½ÃÀ庸°í¼­
»óǰÄÚµå
1623271

¼¼°èÀÇ ¹Ú¸· ÁõÂø Àåºñ ½ÃÀå - ±Ô¸ð, Á¦Ç°º°, ¿ëµµº°, Áö¿ªº°, ¹üÀ§ ¹× ¿¹Ãø

Global Thin Layer Deposition Equipment Market Size By Product (Physical vapor deposition (PVD), Chemical vapor deposition (CVD)), By Application (Semiconductor, Electronic, Computer), By Geographic Scope And Forecast

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: Verified Market Research | ÆäÀÌÁö Á¤º¸: ¿µ¹® 202 Pages | ¹è¼Û¾È³» : 2-3ÀÏ (¿µ¾÷ÀÏ ±âÁØ)

    
    
    



¡Ø º» »óǰÀº ¿µ¹® ÀÚ·á·Î Çѱ۰ú ¿µ¹® ¸ñÂ÷¿¡ ºÒÀÏÄ¡ÇÏ´Â ³»¿ëÀÌ ÀÖÀ» °æ¿ì ¿µ¹®À» ¿ì¼±ÇÕ´Ï´Ù. Á¤È®ÇÑ °ËÅ並 À§ÇØ ¿µ¹® ¸ñÂ÷¸¦ Âü°íÇØÁֽñ⠹ٶø´Ï´Ù.

¹Ú¸· ÁõÂø Àåºñ ½ÃÀå ±Ô¸ð¿Í ¿¹Ãø

¹Ú¸· ÁõÂø Àåºñ ½ÃÀå ±Ô¸ð´Â 2024³â¿¡ 698¾ï ´Þ·¯·Î Æò°¡µÇ¾ú°í, 2031³â¿¡´Â 2,183¾ï ´Þ·¯¿¡ À̸¦ °ÍÀ¸·Î ¿¹ÃøµÇ¸ç, 2024³âºÎÅÍ 2031³â±îÁöÀÇ CAGRÀº 15.6%·Î ¼ºÀåÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ÀÌ ½ÃÀåÀÇ ¼ºÀåÀ» µÞ¹ÞħÇÏ´Â ÇöÀúÇÑ ¿äÀÎÀº ¼¼°èÀÇ ¸¶ÀÌÅ©·Î ÀÏ·ºÆ®·Î´Ð½º¿Í ¼ÒºñÀÚ ÀÏ·ºÆ®·Î´Ð½º ¼ö¿ä Áõ°¡ÀÔ´Ï´Ù. ÀÌ Á¶»ç º¸°í¼­´Â ¼¼°è ¹Ú¸· ÁõÂø Àåºñ ½ÃÀåÀ» Á¾ÇÕÀûÀ¸·Î Æò°¡ÇÕ´Ï´Ù. ÁÖ¿ä ºÎ¹®, µ¿Çâ, ½ÃÀå ¼ºÀå ÃËÁø¿äÀÎ, ¾ïÁ¦¿äÀÎ, °æÀï ±¸µµ, ½ÃÀå¿¡¼­ Áß¿äÇÑ ¿ªÇÒÀ» ÇÏ´Â ¿äÀÎ µîÀ» Á¾ÇÕÀûÀ¸·Î ºÐ¼®Çß½À´Ï´Ù.

¼¼°è ¹Ú¸· ÁõÂøÀåºñ ½ÃÀå Á¤ÀÇ

¹Ú¸· Àç·á¸¦ Çü¼ºÇÏ´Â ¹æ¹ýÀÌ Å©°Ô Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ¹Ú¸·Àº ÁÖ·Î ¹°¸®Àû ±â»ó ¼ºÀå¹ý(PVD)°ú È­ÇÐÀû ±â»ó ¼ºÀå¹ý(CVD)ÀÇ µÎ °¡Áö ±â¼ú¿¡ ÀÇÇØ Á¦Á¶µÇ´Â ÀÛÀº µÎ²²¸¦ °®½À´Ï´Ù. PVD ±â¼ú¿¡´Â ¸î °¡Áö ´ÜÁ¡ÀÌ ÀÖÁö¸¸ CVDº¸´Ù À¯ÀÍÇÕ´Ï´Ù. ´ëºÎºÐÀÇ ÁõÂø ±â¼úÀº ÁõÂø Á¾ÀÇ ÇÕ¼º, ¼Ò½º·ÎºÎÅÍ ±âÆÇÀ¸·ÎÀÇ À̼Û, ÁõÂø°ú ±âÆÇ »ó¿¡ ¼Ò½ºÀÇ ºÎÂø, ±× ÈÄ ¸· ¼ºÀåÀÇ 3´Ü°è¸¦ ¹â¾Æ ¼º¸·À» ÇàÇÕ´Ï´Ù.

