세계의 SLP(Substrate like PCB) 시장 규모 : 층 구조별, 동박 두께별, 최종 용도 산업별, 지역별, 범위 및 예측

Substrate Like PCB Market Size And Forecast

Substrate Like PCB Market size was valued at 1.86 USD Billion in 2024 and is projected to reach 6.15 USD Billion by 2031 , growing at a CAGR of 16.13% from 2024 to 2031. A substrate, like a printed circuit board (PCB), serves as a physical platform for mounting and interconnecting electronic components. It provides a stable base for the fragile components while also maintaining adequate electrical connections between them. Similar to a PCB, the substrate is often a flat, rigid structure made of non-conductive materials such as FR4 (fire-retardant epoxy laminate) or ceramic. Substrates occur in a variety of varieties, each having features tailored to specific purposes. FR4, the most common PCB material, is also commonly utilized for substrates due to its low cost, ease of manufacture, and excellent balance of electrical and mechanical qualities. High-frequency substrates manufactured from ceramic materials such as alumina or FR-4 with high-performance resins are tercih (favored) due to their greater electrical performance at higher frequencies. Additionally, flexible substrates consisting of polyimide films are used in circumstances requiring bendability or conformability to uneven surfaces.

Substrates must be stiff and dimensionally stable. To ensure accurate component placement and electrical connections, the substrate must keep its shape and size during the manufacturing process and while in operation. When exposed to soldering temperatures or environmental fluctuations, high-quality substrates bend or shrink less. This stability is especially important for high-precision electronics, where even tiny dimensional variations can have a major influence on performance.

While substrates are non-conductive, they frequently include patterned layers of metal, usually copper, to provide electrical channels for connecting components. The design and quality of the metal traces have a major impact on the substrate's overall electrical performance. Signal integrity, defined as the substrate's capacity to carry electrical signals with little distortion or loss, is influenced by factors such as trace width, thickness, and surface roughness.

During operation, electronic components generate heat, and the substrate plays an important role in heat dissipation. The thermal conductivity of the substrate material dictates how well it carries heat away from the components, preventing overheating. High thermal conductivity substrates, such as ceramics or metal-clad laminates, are recommended for high-temperature applications. In some circumstances, the substrate design may include additional heat sinks or thermal vias (plated holes) to improve heat dissipation.

The cost of the substrate material has a considerable impact on overall electronics manufacturing. FR4 is still the most cost-effective alternative for many applications. However, for high-performance or specialized applications, materials such as ceramics or high-performance resins can dramatically raise substrate costs. Furthermore, the complexity of the metal trace design and the number of layers can influence the total cost.

Substrates, such as printed circuit boards, are used in a variety of electronic devices. Substrates are necessary for manufacturing functional and dependable electronic circuits in a variety of applications, including consumer electronics such as smartphones and laptop computers, industrial automation systems, and medical devices. Substrate demand is predicted to increase in tandem with current electronics' downsizing, functionality, and performance requirements. Advances in material science are continually leading to the creation of novel substrate materials with improved qualities to meet the electronics industry's ever-changing requirements.

Global Substrate Like PCB Market Dynamics

The key market dynamics that are shaping the global substrate like PCB market include:

Key Market Drivers:

Miniaturization and Lightweight Design:

The persistent search for smaller and lighter electronic devices is a significant driver of the substrate-like PCB market. Substrate-like PCBs are much smaller and lighter than regular PCBs. This makes them excellent for applications requiring little space and weight, such as smartphones, wearables, and other portable gadgets. The high-density interconnect (HDI) technology commonly employed in substrate-like PCBs enables a greater number of components to be placed on a smaller board, further contributing to downsizing.

Exponential Growth of 5G Technology:

The global rollout of 5G networks is increasing demand for sophisticated PCB technologies, such as substrate-like PCBs. These boards are specifically developed to satisfy the demanding needs of 5G applications, including high-speed data transfer and signal integrity at higher frequencies. Their ability to handle complicated designs and modern materials makes them ideal for the sophisticated infrastructure and devices required for 5G.

