¡Ø º» »óǰÀº ¿µ¹® ÀÚ·á·Î Çѱ۰ú ¿µ¹® ¸ñÂ÷¿¡ ºÒÀÏÄ¡ÇÏ´Â ³»¿ëÀÌ ÀÖÀ» °æ¿ì ¿µ¹®À» ¿ì¼±ÇÕ´Ï´Ù. Á¤È®ÇÑ °ËÅ並 À§ÇØ ¿µ¹® ¸ñÂ÷¸¦ Âü°íÇØÁֽñ⠹ٶø´Ï´Ù.
¼ÒºñÀÚ ¹× M2M ½ÃÀå¿¡¼ÀÇ eSIM µ¿ÇâÀ» Á¶»çÇßÀ¸¸ç, eSIM/eUICC ¹× iSIM/iUICCÀÇ ½ÃÀå ±Ô¸ð ÃßÁ¤ ¹× ¿¹Ãø, µð¹ÙÀ̽º Á¾·ù/¿ëµµº° ºÐ¼®, eSIM IC º¥´õÀÇ ½ÃÀå Á¡À¯À² µîÀ» Á¤¸®Çß½À´Ï´Ù.
½Ç¿ëÀûÀÎ ÀåÁ¡:
- eSIM/eUICC ¹× iSIM/iUICC ÆûÆÑÅÍ¿¡ ´ëÇØ ¼ÒºñÀÚ ¹× M2M/IoT ¾ÖÇø®ÄÉÀÌ¼Ç Àü¹Ý¿¡¼ °¡Àå Å« ¼ºÀå ±âȸ¸¦ ½Äº°Çϰí Ÿ°ÙÆÃÇÒ ¼ö ÀÖ½À´Ï´Ù.
- SGP.32ÀÇ »ó¾÷Àû Ãâ½Ã ½Ã±â¸¦ ÀÌÇØÇϰí, À̰ÍÀÌ eSIM IoT ±â±â ½ÃÀå¿¡ ¾î¶² ±àÁ¤ÀûÀÎ ¿µÇâÀ» ¹ÌÄ¥Áö ÆÄ¾ÇÇÒ ¼ö ÀÖ½À´Ï´Ù.
- eSIM/eUICC ¹× iSIM/iUICCÀÇ Ã¤Åà ÀÏÁ¤À» ÀÌÇØÇϰí, ±âÁ¸ Å»Âø½Ä SIM Ä«µå ½ÃÀå¿¡ ¹ÌÄ¥ ¼ö ÀÖ´Â ÀáÀçÀû ¿µÇâÀ» ÆÄ¾ÇÇÒ ¼ö ÀÖ½À´Ï´Ù.
- eSIM IC º¥´õÀÇ »óȲÀ» ÀÌÇØÇϰí Àü·«Àû ÆÄÆ®³Ê½Ê ¹× °æÀï À§ÇùÀ» ½Äº°ÇÏ´Â µ¥ µµ¿òÀÌ µË´Ï´Ù.
Áß¿äÇÑ Áú¹®¿¡ ´ëÇÑ ´äº¯:
- ¼ÒºñÀÚ ½ÃÀå ¹× M2M ½ÃÀå¿¡¼ eSIM/eUICC ¹× iSIM/iUICCÀÇ ½ÃÀå ±Ô¸ð´Â ¾î´À Á¤µµÀ̸ç, ÇâÈÄ 5³â°£ ¼ºÀåÀ» ÁÖµµÇÒ ¾ÖÇø®ÄÉÀ̼Ç/µð¹ÙÀ̽º À¯ÇüÀº ¹«¾ùÀΰ¡?
- »õ·Î¿î ÀÓº£µðµå iSIM/iUICC ÆûÆÑÅÍ´Â ¾î¶»°Ô ¹ßÀüÇϰí ÀÖÀ¸¸ç, ±âÁ¸ eSIM/eUICC Çϵå¿þ¾î ½ÃÀå¿¡ ¾î¶² ¿µÇâÀ» ¹ÌÄ¥ °ÍÀΰ¡?
- eSIM°ú ÀÓº£µðµå º¸¾È ¿ä¼Ò(eSE)ÀÇ À¶ÇÕÀº ¾î¶»°Ô Àü°³µÉ °ÍÀΰ¡?