ÇöÀç, ÆÞ½º ·¹ÀÌÀú ÁõÂø¹ý(PLD)µµ ¹Ú¸· ÁõÂø¿¡ »ç¿ëµÇ´Â ¹°¸®Àû ÁõÂø ±â¼úÀ̸ç, ÀÌ °øÁ¤¿¡¼­´Â Áø°ø è¹ö ³»¿¡¼­ ¹Ú¸· ÁõÂøÀ» À§ÇØ Àç·á¸¦ ÀýÁ¦Çϱâ À§ÇØ ·¹ÀÌÀú ºöÀÌ »ç¿ëµË´Ï´Ù. ¸¶ÀÌÅ©·Î ÀÏ·ºÆ®·Î´Ð½º »ê¾÷, Ư¼ö ÆÐŰ¡, µ¥ÀÌÅÍ ½ºÅ丮Áö, Àý»è °ø±¸, »ê¾÷ ¿ëµµ, ±¤ÀüÀÚ ºÎǰ, ÀÇ·á ±â¼ú µî ´Ù¾çÇÑ »ê¾÷ÀÌ ¹Ú¸· ÁõÂø Àåºñ¸¦ »ç¿ëÇϰí ÀÖ½À´Ï´Ù.

¹Ú¸· ÁõÂø Àåºñ ¼¼°è ½ÃÀå °³¿ä

¹Ú¸· ¹ÝµµÃ¼¿Í °°Àº ±â¼úÀÇ Áøº¸´Â ´Ù¾çÇÑ »ê¾÷¿¡¼­ ±Þ¼ÓÈ÷ ¹Þ¾Æ µé¿©Áö°í ÀÖÀ¸¸ç, žçÀüÁöÆÇ¿¡ ¹ÝµµÃ¼ÀÇ Æø³ÐÀº ÀÀ¿ëÀÌ ¹Ú¸· ¹ÝµµÃ¼ ÁõÂø Á¦Á¶ ¼ö¿ä¸¦ ÃËÁøÇϰí ÀÖ½À´Ï´Ù. °Ô´Ù°¡ °æ·®, °íÈ¿À², Çü»ó À¯¿¬¼º, ¼Òºñ °ø°£ÀÌ ÀûÀº µî ´Ù¸¥ ¹ÝµµÃ¼¿¡´Â ¾ø´Â ´Ù¾çÇÑ ÀåÁ¡ÀÌ Àֱ⠶§¹®¿¡ ¹Ú¸· ÁõÂø ¹ÝµµÃ¼¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡°¡ ½ÃÀåÀÇ ¼ºÀåÀ» µÞ¹ÞħÇϰí ÀÖ½À´Ï´Ù.

À̵éÀº DRAM, ¸¶ÀÌÅ©·ÎÇÁ·Î¼¼¼­, ¿þ¾î·¯ºí ±â¼ú¿¡ »ç¿ëµË´Ï´Ù. ¶ÇÇÑ Ç÷º¼­ºí µð½ºÇ÷¹ÀÌ ¹× ¹èÅ͸®¸¦ Æ÷ÇÔÇÑ ¸¶ÀÌÅ©·Î ÀÏ·ºÆ®·Î´Ð½º¿Í Ç÷º¼­ºí ÀÏ·ºÆ®·Î´Ð½º¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. ¼ÒÇüÈ­ÀÇ ¿ä±¸´Â ¹Ú¸· ÁõÂø¿¡ ÀÇÇØ ÃæÁ·µË´Ï´Ù. ¶ÇÇÑ ½º¸¶Æ®ÆùÀÇ ¼¾¼­ ¼ö¿ä Áõ°¡¿Í ¿î¼Û ½Ã¼³ ¹× Ç×°ø±âÀÇ ±¤¹üÀ§ÇÑ ÀÀ¿ëÀÌ ½ÃÀå¿¡ À¯¸®ÇÑ ±âȸ¸¦ Á¦°øÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ¹Ý¸é, Ãʱ⠼³Á¤¿¡¼­ Ãʱâ ÅõÀÚÀÇ ³ôÀÌ¿Í ¿øÀç·á ºñ¿ëÀÇ »ó½ÂÀº ¹Ú¸· ÁõÂø±â ½ÃÀåÀÇ ¼ºÀåÀ» Á¦ÇÑÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

