아시아태평양의 재분배층 재료 시장 예측(-2030년) : 지역별 분석 - 유형별[폴리이미드, 폴리벤조옥사졸, 벤조실로부텐, 기타], 용도별

The Asia Pacific redistribution layer material market was valued at US$ 143.81 million in 2022 and is expected to reach US$ 351.93 million by 2030; it is estimated to grow at a CAGR of 11.8% from 2022 to 2030.

Increasing Demand from Automotive and Telecommunication Industries Drive Asia Pacific Redistribution Layer Material Market

The Asia Pacific redistribution layer material market is experiencing significant growth, driven primarily by the surging demand from two key industries: automotive and telecommunication.

The telecommunication sector is evolving rapidly, particularly with the deployment of 5G technology. There is a widespread rollout of 5G networks in across the globe, which has led to an increased demand for smartphones and other consumer electronics products. For instance, in October 2021, AIS and Samsung jointly launched a voice-over 5G radio service enabling voice calls on AIS's 5G standalone (SA) network in Thailand. In Vietnam, Samsung Electronics and Viettel announced the 5G commercial trials launched in Da Nang in December 2021. Viettel is piloting 5G services in 11 provinces and cities, namely, Ho Chi Minh City, Hanoi, Bac Ninh, Vinh Phuc, Bac Giang, Dong Nai, Ba Ria-Vung Tau, Binh Phuoc, Thua Thien-Hue, and Da Nang. In addition, according to Viavi Solutions Inc.'s report, over 92 countries across the world have launched 5G networks. A further 23 countries have underway pre-commercial 5G network trials, and 32 nations have announced their 5G rollout plans. The widespread rollout of 5G networks has led to an increased demand for smartphones and other consumer electronics products. This revolution is driving the development of high-frequency, high-performance devices and systems. These requirements extend to the material used in redistribution layers, which must meet stringent specifications to ensure seamless connectivity and signal integrity. In addition, the push for miniaturization is a common thread between these industries. This revolution is driving the development of high-frequency, high-performance devices and systems. These requirements extend to the material used in redistribution layers, which must meet stringent specifications to ensure seamless connectivity and signal integrity. In addition, the push for miniaturization is a common thread between these industries. Smaller, more powerful devices are in demand, necessitating thinner and more advanced redistribution layer materials. These materials play a critical role in enabling high-density interconnections within compact electronic packages.

The ever-expanding production needs of the automotive industry propel the growth of the market. According to the ISEAS-Yusof Ishak Institute, Southeast Asia is also an important automobile production base. Southeast Asia is the seventh largest automotive manufacturing hub worldwide, producing 3.5 million vehicles in 2021. Within the region, Thailand is the largest car producer, producing over 1.6 million motor vehicles in 2021, followed by Indonesia (1.1 million), Malaysia (0.48 million), and Vietnam (0.16 million). In addition, as per the data of the Organisation Internationale des Constructeurs d'Automobiles (OICA), countries in North America, South America, and Central America recorded production of over 16.1 million commercial & passenger cars in 2021, and the production has grown by 10% and registered over 17.7 million commercial & passenger car production in 2022. Numerous companies operating in the automotive market are investing heavily in automobile manufacturing to increase production and sales. In July 2021, Maruti Suzuki India Ltd. announced an investment worth US$ 2.42 billion in a new manufacturing facility in Haryana, India. The facility is expected to manufacture 1 million units annually. As vehicles become increasingly reliant on advanced electronics for safety, entertainment, and autonomous capabilities, the demand for semiconductors has soared. These automotive chips require intricate packaging solutions, often employing redistribution layers, to enable compact design and efficient interconnections.

The economic growth of the automotive and telecommunications sectors across the globe has a ripple effect on the entire supply chain. Investments in research and development, technology, and infrastructure are increasing, fostering an environment conducive to innovation and development in the field of redistribution layer materials. This trend is characterized by increased production, advanced packaging technologies, miniaturization requirements, the region's strategic supply chain position, and a positive economic impact on the entire ecosystem. These factors collectively propel the Asia Pacific redistribution layer material market.

Asia Pacific Redistribution Layer Material Market Overview

Many developing countries in Asia Pacific are witnessing significant growth in their manufacturing sectors. The region is considered a global manufacturing hub owing to the presence of diverse manufacturing industries. With China's evolution into a high-skilled manufacturing hub, developing countries such as India, South Korea, Taiwan, and Vietnam are attracting several businesses that plan to relocate their low to medium-skilled manufacturing facilities to neighboring countries, which results in reduced labor costs. As per the study by the Semiconductor Industry Association, ~75% of global semiconductor capacity is based in East Asia. Semiconductor companies will benefit from a cost advantage of 25% to 50% with the start of manufacturing activities in the region.

