½ÃÀ庸°í¼­
»óǰÄÚµå
1361725

¼¼°èÀÇ ÀúÀ¯ÀüÀ² Àç·á ½ÃÀå º¸°í¼­

Global Low Dielectric Materials Market Report

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: Value Market Research | ÆäÀÌÁö Á¤º¸: ¿µ¹® 236 Pages | ¹è¼Û¾È³» : 1-2ÀÏ (¿µ¾÷ÀÏ ±âÁØ)

    
    
    




¡Ø º» »óǰÀº ¿µ¹® ÀÚ·á·Î Çѱ۰ú ¿µ¹® ¸ñÂ÷¿¡ ºÒÀÏÄ¡ÇÏ´Â ³»¿ëÀÌ ÀÖÀ» °æ¿ì ¿µ¹®À» ¿ì¼±ÇÕ´Ï´Ù. Á¤È®ÇÑ °ËÅ並 À§ÇØ ¿µ¹® ¸ñÂ÷¸¦ Âü°íÇØÁֽñ⠹ٶø´Ï´Ù.

ÀúÀ¯ÀüÀ² Àç·á ½ÃÀåÀÇ ¼¼°è ¼ö¿ä´Â 2023-2030³â Á¶»ç ±â°£ µ¿¾È CAGR 8.72%·Î ¼ºÀåÇÏ¿© 2022³â 47¾ï 3,000¸¸ ´Þ·¯¿¡¼­ 2030³â¿¡´Â 92¾ï 3,000¸¸ ´Þ·¯¿¡ °¡±î¿î ½ÃÀå ±Ô¸ð¿¡ µµ´ÞÇÒ °ÍÀ¸·Î ÃßÁ¤µË´Ï´Ù.

ÀúÀ¯ÀüÀ² Àç·á ½ÃÀåÀÇ ¹Ì·¡´Â À¯¸ÁÇÕ´Ï´Ù. ÀúÀ¯ÀüÀ² Àç·á ½ÃÀåÀÇ ÁÖ¿ä ÃËÁø¿äÀÎÀº PCB ¹× ¸¶ÀÌÅ©·Î ÀÏ·ºÆ®·Î´Ð½º¿Í °°Àº ÀüÀÚ ºÎǰ Á¦Á¶¿¡¼­ ÀÌ·¯ÇÑ Àç·á¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡ÀÔ´Ï´Ù. ¶ÇÇÑ, Ç×°ø ±³Åë·®ÀÇ Áõ°¡·Î ÀÎÇØ Àü ¼¼°èÀûÀ¸·Î ¾ÈÅ׳ª¿Í ·£´ý¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡ÇÏ¿© ÀúÀ¯ÀüÀ² Àç·á¿¡ ´ëÇÑ ¼ö¿ä°¡ ´õ¿í ³ô¾ÆÁ³½À´Ï´Ù. ³ôÀº ³»¿­¼ºÀº ÀúÀ¯ÀüÀ² Àç·áÀÇ ±Þ°ÝÇÑ ¼ºÀåÀÇ ÁÖ¿ä ÀÌÀ¯ÀÔ´Ï´Ù. ±×·¯³ª ±âÁ¸ Àç·á¿¡ ºñÇØ ºñ¿ëÀÌ ³ô±â ¶§¹®¿¡ °¡±î¿î Àå·¡¿¡ ½ÃÀå ¼ºÀå¿¡ Áß¿äÇÑ Àå¾Ö¹°ÀÌ µÉ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.

