플립칩 시장 예측 : 산업 규모, 점유율, 동향, 기회, 웨이퍼 범핑 공정별, 패키징 기술별, 제품별, 최종 사용자별, 지역별, 경쟁 구도(2021-2031년)

The Global Flip Chip Market will grow from USD 36.38 Billion in 2025 to USD 52.93 Billion by 2031 at a 6.45% CAGR. Flip chip technology, also known as Controlled Collapse Chip Connection, is a method for interconnecting semiconductor devices to external circuitry using solder bumps deposited onto the active face of the chip.

Key Market Drivers

The surge in High-Performance Computing (HPC) and Artificial Intelligence constitutes a primary catalyst for the Global Flip Chip Market, as these applications demand unprecedented interconnect density and electrical efficiency. To accommodate the massive computational loads of AI algorithms, manufacturers are increasingly utilizing flip chip interconnects, such as copper pillar bumps, which offer superior thermal management and lower inductance compared to traditional wire bonding. This transition is essential for enabling the dense integration required by modern Graphics Processing Units (GPUs) and AI accelerators found in data centers.

Key Market Challenges

The Global Flip Chip Market faces a substantial challenge regarding the high manufacturing costs and technical complexities associated with the underfilling process. This specific production step is essential for mitigating thermal expansion mismatches between the chip and the substrate but introduces significant operational difficulties. The intricate nature of underfilling requires precise control and specialized materials, which directly increases the overall unit cost.

Key Market Trends

Semiconductor manufacturers are increasingly moving away from monolithic System-on-Chip (SoC) designs toward modular chiplet architectures, relying heavily on advanced flip chip packaging to interconnect multiple smaller dies within a single package. This architectural shift addresses the skyrocketing costs and yield challenges associated with manufacturing large dies at advanced nodes, allowing for the integration of disparate functions like logic and memory into scalable systems.

Key Market Players

• Intel Corporation
• Taiwan Semiconductor Manufacturing Company Limited
• Samsung Electronics Co., Ltd.
• Advanced Micro Devices, Inc.
• Amkor Technology, Inc.
• ASE Group
• Texas Instruments Incorporated
• GlobalFoundries Inc.
• Powertech Technology Inc.
• Siliconware Precision Industries Co., Ltd.

Report Scope:

In this report, the Global Flip Chip Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Flip Chip Market, By Wafer Bumping Process:

• Copper Pillar
• Tin-Lead Eutectic Solder
• Lead-Free Solder
• Gold Stud Bumping

Flip Chip Market, By Packaging Technology:

• BGA (2.1D/2.5D/3D) and CSP

Flip Chip Market, By Product:

• Memory
• Light Emitting Diode
• CMOS Image Sensor
• SoC
• GPU
• CPU

Flip Chip Market, By End User:

• Military and Defense
• Medical and Healthcare
• Industrial Sector
• Automotive
• Consumer Electronics
• Telecommunications

Flip Chip Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Flip Chip Market.

Available Customizations:

Global Flip Chip Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Flip Chip Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Wafer Bumping Process (Copper Pillar, Tin-Lead Eutectic Solder, Lead-Free Solder, Gold Stud Bumping)
  • 5.2.2. By Packaging Technology (BGA (2.1D/2.5D/3D) and CSP)
  • 5.2.3. By Product (Memory, Light Emitting Diode, CMOS Image Sensor, SoC, GPU, CPU)
  • 5.2.4. By End User (Military and Defense, Medical and Healthcare, Industrial Sector, Automotive, Consumer Electronics, Telecommunications)
  • 5.2.5. By Region
  • 5.2.6. By Company (2025)
• 5.3. Market Map

6. North America Flip Chip Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Wafer Bumping Process
  • 6.2.2. By Packaging Technology
  • 6.2.3. By Product
  • 6.2.4. By End User
  • 6.2.5. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Flip Chip Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Wafer Bumping Process
      • 6.3.1.2.2. By Packaging Technology
      • 6.3.1.2.3. By Product
      • 6.3.1.2.4. By End User
  • 6.3.2. Canada Flip Chip Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Wafer Bumping Process
      • 6.3.2.2.2. By Packaging Technology
      • 6.3.2.2.3. By Product
      • 6.3.2.2.4. By End User
  • 6.3.3. Mexico Flip Chip Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Wafer Bumping Process
      • 6.3.3.2.2. By Packaging Technology
      • 6.3.3.2.3. By Product
      • 6.3.3.2.4. By End User