Further, governments of various countries in Asia Pacific are working to improve investment plans regarding semiconductor manufacturing. They are offering tax rebates, funds, and subsidies, among others, to attract manufacturing companies to set up plants in their respective countries. Further, several governments have taken initiatives such as Made in China 2025 and Make in India to propel the growth of the manufacturing sector. However, China, which is the largest manufacturing hub, is experiencing a rise in the country's labor cost owing to the rise in the aging population of the country. This has resulted in manufacturing companies investing in companies based in Southeast Asia. The improving infrastructure, rising domestic consumption, and reducing costs are a few factors attracting manufacturing companies.

The consumer electronics manufacturing industry in Asia Pacific is leading globally, which is anticipated to support the Asia Pacific redistribution layer material market across the region. Additionally, many countries across the region are increasingly adopting digital applications such as smart cities, autonomous vehicles, and IoT in a bid to become global powers.

The semiconductor manufacturing industry in Asia Pacific is the largest in the world. Ease of availability of raw materials for chip manufacturing, government incentives for the manufacturing sector, and inexpensive labor presence in APAC are a few factors driving the semiconductor manufacturing industries. RDL materials are directly sold to the semiconductor manufacturers as packaging is integral to semiconductor manufacturing processes. The growing penetration of consumer electronics, especially smartphones, is a major factor driving the revenues for the semiconductor industry. Also, owing to the rapid adoption of artificial intelligence and IoT in multiple business sectors, data center deployments in APAC are anticipated to grow in the coming years. The growth of network infrastructures is being strengthened with the rise in 5G deployments in various countries of APAC. All these factors are boosting the demand for sensors and other semiconductor-based devices.

The Industrial Revolution has transformed production in Australia, enabling improved productivity and increasing economic profit across the region. Thus, a rise in smart factories, value chain upgradation, data analytics, and connected machines are a few applications that require semiconductors. Furthermore, growing automation, 3D printing, and IoT, as well as emerging businesses, are accelerating the adoption of smart factories in Australia. The country's telecommunication industry contributes heavily to its GDP. The telco operators are seeking continued innovation for the implementation of advanced technologies such as 5G networks, which are projected to positively impact the use of RDL materials.

The large populations of China and India, including the expanding middle-class population in these countries, and well-established manufacturing sectors drive the semiconductor sector. China is the largest producer of passenger cars in the world; Japan, India, and South Korea are also major vehicle manufacturing countries in the region. The development of autonomous vehicles and smart infrastructure in Japan, China, and South Korea will further boost the demand for reliable semiconductor-based electronics devices. Countries such as Vietnam, Cambodia, and the Philippines plan to boost the production of semiconductors, thereby contributing to the revenue generation for the Asia Pacific redistribution layer material market. This factor is propelling the growth of semiconductor applications in the automotive sector in the region. Moreover, the region leads the consumer electronics manufacturing industry across the globe. Thus, the growing manufacturing activities in these industries is anticipated to boost the demand for semiconductors, which, in turn, is fueling the Asia Pacific redistribution layer material market across the region.

Exhibit: Asia Pacific Redistribution Layer Material Market Revenue and Forecast to 2030 (US$ Million)

Asia Pacific Redistribution Layer Material Market Segmentation

The Asia Pacific redistribution layer material market is segmented based on type, application, and country.

Based on type, the Asia Pacific redistribution layer material market is segmented into polyimide (PI), polybenzoxazole (PBO), benzocylobutene (BCB), and others. The polyimide (PI) segment held the largest share in 2022.

By cooling fluid type, the Asia Pacific redistribution layer material market is segmented into fan-out wafer level packaging (FOWLP) and 2.5D/3D IC packaging. The 2.5D/3D IC packaging segment held a larger share in 2022. The 2.5D/3D IC packaging is further subsegmented into high bandwidth memory (HBM), multi-chip integration, package on package (FOPOP), and others.

Based on country, the Asia Pacific redistribution layer material market is segmented into China, Taiwan, Japan, South Korea, and the Rest of Asia Pacific. Taiwan dominated the Asia Pacific redistribution layer material market in 2022.

SK Hynix Inc, Samsung Electronics Co Ltd, Infineon Technologies AG, DuPont de Nemours Inc, FUJIFILM Holdings Corp, Amkor Technology Inc, ASE Technology Holding Co Ltd, NXP Semiconductors NV, JCET Group Co Ltd, and Shin-Etsu Chemical Co Ltd are some of the leading companies operating in the Asia Pacific redistribution layer material market.