ÀÌ º¸°í¼­´Â Porter's Five Forces ¸ðµ¨, ½ÃÀå ¸Å·Âµµ ºÐ¼®, ¹ë·ùüÀÎ ºÐ¼®À» ´Ù·ç°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ µµ±¸´Â »ê¾÷ ±¸Á¶¸¦ ¸íÈ®ÇÏ°Ô ÆÄ¾ÇÇÏ°í ¼¼°è ¼öÁØ¿¡¼­ °æÀïÀÇ ¸Å·ÂÀ» Æò°¡ÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù. ¶ÇÇÑ ÀÌ·¯ÇÑ µµ±¸´Â ÀúÀ¯ÀüÀ² Àç·á ¼¼°è ½ÃÀå¿¡¼­ °¢ ºÎ¹®À» Æ÷°ýÀûÀ¸·Î Æò°¡ÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀúÀ¯ÀüÀ² Àç·á »ê¾÷ÀÇ ¼ºÀå°ú µ¿ÇâÀº ÀÌ Á¶»ç¿¡ ´ëÇÑ ÀüüÀûÀÎ Á¢±Ù ¹æ½ÄÀ» Á¦°øÇÕ´Ï´Ù.

Áö¿ªº° ºÐ¼®:

ÀÌ ¼½¼Ç¿¡¼­´Â ºÏ¹Ì, À¯·´, ¾Æ½Ã¾ÆÅÂÆò¾ç, ¶óƾ¾Æ¸Þ¸®Ä«, Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«ÀÇ ÀúÀ¯ÀüÀ² Àç·á ½ÃÀåÀÇ ÇöÀç ¹× ¹Ì·¡ ¼ö¿ä¸¦ °­Á¶ÇÏ´Â Áö¿ª Àü¸ÁÀ» ´Ù·ì´Ï´Ù. ¶ÇÇÑ, ÁÖ¿ä Áö¿ªº°·Î °¢ ¿ëµµ ºÎ¹®ÀÇ ¼ö¿ä, ÃßÁ¤ ¹× ¿¹Ãø¿¡ ÃÊÁ¡À» ¸ÂÃß°í ÀÖ½À´Ï´Ù.

¿äûÀÌ ÀÖÀ¸½Ã¸é ÀúÈñ¿¡°Ô ¿¬¶ô Áֽñ⠹ٶø´Ï´Ù. ÀúÈñ Á¶»çÆÀÀº °í°´ÀÇ ¿ä±¸¿¡ µû¶ó ¸ÂÃãÇü º¸°í¼­¸¦ Á¦°øÇÒ ¼ö ÀÖ½À´Ï´Ù.

¸ñÂ÷

Á¦1Àå ¼­¹®

Á¦2Àå ÁÖ¿ä ¿ä¾à

  • ½ÃÀå ÇÏÀ̶óÀÌÆ®
  • ¼¼°è ½ÃÀå ÇöȲ

Á¦3Àå ÀúÀ¯ÀüÀ² Àç·á : »ê¾÷ ºÐ¼®

  • ¼­·Ð : ½ÃÀå ¿ªÇÐ
  • ½ÃÀå ¼ºÀå ÃËÁø¿äÀÎ
  • ½ÃÀå ¼ºÀå ¾ïÁ¦¿äÀÎ
  • ½ÃÀå ±âȸ
  • ¾÷°è µ¿Çâ
  • Porter's Five Forces ºÐ¼®
  • ½ÃÀå ¸Å·Âµµ ºÐ¼®

Á¦4Àå ¹ë·ùüÀÎ ºÐ¼®

  • ¹ë·ùüÀÎ ºÐ¼®
  • ¿øÀç·á ºÐ¼®
    • ¿øÀç·á ¸®½ºÆ®
    • ¿øÀç·á Á¦Á¶¾÷ü ¸®½ºÆ®
    • ÁÖ¿ä ¿øÀç·á °¡°Ý µ¿Çâ
  • ÀáÀçÀû ¹ÙÀÌ¾î ¸®½ºÆ®
  • ¸¶ÄÉÆÃ Ã¤³Î
    • Á÷Á¢ ¸¶ÄÉÆÃ
    • °£Á¢ ¸¶ÄÉÆÃ
    • ¸¶ÄÉÆÃ Ã¤³Î ¹ßÀü µ¿Çâ