Internet of Things (IoT) Boom:

The ever-expanding universe of interconnected devices known as the Internet of Things (IoT) is driving demand for smaller, more efficient electrical components. Substrate-like PCBs are ideal for creating tiny, low-power devices appropriate for a wide range of IoT applications. These devices frequently require sophisticated functionality within constrained area limits, which substrate-like PCBs may successfully solve.

Consumer Electronics Evolution:

The insatiable desire for feature-rich but tiny consumer electronics such as smartphones, tablets, and smartwatches is a major driver of the substrate-like PCB market. Manufacturers are continually pushing the limits of functionality and design, necessitating PCBs that can handle rising component density and sophisticated features. Substrate-like PCBs are a great platform for these improvements.

Automotive Electronics Revolution:

The automotive sector is experiencing a spike in electronic components as vehicles become more automated, networked, and safety-conscious. Substrate-like PCBs, with their tiny size, great performance, and outstanding thermal management capabilities, are ideal for these sophisticated automotive applications. They allow for the integration of complicated features such as driver assistance systems, entertainment systems, and autonomous driving technologies into the limited space of current automobiles.

Medical Device Advancements:

The medical device business is continually working to develop compact, high-performance medical equipment. This initiative relies heavily on substrate-like PCBs. Their capacity to handle complicated features and strict medical requirements makes them perfect for a wide range of medical devices, including portable diagnostic gadgets and modern surgical equipment.

Growing Focus on Energy Efficiency:

The growing emphasis on energy economy in electronics is another element driving demand for substrate-like PCBs. These boards are frequently lighter and use less material than typical PCBs, which contributes to a more sustainable manufacturing process. Furthermore, some substrate-like PCB materials have higher thermal conductivity, which allows for greater heat dissipation and potentially lower power usage in electrical devices.

Key Challenges:

High Manufacturing Complexity:

Compared to regular PCBs, substrate-like PCBs have a more complex manufacturing process. These boards frequently use sophisticated materials with tighter tolerances, necessitating high-precision fabrication procedures. This intricacy needs specialized equipment, trained workers, and tight quality control methods, all of which can raise production costs and create bottlenecks in the manufacturing process.

Evolving Environmental rules:

The electronics sector is subject to increasingly strict environmental rules governing material use and disposal. Substrate-like PCBs may contain elements such as specific resins or specialized metals that must be handled carefully and represent possible environmental risks during production or disposal. Manufacturers must invest in environmentally friendly procedures and stay up to date on evolving legislation to ensure compliance and maintain sustainable production methods.

Limited Standardization and Interoperability:

While the PCB industry has set standards for materials and production procedures, substrate-like PCBs are a novel and emerging technology. Standardization for these boards is currently being developed, which may result in compatibility concerns between different manufacturers and designs. This lack of homogeneity can be difficult for design engineers and prevent the broad use of substrate-like PCBs.

Shortage of trained Labor:

The delicate nature of substrate-like PCB production needs trained labor with experience handling advanced materials, running specialized equipment, and adhering to tight quality control processes. However, the quick growth of this market may result in a shortage of trained staff, limiting manufacturing capacity and affecting overall efficiency.

Intense Competition and Price Pressures:

Intense competition and price pressures: As the substrate-like PCB industry grows in popularity, manufacturers compete fiercely. This can put pressure on prices, pushing producers to compromise on quality or innovation to remain competitive. Balancing cost-effectiveness with good quality standards remains a critical problem for producers in this ever-changing industry.

Key Trends:

Technological advancements in high-density interconnect (HDI):

High-density interconnect (HDI) technology is constantly evolving, which is a major trend in the substrate-like PCB market. This method enables the insertion of more electrical traces and components on a smaller substrate space. As electronic devices become increasingly small and feature-rich, HDI is critical in enabling the downsizing of substrate-like PCBs while retaining optimal performance. Manufacturers are constantly pushing the boundaries of HDI technology by inventing finer line widths, thinner dielectrics, and better formation processes to further miniaturize and increase the capabilities of substrate-like PCBs.