Table Of Contents

1. Introduction

• 1.1 The Insight Partners Research Report Guidance
• 1.2 Market Segmentation

2. Executive Summary

• 2.1 Key Insights
• 2.2 Market Attractiveness
  • 2.2.1 Market Attractiveness

3. Research Methodology

• 3.1 Coverage
• 3.2 Secondary Research
• 3.3 Primary Research

4. Asia Pacific Redistribution Layer Material Market Landscape

• 4.1 Overview
• 4.2 Porter's Five Forces Analysis
  • 4.2.1 Bargaining Power of Suppliers
  • 4.2.2 Bargaining Power of Buyers
  • 4.2.3 Threat of New Entrants
  • 4.2.4 Intensity of Competitive Rivalry
  • 4.2.5 Threat of Substitutes
• 4.3 Ecosystem Analysis
  • 4.3.1 Raw Material Suppliers
  • 4.3.2 Manufacturers
  • 4.3.3 End Use
  • 4.3.4 List of Vendors in the Value Chain
    • 4.3.4.1 List of Raw Material Suppliers in Value Chain
    • 4.3.4.2 List of Manufacturers in Value Chain

5. Asia Pacific Redistribution Layer Material Market - Key Market Dynamics

• 5.1 Market Drivers
  • 5.1.1 Growing Focus on AI-based Equipment and Tools
  • 5.1.2 Increasing Demand from Automotive and Telecommunication Industries
• 5.2 Market Restraints
  • 5.2.1 Fluctuation in Raw Material Prices
• 5.3 Market Opportunities
  • 5.3.1 Proliferation of IoT and Connected Devices Across Industry Verticals
• 5.4 Future Trends
  • 5.4.1 Advancements in the Packaging Technology
• 5.5 Impact Analysis

6. Redistribution Layer Material Market - Asia Pacific Market Analysis

• 6.1 Asia Pacific Redistribution Layer Material Market Volume (Tons)
• 6.2 Asia Pacific Redistribution Layer Material Market Revenue (US$ Million)
• 6.3 Asia Pacific Redistribution Layer Material Market Forecast and Analysis

7. Asia Pacific Redistribution Layer Material Market Analysis - Type

• 7.1 Polyimide (PI)
  • 7.1.1 Overview
  • 7.1.2 Polyimide (PI) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
  • 7.1.3 Polyimide (PI) Market, Revenue and Forecast to 2030 (US$ Million)
• 7.2 Polybenzoxazole (PBO)
  • 7.2.1 Overview
  • 7.2.2 Polybenzoxazole (PBO) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
  • 7.2.3 Polybenzoxazole (PBO) Market, Revenue and Forecast to 2030 (US$ Million)
• 7.3 Benzocylobutene (BCB)
  • 7.3.1 Overview
  • 7.3.2 Benzocylobutene (BCB) Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
  • 7.3.3 Benzocylobutene (BCB) Market, Revenue and Forecast to 2030 (US$ Million)
• 7.4 Others
  • 7.4.1 Overview
  • 7.4.2 Others Market Volume, Revenue and Forecast to 2030 (Tons) (US$ Million)
  • 7.4.3 Others Market, Revenue and Forecast to 2030 (US$ Million)

8. Asia Pacific Redistribution Layer Material Market Analysis - Application

• 8.1 Fan-Out Wafer Level Packaging (FOWLP)
  • 8.1.1 Overview
  • 8.1.2 Fan-Out Wafer Level Packaging (FOWLP) Market, Revenue, and Forecast to 2030 (US$ Million)
• 8.2 2 5D/3D IC Packaging
  • 8.2.1 Overview
  • 8.2.2 2 5D/3D IC Packaging Market Revenue, and Forecast to 2030 (US$ Million)
  • 8.2.3 High Bandwidth Memory (HBM)
    • 8.2.3.1 High Bandwidth Memory (HBM) Market Revenue and Forecast to 2030 (US$ Million)
  • 8.2.4 Multi-Chip Integration
    • 8.2.4.1 Multi-Chip Integration Market Revenue and Forecast to 2030 (US$ Million)
  • 8.2.5 Package on Package (FOPOP)
    • 8.2.5.1 Package on Package (FOPOP) Market Revenue and Forecast to 2030 (US$ Million)
  • 8.2.6 Others
    • 8.2.6.1 Others Market Revenue and Forecast to 2030 (US$ Million)

