파워 오버 이더넷(PoE) 칩셋 시장 : 세계 산업 규모, 점유율, 동향, 기회, 예측 - 용도별, 최종사용자별, 디바이스별, 지역별, 경쟁(2021-2031년)

The Global Power over Ethernet (PoE) Chipset Market is projected to expand from USD 1.34 Billion in 2025 to USD 3.12 Billion by 2031, achieving a compound annual growth rate of 15.13%. These specialized integrated circuits allow standard Ethernet cables to carry both data and electrical power simultaneously. The primary catalysts for this growth are the rapid proliferation of the Internet of Things and the demand for cost-efficient cabling solutions in smart buildings, specifically for networked LED lighting and sophisticated IP security systems. These drivers maintain robust demand for chipsets that simplify infrastructure setup and accommodate the increasing density of connected devices in industrial and commercial settings.

Conversely, a major obstacle limiting market growth is the interoperability issue arising when devices from various manufacturers are combined, leading to operational inconsistencies. In 2024, the Ethernet Alliance reported that 33 percent of survey participants intended to deploy high-power PoE devices exceeding 51 watts within the coming year. This trend toward elevated power requirements amplifies compatibility risks, making strict adherence to certification standards essential to avoid system failures that could otherwise hinder deployment momentum.

Market Driver

The rise of Smart Building and Lighting Automation acts as a pivotal growth mechanism for the PoE chipset sector, revolutionizing energy and data management in commercial facilities. As enterprises move toward integrated infrastructures, PoE chipsets are increasingly employed to power connected LED lighting, environmental sensors, and HVAC controls via a single platform, removing the need for distinct electrical wiring. This shift is deeply rooted in real estate digital transformation; according to Johnson Controls' "Cracking The Smart Buildings Code" report from September 2024, 75 percent of retail and commercial real estate leaders view smart buildings as vital for accelerating digital transformation, prompting manufacturers to focus on energy-efficient designs for massive low-voltage endpoint deployments.

Concurrently, the escalating deployment of Wireless Access Points and 5G Small Cells drives the need for high-performance PoE solutions equipped to manage elevated power and bandwidth loads. Modern wireless standards demand robust power delivery that only advanced chipsets can sustain to ensure reliable connectivity. The Wireless Broadband Alliance's "Annual Industry Report 2024" identified Wi-Fi 6, 6E, and 7 as leading technologies slated for deployment by network operators and enterprises by year's end. This adoption highlights the need for seamless interoperability and higher power outputs, a sentiment echoed by the Ethernet Alliance in 2024, noting that 80 percent of respondents are willing to pay a premium of at least five percent for certified PoE products to ensure quality and reliability.

Market Challenge

The central hurdle constraining the Global Power over Ethernet (PoE) Chipset Market is the ongoing lack of interoperability between power sourcing equipment and powered devices from different vendors. As the ecosystem grows to encompass a broader range of endpoints, inconsistent compliance with technical standards introduces substantial integration risks. When components fail to properly negotiate power levels or communicate, deployments experience hardware malfunctions and operational instability. These reliability concerns discourage widespread adoption in mission-critical settings, as facility managers worry that combining equipment from various sources will result in intricate troubleshooting needs or expensive downtime.

This uncertainty forces market participants to proceed with significant caution, effectively decelerating the sales cycle. The apprehension surrounding incompatibility constructs a barrier where end-users are reluctant to invest in infrastructure lacking guaranteed performance verification. Consequently, the potential for system failure limits the available market for chipsets that cannot demonstrate strict adherence to standards. This hesitation is supported by industry data; the Ethernet Alliance reported in 2024 that 96 percent of PoE professionals allowed certification to influence their purchasing decisions, indicating that doubts regarding compatibility drive market access and penalize manufacturers who neglect these integration challenges.

Market Trends

The migration of PoE into Industrial IoT (IIoT) and Factory Automation is transforming the chipset market as manufacturers shift from legacy fieldbus systems to standardized Ethernet connectivity. This evolution allows industrial controllers, cameras, and sensors to be powered directly through a single cable, promoting seamless IT/OT convergence on production floors. In response, chipset vendors are engineering ruggedized solutions designed to maintain power delivery in harsh environments where reliability is critical. This industrial transition is corroborated by HMS Networks' "Industrial Network Market Shares 2025" report from May 2025, which states that Ethernet-based solutions now comprise 76 percent of all newly installed factory automation nodes, signaling a definitive move toward IP-based power infrastructure.

Furthermore, the integration of Intelligent Power Management and Remote Monitoring is gaining momentum due to the need for advanced telemetry and cybersecurity in connected systems. Modern PoE chipsets are advancing to offer continuous thermal and voltage status monitoring, which facilitates anomaly detection and predictive maintenance algorithms. This functionality is essential as organizations employ artificial intelligence to protect physical infrastructure vulnerabilities. The necessity for such intelligence is emphasized by Rockwell Automation's "10th Annual State of Smart Manufacturing Report" from June 2025, which notes that 49 percent of manufacturers intend to utilize artificial intelligence for cybersecurity initiatives, highlighting the demand for chipsets capable of supporting secure, data-intensive power management.