¸ñÂ÷

Á¦1Àå ¹Ú¸· ÁõÂø Àåºñ ¼¼°è ½ÃÀå : ¼Ò°³

  • ½ÃÀå °³¿ä
  • Á¶»ç ¹üÀ§
  • ÀüÁ¦Á¶°Ç

Á¦2Àå ÁÖ¿ä ¿ä¾à

Á¦3Àå VERIFIED MARKET RESEARCHÀÇ Á¶»ç ¹æ¹ý

  • µ¥ÀÌÅÍ ¸¶ÀÌ´×
  • ¹ë¸®µ¥À̼Ç
  • 1Â÷ ÀÚ·á
  • µ¥ÀÌÅÍ ¼Ò½º À϶÷

Á¦4Àå ¹Ú¸· ÁõÂø Àåºñ ¼¼°è ½ÃÀå Àü¸Á

  • °³¿ä
  • ½ÃÀå ¿ªÇÐ
  • ¼ºÀå ÃËÁø¿äÀÎ
  • ¾ïÁ¦¿äÀÎ
  • ±âȸ
  • Porter's Five Forces ¸ðµ¨
  • ¹ë·ùüÀÎ ºÐ¼®

Á¦5Àå ¹Ú¸· ÁõÂø Àåºñ ¼¼°è ½ÃÀå : Á¦Ç°º°

  • °³¿ä
  • ¹°¸® ÁõÂø(PVD)
  • È­ÇÐ ÁõÂø(CVD)
  • ¿øÀÚÃþ ÁõÂø(ALD)

Á¦6Àå ¹Ú¸· ÁõÂø Àåºñ ¼¼°è ½ÃÀå : ¿ëµµº°

  • °³¿ä
  • ¹ÝµµÃ¼
  • ÀÏ·ºÆ®·Î´Ð½º
  • ÄÄÇ»ÅÍ
  • ÀÚµ¿Â÷
  • ±âŸ

Á¦7Àå ¹Ú¸· ÁõÂø Àåºñ ¼¼°è ½ÃÀå : Áö¿ªº°

  • °³¿ä
  • ºÏ¹Ì
  • ¹Ì±¹
  • ij³ª´Ù
  • ¸ß½ÃÄÚ
  • À¯·´
  • µ¶ÀÏ
  • ¿µ±¹
  • ÇÁ¶û½º
  • ±âŸ À¯·´
  • ¾Æ½Ã¾ÆÅÂÆò¾ç
  • Áß±¹
  • ÀϺ»
  • Àεµ
  • ±âŸ ¾Æ½Ã¾ÆÅÂÆò¾ç
  • ¼¼°è ±âŸ Áö¿ª
  • ¶óƾ¾Æ¸Þ¸®Ä«
  • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«

Á¦8Àå ¼¼°èÀÇ ¹Ú¸· ÁõÂø Àåºñ ½ÃÀå °æÀï ±¸µµ

  • °³¿ä
  • °¢»ç ½ÃÀå ·©Å·
  • ÁÖ¿ä ¹ßÀü Àü·«

Á¦9Àå ±â¾÷ ÇÁ·ÎÆÄÀÏ

  • AIXTRON
  • Applied Materials
  • ASM International
  • Canon ANELVA
  • CHA Industries
  • CVD Equipment
  • Denton Vacuum
  • Edwards
  • Ionbond
  • Jusung Engineering
  • KDF Electronic & Vacuum Services
  • Kokusai Semiconductor Equipment
  • Lam Research
  • RIBER
  • Seki Diamond Systems
  • Silicon Genesis

