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¼¼°èÀÇ GaN ÆÄ¿ö µð¹ÙÀ̽º ½ÃÀå Á¶»ç º¸°í¼­ : »ê¾÷ ºÐ¼®, ±Ô¸ð, Á¡À¯À², ¼ºÀå, µ¿Çâ ¹× ¿¹Ãø(2023-2030³â)

Global Power GaN Devices Market Research Report - Industry Analysis, Size, Share, Growth, Trends and Forecast 2023 to 2030

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GaN ÆÄ¿ö µð¹ÙÀ̽º ½ÃÀåÀÇ ¼¼°è ¼ö¿ä´Â 2023-2030³âÀÇ Á¶»ç ±â°£ Áß 43.84%ÀÇ CAGR·Î 2022³â 8,784¸¸ ´Þ·¯¿¡¼­ 2030³â¿¡´Â ¾à 23¾ï 1,530¸¸ ´Þ·¯ ±Ô¸ð¿¡ µµ´ÞÇÒ °ÍÀ¸·Î ÃßÁ¤µË´Ï´Ù.

ÆÄ¿ö GaN(Gallium Nitride) µð¹ÙÀ̽º´Â ÁúÈ­°¥·ý ±â¼úÀ» »ç¿ëÇÏ¿© ¸¸µç ÀüÀÚ ºÎǰÀÔ´Ï´Ù. °íÀü¾Ð, °íÁÖÆÄ, °íÃâ·Â ¿ëµµÀÇ ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º ½Ã½ºÅÛ¿¡ »ç¿ëµÇ¸ç, GaN ÆÄ¿ö µð¹ÙÀ̽º´Â ±âÁ¸ ½Ç¸®ÄÜ ±â¹Ý ÆÄ¿ö µð¹ÙÀ̽º¿¡ ºñÇØ ºü¸¥ ½ºÀ§Äª ¼Óµµ, ³ôÀº Àü·Â ¹Ðµµ, °íÈ¿À² µî ¿©·¯ °¡Áö ÀåÁ¡À» °¡Áö°í ÀÖ½À´Ï´Ù. GaN ÆÄ¿ö µð¹ÙÀ̽º´Â ÀϹÝÀûÀ¸·Î Àü±âÀÚµ¿Â÷, ž籤 ¹× dz·Â¹ßÀü ½Ã½ºÅÛ, Àü¿ø °ø±Þ Àåºñ, µ¥ÀÌÅͼ¾ÅÍ µî ´Ù¾çÇÑ ¿ëµµ¿¡ »ç¿ëµË´Ï´Ù. GaN ÆÄ¿ö µð¹ÙÀ̽º´Â ÀÚµ¿Â÷, »ê¾÷, Åë½Å µîÀÇ ºÐ¾ß¿¡¼­ º¼ ¼ö ÀÖµíÀÌ °íÈ¿À², °íÃâ·Â ¹Ðµµ, ³ôÀº ½ºÀ§Äª ¼Óµµ°¡ ÇÊ¿äÇÑ ¿ëµµ¿¡ ÀûÇÕÇϸç, GaN ÆÄ¿ö µð¹ÙÀ̽º¿¡´Â GaN HEMT(°íÀüÀÚ À̵¿µµ Æ®·£Áö½ºÅÍ), GaN ¼îƮŰ ´ÙÀÌ¿Àµå, GaN ±â¹Ý ÁýÀûȸ·Î(IC) µî ´Ù¾çÇÑ Á¦Ç°ÀÌ ÀÖ½À´Ï´Ù. GaN HEMT´Â °íÀü¾Ð, °íÀü·Â ¿ëµµ¿¡ »ç¿ëÇÒ ¼ö ÀÖÀ¸¹Ç·Î ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º ½Ã½ºÅÛ¿¡¼­ ÀÚÁÖ »ç¿ëµÇ¸ç, GaN ¼îƮŰ ´ÙÀÌ¿Àµå´Â Á¤·ù ȸ·Î¿¡ »ç¿ëµÇ¸ç, °íÁÖÆÄ ½ºÀ§Äª ¾ÖÇø®ÄÉÀ̼ÇÀ» ó¸®ÇÒ ¼ö ÀÖÀ¸¸ç, GaN ±â¹Ý IC´Â ÅëÇÕ ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º ¿ëµµ¿¡ »ç¿ëµË´Ï´Ù.