Á¦5Àå COVID-19 ¹ß»ýÀÇ ¿µÇ⠺м®

Á¦6Àå ÀúÀ¯ÀüÀ² Àç·á ¼¼°è ½ÃÀå ºÐ¼® : À¯Çüº°

  • °³¿ä : À¯Çüº°
  • ½ÇÀû µ¥ÀÌÅÍ¿Í ¿¹Ãø µ¥ÀÌÅÍ
  • ºÐ¼® : À¯Çüº°
  • ¿­°¡¼Ò¼º
  • ¿­°æÈ­¼º
  • ¼¼¶ó¹Í

Á¦7Àå ÀúÀ¯ÀüÀ² Àç·á ¼¼°è ½ÃÀå ºÐ¼® : Àç·á À¯Çüº°

  • °³¿ä : Àç·á À¯Çüº°
  • ½ÇÀû µ¥ÀÌÅÍ¿Í ¿¹Ãø µ¥ÀÌÅÍ
  • ºÐ¼® : Àç·á À¯Çüº°
  • ºÒ¼Ò¼öÁö(PTFE, ±âŸ(ETFE, FEP, PFA))
  • º¯¼º Æú¸®Æä´Ò·» ¿¡Å׸£
  • Æú¸®À̵̹å
  • ȯÇü ¿Ã·¹ÇÉ °øÁßÇÕü
  • ½Ã¾Æ³×ÀÌÆ® ¿¡½ºÅ׸£
  • ¾×Á¤ Æú¸®¸Ó
  • ±âŸ(¼¼¶ó¹Í, BCB, SiLK, SLK, PEEK)

Á¦8Àå ÀúÀ¯ÀüÀ² Àç·á ¼¼°è ½ÃÀå ºÐ¼® : ¿ëµµº°

  • °³¿ä : ¿ëµµº°
  • ½ÇÀû µ¥ÀÌÅÍ¿Í ¿¹Ãø µ¥ÀÌÅÍ
  • ºÐ¼® : ¿ëµµº°
  • Àμâȸ·Î±âÆÇ
  • ¾ÈÅ׳ª
  • ¸¶ÀÌÅ©·ÎÀÏ·ºÆ®·Î´Ð½º
  • ¿ÍÀÌ¾î ¹× ÄÉÀ̺í
  • ·¹À̵¼
  • ±âŸ(CMOS µð¹ÙÀ̽º, ¼¾¼­ µð¹ÙÀ̽º)

