시장보고서
상품코드
1977927

멀티 모드 칩셋 시장 규모, 점유율, 동향 및 성장 분석 보고서(2026-2034년)

Global Multi-Mode Chipset Market Size, Share, Trends & Growth Analysis Report 2026-2034

발행일: | 리서치사: 구분자 Value Market Research | 페이지 정보: 영문 165 Pages | 배송안내 : 1-2일 (영업일 기준)

    
    
    




※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

멀티 모드 칩셋 시장 규모는 2025년 84억 5,000만 달러에서 2034년에는 253억 달러에 달할 것으로 예측되며, 2026년부터 2034년까지 CAGR 12.96%로 성장할 전망입니다.

세계 멀티 모드 칩셋 시장은 디바이스 간 원활한 연결성에 대한 수요 증가로 인해 빠르게 성장하고 있습니다. 멀티 모드 칩셋은 4G, 5G, Wi-Fi, 블루투스 등 다양한 통신 표준과의 호환성을 실현합니다. 스마트폰 보급률의 향상과 IoT 기기의 확대로 인해 수요가 크게 증가하고 있습니다. 반도체 설계의 기술적 진보도 시장 확대를 더욱 촉진하고 있습니다.

주요 성장 요인으로는 전 세계 5G 네트워크 구축과 고속 데이터 전송에 대한 수요 증가를 꼽을 수 있습니다. 가전제품 제조업체들은 기기의 성능과 연결성을 향상시키기 위해 첨단 칩셋을 통합하고 있습니다. 또한, 자동차 및 산업용 IoT 애플리케이션은 멀티 모드 칩셋의 적용 범위를 확장하고 있습니다. 반도체 제조에 대한 투자 증가로 공급망이 강화되고 있습니다.

산업 전반의 디지털 전환이 가속화되고 있는 가운데, 향후 전망은 여전히 견고합니다. 스마트 시티, 자율주행차, 웨어러블 디바이스의 새로운 응용 분야가 새로운 기회를 창출할 것입니다. 에너지 절약과 소형화를 추구하는 칩셋 설계의 지속적인 혁신이 보급을 촉진합니다. 연결성이 현대 기술 생태계의 중심이 되면서 멀티 모드 칩셋 시장은 지속적인 성장이 예상됩니다.

목차

제1장 소개

제2장 주요 요약

제3장 시장 변수, 동향, 프레임워크

제4장 세계의 멀티 모드 칩셋 시장 : 유형별

제5장 세계의 멀티 모드 칩셋 시장 : 디바이스별

제6장 세계의 멀티 모드 칩셋 시장 : 커뮤니케이션별

제7장 세계의 멀티 모드 칩셋 시장 : 용도별

제8장 세계의 멀티 모드 칩셋 시장 : 지역별

제9장 경쟁 구도

제10장 기업 개요

KSM 26.04.07

The Multi-Mode Chipset Market size is expected to reach USD 25.30 Billion in 2034 from USD 8.45 Billion (2025) growing at a CAGR of 12.96% during 2026-2034.

The Global Multi-Mode Chipset Market is experiencing rapid growth driven by increasing demand for seamless connectivity across devices. Multi-mode chipsets enable compatibility with various communication standards, including 4G, 5G, Wi-Fi, and Bluetooth. Growing smartphone penetration and expansion of IoT devices are significantly boosting demand. Technological advancements in semiconductor design further support market expansion.

Major growth drivers include the global rollout of 5G networks and rising demand for high-speed data transmission. Consumer electronics manufacturers are integrating advanced chipsets to enhance device performance and connectivity. Additionally, automotive and industrial IoT applications are expanding the scope of multi-mode chipsets. Increasing investments in semiconductor manufacturing are strengthening supply chains.

Future prospects remain strong as digital transformation accelerates across industries. Emerging applications in smart cities, autonomous vehicles, and wearable devices will create new opportunities. Continuous innovation in energy-efficient and compact chipset designs will enhance adoption. As connectivity becomes central to modern technology ecosystems, the multi-mode chipset market is expected to witness sustained growth.

Our reports are meticulously crafted to provide clients with comprehensive and actionable insights into various industries and markets. Each report encompasses several critical components to ensure a thorough understanding of the market landscape:

Market Overview: A detailed introduction to the market, including definitions, classifications, and an overview of the industry's current state.

