molded parts. Polyimides offer good chemical resistance, high mechanical strength, higher thermal stabilities, and exceptional electrical properties. For the IC packaging methods, polyimides are used as high-temperature adhesives, mechanical stress buffers, and as a film supporting the micro-sized circuitry. Polyimides require higher cure temperatures, which is its major drawback, as packaging demands lower cure temperatures. Several material suppliers have thus focused on providing polyimides with lower cure temperatures. PI is majorly used in all the flip-chip wafer bumping and WLP applications. Based on application, the redistribution layer material market is bifurcated into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging [high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others]. The redistribution layer material market share of the 2.5D/3D IC packaging segment was notable in 2022. The increased costs of lithography steps and wafer processing in general at the next-generation silicon nodes are driving the industry to find alternatives to improve the performance and functionality of electronic devices. Additionally, the need to integrate disparate technologies such as logic, memory, RF, and sensors in small form factors is driving the semiconductor industry toward 3D integration as a solution.

In 2022, Asia Pacific held the largest share of the global redistribution layer material market. The region is considered a global manufacturing hub owing to the presence of diverse manufacturing industries. With China's evolution into a high-skilled manufacturing hub, developing countries such as India, South Korea, Taiwan, and Vietnam are attracting several businesses that plan to relocate their low to medium-skilled manufacturing facilities to neighboring countries, which results in reduced labor costs. As per the study by the Semiconductor Industry Association, ~75% of global semiconductor capacity is based in East Asia. Semiconductor companies will benefit from a cost advantage of 25% to 50% with the start of manufacturing activities in the region.

SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, Dupont De Nemours Inc, Fujifilm Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd., NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd are key players operating in the global redistribution layer material market. Market players focus on providing high-quality products to fulfill customer demand. They are also adopting strategies such as investments in research and development activities and new product launches.

The overall global redistribution layer material market size has been derived using both primary and secondary sources. To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the market. Also, multiple primary interviews have been conducted with industry participants to validate the data and gain more analytical insights into the topic. Participants of this process include industry experts such as VPs, business development managers, market intelligence managers, and national sales managers, along with external consultants such as valuation experts, research analysts, and key opinion leaders, specializing in the redistribution layer material market.

Reasons to Buy:

  • Highlights key business priorities in order to assist companies to realign their business strategies.
  • The key findings and recommendations highlight crucial progressive industry trends in the global redistribution layer material market, thereby allowing players to develop effective long-term strategies.
  • Develop/modify business expansion plans by using substantial growth offering developed and emerging markets.
  • Scrutinize in-depth the market trends and outlook coupled with the factors driving the market, as well as those hindering it.
  • Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to products, segmentation, and industry verticals.

Table Of Contents

1. Introduction

  • 1.1 The Insight Partners Research Report Guidance
  • 1.2 Market Segmentation

2. Executive Summary

  • 2.1 Key Insights
  • 2.2 Market Attractiveness
    • 2.2.1 Market Attractiveness

3. Research Methodology

  • 3.1 Coverage
  • 3.2 Secondary Research
  • 3.3 Primary Research

4. Global Redistribution Layer Material Market Landscape

  • 4.1 Overview
  • 4.2 Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Intensity of Competitive Rivalry
    • 4.2.5 Threat of Substitutes
  • 4.3 Ecosystem Analysis
    • 4.3.1 Raw Material Suppliers
    • 4.3.2 Manufacturers
    • 4.3.3 End Use
    • 4.3.4 List of Vendors in the Value Chain
      • 4.3.4.1 List of Raw Material Suppliers in Value Chain
      • 4.3.4.2 List of Manufacturers in Value Chain

