세계의 IGBT용 Pin Fin 히트 싱크 시장 : 재료 유형별, 지역별, 범위 및 예측

Pin Fin Heat Sink For IGBT Market Size And Forecast

Pin Fin Heat Sink For IGBT Market size was valued at USD 2.5 Billion in 2023 and is projected to reach USD 6.17 Billion by 2030 , growing at a CAGR of 5.3% from 2024 to 2030. The increasing trend of electric mobility, home remodeling, and kitchen updates is boosting the Pin Fin Heat Sink For IGBT Market. IGBT-based power modules have become significantly more advanced and powerful in recent times. These modules contain large arrays of power-hungry electronic components that require high-performance heat sinks to prevent them from overheating and being damaged or destroyed. This will foster market growth.

The Global Pin Fin Heat Sink For IGBT Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.

Global Pin Fin Heat Sink For IGBT Market Definition

Pin Fin Heat Sink is comprised of a flat base with a scale of round pins that are implanted into the base. It is a rectangular-shaped piece of metal that rises from a metal base, the fins are situated perpendicular to the metal base, but are parallel to one another. These heat sinks are designed and structured geometrically to make them highly effective. These are available in copper and aluminum material and comes in different pin densities, which are suitable for different airspeed environments. A heat sink is a solid block of copper or aluminum with recurring fins that expand the possible surface area for heat transfer. Pin fins concurrently increase both the heat transfer surface region and the heat transfer coefficient. These are available in different sizes with a wide array of applications and devices, ranging from miniature semiconductors to large power devices.

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Global Pin Fin Heat Sink For IGBT Market Overview

The increasing need for effective cooling of consumer electronics by proper heat dissipation method, supported by an escalation in demand for huge power supply due to growing population and digitization are some of the prime factors that drive the global pin fin heat sink IGBT market growth. Moreover, the rise in demand for pin fin heat sinks owing to its multiple advantages such as higher volumetric efficiency and low cost over other types of heat sinks is also expected to fuel the growth of pin fin heat sink for the IGBT market. Also, an increase in the use of IGBT modules in the automotive field for HEVs and hybrid pin fin heat sinks has positively anticipated in propelling the growth of the global pin fin heat sink IGBT market.

There are certain restrictions and barriers that will hinder the overall market growth. Factors such as low capacity utilization of pin fin heat sink manufacturers are limiting the market growth. Nevertheless, the advancements in technologies, the increase in the use of IGBT modules in the automotive field for HEVs and hybrid pin fin heat sink, and untapped potential in emerging markets offer beneficial growth opportunities.

Global Pin Fin Heat Sink For IGBT Market: Segmentation Analysis

The Global Pin Fin Heat Sink For IGBT Market Segmented On The Basis Of Material Type, And Geography.

Pin Fin Heat Sink For IGBT Market, By Material Type

• Copper
• Aluminium

Based on Material Type, the market is bifurcated into Copper and Aluminium. The Aluminium segment holds the largest market share during the forecast period. The factors that can be attributed to the increasing need by electronic manufacturers owing to benefits such as high thermal performance and flexibility to fit into a variety of systems and designs are accelerating the demand for this segment.

Pin Fin Heat Sink For IGBT Market, By Geography

• North America
• Europe
• Asia Pacific
• Rest of the World
• On the basis of regional analysis, the Global Pin Fin Heat Sink For IGBT Market is classified into North America, Europe, Asia Pacific, and Rest of the world. Asia-Pacific holds the largest market share. The increasing consumer electronics and ongoing projects will boost the market in the APAC region.

Key Players

• The study report will provide a valuable insight with an emphasis on the global market including some of the major players such as
• Advanced Micro Devices (AMD), Apex Microtechnology, Aavid Thermalloy, LLC, Advanced Thermal Solutions, Inc., Allbrass Industrial The Brass, CUI Inc, Comair Rotron, Honeywell International Inc and Kunshan Googe Metal Products Co., Ltd.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis.

TABLE OF CONTENTS

1. INTRODUCTION OF GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET

• 1.1. Overview of the Market
• 1.2. Scope of Report
• 1.3. Assumptions

2. EXECUTIVE SUMMARY

3. RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

• 3.1. Data Mining
• 3.2. Validation
• 3.3. Primary Interviews
• 3.4. List of Data Sources

4. GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET OUTLOOK

• 4.1. Overview
• 4.2. Market Dynamics
  • 4.2.1. Drivers
  • 4.2.2. Restraints
  • 4.2.3. Opportunities
• 4.3. Porters Five Force Model
• 4.4. Value Chain Analysis

5. GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL

• 5.1. Overview
• 5.2. Copper
• 5.3. Aluminium

6. GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET, BY GEOGRAPHY

• 6.1. Overview
• 6.2. North America
  • 6.2.1. U.S.
  • 6.2.2. Canada
  • 6.2.3. Mexico
• 6.3. Europe
  • 6.3.1. Germany
  • 6.3.2. U.K.
  • 6.3.3. France
  • 6.3.4. Rest of Europe
• 6.4. Asia Pacific
  • 6.4.1. China
  • 6.4.2. Japan
  • 6.4.3. India
  • 6.4.4. Rest of Asia Pacific
• 6.5. Rest of the World
  • 6.5.1. Latin America
  • 6.5.2. Middle East & Africa

7. GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET COMPETITIVE LANDSCAPE

• 7.1. Overview
• 7.2. Company Market Ranking
• 7.3. Key Development Strategies

8. COMPANY PROFILES

• 8.1. Advanced Micro Devices (AMD)
  • 8.1.1. Overview
  • 8.1.2. Financial Performance
  • 8.1.3. Product Outlook
  • 8.1.4. Key Developments
• 8.2. Apex Microtechnology
  • 8.2.1. Overview
  • 8.2.2. Financial Performance
  • 8.2.3. Product Outlook
  • 8.2.4. Key Developments
• 8.3. Aavid Thermalloy, LLC
  • 8.3.1. Overview
  • 8.3.2. Financial Performance
  • 8.3.3. Product Outlook
  • 8.3.4. Key Developments
• 8.4. Advanced Thermal Solutions, Inc.
  • 8.4.1. Overview
  • 8.4.2. Financial Performance
  • 8.4.3. Product Outlook
  • 8.4.4. Key Developments
• 8.5. Allbrass Industrial The Brass
  • 8.5.1. Overview
  • 8.5.2. Financial Performance
  • 8.5.3. Product Outlook
  • 8.5.4. Key Developments
• 8.6. CUI Inc
  • 8.6.1. Overview
  • 8.6.2. Financial Performance
  • 8.6.3. Product Outlook
  • 8.6.4. Key Developments
• 8.7. Comair Rotron
  • 8.7.1. Overview
  • 8.7.2. Financial Performance
  • 8.7.3. Product Outlook
  • 8.7.4. Key Developments
• 8.8. Honeywell International Inc
  • 8.8.1. Overview
  • 8.8.2. Financial Performance
  • 8.8.3. Product Outlook
  • 8.8.4. Key Developments
• 8.9. Kunshan Googe Metal Products Co., Ltd.
  • 8.9.1. Overview
  • 8.9.2. Financial Performance
  • 8.9.3. Product Outlook
  • 8.9.4. Key Developments

9. Appendix

• 9.1. Related Reports