고신뢰성 반도체 시장 : 세계 산업 분석, 규모, 점유율, 성장, 동향, 예측(2022-2031년)

The report provides revenue of the global high-reliability semiconductor market for the period 2017-2031, considering 2022 as the base year and 2031 as the forecast year. The report also provides the compound annual growth rate (CAGR %) of the global high-reliability semiconductor market from 2022 to 2031.

The report has been prepared after an extensive research. Primary research involved bulk of the research efforts, wherein analysts carried out interviews with key opinion leaders, industry leaders, and opinion makers. Secondary research involved referring to key players' product literature, annual reports, press releases, and relevant documents to understand the high-reliability semiconductor market.

The report delves into the competitive landscape of the global high-reliability semiconductor market. Key players operating in the global high-reliability semiconductor market have been identified and each one of these has been profiled, in terms of various attributes. Company overview, financial standings, recent developments, and SWOT are attributes of players in the global high-reliability semiconductor market profiled in this report.

Table of Contents

1. Preface

• 1.1. Market Introduction
• 1.2. Market and Segments Definition
• 1.3. Market Taxonomy
• 1.4. Research Methodology
• 1.5. Assumption and Acronyms

2. Executive Summary

• 2.1. Global High-reliability Semiconductor Market Overview
• 2.2. Regional Outline
• 2.3. Industry Outline
• 2.4. Market Dynamics Snapshot
• 2.5. Competition Blueprint

3. Market Dynamics

• 3.1. Macro-economic Factors
• 3.2. Drivers
• 3.3. Restraints
• 3.4. Opportunities
• 3.5. Key Trends
• 3.6. Regulatory Framework

4. Associated Industry and Key Indicator Assessment

• 4.1. Parent Industry Overview - Global Semiconductor Industry Overview
• 4.2. Supply Chain Analysis
• 4.3. Technology Roadmap Analysis
• 4.4. Industry SWOT Analysis
• 4.5. Porter's Five Forces Analysis
• 4.6. COVID-19 Impact and Recovery Analysis

5. Global High-reliability Semiconductor Market Analysis, by Type

• 5.1. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Type, 2017-2031
  • 5.1.1. Discrete
  • 5.1.2. Analog
  • 5.1.3. Mixed
• 5.2. Market Attractiveness Analysis, by Type

6. Global High-reliability Semiconductor Market Analysis, by Packaging Material

• 6.1. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Packaging Material, 2017-2031
  • 6.1.1. Plastic
  • 6.1.2. Ceramic
• 6.2. Market Attractiveness Analysis, by Packaging Material

7. Global High-reliability Semiconductor Market Analysis, by Technology

• 7.1. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Technology, 2017-2031
  • 7.1.1. Surface Mount Technology (SMT)
  • 7.1.2. Through Hole Technology (THT)
• 7.2. Market Attractiveness Analysis, by Technology

8. Global High-reliability Semiconductor Market Analysis, by Quality Level

• 8.1. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Quality Level, 2017-2031
  • 8.1.1. JAN
  • 8.1.2. JANX
  • 8.1.3. JANTXV
  • 8.1.4. JANS
  • 8.1.5. JANSR
  • 8.1.6. QMLQ
  • 8.1.7. QMLV
• 8.2. Market Attractiveness Analysis, by Quality Level

9. Global High-reliability Semiconductor Market Analysis, by End-use Industry

• 9.1. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by End-use Industry, 2017-2031
  • 9.1.1. Aerospace
  • 9.1.2. Defense
  • 9.1.3. Space
• 9.2. Market Attractiveness Analysis, by End-use Industry

10. Global High-reliability Semiconductor Market Analysis and Forecast, by Region

• 10.1. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Region, 2017-2031
  • 10.1.1. North America
  • 10.1.2. Europe
  • 10.1.3. Asia Pacific
  • 10.1.4. Middle East & Africa
  • 10.1.5. South America
• 10.2. Market Attractiveness Analysis, by Region