Market Dynamics: In-depth analysis of key drivers, restraints, opportunities, and challenges influencing market growth. This section examines factors such as technological advancements, regulatory changes, and emerging trends.

Segmentation Analysis: Breakdown of the market into distinct segments based on criteria like product type, application, end-user, and geography. This analysis highlights the performance and potential of each segment.

Competitive Landscape: Comprehensive assessment of major market players, including their market share, product portfolio, strategic initiatives, and financial performance. This section provides insights into the competitive dynamics and key strategies adopted by leading companies.

Market Forecast: Projections of market size and growth trends over a specified period, based on historical data and current market conditions. This includes quantitative analyses and graphical representations to illustrate future market trajectories.

Regional Analysis: Evaluation of market performance across different geographical regions, identifying key markets and regional trends. This helps in understanding regional market dynamics and opportunities.

Emerging Trends and Opportunities: Identification of current and emerging market trends, technological innovations, and potential areas for investment. This section offers insights into future market developments and growth prospects.

MARKET SEGMENTATION

By Type

  • Integrated Chipset
  • Non-Integrated Chipset

By Device

  • Smartphones
  • Tablets
  • Wearable Devices
  • Internet Of Things

By Communication

  • Second-Generation
  • Third Generation
  • Fourth Generation
  • Fifth Generation

By Application

  • Consumer Electronics Automotive
  • Healthcare
  • Industrial
  • Other Applications

COMPANIES PROFILED

  • Samsung Electronics Co Ltd, Huawei Technologies Co Ltd, Intel Corporation, Qualcomm Technologies Inc, Broadcom Corporation, Fujitsu Limited, Telefonaktiebolaget LM Ericsson, Nokia Corporation, MediaTek Inc, STMicroelectronics NV, Infineon Technologies AG
  • We can customise the report as per your requirements.

TABLE OF CONTENTS

Chapter 1. PREFACE

  • 1.1. Market Segmentation & Scope
  • 1.2. Market Definition
  • 1.3. Information Procurement
    • 1.3.1 Information Analysis
    • 1.3.2 Market Formulation & Data Visualization
    • 1.3.3 Data Validation & Publishing
  • 1.4. Research Scope and Assumptions
    • 1.4.1 List of Data Sources

Chapter 2. EXECUTIVE SUMMARY

  • 2.1. Market Snapshot
  • 2.2. Segmental Outlook
  • 2.3. Competitive Outlook

Chapter 3. MARKET VARIABLES, TRENDS, FRAMEWORK

  • 3.1. Market Lineage Outlook
  • 3.2. Penetration & Growth Prospect Mapping
  • 3.3. Value Chain Analysis
  • 3.4. Regulatory Framework
    • 3.4.1 Standards & Compliance
    • 3.4.2 Regulatory Impact Analysis
  • 3.5. Market Dynamics
    • 3.5.1 Market Drivers
    • 3.5.2 Market Restraints
    • 3.5.3 Market Opportunities
    • 3.5.4 Market Challenges
  • 3.6. Porter's Five Forces Analysis
  • 3.7. PESTLE Analysis

Chapter 4. GLOBAL MULTI-MODE CHIPSET MARKET: BY TYPE 2022-2034 (USD MN)

  • 4.1. Market Analysis, Insights and Forecast Type
  • 4.2. Integrated Chipset Estimates and Forecasts By Regions 2022-2034 (USD MN)
  • 4.3. Non-Integrated Chipset Estimates and Forecasts By Regions 2022-2034 (USD MN)

Chapter 5. GLOBAL MULTI-MODE CHIPSET MARKET: BY DEVICE 2022-2034 (USD MN)

  • 5.1. Market Analysis, Insights and Forecast Device
  • 5.2. Smartphones Estimates and Forecasts By Regions 2022-2034 (USD MN)
  • 5.3. Tablets Estimates and Forecasts By Regions 2022-2034 (USD MN)
  • 5.4. Wearable Devices Estimates and Forecasts By Regions 2022-2034 (USD MN)
  • 5.5. Internet Of Things Estimates and Forecasts By Regions 2022-2034 (USD MN)

Chapter 6. GLOBAL MULTI-MODE CHIPSET MARKET: BY COMMUNICATION 2022-2034 (USD MN)