Á¦10Àå ºÎ·Ï

  • °ü·Ã º¸°í¼­
JHS 25.01.16

Thin Layer Deposition Equipment Market Size And Forecast

Thin Layer Deposition Equipment Market size was valued at USD 69.8 Billion in 2024 and is projected to reach USD 218.3 Billion by 2031 , growing at a CAGR of 15.6% from 2024 to 2031. The prominent factor responsible for boosting the growth of the market is the increase in demand for microelectronics and consumer electronics across the globe. The Global Thin Layer Deposition Equipment Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.

Global Thin Layer Deposition Equipment Market Definition

A significant increase has been seen in methods of forming thin films materials. Thin-film possesses small thickness that produces by majorly two techniques, physical vapor deposition process (PVD) and chemical vapor deposition process (CVD). Though PVD techniques have some drawbacks it is more beneficial than CVD. Most deposition techniques follow three steps for deposition, synthesis of the deposition species followed by conveyance from source to substrate and then deposition and adhesion of the source onto the substrate and subsequent film growth.

Nowadays, Pulsed-laser deposition (PLD) is another physical deposition technique used for thin film deposition, during this process laser beam is used to ablate the material for deposition of the thin film inside a vacuum chamber. Various industries are using thin layer deposition equipment such as Microelectronics Industry, Specialty Packaging, Data Storage, Cutting Tools, Industrial Applications, Optoelectronic Components, and Medical Technology.

What's inside a VMR industry report?

Our reports include actionable data and forward-looking analysis that help you craft pitches, create business plans, build presentations and write proposals.

Global Thin Layer Deposition Equipment Market Overview

Advancements in technology such as thin-film semiconductors are achieving rapid acceptance across various industries, wide applications of semiconductors in solar panels are fueling the demand for thin-film semiconductors deposition manufacturing. In addition, increased demand for thin-layer deposition semiconductors due to various advantages over other such as, lightweight, higher efficiency, flexibility in shape, and less space consumption is fueling the growth of market.

These are used in DRAMs, microprocessors, and wearable technologies. Furthermore, increasing demand for microelectronics and flexible electronics that include flexible displays and batteries. The need for miniaturization is fulfilled by Thin Layer Deposition. Moreover, the growing demand for sensors in smartphones and wide applications in transportation facilities and aircraft are expected to generate lucrative opportunities for the market. On the other side, high initial investment in initial settings and increasing cost of raw material is anticipated to restrict the market growth of the Market for Thin Layer Deposition Equipment.

Global Thin Layer Deposition Equipment Market Segmentation Analysis

The Global Thin Layer Deposition Equipment Market is segmented on the basis of Product, Application, And Geography.

Thin Layer Deposition Equipment Market, By Product

  • Physical vapor deposition (PVD)
  • Chemical vapor deposition (CVD)
  • Atomic layer deposition (ALD)

Based on Product, The market is segmented into, Physical vapor deposition (PVD), Chemical vapor deposition (CVD), And Atomic layer deposition (ALD). Physical vapor deposition (PVD) is expected to hold the largest share in the market whereas, the atomic layer deposition segment is growing at the fastest pace due to wide applications of technology in the growing electronics and semiconductors industry driving the growth of Atomic layer deposition (ALD).

Thin Layer Deposition Equipment Market, By Application

  • Semiconductor
  • Electronic
  • Computer
  • Car
  • Other

Based on Application, The market is segmented into, Semiconductor, Electronic, Computer, Car, And Other. The semiconductors industry segment has accounted for holding the largest share in the market due to semiconductor technology node transition and drive for miniaturized components in the semiconductors industry.

Thin Layer Deposition Equipment Market, By Geography

  • North America
  • Europe
  • Asia Pacific
  • Rest of the World

Based on Geography, The Global Thin Layer Deposition Equipment Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. Europe and Asia-Pacific are expected to dominate the market due to the progression of electronics and semiconductors industries in the region mainly in china. In addition, deep-rooted electronics manufacturing bases in South Korea and Taiwan are fueling the market growth of the market in the region.