9. Asia Pacific Redistribution Layer Material Market - Country Analysis

• 9.1 Overview
  • 9.1.1 Asia Pacific Redistribution Layer Material Market Revenue and Forecasts and Analysis - By Countries
    • 9.1.1.1 Redistribution Layer Material Market Breakdown by Country
    • 9.1.1.2 China Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
    • 9.1.1.3 China Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
      • 9.1.1.3.1 China Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.3.2 China Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.3.3 China Redistribution Layer Material Market Breakdown by Application
    • 9.1.1.4 Taiwan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
    • 9.1.1.5 Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
      • 9.1.1.5.1 Taiwan Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.5.2 Taiwan Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.5.3 Taiwan Redistribution Layer Material Market Breakdown by Application
    • 9.1.1.6 Japan Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
    • 9.1.1.7 Japan Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
      • 9.1.1.7.1 Japan Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.7.2 Japan Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.7.3 Japan Redistribution Layer Material Market Breakdown by Application
    • 9.1.1.8 South Korea Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
    • 9.1.1.9 South Korea Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
      • 9.1.1.9.1 South Korea Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.9.2 South Korea Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.9.3 South Korea Redistribution Layer Material Market Breakdown by Application
    • 9.1.1.10 Rest of Asia Pacific Redistribution Layer Material Market Volume and Forecasts to 2030 (Tons)
    • 9.1.1.11 Rest of Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2030 (US$ Million)
      • 9.1.1.11.1 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.11.2 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Type
      • 9.1.1.11.3 Rest of Asia Pacific Redistribution Layer Material Market Breakdown by Application

10. Competitive Landscape

• 11.1 Heat Map Analysis by Key Players
• 11.2 Company Positioning & Concentration

11. Industry Landscape

• 12.1 Overview
• 12.2 Market Initiative
• 12.3 New Product Development
• 12.4 Merger and Acquisition

12. Company Profiles

• 12.1 SK Hynix Inc
  • 13.1.1 Key Facts
  • 13.1.2 Business Description
  • 13.1.3 Products and Services
  • 13.1.4 Financial Overview
  • 13.1.5 SWOT Analysis
  • 13.1.6 Key Developments
• 12.2 Samsung Electronics Co Ltd
  • 13.2.1 Key Facts
  • 13.2.2 Business Description
  • 13.2.3 Products and Services
  • 13.2.4 Financial Overview
  • 13.2.5 SWOT Analysis
  • 13.2.6 Key Developments
• 12.3 Infineon Technologies AG
  • 13.3.1 Key Facts
  • 13.3.2 Business Description
  • 13.3.3 Products and Services
  • 13.3.4 Financial Overview
  • 13.3.5 SWOT Analysis
  • 13.3.6 Key Developments
• 12.4 DuPont de Nemours Inc
  • 13.4.1 Key Facts
  • 13.4.2 Business Description
  • 13.4.3 Products and Services
  • 13.4.4 Financial Overview
  • 13.4.5 SWOT Analysis
  • 13.4.6 Key Developments
• 12.5 FUJIFILM Holdings Corp
  • 13.5.1 Key Facts
  • 13.5.2 Business Description
  • 13.5.3 Products and Services
  • 13.5.4 Financial Overview
  • 13.5.5 SWOT Analysis
  • 13.5.6 Key Developments
• 12.6 Amkor Technology Inc
  • 13.6.1 Key Facts
  • 13.6.2 Business Description
  • 13.6.3 Products and Services
  • 13.6.4 Financial Overview
  • 13.6.5 SWOT Analysis
  • 13.6.6 Key Developments
• 12.7 ASE Technology Holding Co Ltd
  • 13.7.1 Key Facts
  • 13.7.2 Business Description
  • 13.7.3 Products and Services
  • 13.7.4 Financial Overview
  • 13.7.5 SWOT Analysis
  • 13.7.6 Key Developments
• 12.8 NXP Semiconductors NV
  • 13.8.1 Key Facts
  • 13.8.2 Business Description
  • 13.8.3 Products and Services
  • 13.8.4 Financial Overview
  • 13.8.5 SWOT Analysis
  • 13.8.6 Key Developments
• 12.9 JCET Group Co Ltd
  • 13.9.1 Key Facts
  • 13.9.2 Business Description
  • 13.9.3 Products and Services
  • 13.9.4 Financial Overview
  • 13.9.5 SWOT Analysis
  • 13.9.6 Key Developments
• 12.10 Shin-Etsu Chemical Co Ltd
  • 13.10.1 Key Facts
  • 13.10.2 Business Description
  • 13.10.3 Products and Services
  • 13.10.4 Financial Overview
  • 13.10.5 SWOT Analysis
  • 13.10.6 Key Developments

13. Appendix