½ÃÀå ¿ªÇÐ :

Àç»ý ¿¡³ÊÁö ½Ã½ºÅÛ, Àü±âÀÚµ¿Â÷, µ¥ÀÌÅͼ¾ÅÍ µî ´Ù¾çÇÑ ÀÀ¿ë ºÐ¾ß¿¡¼­ ÀüÀÚ±â±â »ç¿ëÀÌ Áõ°¡Çϰí È¿À²ÀûÀÌ°í ¾ÈÁ¤ÀûÀÎ Àü·Â º¯È¯ÀÌ ÇÊ¿äÇÔ¿¡ µû¶ó ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º¿¡ ´ëÇÑ ¼ö¿ä°¡ ºü¸£°Ô Áõ°¡Çϰí ÀÖÀ¸¸ç, GaN ÆÄ¿ö µð¹ÙÀ̽º´Â °íÈ¿À², °íÃâ·Â ¹Ðµµ, °í¼Ó ½ºÀ§ÄªÀ» ±¸ÇöÇÏ´Â ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º ¿ëµµ¿¡ ÀÌ»óÀûÀÎ ¼ÒÀÚÀÔ´Ï´Ù. GaN ÆÄ¿ö µð¹ÙÀ̽º´Â ±âÁ¸ ½Ç¸®ÄÜ ±â¹Ý ¼ÒÀÚº¸´Ù ´õ ³ôÀº Àü¾Ð°ú Àü·ù¸¦ ó¸®ÇÒ ¼ö ÀÖÀ¸¹Ç·Î ³ôÀº Àü·Â ¹Ðµµ, °íÁÖÆÄ µ¿ÀÛ ¹× ³ôÀº ½ºÀ§Äª ¼Óµµ¸¦ ÇÊ¿ä·Î ÇÏ´Â °í¼º´É ¿ëµµ¿¡ ÀÌ»óÀûÀÔ´Ï´Ù. ÀûÇÕÇÕ´Ï´Ù. °áÁ¤ ¼ºÀå, ±âÆÇ ǰÁú, ¼ÒÀÚ ¼³°è °³¼± µî GaN ±â¼úÀÇ ¹ßÀüÀ¸·Î ±âÁ¸ ½Ç¸®ÄÜ ±â¹Ý ¼ÒÀÚº¸´Ù ´õ ³ôÀº È¿À²°ú ½Å·Ú¼ºÀ» °®Ãá °í¼º´É GaN ÆÄ¿ö µð¹ÙÀ̽º°¡ °³¹ßµÇ°í ÀÖ½À´Ï´Ù. dz·Â ¹× ž籤°ú °°Àº Àç»ý °¡´É ¿¡³ÊÁö¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡ÇÔ¿¡ µû¶ó ÀÌ·¯ÇÑ ¿¡³ÊÁö¿ø¿¡¼­ ¹ß»ýÇÏ´Â ¿¡³ÊÁö¸¦ º¯È¯Çϰí Á¦¾îÇÏ´Â °í¼º´É ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖÀ¸¸ç, GaN ÆÄ¿ö µð¹ÙÀ̽º´Â ³ôÀº È¿À²°ú ½Å·Ú¼ºÀ¸·Î ÀÎÇØ ÀÌ·¯ÇÑ ¿ëµµ¿¡ ÀûÇÕÇÕ´Ï´Ù. ÀûÇÕÇÕ´Ï´Ù. Àü±âÀÚµ¿Â÷¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡ÇÔ¿¡ µû¶ó Àü±â ¸ðÅÍ ¹× ¹èÅ͸® ½Ã½ºÅÛÀ» Á¦¾îÇÏ´Â °í¼º´É ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º¿¡ ´ëÇÑ Çʿ伺ÀÌ Áõ°¡Çϰí ÀÖÀ¸¸ç, GaN ÆÄ¿ö µð¹ÙÀ̽º´Â °íÈ¿À², °íÃâ·Â ¹Ðµµ ¹× °í¼Ó ½ºÀ§ÄªÀ» Á¦°øÇÏ¿© Àü±âÀÚµ¿Â÷ ¿ëµµ¿¡ ÀÌ»óÀûÀÔ´Ï´Ù.