Á¦9Àå ÀúÀ¯ÀüÀ² Àç·á ¼¼°è ½ÃÀå ºÐ¼® : Áö¿ªº°

  • Áö¿ªº° Àü¸Á
  • ¼­·Ð
  • ºÏ¹ÌÀÇ ¸ÅÃ⠺м®
    • °³¿ä, ½ÇÀû°ú ¿¹Ãø
    • ºÏ¹Ì : ºÎ¹®º°
    • ºÏ¹Ì : ±¹°¡º°
    • ¹Ì±¹
    • ij³ª´Ù
    • ¸ß½ÃÄÚ
  • À¯·´ÀÇ ¸ÅÃ⠺м®
    • °³¿ä, ½ÇÀû°ú ¿¹Ãø
    • À¯·´ : ºÎ¹®º°
    • À¯·´ : ±¹°¡º°
    • ¿µ±¹
    • ÇÁ¶û½º
    • µ¶ÀÏ
    • ÀÌÅ»¸®¾Æ
    • ·¯½Ã¾Æ
    • ±âŸ À¯·´
  • ¾Æ½Ã¾ÆÅÂÆò¾çÀÇ ¸ÅÃ⠺м®
    • °³¿ä, ½ÇÀû°ú ¿¹Ãø
    • ¾Æ½Ã¾ÆÅÂÆò¾ç : ºÎ¹®º°
    • ¾Æ½Ã¾ÆÅÂÆò¾ç : ±¹°¡º°
    • Áß±¹
    • Àεµ
    • ÀϺ»
    • Çѱ¹
    • È£ÁÖ
    • ±âŸ ¾Æ½Ã¾ÆÅÂÆò¾ç
  • ¶óƾ¾Æ¸Þ¸®Ä«ÀÇ ¸ÅÃ⠺м®
    • °³¿ä, ½ÇÀû°ú ¿¹Ãø
    • ¶óƾ¾Æ¸Þ¸®Ä« : ºÎ¹®º°
    • ¶óƾ¾Æ¸Þ¸®Ä« : ±¹°¡º°
    • ºê¶óÁú
    • ¾Æ¸£ÇîÆ¼³ª
    • Æä·ç
    • Ä¥·¹
    • ±âŸ ¶óƾ¾Æ¸Þ¸®Ä«
  • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«ÀÇ ¸ÅÃ⠺м®
    • °³¿ä, ½ÇÀû°ú ¿¹Ãø
    • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä« : ºÎ¹®º°
    • Áßµ¿ ¹× ¾ÆÇÁ¸®Ä« : ±¹°¡º°
    • »ç¿ìµð¾Æ¶óºñ¾Æ
    • ¾Æ¶ø¿¡¹Ì¸®Æ®
    • À̽º¶ó¿¤
    • ³²¾ÆÇÁ¸®Ä«°øÈ­±¹
    • ±âŸ Áßµ¿ ¹× ¾ÆÇÁ¸®Ä«

Á¦10Àå ÀúÀ¯ÀüÀ² Àç·á ±â¾÷ °æÀï »óȲ

  • ÀúÀ¯ÀüÀ² Àç·á ½ÃÀå °æÀï
  • Á¦ÈÞ, Çù·Â, ÇÕÀÇ
  • ÀμöÇÕº´
  • ½ÅÁ¦Ç° ¹ß¸Å
  • ±âŸ °³¹ß

Á¦11Àå ±â¾÷ °³¿ä

  • ±â¾÷ Á¡À¯À² ºÐ¼®
  • ½ÃÀå ÁýÁßµµ
  • Huntsman Corporation(U.S.)
  • Arxada(Switzerland)
  • SABIC(Saudi Arabia)
  • Asahi Kasei(Japan)
  • Topas Advanced Polymers(Germany)
  • Zeon Corp.(Japan)
  • Chemours Company LLC(U.S.)
  • DIC Corporation(Japan)
  • Arkema(France)
  • Mitsubishi Corporation(Japan)
  • Showa Denko(Japan)
  • Dow(U.S.)
  • Shin Etsu Chemical Co. Ltd.(Japan)
  • Olin Corporation(U.S.)
  • Celanese Corporation(U.S.)
  • Solvay(Belgium)
ksm 23.10.31

The global demand for Low Dielectric Materials Market is presumed to reach the market size of nearly USD 9.23 BN by 2030 from USD 4.73 BN in 2022 with a CAGR of 8.72% under the study period of 2023 - 2030.

The future of the low dielectric materials market looks promising. The major low dielectric materials market drivers are increasing demand for these materials in manufacturing electronic components such as PCBs and microelectronics. Moreover, the increase in air traffic has expanded the demand for antenna and randoms globally, further propelling the demand for low dielectric materials to newer heights. High heat resistance capacity is the primary reason behind the fastest growth of low dielectric materials. However, the high cost compared to traditional materials is expected to soon be a critical hurdle for the market's growth.

The report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of low dielectric materials. The growth and trends of Low Dielectric Materials Industry provide a holistic approach to this study.

MARKET SEGMENTATION:

This section of the low dielectric materials market report provides detailed data on the segments by analyzing them at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.