7. Europe Flip Chip Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Wafer Bumping Process
  • 7.2.2. By Packaging Technology
  • 7.2.3. By Product
  • 7.2.4. By End User
  • 7.2.5. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Flip Chip Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Wafer Bumping Process
      • 7.3.1.2.2. By Packaging Technology
      • 7.3.1.2.3. By Product
      • 7.3.1.2.4. By End User
  • 7.3.2. France Flip Chip Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Wafer Bumping Process
      • 7.3.2.2.2. By Packaging Technology
      • 7.3.2.2.3. By Product
      • 7.3.2.2.4. By End User
  • 7.3.3. United Kingdom Flip Chip Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Wafer Bumping Process
      • 7.3.3.2.2. By Packaging Technology
      • 7.3.3.2.3. By Product
      • 7.3.3.2.4. By End User
  • 7.3.4. Italy Flip Chip Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Wafer Bumping Process
      • 7.3.4.2.2. By Packaging Technology
      • 7.3.4.2.3. By Product
      • 7.3.4.2.4. By End User
  • 7.3.5. Spain Flip Chip Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Wafer Bumping Process
      • 7.3.5.2.2. By Packaging Technology
      • 7.3.5.2.3. By Product
      • 7.3.5.2.4. By End User

8. Asia Pacific Flip Chip Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Wafer Bumping Process
  • 8.2.2. By Packaging Technology
  • 8.2.3. By Product
  • 8.2.4. By End User
  • 8.2.5. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Flip Chip Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Wafer Bumping Process
      • 8.3.1.2.2. By Packaging Technology
      • 8.3.1.2.3. By Product
      • 8.3.1.2.4. By End User
  • 8.3.2. India Flip Chip Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Wafer Bumping Process
      • 8.3.2.2.2. By Packaging Technology
      • 8.3.2.2.3. By Product
      • 8.3.2.2.4. By End User
  • 8.3.3. Japan Flip Chip Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Wafer Bumping Process
      • 8.3.3.2.2. By Packaging Technology
      • 8.3.3.2.3. By Product
      • 8.3.3.2.4. By End User
  • 8.3.4. South Korea Flip Chip Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Wafer Bumping Process
      • 8.3.4.2.2. By Packaging Technology
      • 8.3.4.2.3. By Product
      • 8.3.4.2.4. By End User
  • 8.3.5. Australia Flip Chip Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Wafer Bumping Process
      • 8.3.5.2.2. By Packaging Technology
      • 8.3.5.2.3. By Product
      • 8.3.5.2.4. By End User

9. Middle East & Africa Flip Chip Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Wafer Bumping Process
  • 9.2.2. By Packaging Technology
  • 9.2.3. By Product
  • 9.2.4. By End User
  • 9.2.5. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Flip Chip Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Wafer Bumping Process
      • 9.3.1.2.2. By Packaging Technology
      • 9.3.1.2.3. By Product
      • 9.3.1.2.4. By End User
  • 9.3.2. UAE Flip Chip Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Wafer Bumping Process
      • 9.3.2.2.2. By Packaging Technology
      • 9.3.2.2.3. By Product
      • 9.3.2.2.4. By End User
  • 9.3.3. South Africa Flip Chip Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Wafer Bumping Process
      • 9.3.3.2.2. By Packaging Technology
      • 9.3.3.2.3. By Product
      • 9.3.3.2.4. By End User

10. South America Flip Chip Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Wafer Bumping Process
  • 10.2.2. By Packaging Technology
  • 10.2.3. By Product
  • 10.2.4. By End User
  • 10.2.5. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Flip Chip Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Wafer Bumping Process
      • 10.3.1.2.2. By Packaging Technology
      • 10.3.1.2.3. By Product
      • 10.3.1.2.4. By End User
  • 10.3.2. Colombia Flip Chip Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Wafer Bumping Process
      • 10.3.2.2.2. By Packaging Technology
      • 10.3.2.2.3. By Product
      • 10.3.2.2.4. By End User
  • 10.3.3. Argentina Flip Chip Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Wafer Bumping Process
      • 10.3.3.2.2. By Packaging Technology
      • 10.3.3.2.3. By Product
      • 10.3.3.2.4. By End User

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Flip Chip Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. Intel Corporation
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. Taiwan Semiconductor Manufacturing Company Limited
• 15.3. Samsung Electronics Co., Ltd.
• 15.4. Advanced Micro Devices, Inc.
• 15.5. Amkor Technology, Inc.
• 15.6. ASE Group
• 15.7. Texas Instruments Incorporated
• 15.8. GlobalFoundries Inc.
• 15.9. Powertech Technology Inc.
• 15.10. Siliconware Precision Industries Co., Ltd.

16. Strategic Recommendations

17. About Us & Disclaimer