Emerging Materials and Substrate Integration:

The development of novel materials with improved qualities is another major trend influencing the substrate-like PCB market. These materials provide advantages such as higher thermal conductivity for better heat dissipation, a lower dielectric constant for improved signal integrity at high frequencies, and increased mechanical flexibility for applications that require bendability. Furthermore, there is a growing tendency to embed various functionalities within the substrate itself. This can include embedding passive components such as capacitors or resistors directly into the substrate, hence lowering board size and complexity.

Focus on Sustainability:

Sustainability is becoming a primary issue in many businesses, including the substrate-like PCB market. Manufacturers are increasingly focused on eco-friendly materials and procedures. This involves looking into the use of biodegradable or recyclable materials in substrate construction, as well as instituting stricter waste management techniques to reduce environmental effects. Furthermore, there is a rising emphasis on lowering material consumption through efficient design and manufacturing procedures, which helps to create a more sustainable electronics manufacturing ecosystem.

Rise of Flexible and Rigid-Flex Substrates:

The need for flexible and rigid-flex substrates is rising. These substrates have distinct advantages, especially in applications where space constraints are severe or conformability to uneven surfaces is required. Flexible substrates are useful for wearable electronics and other applications that require bendability. Rigid-flex substrates combine rigid and flexible parts on a single board, providing greater design freedom and space optimization for complicated electrical systems. Material science and fabrication techniques have advanced, allowing for the development of more dependable and cost-effective flexible and rigid-flex substrate solutions.

Nearshoring and Regional Production:

The global political and economic backdrop is influencing the substrate-like PCB market, with a growing emphasis on nearshoring and regional production. Factors driving this move include trade disputes, supply chain disruptions, and a desire for greater control over production operations. Manufacturers are increasingly aiming to locate manufacturing facilities closer to their target markets, which could lead to the formation of regional hubs for substrate-like PCB manufacture. This trend has the potential to help electronic device makers decrease supply chain risks and lead times.

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Global Substrate Like PCB Market Regional Analysis

Here is a more detailed regional analysis of the global substrate-like PCB market:

Asia Pacific:

Asia Pacific is projected to be the dominant and fastest-growing region in the substrate-like PCB market.

The region is a well-established manufacturing hub for consumer electronics, automotive electronics, and various other electronic devices. This existing infrastructure provides a strong foundation for the growth of the substrate-like PCB market as manufacturers readily adopt this advanced technology.

Several Asian governments are actively promoting the development of their domestic electronics industries. This includes investments in research and development, subsidies for local manufacturers, and initiatives to create favorable business environments. These policies significantly incentivize the adoption of advanced PCB technologies like substrate-like PCBs.

The burgeoning middle class in many Asian countries is fueling a surge in demand for feature-rich electronic devices like smartphones, tablets, and wearables. This domestic demand creates a readily available market for substrate-like PCB manufacturers within the region.

Manufacturing costs in Asia Pacific are generally lower compared to other regions. This cost advantage allows Asian manufacturers to offer substrate-like PCBs at competitive prices, further driving market penetration.

North America:

North America is a mature market for PCBs and is expected to maintain a steady growth trajectory for substrate-like PCBs. The region boasts a strong presence of leading technology companies and established electronics manufacturers who are constantly innovating and pushing the boundaries of electronic device functionality. This focus on cutting-edge technology ensures a continued demand for advanced PCBs like substrate-like PCBs.

Stringent regulations in North America regarding product quality and environmental impact can act as a barrier to entry for some foreign manufacturers. However, this also incentivizes domestic manufacturers to invest in high-quality materials and advanced manufacturing processes, leading to the production of premium substrate-like PCBs.

Europe:

The European market prioritizes high-quality electronics, and substrate-like PCBs are well-positioned to cater to this demand. European manufacturers are known for their focus on precision engineering and reliable products, making them suitable partners for industries like automotive and medical devices that rely heavily on high-performance electronics.