By Type

  • Thermoplastic
  • Thermoset
  • Ceramics

By Material Type

  • Fluoropolymer (PTFE, Others (ETFE, FEP, and PFA))
  • Modified Polyphenylene Ether
  • Polyimide
  • Cyclic Olefin Copolymer
  • Cyanate Ester
  • Liquid Crystal Polymer
  • Others (Ceramics, BCB, SiLK, SLK, PEEK)

By Application

  • PCBs
  • Antenna
  • Microelectronics
  • Wire & Cable
  • Radome
  • Others (CMOS Devices, And Sensor Devices)

REGIONAL ANALYSIS:

This section covers the regional outlook, which accentuates current and future demand for the Low Dielectric Materials market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.

The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the Low Dielectric Materials market include Huntsman Corporation (U.S.), Arxada (Switzerland), SABIC (Saudi Arabia), Asahi Kasei (Japan), Topas Advanced Polymers (Germany), Zeon Corp. (Japan), Chemours Company LLC (U.S.), DIC Corporation (Japan), Arkema (France), Mitsubishi Corporation (Japan), Showa Denko (Japan), Dow (U.S.), Shin Etsu Chemical Co. Ltd. (Japan), Olin Corporation (U.S.), Celanese Corporation (U.S.), and Solvay (Belgium). This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.

In case you have any custom requirements, do write to us. Our research team can offer a customized report as per your need.

TABLE OF CONTENTS

1 . PREFACE

  • 1.1. Report Description
    • 1.1.1. Objective
    • 1.1.2. Target Audience
    • 1.1.3. Unique Selling Proposition (USP) & offerings
  • 1.2. Research Scope
  • 1.3. Research Methodology
    • 1.3.1. Market Research Process
    • 1.3.2. Market Research Methodology

2 . EXECUTIVE SUMMARY

  • 2.1. Highlights of Market
  • 2.2. Global Market Snapshot

3 . LOW DIELECTRIC MATERIALS - INDUSTRY ANALYSIS

  • 3.1. Introduction - Market Dynamics
  • 3.2. Market Drivers
  • 3.3. Market Restraints
  • 3.4. Opportunities
  • 3.5. Industry Trends
  • 3.6. Porter's Five Force Analysis
  • 3.7. Market Attractiveness Analysis
    • 3.7.1 Market Attractiveness Analysis By Type
    • 3.7.2 Market Attractiveness Analysis By Material Type
    • 3.7.3 Market Attractiveness Analysis By Application
    • 3.7.4 Market Attractiveness Analysis By Region

4 . VALUE CHAIN ANALYSIS

  • 4.1. Value Chain Analysis
  • 4.2. Raw Material Analysis
    • 4.2.1. List of Raw Materials
    • 4.2.2. Raw Material Manufactures List
    • 4.2.3. Price Trend of Key Raw Materials
  • 4.3. List of Potential Buyers
  • 4.4. Marketing Channel
    • 4.4.1. Direct Marketing
    • 4.4.2. Indirect Marketing
    • 4.4.3. Marketing Channel Development Trend

5 . IMPACT ANALYSIS OF COVID-19 OUTBREAK

6 . GLOBAL LOW DIELECTRIC MATERIALS MARKET ANALYSIS BY TYPE

  • 6.1 Overview by Type
  • 6.2 Historical and Forecast Data
  • 6.3 Analysis by Type
  • 6.4 Thermoplastic Historic and Forecast Sales by Regions
  • 6.5 Thermoset Historic and Forecast Sales by Regions
  • 6.6 Ceramics Historic and Forecast Sales by Regions

7 . GLOBAL LOW DIELECTRIC MATERIALS MARKET ANALYSIS BY MATERIAL TYPE

  • 7.1 Overview by Material Type
  • 7.2 Historical and Forecast Data
  • 7.3 Analysis by Material Type
  • 7.4 Fluoropolymer (PTFE, Others (ETFE, FEP, And PFA)) Historic and Forecast Sales by Regions
  • 7.5 Modified Polyphenylene Ether Historic and Forecast Sales by Regions
  • 7.6 Polyimide Historic and Forecast Sales by Regions
  • 7.7 Cyclic Olefin Copolymer Historic and Forecast Sales by Regions
  • 7.8 Cyanate Ester Historic and Forecast Sales by Regions
  • 7.9 Liquid Crystal Polymer Historic and Forecast Sales by Regions
  • 7.10. Others (Ceramics, BCB, SiLK, SLK, PEEK) Historic and Forecast Sales by Regions