ÀÌ Á¶»ç º¸°í¼­´Â Portre's Five Forces ¸ðµ¨, ½ÃÀå ¸Å·Âµµ ºÐ¼® ¹× ¹ë·ùüÀÎ ºÐ¼®¿¡ ´ëÇØ ¼³¸íÇÕ´Ï´Ù. ÀÌ·¯ÇÑ ÅøÀº »ê¾÷ ±¸Á¶¸¦ ¸íÈ®ÇÏ°Ô ÆÄ¾ÇÇÏ°í ¼¼°è ¼öÁØ¿¡¼­ °æÀïÀÇ ¸Å·Âµµ¸¦ Æò°¡ÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ¶ÇÇÑ ÀÌ·¯ÇÑ ÅøÀº ¼¼°è GaN ÆÄ¿ö µð¹ÙÀ̽º ½ÃÀåÀÇ °¢ ºÎ¹®À» Á¾ÇÕÀûÀ¸·Î Æò°¡ÇÒ ¼ö ÀÖÀ¸¸ç, GaN ÆÄ¿ö µð¹ÙÀ̽º »ê¾÷ÀÇ ¼ºÀå°ú µ¿ÇâÀº º» ¿¬±¸¿¡ ´ëÇÑ ÀüüÀûÀÎ Á¢±Ù ¹æ½ÄÀ» Á¦°øÇÕ´Ï´Ù.

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Á¦11Àå ±â¾÷ °³¿ä

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  • Efficient Power Conversion Corporation Inc.
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  • Fujitsu limited
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  • GaN Systems
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  • Infineon Technologies
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  • ROHM CO. LTD.
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  • SOITEC
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  • Texas Instruments Incorporated
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  • VisIC Technologies.
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KSA 23.07.05

The global demand for Power GaN Devices Market is presumed to reach the market size of nearly USD 2315.3 MN by 2030 from USD 87.84 MN in 2022 with a CAGR of 43.84% under the study period 2023-2030. Regarding volume, the market was calculated XX Million Units in 2022 and forecast to touch XX Million Units by 2030 with a CAGR of XX% during 2023-2030.

Power GaN (Gallium Nitride) devices are electronic components that are made using Gallium Nitride technology. They are used in power electronic systems for high voltage, high frequency and high power applications. Power GaN devices offer several advantages over traditional silicon-based power devices, including higher switching speeds, higher power density, and higher efficiency. Power GaN devices are typically used in a variety of applications, including electric vehicles, solar and wind power systems, power supplies, and data centres. These devices are well-suited for applications that require high efficiency, high power density, and high switching speeds, such as those found in the automotive, industrial, and telecommunications sectors. There are several types of power GaN devices available on the market, including GaN HEMTs (High Electron Mobility Transistors), GaN Schottky diodes, and GaN-based integrated circuits (ICs). GaN HEMTs are commonly used in power electronic systems due to their ability to handle high voltage and high power applications. GaN Schottky diodes are used in rectifier circuits and can handle high-frequency switching applications, while GaN-based ICs are used in integrated power electronics applications.