While quality is paramount, cost remains a significant factor for European manufacturers. The increasing competition from Asia Pacific, with its cost-effective production capabilities, can put pressure on European substrate-like PCB pricing. To remain competitive, European manufacturers may need to focus on niche markets or specialize in high-value, high-performance substrate-like PCBs.

Global Substrate Like PCB Market Segmentation Analysis

The Global substrate like PCB market is segmented based on the Layer Structure, Copper Foil Thickness, End-Use Industry, and Geography.

Substrate Like PCB Market, By Layer Structure

• Single-layer SLPCB
• Multilayer SLPCB

Based on the layer structure, the market is bifurcated into Single-layer SLPCB and Multilayer SLPCB. According to VMR analysts, Multilayer substrate-like PCBs (SLPCBs) are predicted to dominate the market throughout the projection period, surpassing single-layer SLPBCs. This dominance is caused by a variety of circumstances. Multilayer SLP PCBs have substantial advantages. They can contain a larger density of electrical components, allowing for the production of more compact and feature-rich devices, which is an important aspect in consumer electronics and mobile device shrinking. Furthermore, multilayer SLP PCBs deliver greater electrical performance due to improved signal integrity and reduced crosstalk between components, which is critical for high-speed applications such as 5G technology and advanced communication systems. While single-layer SLP PCBs are still a low-cost alternative for simple applications, the growing need for functionality and performance in electronic devices is driving the rise of the multilayer SLP PCB market.

Substrate Like PCB Market, By Copper Foil Thickness

• Standard Copper Foil SLPCB
• Thick Copper Foil SLPCB

Based on the copper foil thickness, the market is bifurcated into Standard Copper Foil SLPCB and Thick Copper Foil SLPCB. According to VMR analysts, Thick copper foil substrate-like PCBs (SLPCBs) are expected to have a higher market share than normal copper foil SLPBCs throughout the forecast period (2024-2031). This expansion is being driven by the rising demand for high-power, high-performance electronic products. Thick copper foil has better thermal management capabilities because of its bigger cross-sectional area, which allows for effective heat dissipation from electronic components. This is critical for applications such as power electronics, electric vehicles, and high-performance computing systems where heat generation is a big issue. While ordinary copper foil SLPBCs are still suitable for low-power applications, the continuing trend of downsizing and increased power demands in electronic devices necessitates the adoption of thicker copper foils to properly regulate heat and assure dependable operation.

Substrate Like PCB Market, By End-Use Industries

• Consumer Electronics
• Automotive
• Telecommunications
• Industrial

Based on the end-use industries, the market is bifurcated into Consumer Electronics, Automotive, Telecommunications, and Industrial. According to VMR analysis, Consumer electronics is expected to have the biggest market share for substrate-like PCBs (SLPCBs) during the projected period (2024-2031). This domination stems from the insatiable demand for smaller, lighter, and more feature-rich electronic gadgets such as smartphones, tablets, and wearable electronics. These applications are best suited to substrate-like PCBs, which are small in size yet excellent in performance. Furthermore, significant improvements in 5G technology and the ever-expanding Internet of Things (IoT) are driving up the demand for substrate-like PCBs in consumer devices. While other industries, including automotive and telecommunications, may see an increase in the use of substrate-like PCBs, the consumer electronics sector's sheer volume and rapid innovation cycles are projected to cement its position as the main end-use industry.

Substrate Like PCB Market, By Geography

• North America
• Europe
• Asia Pacific
• Middle East and Africa
• Latin America

Based on regional analysis, the market is classified into North America, Europe, Asia Pacific, and Middle East & Africa. The Asia Pacific region is poised to dominate the substrate-like PCB market share in the forecasted years. A variety of variables contribute to its supremacy. It is home to large consumer electronics companies and has a well-established supply chain with easily accessible skilled labor and raw materials. Government initiatives and funding accelerate growth by encouraging research and development of advanced substrate-like PCB materials and production techniques. While North America and Europe are experiencing steady growth, driven by specific industry needs such as high-performance electronics and stringent environmental regulations, their market share is likely to be surpassed by Asia Pacific's thriving consumer electronics industry, strong domestic demand, and supportive government policies. The remainder of the world has the potential for future expansion, but constraints in infrastructure, skilled labor, and access to modern technologies will likely restrict its immediate market share contribution.