8 . GLOBAL LOW DIELECTRIC MATERIALS MARKET ANALYSIS BY APPLICATION

  • 8.1 Overview by Application
  • 8.2 Historical and Forecast Data
  • 8.3 Analysis by Application
  • 8.4 PCBs Historic and Forecast Sales by Regions
  • 8.5 Antenna Historic and Forecast Sales by Regions
  • 8.6 Microelectronics Historic and Forecast Sales by Regions
  • 8.7 Wire & Cable Historic and Forecast Sales by Regions
  • 8.8 Radome Historic and Forecast Sales by Regions
  • 8.9 Others (CMOS Devices, And Sensor Devices) Historic and Forecast Sales by Regions

9 . GLOBAL LOW DIELECTRIC MATERIALS MARKET ANALYSIS BY GEOGRAPHY

  • 9.1. Regional Outlook
  • 9.2. Introduction
  • 9.3. North America Sales Analysis
    • 9.3.1. Overview, Historic and Forecast Data Sales Analysis
    • 9.3.2. North America By Segment Sales Analysis
    • 9.3.3. North America By Country Sales Analysis
    • 9.3.4. United State Sales Analysis
    • 9.3.5. Canada Sales Analysis
    • 9.3.6. Mexico Sales Analysis
  • 9.4. Europe Sales Analysis
    • 9.4.1. Overview, Historic and Forecast Data Sales Analysis
    • 9.4.2. Europe by Segment Sales Analysis
    • 9.4.3. Europe by Country Sales Analysis
    • 9.4.4. United Kingdom Sales Analysis
    • 9.4.5. France Sales Analysis
    • 9.4.6. Germany Sales Analysis
    • 9.4.7. Italy Sales Analysis
    • 9.4.8. Russia Sales Analysis
    • 9.4.9. Rest Of Europe Sales Analysis
  • 9.5. Asia Pacific Sales Analysis
    • 9.5.1. Overview, Historic and Forecast Data Sales Analysis
    • 9.5.2. Asia Pacific by Segment Sales Analysis
    • 9.5.3. Asia Pacific by Country Sales Analysis
    • 9.5.4. China Sales Analysis
    • 9.5.5. India Sales Analysis
    • 9.5.6. Japan Sales Analysis
    • 9.5.7. South Korea Sales Analysis
    • 9.5.8. Australia Sales Analysis
    • 9.5.9. Rest Of Asia Pacific Sales Analysis
  • 9.6. Latin America Sales Analysis
    • 9.6.1. Overview, Historic and Forecast Data Sales Analysis
    • 9.6.2. Latin America by Segment Sales Analysis
    • 9.6.3. Latin America by Country Sales Analysis
    • 9.6.4. Brazil Sales Analysis
    • 9.6.5. Argentina Sales Analysis
    • 9.6.6. Peru Sales Analysis
    • 9.6.7. Chile Sales Analysis
    • 9.6.8. Rest of Latin America Sales Analysis
  • 9.7. Middle East & Africa Sales Analysis
    • 9.7.1. Overview, Historic and Forecast Data Sales Analysis
    • 9.7.2. Middle East & Africa by Segment Sales Analysis
    • 9.7.3. Middle East & Africa by Country Sales Analysis
    • 9.7.4. Saudi Arabia Sales Analysis
    • 9.7.5. UAE Sales Analysis
    • 9.7.6. Israel Sales Analysis
    • 9.7.7. South Africa Sales Analysis
    • 9.7.8. Rest Of Middle East And Africa Sales Analysis