Market Dynamics:

The demand for power electronics is growing rapidly owing to the increasing use of electronic devices and the need for efficient and reliable power conversion in a wide range of applications, including renewable energy systems, electric vehicles, and data centres. Power GaN devices offer high efficiency, high power density, and high switching speeds, making them ideal for power electronics applications. Power GaN devices are capable of handling higher voltages and currents than traditional silicon-based devices, making them ideal for high-performance applications that require high power density, high-frequency operation, and high switching speeds. Advances in GaN technology, including improvements in crystal growth, substrate quality, and device design, have led to the development of higher-performance power GaN devices that offer better efficiency and reliability than traditional silicon-based devices. The growing demand for renewable energy sources (wind and solar power) is driving the demand for high-performance power electronics to convert and control the energy generated by these sources. Power GaN devices are well-suited for these applications due to their high efficiency and reliability. The increasing demand for electric vehicles is driving the need for high-performance power electronics to control electric motor and battery systems. Power GaN devices offer high efficiency, high power density, and high switching speeds, making them ideal for electric vehicle applications.

The research report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of power gan devices. The growth and trends of power gan devices industry provide a holistic approach to this study.

Market Segmentation:

This section of the power gan devices market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.

By Device Type

  • Integrated Power Devices
  • Discrete Power Devices

By Voltage

  • Below 200V
  • 200-600V
  • Above 600V

By End-Use Industry

  • IT & Telecommunication
  • Automotive
  • Semiconductor & Electronics
  • Industrial
  • Aerospace & Defense
  • Others (Energy & Utilities, Healthcare, Etc.)

Regional Analysis:

This section covers the regional outlook, which accentuates current and future demand for the Power GaN Devices market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.

The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the power gan devices market include Efficient Power Conversion Corporation Inc., Fujitsu limited, GaN Power Inc., GaN Systems, Infineon Technologies, Navitas Semiconductor, NexGen Power Systems, On Semiconductors, Panasonic Corporation, Power Integrations Inc., ROHM CO. LTD., SOITEC, Texas Instruments Incorporated, Transphorm Inc., VisIC Technologies. This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.

TABLE OF CONTENTS

1 . PREFACE

  • 1.1. Report Description
    • 1.1.1. Objective
    • 1.1.2. Target Audience
    • 1.1.3. Unique Selling Proposition (USP) & offerings
  • 1.2. Research Scope
  • 1.3. Research Methodology
    • 1.3.1. Market Research Process
    • 1.3.2. Market Research Methodology

2 . EXECUTIVE SUMMARY

  • 2.1. Highlights of Market
  • 2.2. Global Market Snapshot

3 . POWER GAN DEVICES - INDUSTRY ANALYSIS

  • 3.1. Introduction - Market Dynamics
  • 3.2. Market Drivers
  • 3.3. Market Restraints
  • 3.4. Opportunities
  • 3.5. Industry Trends
  • 3.6. Porter's Five Force Analysis
  • 3.7. Market Attractiveness Analysis
    • 3.7.1 Market Attractiveness Analysis By Device Type
    • 3.7.2 Market Attractiveness Analysis By Voltage
    • 3.7.3 Market Attractiveness Analysis By End-use Industry
    • 3.7.4 Market Attractiveness Analysis By Region

4 . VALUE CHAIN ANALYSIS

  • 4.1. Value Chain Analysis
  • 4.2. Raw Material Analysis
    • 4.2.1. List of Raw Materials
    • 4.2.2. Raw Material Manufactures List
    • 4.2.3. Price Trend of Key Raw Materials
  • 4.3. List of Potential Buyers
  • 4.4. Marketing Channel
    • 4.4.1. Direct Marketing
    • 4.4.2. Indirect Marketing
    • 4.4.3. Marketing Channel Development Trend