5. Global Redistribution Layer Material Market - Key Market Dynamics

  • 5.1 Market Drivers
    • 5.1.1 Growing Focus on AI-based Equipment and Tools
    • 5.1.2 Increasing Demand from Automotive and Telecommunication Industries
  • 5.2 Market Restraints
    • 5.2.1 Fluctuation in Raw Material Prices
  • 5.3 Market Opportunities
    • 5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals
  • 5.4 Future Trends
    • 5.4.1 Advancements in the Packaging Technology
  • 5.5 Impact Analysis

6. Global Redistribution Layer Material Market - Global Market Analysis

  • 6.1 Global Redistribution Layer Material Market Volume (Tons)
  • 6.2 Global Redistribution Layer Material Market Revenue (US$ Million)
  • 6.3 Global Redistribution Layer Material Market Forecast and Analysis

7. Global Redistribution Layer Material Market Analysis - Type

  • 7.1 Polyimide (PI)
    • 7.1.1 Overview
    • 7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
  • 7.2 Polybenzoxazole (PBO)
      • 7.2.1.1 Overview
      • 7.2.1.2 Polybenzoxazole (PBO) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
  • 7.3 Benzocylobutene (BCB)
      • 7.3.1.1 Overview
      • 7.3.1.2 Benzocylobutene (BCB) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
  • 7.4 Others
      • 7.4.1.1 Overview
      • 7.4.1.2 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)

8. Global Redistribution Layer Material Market Analysis - Application

  • 8.1 Fan-Out Wafer Level Packaging (FOWLP)
    • 8.1.1 Overview
    • 8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)
  • 8.2 2 5D/3D IC Packaging
    • 8.2.1 Overview
    • 8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)
    • 8.2.3 High Bandwidth Memory (HBM)
      • 8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)
    • 8.2.4 Multi-Chip Integration
      • 8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)
    • 8.2.5 Package on Package (FOPOP)
      • 8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)
    • 8.2.6 Others
      • 8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)