10 . COMPETITIVE LANDSCAPE OF THE LOW DIELECTRIC MATERIALS COMPANIES

  • 10.1. Low Dielectric Materials Market Competition
  • 10.2. Partnership/Collaboration/Agreement
  • 10.3. Merger And Acquisitions
  • 10.4. New Product Launch
  • 10.5. Other Developments

11 . COMPANY PROFILES OF LOW DIELECTRIC MATERIALS INDUSTRY

  • 11.1. Company Share Analysis
  • 11.2. Market Concentration Rate
  • 11.3. Huntsman Corporation (U.S.)
    • 11.3.1. Company Overview
    • 11.3.2. Company Revenue
    • 11.3.3. Products
    • 11.3.4. Recent Developments
  • 11.4. Arxada (Switzerland)
    • 11.4.1. Company Overview
    • 11.4.2. Company Revenue
    • 11.4.3. Products
    • 11.4.4. Recent Developments
  • 11.5. SABIC (Saudi Arabia)
    • 11.5.1. Company Overview
    • 11.5.2. Company Revenue
    • 11.5.3. Products
    • 11.5.4. Recent Developments
  • 11.6. Asahi Kasei (Japan)
    • 11.6.1. Company Overview
    • 11.6.2. Company Revenue
    • 11.6.3. Products
    • 11.6.4. Recent Developments
  • 11.7. Topas Advanced Polymers (Germany)
    • 11.7.1. Company Overview
    • 11.7.2. Company Revenue
    • 11.7.3. Products
    • 11.7.4. Recent Developments
  • 11.8. Zeon Corp. (Japan)
    • 11.8.1. Company Overview
    • 11.8.2. Company Revenue
    • 11.8.3. Products
    • 11.8.4. Recent Developments
  • 11.9. Chemours Company LLC (U.S.)
    • 11.9.1. Company Overview
    • 11.9.2. Company Revenue
    • 11.9.3. Products
    • 11.9.4. Recent Developments
  • 11.10. DIC Corporation (Japan)
    • 11.10.1. Company Overview
    • 11.10.2. Company Revenue
    • 11.10.3. Products
    • 11.10.4. Recent Developments
  • 11.11. Arkema (France)
    • 11.11.1. Company Overview
    • 11.11.2. Company Revenue
    • 11.11.3. Products
    • 11.11.4. Recent Developments
  • 11.12. Mitsubishi Corporation (Japan)
    • 11.12.1. Company Overview
    • 11.12.2. Company Revenue
    • 11.12.3. Products
    • 11.12.4. Recent Developments
  • 11.13. Showa Denko (Japan)
    • 11.13.1. Company Overview
    • 11.13.2. Company Revenue
    • 11.13.3. Products
    • 11.13.4. Recent Developments
  • 11.14. Dow (U.S.)
    • 11.14.1. Company Overview
    • 11.14.2. Company Revenue
    • 11.14.3. Products
    • 11.14.4. Recent Developments
  • 11.15. Shin Etsu Chemical Co. Ltd. (Japan)
    • 11.15.1. Company Overview
    • 11.15.2. Company Revenue
    • 11.15.3. Products
    • 11.15.4. Recent Developments
  • 11.16. Olin Corporation (U.S.)
    • 11.16.1. Company Overview
    • 11.16.2. Company Revenue
    • 11.16.3. Products
    • 11.16.4. Recent Developments
  • 11.17. Celanese Corporation (U.S.)
    • 11.17.1. Company Overview
    • 11.17.2. Company Revenue
    • 11.17.3. Products
    • 11.17.4. Recent Developments
  • 11.18. Solvay (Belgium)
    • 11.18.1. Company Overview
    • 11.18.2. Company Revenue
    • 11.18.3. Products
    • 11.18.4. Recent Developments

Note - in company profiling, financial details and recent development are subject to availability or might not be covered in case of private companies

ºñ±³¸®½ºÆ®
0 °ÇÀÇ »óǰÀ» ¼±Åà Áß
»óǰ ºñ±³Çϱâ
Àüü»èÁ¦