11. North America High-reliability Semiconductor Market Analysis and Forecast

• 11.1. Market Snapshot
• 11.2. Drivers and Restraints: Impact Analysis
• 11.3. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Type, 2017-2031
  • 11.3.1. Discrete
  • 11.3.2. Analog
  • 11.3.3. Mixed
• 11.4. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Packaging Material, 2017-2031
  • 11.4.1. Plastic
  • 11.4.2. Ceramic
• 11.5. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Technology, 2017-2031
  • 11.5.1. Surface Mount Technology (SMT)
  • 11.5.2. Through Hole Technology (THT)
• 11.6. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Quality Level, 2017-2031
  • 11.6.1. JAN
  • 11.6.2. JANX
  • 11.6.3. JANTXV
  • 11.6.4. JANS
  • 11.6.5. JANSR
  • 11.6.6. QMLQ
  • 11.6.7. QMLV
• 11.7. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by End-use Industry, 2017-2031
  • 11.7.1. Aerospace
  • 11.7.2. Defense
  • 11.7.3. Space
• 11.8. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Country and Sub-region, 2017-2031
  • 11.8.1. The U.S.
  • 11.8.2. Canada
  • 11.8.3. Rest of North America
• 11.9. Market Attractiveness Analysis
  • 11.9.1. By Type
  • 11.9.2. By Packaging Material
  • 11.9.3. By Technology
  • 11.9.4. By Quality Level
  • 11.9.5. By End-use Industry
  • 11.9.6. By Country/Sub-region

12. Europe High-reliability Semiconductor Market Analysis and Forecast

• 12.1. Market Snapshot
• 12.2. Drivers and Restraints: Impact Analysis
• 12.3. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Type, 2017-2031
  • 12.3.1. Discrete
  • 12.3.2. Analog
  • 12.3.3. Mixed
• 12.4. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Packaging Material, 2017-2031
  • 12.4.1. Plastic
  • 12.4.2. Ceramic
• 12.5. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Technology, 2017-2031
  • 12.5.1. Surface Mount Technology (SMT)
  • 12.5.2. Through Hole Technology (THT)
• 12.6. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Quality Level, 2017-2031
  • 12.6.1. JAN
  • 12.6.2. JANX
  • 12.6.3. JANTXV
  • 12.6.4. JANS
  • 12.6.5. JANSR
  • 12.6.6. QMLQ
  • 12.6.7. QMLV
• 12.7. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by End-use Industry, 2017-2031
  • 12.7.1. Aerospace
  • 12.7.2. Defense
  • 12.7.3. Space
• 12.8. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Country and Sub-region, 2017-2031
  • 12.8.1. U.K.
  • 12.8.2. Germany
  • 12.8.3. France
  • 12.8.4. Rest of Europe
• 12.9. Market Attractiveness Analysis
  • 12.9.1. By Type
  • 12.9.2. By Packaging Material
  • 12.9.3. By Technology
  • 12.9.4. By Quality Level
  • 12.9.5. By End-use Industry
  • 12.9.6. By Country/Sub-region

13. Asia Pacific High-reliability Semiconductor Market Analysis and Forecast

• 13.1. Market Snapshot
• 13.2. Drivers and Restraints: Impact Analysis
• 13.3. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Type, 2017-2031
  • 13.3.1. Discrete
  • 13.3.2. Analog
  • 13.3.3. Mixed
• 13.4. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Packaging Material, 2017-2031
  • 13.4.1. Plastic
  • 13.4.2. Ceramic
• 13.5. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Technology, 2017-2031
  • 13.5.1. Surface Mount Technology (SMT)
  • 13.5.2. Through Hole Technology (THT)
• 13.6. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Quality Level, 2017-2031
  • 13.6.1. JAN
  • 13.6.2. JANX
  • 13.6.3. JANTXV
  • 13.6.4. JANS
  • 13.6.5. JANSR
  • 13.6.6. QMLQ
  • 13.6.7. QMLV
• 13.7. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by End-use Industry, 2017-2031
  • 13.7.1. Aerospace
  • 13.7.2. Defense
  • 13.7.3. Space
• 13.8. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Country and Sub-region, 2017-2031
  • 13.8.1. China
  • 13.8.2. India
  • 13.8.3. Japan
  • 13.8.4. South Korea
  • 13.8.5. ASEAN
  • 13.8.6. Rest of Asia Pacific
• 13.9. Market Attractiveness Analysis
  • 13.9.1. By Type
  • 13.9.2. By Packaging Material
  • 13.9.3. By Technology
  • 13.9.4. By Quality Level
  • 13.9.5. By End-use Industry
  • 13.9.6. By Country/Sub-region

