임베디드 보드, 모듈, 시스템 : 현대적인 제품 개발과 엣지 솔루션 구축에 필수적인 플랫폼

Inside this Report

This report provides a comprehensive analysis of the global market for embedded boards, modules, and integrated systems, examining how evolving edge computing, AI, and IoT workloads are reshaping demand across hardware form factors and deployment environments. It explores the total addressable market, growth outlook, and key technology and application trends influencing hardware adoption across form factors, including computer-on-modules (COMs), system-on-modules (SOMs), motherboards, single-board computers (SBCs), and embedded/OEM integrated computing systems and servers.

In addition, the report delivers a detailed assessment of the competitive landscape, profiling leading vendors, their market share positions, and their strategic differentiators across product categories and vertical markets. It incorporates both supplier-side analysis and demand-side insights drawn from extensive Voice of the Engineer research, illustrating how selection criteria, platform preferences, and design requirements vary across projects.

What Questions are Addressed?

• What is the current and forecasted size of the global market for embedded boards, modules, and integrated systems across key form factors?
• How are trends such as edge AI, IoT, and workload acceleration reshaping demand for platforms?
• Which vendors lead the market across embedded motherboards, modules, SBCs, and integrated systems, and how is share distributed?
• How is the competitive landscape evolving across different hardware categories and vertical markets?
• What impact are regulatory, security, and certification requirements having on hardware design and procurement decisions?
• What are key dynamics affecting embedded/OEM hardware differentiation?
• How are supplier strategies (e.g., vertical integration, AI enablement, customization, and services) evolving to capture future growth opportunities?

Who Should Read this Report?

This report was written for those making critical decisions regarding product, market, channel, and competitive strategy and tactics. This report is intended for senior decision-makers who are developing or participating in the ecosystem of IoT, embedded, and/or edge computing solutions, including:

• CEO or other C-level executives
• Corporate development and M&A teams
• Marketing executives
• Business development and sales leaders
• Product development/strategy leaders
• Channel management/strategy leaders

Technology Suppliers in this Research

• AAEON Technologies
• Abaco Systems
• ADLINK Technology
• Advantech
• AMD
• Arm
• Avalue Technology
• Axiomtek
• BAE Systems
• Beckhoff Automation
• Cisco
• congatec
• Curtiss-Wright Defense Solutions
• Dell Technologies OEM Solutions
• DFI
• Digi International
• duagon
• Eurotech
• EVOC Intelligent Technology
• Fujitsu Technology Solutions
• General Dynamics Mission Systems
• Hewlett Packard Enterprise
• Huawei
• IBASE Technology
• IBM
• IEI Integration
• Inspur
• Intel
• Kontron
• L3 Technologies
• Lanner Electronics
• Lenovo OEM
• Leonardo DRS
• MediaTek
• Mercury Systems
• MiTAC Computing
• MPL
• MSI
• NEC Corporation
• NVIDIA
• OnLogic
• Oracle
• Penguin Solutions
• PHYTEC
• Portwell
• Qualcomm
• Radisys
• Raspberry Pi
• RTD Embedded
• SECO
• Semtech
• Shenzhen NORCO Intelligent Technology
• Silicon Labs
• Supermicro Computer
• Texas Instruments
• Toradex
• TQ Systems
• Tria Technologies
• VersaLogic
• … and many others

Demand-side Research Overview

VDC launches numerous surveys of the IoT and embedded engineering ecosystem every year using an online survey platform. To support this research, VDC leverages its in-house panel of more than 30,000 individuals from various roles and industries across the world. Our global Voice of the Engineer survey recently captured insights from a total of 600 qualified respondents. This survey was used to inform our insights into key trends, preferences, and predictions within the engineering community. VDC does not use any AI-generated samples or panels for its surveys.

Table of Contents

Inside this Report

Executive Summary

• Key Findings
  • Hardware Demand Rebounds in 2025 and Rides Long-term Tailwinds
  • Edge AI Stimulates Architectural Change
  • Modularity and Standardization Help Alleviate Major Pain Points
  • Memory Bottlenecks, Shortages & Security Drive Redesigns
  • Cybersecurity Moves from Differentiator to Regulatory Requirement
  • Edge Use Cases Feed Verticalization
  • Edge-to-Cloud Convergence Extends to Hardware Platforms
  • Recent Acquisitions & Mergers

Engineering Insights

• Feature Set Requirements Hold a Massive Influence Over Hardware Component Selection
• Criteria for Systems-level Hardware Similarly Fluctuates by Embedded Capability Demand
• Growing Product Demands are in Turn Driving Higher Configuration Requirements
• Competitive Landscape
  • Embedded Motherboards & Single-board Computers
  • Embedded Computing Modules & Cards
  • Embedded Integrated Computer Systems & Servers

Vendor Profiles

• Abaco Systems
• ADLINK
• Advantech
• BAE Systems
• Beckhoff Automation
• congatec
• Dell Technologies
• Eurotech
• Hewlett Packard Enterprise
• Kontron
• Lenovo
• Mercury Systems
• NVIDIA
• Penguin Solutions
• Raspberry Pi
• Supermicro
• Toradex
• Tria Technologies

About the Authors

About VDC Strategy