5 . IMPACT ANALYSIS OF COVID-19 OUTBREAK

6 . GLOBAL POWER GAN DEVICES MARKET ANALYSIS BY DEVICE TYPE

  • 6.1 Overview by Device Type
  • 6.2 Historical and Forecast Data
  • 6.3 Analysis by Device Type
  • 6.4 Integrated Power Devices Historic and Forecast Sales by Regions
  • 6.5 Discrete Power Devices Historic and Forecast Sales by Regions

7 . GLOBAL POWER GAN DEVICES MARKET ANALYSIS BY VOLTAGE

  • 7.1 Overview by Voltage
  • 7.2 Historical and Forecast Data
  • 7.3 Analysis by Voltage
  • 7.4 Below 200V Historic and Forecast Sales by Regions
  • 7.5 200-600V Historic and Forecast Sales by Regions
  • 7.6 Above 600V Historic and Forecast Sales by Regions

8 . GLOBAL POWER GAN DEVICES MARKET ANALYSIS BY END-USE INDUSTRY

  • 8.1 Overview by End-use Industry
  • 8.2 Historical and Forecast Data
  • 8.3 Analysis by End-use Industry
  • 8.4 IT & Telecommunication Historic and Forecast Sales by Regions
  • 8.5 Automotive Historic and Forecast Sales by Regions
  • 8.6 Semiconductor & Electronics Historic and Forecast Sales by Regions
  • 8.7 Industrial Historic and Forecast Sales by Regions
  • 8.8 Aerospace & Defense Historic and Forecast Sales by Regions
  • 8.9 Others (Energy & Utilities, Healthcare, Etc.) Historic and Forecast Sales by Regions

9 . GLOBAL POWER GAN DEVICES MARKET ANALYSIS BY GEOGRAPHY

  • 9.1. Regional Outlook
  • 9.2. Introduction
  • 9.3. North America Sales Analysis
    • 9.3.1. Overview, Historic and Forecast Data Sales Analysis
    • 9.3.2. North America By Segment Sales Analysis
    • 9.3.3. North America By Country Sales Analysis
    • 9.3.4. United State Sales Analysis
    • 9.3.5. Canada Sales Analysis
    • 9.3.6. Mexico Sales Analysis
  • 9.4. Europe Sales Analysis
    • 9.4.1. Overview, Historic and Forecast Data Sales Analysis
    • 9.4.2. Europe by Segment Sales Analysis
    • 9.4.3. Europe by Country Sales Analysis
    • 9.4.4. United Kingdom Sales Analysis
    • 9.4.5. France Sales Analysis
    • 9.4.6. Germany Sales Analysis
    • 9.4.7. Italy Sales Analysis
    • 9.4.8. Russia Sales Analysis
    • 9.4.9. Rest Of Europe Sales Analysis
  • 9.5. Asia Pacific Sales Analysis
    • 9.5.1. Overview, Historic and Forecast Data Sales Analysis
    • 9.5.2. Asia Pacific by Segment Sales Analysis
    • 9.5.3. Asia Pacific by Country Sales Analysis
    • 9.5.4. China Sales Analysis
    • 9.5.5. India Sales Analysis
    • 9.5.6. Japan Sales Analysis
    • 9.5.7. South Korea Sales Analysis
    • 9.5.8. Australia Sales Analysis
    • 9.5.9. Rest Of Asia Pacific Sales Analysis
  • 9.6. Latin America Sales Analysis
    • 9.6.1. Overview, Historic and Forecast Data Sales Analysis
    • 9.6.2. Latin America by Segment Sales Analysis
    • 9.6.3. Latin America by Country Sales Analysis
    • 9.6.4. Brazil Sales Analysis
    • 9.6.5. Argentina Sales Analysis
    • 9.6.6. Peru Sales Analysis
    • 9.6.7. Chile Sales Analysis
    • 9.6.8. Rest of Latin America Sales Analysis
  • 9.7. Middle East & Africa Sales Analysis
    • 9.7.1. Overview, Historic and Forecast Data Sales Analysis
    • 9.7.2. Middle East & Africa by Segment Sales Analysis
    • 9.7.3. Middle East & Africa by Country Sales Analysis
    • 9.7.4. Saudi Arabia Sales Analysis
    • 9.7.5. UAE Sales Analysis
    • 9.7.6. Israel Sales Analysis
    • 9.7.7. South Africa Sales Analysis
    • 9.7.8. Rest Of Middle East And Africa Sales Analysis