14. Middle East & Africa High-reliability Semiconductor Market Analysis and Forecast

• 14.1. Market Snapshot
• 14.2. Drivers and Restraints: Impact Analysis
• 14.3. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Type, 2017-2031
  • 14.3.1. Discrete
  • 14.3.2. Analog
  • 14.3.3. Mixed
• 14.4. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Packaging Material, 2017-2031
  • 14.4.1. Plastic
  • 14.4.2. Ceramic
• 14.5. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Technology, 2017-2031
  • 14.5.1. Surface Mount Technology (SMT)
  • 14.5.2. Through Hole Technology (THT)
• 14.6. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Quality Level, 2017-2031
  • 14.6.1. JAN
  • 14.6.2. JANX
  • 14.6.3. JANTXV
  • 14.6.4. JANS
  • 14.6.5. JANSR
  • 14.6.6. QMLQ
  • 14.6.7. QMLV
• 14.7. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by End-use Industry, 2017-2031
  • 14.7.1. Aerospace
  • 14.7.2. Defense
  • 14.7.3. Space
• 14.8. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Country and Sub-region, 2017-2031
  • 14.8.1. GCC
  • 14.8.2. South Africa
  • 14.8.3. Rest of the Middle East & Africa
• 14.9. Market Attractiveness Analysis
  • 14.9.1. By Type
  • 14.9.2. By Packaging Material
  • 14.9.3. By Technology
  • 14.9.4. By Quality Level
  • 14.9.5. By End-use Industry
  • 14.9.6. By Country/Sub-region

15. South America High-reliability Semiconductor Market Analysis and Forecast

• 15.1. Market Snapshot
• 15.2. Drivers and Restraints: Impact Analysis
• 15.3. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Type, 2017-2031
  • 15.3.1. Discrete
  • 15.3.2. Analog
  • 15.3.3. Mixed
• 15.4. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Packaging Material, 2017-2031
  • 15.4.1. Plastic
  • 15.4.2. Ceramic
• 15.5. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Technology, 2017-2031
  • 15.5.1. Surface Mount Technology (SMT)
  • 15.5.2. Through Hole Technology (THT)
• 15.6. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Quality Level, 2017-2031
  • 15.6.1. JAN
  • 15.6.2. JANX
  • 15.6.3. JANTXV
  • 15.6.4. JANS
  • 15.6.5. JANSR
  • 15.6.6. QMLQ
  • 15.6.7. QMLV
• 15.7. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by End-use Industry, 2017-2031
  • 15.7.1. Aerospace
  • 15.7.2. Defense
  • 15.7.3. Space
• 15.8. High-reliability Semiconductor Market Value (US$ Mn) Analysis & Forecast, by Country and Sub-region, 2017-2031
  • 15.8.1. Brazil
  • 15.8.2. Rest of South America
• 15.9. Market Attractiveness Analysis
  • 15.9.1. By Type
  • 15.9.2. By Packaging Material
  • 15.9.3. By Technology
  • 15.9.4. By Quality Level
  • 15.9.5. By End-use Industry
  • 15.9.6. By Country/Sub-region