Key Players

• The "Global Substrate Like PCB Market" study report will provide valuable insight with an emphasis on the global market. The major players in the market are
• Kinsus Interconnect Technology Corp., Ibiden Co., Ltd., Compeq Manufacturing Co., Ltd., Unimicron Technology Corporation, AT&S (Austria), TTM Technologies, Samsung Electro-Mechanics, LG Innotek.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the above-mentioned players globally.

• Substrate Like PCB Market Recent Developments
• In August 2023, Murata Manufacturing Co., Ltd. announced the mass production of a new ultra-thin, high-density substrate-like PCB specifically designed for high-performance computing applications. This new substrate boasts a thickness of just 120 micrometers while maintaining excellent electrical performance, catering to the miniaturization needs of data center equipment.
• In May 2022, SEMI, the industry association for electronics manufacturing and design, released a report highlighting the significant growth in demand for high-density interconnect (HDI) technology within the substrate-like PCB market. The report attributes this growth to the increasing complexity and miniaturization of electronic devices, particularly in consumer electronics and automotive sectors.
• In February 2021, Taiwan-based TTM Technologies, a leading manufacturer of substrate-like PCBs, announced a strategic partnership with a major European automotive manufacturer to develop next-generation automotive electronics solutions. This collaboration signifies the growing adoption of substrate-like PCBs in the automotive industry for advanced driver-assistance systems (ADAS) and autonomous driving technologies.
• In October 2020, Ibiden Co., Ltd., a Japanese electronics manufacturer, unveiled a new low-loss, high-frequency substrate-like PCB material specifically tailored for 5G applications. This material offers superior signal integrity at high frequencies, crucial for enabling faster data transmission speeds required by 5G networks.
• In June 2020, The IPC - Association Connecting Electronics Industries, a global industry association, published a white paper outlining the future trends and challenges of the substrate-like PCB market. The white paper identifies the growing demand for environmentally friendly materials and sustainable manufacturing practices as a key trend shaping the industry's future.

TABLE OF CONTENTS

1. Introduction

• Market Definition
• Market Segmentation
• Research Methodology

2. Executive Summary

• Key Findings
• Market Overview
• Market Highlights

3. Market Overview

• Market Size and Growth Potential
• Market Trends
• Market Drivers
• Market Restraints
• Market Opportunities
• Porter's Five Forces Analysis

4. Substrate Like Pcb Market, By Layer Structure

• Single-layer SLPCB
• Multilayer SLPCB

5. Substrate Like Pcb Market, By Copper Foil Thickness

• Standard Copper Foil SLPCB
• Thick Copper Foil SLPCB

6. Substrate Like Pcb Market, By End-Use Industries

• Consumer Electronics
• Automotive
• Telecommunications
• Industrial

7. Regional Analysis

• North America
• United States
• Canada
• Mexico
• Europe
• United Kingdom
• Germany
• France
• Italy
• Asia-Pacific
• China
• Japan
• India
• Australia
• Latin America
• Brazil
• Argentina
• Chile
• Middle East and Africa
• South Africa
• Saudi Arabia
• UAE

8. Market Dynamics

• Market Drivers
• Market Restraints
• Market Opportunities
• Impact of COVID-19 on the Market

9. Competitive Landscape

• Key Players
• Market Share Analysis

10. Company Profiles

• Kinsus Interconnect Technology Corp
• Ibiden Co., Ltd.
• Compeq Manufacturing Co., Ltd.
• Unimicron Technology Corporation
• Austria Technologies & Systemtechnik AG (AT&S)
• TTM Technologies
• Samsung Electro-Mechanics
• Korea Circuit

11. Market Outlook and Opportunities

• Emerging Technologies
• Future Market Trends
• Investment Opportunities

12. Appendix

• List of Abbreviations
• Sources and References