10 . COMPETITIVE LANDSCAPE OF THE POWER GAN DEVICES COMPANIES

  • 10.1. Power Gan Devices Market Competition
  • 10.2. Partnership/Collaboration/Agreement
  • 10.3. Merger And Acquisitions
  • 10.4. New Product Launch
  • 10.5. Other Developments

11 . COMPANY PROFILES OF POWER GAN DEVICES INDUSTRY

  • 11.1. Company Share Analysis
  • 11.2. Market Concentration Rate
  • 11.3. Efficient Power Conversion Corporation Inc.
    • 11.3.1. Company Overview
    • 11.3.2. Company Revenue
    • 11.3.3. Products
    • 11.3.4. Recent Developments
  • 11.4. Fujitsu limited
    • 11.4.1. Company Overview
    • 11.4.2. Company Revenue
    • 11.4.3. Products
    • 11.4.4. Recent Developments
  • 11.5. GaN Power Inc.
    • 11.5.1. Company Overview
    • 11.5.2. Company Revenue
    • 11.5.3. Products
    • 11.5.4. Recent Developments
  • 11.6. GaN Systems
    • 11.6.1. Company Overview
    • 11.6.2. Company Revenue
    • 11.6.3. Products
    • 11.6.4. Recent Developments
  • 11.7. Infineon Technologies
    • 11.7.1. Company Overview
    • 11.7.2. Company Revenue
    • 11.7.3. Products
    • 11.7.4. Recent Developments
  • 11.8. Navitas Semiconductor
    • 11.8.1. Company Overview
    • 11.8.2. Company Revenue
    • 11.8.3. Products
    • 11.8.4. Recent Developments
  • 11.9. NexGen Power Systems
    • 11.9.1. Company Overview
    • 11.9.2. Company Revenue
    • 11.9.3. Products
    • 11.9.4. Recent Developments
  • 11.10. On Semiconductors
    • 11.10.1. Company Overview
    • 11.10.2. Company Revenue
    • 11.10.3. Products
    • 11.10.4. Recent Developments
  • 11.11. Panasonic Corporation
    • 11.11.1. Company Overview
    • 11.11.2. Company Revenue
    • 11.11.3. Products
    • 11.11.4. Recent Developments
  • 11.12. Power Integrations Inc.
    • 11.12.1. Company Overview
    • 11.12.2. Company Revenue
    • 11.12.3. Products
    • 11.12.4. Recent Developments
  • 11.13. ROHM CO. LTD.
    • 11.13.1. Company Overview
    • 11.13.2. Company Revenue
    • 11.13.3. Products
    • 11.13.4. Recent Developments
  • 11.14. SOITEC
    • 11.14.1. Company Overview
    • 11.14.2. Company Revenue
    • 11.14.3. Products
    • 11.14.4. Recent Developments
  • 11.15. Texas Instruments Incorporated
    • 11.15.1. Company Overview
    • 11.15.2. Company Revenue
    • 11.15.3. Products
    • 11.15.4. Recent Developments
  • 11.16. Transphorm Inc.
    • 11.16.1. Company Overview
    • 11.16.2. Company Revenue
    • 11.16.3. Products
    • 11.16.4. Recent Developments
  • 11.17. VisIC Technologies.
    • 11.17.1. Company Overview
    • 11.17.2. Company Revenue
    • 11.17.3. Products
    • 11.17.4. Recent Developments

Note - in company profiling, financial details and recent development are subject to availability or might not be covered in case of private companies

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