16. Competition Assessment

• 16.1. Global High-reliability Semiconductor Market Competition Matrix - a Dashboard View
  • 16.1.1. Global High-reliability Semiconductor Market Company Share Analysis, by Value (2021)
  • 16.1.2. Technological Differentiator

17. Company Profiles (Global Manufacturers/Suppliers)

• 17.1. Digitron Semiconductors
  • 17.1.1. Overview
  • 17.1.2. Product Portfolio
  • 17.1.3. Sales Footprint
  • 17.1.4. Key Subsidiaries or Distributors
  • 17.1.5. Strategy and Recent Developments
  • 17.1.6. Key Financials
• 17.2. Infineon Technologies AG
  • 17.2.1. Overview
  • 17.2.2. Product Portfolio
  • 17.2.3. Sales Footprint
  • 17.2.4. Key Subsidiaries or Distributors
  • 17.2.5. Strategy and Recent Developments
  • 17.2.6. Key Financials
• 17.3. KCB Solutions, LLC
  • 17.3.1. Overview
  • 17.3.2. Product Portfolio
  • 17.3.3. Sales Footprint
  • 17.3.4. Key Subsidiaries or Distributors
  • 17.3.5. Strategy and Recent Developments
  • 17.3.6. Key Financials
• 17.4. Microsemi Corporation
  • 17.4.1. Overview
  • 17.4.2. Product Portfolio
  • 17.4.3. Sales Footprint
  • 17.4.4. Key Subsidiaries or Distributors
  • 17.4.5. Strategy and Recent Developments
  • 17.4.6. Key Financials
• 17.5. SEMICOA
  • 17.5.1. Overview
  • 17.5.2. Product Portfolio
  • 17.5.3. Sales Footprint
  • 17.5.4. Key Subsidiaries or Distributors
  • 17.5.5. Strategy and Recent Developments
  • 17.5.6. Key Financials
• 17.6. Semtech Corporation
  • 17.6.1. Overview
  • 17.6.2. Product Portfolio
  • 17.6.3. Sales Footprint
  • 17.6.4. Key Subsidiaries or Distributors
  • 17.6.5. Strategy and Recent Developments
  • 17.6.6. Key Financials
• 17.7. Skyworks Solutions Inc
  • 17.7.1. Overview
  • 17.7.2. Product Portfolio
  • 17.7.3. Sales Footprint
  • 17.7.4. Key Subsidiaries or Distributors
  • 17.7.5. Strategy and Recent Developments
  • 17.7.6. Key Financials
• 17.8. Teledyne Technologies Incorporated
  • 17.8.1. Overview
  • 17.8.2. Product Portfolio
  • 17.8.3. Sales Footprint
  • 17.8.4. Key Subsidiaries or Distributors
  • 17.8.5. Strategy and Recent Developments
  • 17.8.6. Key Financials
• 17.9. Testime Technology Ltd
  • 17.9.1. Overview
  • 17.9.2. Product Portfolio
  • 17.9.3. Sales Footprint
  • 17.9.4. Key Subsidiaries or Distributors
  • 17.9.5. Strategy and Recent Developments
  • 17.9.6. Key Financials
• 17.10. Texas Instruments Inc
  • 17.10.1. Overview
  • 17.10.2. Product Portfolio
  • 17.10.3. Sales Footprint
  • 17.10.4. Key Subsidiaries or Distributors
  • 17.10.5. Strategy and Recent Developments
  • 17.10.6. Key Financials
• 17.11. Vishay Intertechnology, Inc
  • 17.11.1. Overview
  • 17.11.2. Product Portfolio
  • 17.11.3. Sales Footprint
  • 17.11.4. Key Subsidiaries or Distributors
  • 17.11.5. Strategy and Recent Developments
  • 17.11.6. Key Financials

18. Recommendation

• 18.1. Opportunity Assessment
  • 18.1.1. By Type
  • 18.1.2. By Packaging Material
  • 18.1.3. By Technology
  • 18.1.4. By Quality Level
  • 18.1.5. By End-use Industry
  • 18.1.6. By Region