9. Global Redistribution Layer Material Market - Geographical Analysis

  • 9.1 North America
    • 9.1.1 North America Redistribution Layer Material Market Overview
    • 9.1.2 North America Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
    • 9.1.3 North America Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    • 9.1.4 North America Redistribution Layer Material Market Breakdown by Type
      • 9.1.4.1 North America Redistribution Layer Material Market Volume and Forecasts and Analysis - By Type
      • 9.1.4.2 North America Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Type
    • 9.1.5 North America Redistribution Layer Material Market Breakdown by Application
      • 9.1.5.1 North America Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Application
    • 9.1.6 North America Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries
      • 9.1.6.1 Redistribution Layer Material Market Breakdown by Country
      • 9.1.6.2 US Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.6.3 US Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.6.3.1 US Redistribution Layer Material Market Breakdown by Type
        • 9.1.6.3.2 US Redistribution Layer Material Market Breakdown by Type
        • 9.1.6.3.3 US Redistribution Layer Material Market Breakdown by Application
      • 9.1.6.4 Canada Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.6.5 Canada Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.6.5.1 Canada Redistribution Layer Material Market Breakdown by Type
        • 9.1.6.5.2 Canada Redistribution Layer Material Market Breakdown by Type
        • 9.1.6.5.3 Canada Redistribution Layer Material Market Breakdown by Application
      • 9.1.6.6 Mexico Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.1.6.7 Mexico Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.1.6.7.1 Mexico Redistribution Layer Material Market Breakdown by Type
        • 9.1.6.7.2 Mexico Redistribution Layer Material Market Breakdown by Type
        • 9.1.6.7.3 Mexico Redistribution Layer Material Market Breakdown by Application
  • 9.2 Europe
    • 9.2.1 Europe Redistribution Layer Material Market Overview
    • 9.2.2 Europe Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
    • 9.2.3 Europe Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    • 9.2.4 Europe Redistribution Layer Material Market Breakdown by Type
      • 9.2.4.1 Europe Redistribution Layer Material Market Volume and Forecasts and Analysis - By Type
      • 9.2.4.2 Europe Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Type
    • 9.2.5 Europe Redistribution Layer Material Market Breakdown by Application
      • 9.2.5.1 Europe Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Application
    • 9.2.6 Europe Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries
      • 9.2.6.1 Redistribution Layer Material Market Breakdown by Country
      • 9.2.6.2 Germany Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.2.6.3 Germany Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.2.6.3.1 Germany Redistribution Layer Material Market Breakdown by Type
        • 9.2.6.3.2 Germany Redistribution Layer Material Market Breakdown by Type
        • 9.2.6.3.3 Germany Redistribution Layer Material Market Breakdown by Application
      • 9.2.6.4 Austria Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.2.6.5 Austria Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.2.6.5.1 Austria Redistribution Layer Material Market Breakdown by Type
        • 9.2.6.5.2 Austria Redistribution Layer Material Market Breakdown by Type
        • 9.2.6.5.3 Austria Redistribution Layer Material Market Breakdown by Application
      • 9.2.6.6 Italy Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.2.6.7 Italy Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.2.6.7.1 Italy Redistribution Layer Material Market Breakdown by Type
        • 9.2.6.7.2 Italy Redistribution Layer Material Market Breakdown by Type
        • 9.2.6.7.3 Italy Redistribution Layer Material Market Breakdown by Application
      • 9.2.6.8 Rest of Europe Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.2.6.9 Rest of Europe Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.2.6.9.1 Rest of Europe Redistribution Layer Material Market Breakdown by Type
        • 9.2.6.9.2 Rest of Europe Redistribution Layer Material Market Breakdown by Type
        • 9.2.6.9.3 Rest of Europe Redistribution Layer Material Market Breakdown by Application
  • 9.3 Asia Pacific
    • 9.3.1 Asia Pacific Redistribution Layer Material Market Overview
    • 9.3.2 Asia Pacific Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
    • 9.3.3 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    • 9.3.4 Asia Pacific Redistribution Layer Material Market Breakdown by Type
      • 9.3.4.1 Asia Pacific Redistribution Layer Material Market Volume and Forecasts and Analysis - By Type
      • 9.3.4.2 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Type
    • 9.3.5 Asia Pacific Redistribution Layer Material Market Breakdown by Application
      • 9.3.5.1 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Application
    • 9.3.6 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries
      • 9.3.6.1 Redistribution Layer Material Market Breakdown by Country
      • 9.3.6.2 China Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.3.6.3 China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.3.6.3.1 China Redistribution Layer Material Market Breakdown by Type
        • 9.3.6.3.2 China Redistribution Layer Material Market Breakdown by Type
        • 9.3.6.3.3 China Redistribution Layer Material Market Breakdown by Application
      • 9.3.6.4 Taiwan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.3.6.5 Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.3.6.5.1 Taiwan Redistribution Layer Material Market Breakdown by Type
        • 9.3.6.5.2 Taiwan Redistribution Layer Material Market Breakdown by Type
        • 9.3.6.5.3 Taiwan Redistribution Layer Material Market Breakdown by Application
      • 9.3.6.6 Japan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.3.6.7 Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.3.6.7.1 Japan Redistribution Layer Material Market Breakdown by Type
        • 9.3.6.7.2 Japan Redistribution Layer Material Market Breakdown by Type
        • 9.3.6.7.3 Japan Redistribution Layer Material Market Breakdown by Application
      • 9.3.6.8 South Korea Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.3.6.9 South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.3.6.9.1 South Korea Redistribution Layer Material Market Breakdown by Type
        • 9.3.6.9.2 South Korea Redistribution Layer Material Market Breakdown by Type
        • 9.3.6.9.3 South Korea Redistribution Layer Material Market Breakdown by Application
      • 9.3.6.10 Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
      • 9.3.6.11 Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
        • 9.3.6.11.1 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type
        • 9.3.6.11.2 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type
        • 9.3.6.11.3 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Application
  • 9.4 Rest of World
    • 9.4.1 Rest of World Redistribution Layer Material Market Overview
    • 9.4.2 Rest of World Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
    • 9.4.3 Rest of World Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
    • 9.4.4 Rest of World Redistribution Layer Material Market Breakdown by Type
      • 9.4.4.1 Rest of World Redistribution Layer Material Market Volume and Forecasts and Analysis - By Type
      • 9.4.4.2 Rest of World Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Type
    • 9.4.5 Rest of World Redistribution Layer Material Market Breakdown by Application
      • 9.4.5.1 Rest of World Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Application