  • 6.1. Market Analysis, Insights and Forecast Communication
  • 6.2. Second-Generation Estimates and Forecasts By Regions 2022-2034 (USD MN)
  • 6.3. Third Generation Estimates and Forecasts By Regions 2022-2034 (USD MN)
  • 6.4. Fourth Generation Estimates and Forecasts By Regions 2022-2034 (USD MN)
  • 6.5. Fifth Generation Estimates and Forecasts By Regions 2022-2034 (USD MN)

Chapter 7. GLOBAL MULTI-MODE CHIPSET MARKET: BY APPLICATION 2022-2034 (USD MN)

  • 7.1. Market Analysis, Insights and Forecast Application
  • 7.2. Consumer Electronics Automotive Estimates and Forecasts By Regions 2022-2034 (USD MN)
  • 7.3. Healthcare Estimates and Forecasts By Regions 2022-2034 (USD MN)
  • 7.4. Industrial Estimates and Forecasts By Regions 2022-2034 (USD MN)
  • 7.5. Other Applications Estimates and Forecasts By Regions 2022-2034 (USD MN)

Chapter 8. GLOBAL MULTI-MODE CHIPSET MARKET: BY REGION 2022-2034(USD MN)

  • 8.1. Regional Outlook
  • 8.2. North America Market Analysis, Insights and Forecast, 2022-2034 (USD MN)
    • 8.2.1 By Type
    • 8.2.2 By Device
    • 8.2.3 By Communication
    • 8.2.4 By Application
    • 8.2.5 United States
    • 8.2.6 Canada
    • 8.2.7 Mexico
  • 8.3. Europe Market Analysis, Insights and Forecast, 2022-2034 (USD MN)
    • 8.3.1 By Type
    • 8.3.2 By Device
    • 8.3.3 By Communication
    • 8.3.4 By Application
    • 8.3.5 United Kingdom
    • 8.3.6 France
    • 8.3.7 Germany
    • 8.3.8 Italy
    • 8.3.9 Russia
    • 8.3.10 Rest Of Europe
  • 8.4. Asia-Pacific Market Analysis, Insights and Forecast, 2022-2034 (USD MN)
    • 8.4.1 By Type
    • 8.4.2 By Device
    • 8.4.3 By Communication
    • 8.4.4 By Application
    • 8.4.5 India
    • 8.4.6 Japan
    • 8.4.7 South Korea
    • 8.4.8 Australia
    • 8.4.9 South East Asia
    • 8.4.10 Rest Of Asia Pacific
  • 8.5. Latin America Market Analysis, Insights and Forecast, 2022-2034 (USD MN)
    • 8.5.1 By Type
    • 8.5.2 By Device
    • 8.5.3 By Communication
    • 8.5.4 By Application
    • 8.5.5 Brazil
    • 8.5.6 Argentina
    • 8.5.7 Peru
    • 8.5.8 Chile
    • 8.5.9 South East Asia
    • 8.5.10 Rest of Latin America
  • 8.6. Middle East & Africa Market Analysis, Insights and Forecast, 2022-2034 (USD MN)
    • 8.6.1 By Type
    • 8.6.2 By Device
    • 8.6.3 By Communication
    • 8.6.4 By Application
    • 8.6.5 Saudi Arabia
    • 8.6.6 UAE
    • 8.6.7 Israel
    • 8.6.8 South Africa
    • 8.6.9 Rest of the Middle East And Africa

Chapter 9. COMPETITIVE LANDSCAPE

  • 9.1. Recent Developments
  • 9.2. Company Categorization
  • 9.3. Supply Chain & Channel Partners (based on availability)
  • 9.4. Market Share & Positioning Analysis (based on availability)
  • 9.5. Vendor Landscape (based on availability)
  • 9.6. Strategy Mapping

Chapter 10. COMPANY PROFILES OF GLOBAL MULTI-MODE CHIPSET INDUSTRY

  • 10.1. Top Companies Market Share Analysis
  • 10.2. Company Profiles
    • 10.2.1 Samsung Electronics Co. Ltd
    • 10.2.2 Huawei Technologies Co. Ltd
    • 10.2.3 Intel Corporation
    • 10.2.4 Qualcomm Technologies Inc
    • 10.2.5 Broadcom Corporation
    • 10.2.6 Fujitsu Limited
    • 10.2.7 Telefonaktiebolaget LM Ericsson
    • 10.2.8 Nokia Corporation
    • 10.2.9 MediaTek Inc
    • 10.2.10 STMicroelectronics N.V
    • 10.2.11 Infineon Technologies AG
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