Key Players

  • The "Global Thin Layer Deposition Equipment Market" study report will provide valuable insight with an emphasis on the global market. The major players in the market are
  • AIXTRON, Applied Materials, ASM International, Canon ANELVA, CHA Industries, CVD Equipment, Denton Vacuum, Edwards, Ionbond, Jusung Engineering, KDF Electronic & Vacuum Services, Kokusai Semiconductor Equipment, Lam Research, RIBER, Seki Diamond Systems, Silicon Genesis.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the above-mentioned players globally.

Key Developments

  • Partnerships, Collaborations and Agreements
  • On June 2019, AIXTRON SE a worldwide leading provider of deposition equipment to the semiconductor industry, is a partner in the European research project "UltimateGaN" (Research for GaN technologies, devices and applications to address the challenges of the futureGaN roadmap).
  • On February 2021, AIXTRON SE is a partner of the future cluster "NeuroSys". As one of the leading suppliers of deposition equipment to the semiconductor industry, AIXTRON develops, builds and optimizes the necessary MOCVD tool for the new application. The work on the "NeuroSys" future cluster is expected to run for several years.
  • Mergers and Acquisitions
  • On July 2019, Applied Materials, Inc. ("Applied") announced a definitive agreement under which Applied will acquire all outstanding shares of Kokusai Electric Corporation ("Kokusai Electric") for $2.2 billion in cash from global investment firm KKR.
  • Product Launches and Product Expansions
  • On December 2019, AIXTRON SE, a worldwide leading provider of deposition equipment to the semiconductor industry, announced that Japanese group Sumitomo Electric Device Innovations, Inc. has ordered an AIX G5+ tool with 8X6-inch wafer configuration in order to expand the production capacity of GaN-on-SiC (gallium nitride-on-silicon carbide) radio frequency (RF) devices for wireless applications such as radars, satellite communication and base stations for the rapidly expanding 5G mobile networks.

TABLE OF CONTENTS

1. Introduction of Global Thin Layer Deposition Equipment Market

  • Overview of the Market
  • Scope of Report
  • Assumptions

2. Executive Summary

3. Research Methodology of Verified Market Research

  • Data Mining
  • Validation
  • Primary Interviews
  • List of Data Sources

4. Global Thin Layer Deposition Equipment Market Outlook

  • Overview
  • Market Dynamics
  • Drivers
  • Restraints
  • Opportunities
  • Porters Five Force Model
  • Value Chain Analysis

5. Global Thin Layer Deposition Equipment Market, By Product

  • Overview
  • Physical vapor deposition (PVD)
  • Chemical vapor deposition (CVD)
  • Atomic layer deposition (ALD)

6. Global Thin Layer Deposition Equipment Market, By Application

  • Overview
  • Semiconductor
  • Electronic
  • Computer
  • Car
  • Other

7. Global Thin Layer Deposition Equipment Market, By Geography

  • Overview
  • North America
  • U.S.
  • Canada
  • Mexico
  • Europe
  • Germany
  • UK
  • France
  • Rest of Europe
  • Asia Pacific
  • China
  • Japan
  • India
  • Rest of Asia Pacific
  • Rest of the World
  • Latin America
  • Middle East & Africa

8. Global Thin Layer Deposition Equipment Market Competitive Landscape

  • Overview
  • Company Market Ranking
  • Key Development Strategies

9. Company Profiles

  • AIXTRON
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments
  • Applied Materials
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments
  • ASM International
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments
  • Canon ANELVA
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments
  • CHA Industries
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments
  • CVD Equipment
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments
  • Denton Vacuum
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments
  • Edwards
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments
  • Ionbond
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments
  • Jusung Engineering
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments
  • KDF Electronic & Vacuum Services
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments
  • Kokusai Semiconductor Equipment
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments
  • Lam Research
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments
  • RIBER
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments
  • Seki Diamond Systems
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments
  • Silicon Genesis
    • Overview
    • Financial Performance
    • Product Outlook
    • Key Developments

10. Appendix

  • Related Reports
ºñ±³¸®½ºÆ®
0 °ÇÀÇ »óǰÀ» ¼±Åà Áß
»óǰ ºñ±³Çϱâ
Àüü»èÁ¦