Key Market Players

• Veolia Environnement SA
• Filtra-Systems Company LLC
• WesTech Engineering, LLC.
• Ecolab Inc.
• Aquatech International LLC.
• Lenntech B.V.
• Xylem Inc.
• Danaher Corporation

Report Scope

In this report, the Global Power over Ethernet (PoE) Chipset Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Power over Ethernet (PoE) Chipset Market, By Application

• LED Lighting
• Security
• Connectivity

Power over Ethernet (PoE) Chipset Market, By End-User

• Commercial
• Residential
• Industrial

Power over Ethernet (PoE) Chipset Market, By Device

• Network Cameras
• VOIP Phone
• Ethernet Switch & Injector

Power over Ethernet (PoE) Chipset Market, By Region

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
• Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
• South America
  • Brazil
  • Argentina
  • Colombia
• Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Power over Ethernet (PoE) Chipset Market.

Available Customizations:

Global Power over Ethernet (PoE) Chipset Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Power over Ethernet (PoE) Chipset Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Application (LED Lighting, Security, Connectivity)
  • 5.2.2. By End-User (Commercial, Residential, Industrial)
  • 5.2.3. By Device (Network Cameras, VOIP Phone, Ethernet Switch & Injector)
  • 5.2.4. By Region
  • 5.2.5. By Company (2025)
• 5.3. Market Map

6. North America Power over Ethernet (PoE) Chipset Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Application
  • 6.2.2. By End-User
  • 6.2.3. By Device
  • 6.2.4. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Power over Ethernet (PoE) Chipset Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Application
      • 6.3.1.2.2. By End-User
      • 6.3.1.2.3. By Device
  • 6.3.2. Canada Power over Ethernet (PoE) Chipset Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Application
      • 6.3.2.2.2. By End-User
      • 6.3.2.2.3. By Device
  • 6.3.3. Mexico Power over Ethernet (PoE) Chipset Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Application
      • 6.3.3.2.2. By End-User
      • 6.3.3.2.3. By Device

7. Europe Power over Ethernet (PoE) Chipset Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Application
  • 7.2.2. By End-User
  • 7.2.3. By Device
  • 7.2.4. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Power over Ethernet (PoE) Chipset Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Application
      • 7.3.1.2.2. By End-User
      • 7.3.1.2.3. By Device
  • 7.3.2. France Power over Ethernet (PoE) Chipset Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Application
      • 7.3.2.2.2. By End-User
      • 7.3.2.2.3. By Device
  • 7.3.3. United Kingdom Power over Ethernet (PoE) Chipset Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Application
      • 7.3.3.2.2. By End-User
      • 7.3.3.2.3. By Device
  • 7.3.4. Italy Power over Ethernet (PoE) Chipset Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Application
      • 7.3.4.2.2. By End-User
      • 7.3.4.2.3. By Device
  • 7.3.5. Spain Power over Ethernet (PoE) Chipset Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Application
      • 7.3.5.2.2. By End-User
      • 7.3.5.2.3. By Device

8. Asia Pacific Power over Ethernet (PoE) Chipset Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Application
  • 8.2.2. By End-User
  • 8.2.3. By Device
  • 8.2.4. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Power over Ethernet (PoE) Chipset Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Application
      • 8.3.1.2.2. By End-User
      • 8.3.1.2.3. By Device
  • 8.3.2. India Power over Ethernet (PoE) Chipset Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Application
      • 8.3.2.2.2. By End-User
      • 8.3.2.2.3. By Device
  • 8.3.3. Japan Power over Ethernet (PoE) Chipset Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Application
      • 8.3.3.2.2. By End-User
      • 8.3.3.2.3. By Device
  • 8.3.4. South Korea Power over Ethernet (PoE) Chipset Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Application
      • 8.3.4.2.2. By End-User
      • 8.3.4.2.3. By Device
  • 8.3.5. Australia Power over Ethernet (PoE) Chipset Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Application
      • 8.3.5.2.2. By End-User
      • 8.3.5.2.3. By Device

9. Middle East & Africa Power over Ethernet (PoE) Chipset Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Application
  • 9.2.2. By End-User
  • 9.2.3. By Device
  • 9.2.4. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Power over Ethernet (PoE) Chipset Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Application
      • 9.3.1.2.2. By End-User
      • 9.3.1.2.3. By Device
  • 9.3.2. UAE Power over Ethernet (PoE) Chipset Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Application
      • 9.3.2.2.2. By End-User
      • 9.3.2.2.3. By Device
  • 9.3.3. South Africa Power over Ethernet (PoE) Chipset Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Application
      • 9.3.3.2.2. By End-User
      • 9.3.3.2.3. By Device

10. South America Power over Ethernet (PoE) Chipset Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Application
  • 10.2.2. By End-User
  • 10.2.3. By Device
  • 10.2.4. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Power over Ethernet (PoE) Chipset Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Application
      • 10.3.1.2.2. By End-User
      • 10.3.1.2.3. By Device
  • 10.3.2. Colombia Power over Ethernet (PoE) Chipset Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Application
      • 10.3.2.2.2. By End-User
      • 10.3.2.2.3. By Device
  • 10.3.3. Argentina Power over Ethernet (PoE) Chipset Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Application
      • 10.3.3.2.2. By End-User
      • 10.3.3.2.3. By Device

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Power over Ethernet (PoE) Chipset Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. Veolia Environnement SA
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. Filtra-Systems Company LLC
• 15.3. WesTech Engineering, LLC.
• 15.4. Ecolab Inc.
• 15.5. Aquatech International LLC.
• 15.6. Lenntech B.V.
• 15.7. Xylem Inc.
• 15.8. Danaher Corporation

16. Strategic Recommendations

17. About Us & Disclaimer