10. Impact of COVID-19 Pandemic on Global Redistribution Layer Material Market

  • 10.1 Pre & Post Covid-19 Impact

11. Competitive Landscape

  • 11.1 Heat Map Analysis by Key Players
  • 11.2 Company Positioning & Concentration

12. Industry Landscape

  • 12.1 Overview
  • 12.2 Market Initiative
  • 12.3 New Product Development
  • 12.4 Merger and Acquisition

13. Company Profiles

  • 13.1 SK Hynix Inc
    • 13.1.1 Key Facts
    • 13.1.2 Business Description
    • 13.1.3 Products and Services
    • 13.1.4 Financial Overview
    • 13.1.5 SWOT Analysis
    • 13.1.6 Key Developments
  • 13.2 Samsung Electronics Co Ltd
    • 13.2.1 Key Facts
    • 13.2.2 Business Description
    • 13.2.3 Products and Services
    • 13.2.4 Financial Overview
    • 13.2.5 SWOT Analysis
    • 13.2.6 Key Developments
  • 13.3 Infineon Technologies AG
    • 13.3.1 Key Facts
    • 13.3.2 Business Description
    • 13.3.3 Products and Services
    • 13.3.4 Financial Overview
    • 13.3.5 SWOT Analysis
    • 13.3.6 Key Developments
  • 13.4 DuPont de Nemours Inc
    • 13.4.1 Key Facts
    • 13.4.2 Business Description
    • 13.4.3 Products and Services
    • 13.4.4 Financial Overview
    • 13.4.5 SWOT Analysis
    • 13.4.6 Key Developments
  • 13.5 FUJIFILM Holdings Corp
    • 13.5.1 Key Facts
    • 13.5.2 Business Description
    • 13.5.3 Products and Services
    • 13.5.4 Financial Overview
    • 13.5.5 SWOT Analysis
    • 13.5.6 Key Developments
  • 13.6 Amkor Technology Inc
    • 13.6.1 Key Facts
    • 13.6.2 Business Description
    • 13.6.3 Products and Services
    • 13.6.4 Financial Overview
    • 13.6.5 SWOT Analysis
    • 13.6.6 Key Developments
  • 13.7 ASE Technology Holding Co Ltd
    • 13.7.1 Key Facts
    • 13.7.2 Business Description
    • 13.7.3 Products and Services
    • 13.7.4 Financial Overview
    • 13.7.5 SWOT Analysis
    • 13.7.6 Key Developments
  • 13.8 NXP Semiconductors NV
    • 13.8.1 Key Facts
    • 13.8.2 Business Description
    • 13.8.3 Products and Services
    • 13.8.4 Financial Overview
    • 13.8.5 SWOT Analysis
    • 13.8.6 Key Developments
  • 13.9 JCET Group Co Ltd
    • 13.9.1 Key Facts
    • 13.9.2 Business Description
    • 13.9.3 Products and Services
    • 13.9.4 Financial Overview
    • 13.9.5 SWOT Analysis
    • 13.9.6 Key Developments
  • 13.10 Shin-Etsu Chemical Co Ltd
    • 13.10.1 Key Facts
    • 13.10.2 Business Description
    • 13.10.3 Products and Services
    • 13.10.4 Financial Overview
    • 13.10.5 SWOT Analysis
    • 13.10.6 Key Developments

14. Appendix

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