- eSIM Ȱ¼ºÈÀ² ÇöȲ°ú ÇâÈÄ 5³â°£ÀÇ È°¼ºÈÀ² ÃßÀÌ´Â?
- ´ÙÀ½À¸·Î eSIM ÅëÇÕÀ» ÃßÁøÇÒ ´Ü¸» º¥´õ´Â ¾îµðÀϱî?
- eSIM ICÀÇ ÁÖ¿ä °ø±Þ¾÷ü´Â?
Á¶»ç ÇÏÀ̶óÀÌÆ®:
- ¼ÒºñÀÚ ¹× M2M/IoT¿ë SIM/eUICC µð¹ÙÀ̽º/¿ëµµ ¿¹Ãø
- eSIM/eUICC ÆûÆÑÅͺ° ¿¹Ãø : µ¶¸³Çü ¹× eSIM/eSE µ¥ÀÌÅÍ Æ÷ÀÎÆ® Æ÷ÇÔ
- µð¹ÙÀ̽º À¯Çü/¿ëµµº° iSIM/iUICC ¿¹Ãø
- ÁÖ¿ä µð¹ÙÀ̽º OEMº° ½º¸¶Æ®Æù eSIM ¿¹Ãø : Apple, Samsung, Google, Huawei µî
- eSIM IC º¥´õ ½ÃÀå Á¡À¯À² : 2018³â »ó¹Ý±â-2024³â »ó¹Ý±â
¸ñÂ÷
Å×À̺í
Â÷Æ®
- ¼ÒºñÀÚ ½ÃÀåÀÇ eSIM ÃâÇÏ·® : µð¹ÙÀ̽º À¯Çüº°
- ¼ÒºñÀÚ ½ÃÀåÀÇ eSIM ÃâÇÏ º¸±Þ·ü : µð¹ÙÀ̽º À¯Çüº°
- eSIM ½º¸¶Æ®Æù ÃâÇÏ·® : OEMº°
- eSIM ½º¸¶Æ®Æù ÃâÇÏ·® Á¡À¯À² : OEMº°
- M2M IoT eMFF SIM ÃâÇÏ·® : ¿ëµµº°
- RSP ´ëÀÀ M2M IoT eMFF SIM ÃâÇÏ·®
- eSIM IC º¥´õÀÇ ½ÃÀå Á¡À¯À²
- iUICC ÃâÇÏ·® : ¼ÒºñÀÚ vs M2M IoT
- iUICC ÃâÇÏ·® : ¿£µå ¸¶ÄÏ¡¤µð¹ÙÀ̽º À¯Çüº°
ksm 25.04.15
Actionable Benefits:
- Identify and better target the largest growth opportunities for the Embedded Subscriber Identity Module (eSIM))/Embedded Universal Integrated Circuit Card (eUICC), and Integrated SIM (iSIM)/Integrated UICC (iUICC) form factors across consumer and Machine-to-Machine (M2M)/Internet of Things (IoT) applications.
- Understand the likely commercial launch timeline for SGP.32 and identify how this will positively impact the market for eSIM IoT devices.
- Understand the eSIM/eUICC and iSIM/iUICC adoption timelines to better gauge the potential impacts on the traditional removable Subscriber Identity Module (SIM) cards market.
- Understand the eSIM Integrated Circuit (IC) vendor landscape to help with strategic partnerships and to identify competitive threats.
Critical Questions Answered:
- What is the total market size for eSIM/eUICC and iSIM/iUICC in the consumer and M2M markets and what applications/device types will drive growth over the next 5 years?
- How will emerging embedded iSIM/iUICC form factors progress and, if at all, affect the traditional eSIM/eUICC hardware market?
- How will the convergence of eSIM and Embedded Secure Element (eSE) play out?
- What is the situation related to eSIM activation rates and how will activation rates progress over the next 5 years?
- Which handset vendor will move toward eSIM integration next?
- Who are the leading suppliers of eSIM ICs?
Research Highlights:
- SIM/eUICC device/application forecasts across consumer and M2M/IoT applications.
- eSIM/eUICC forecasts by form factor, covering standalone and combined eSIM/eSE datapoints.
- iSIM/iUICC forecasts by device type/application.
- Smartphone eSIM forecasts by select device Original Equipment Manufacturers (OEMs), including Apple, Samsung, Google, and Huawei.
- 1H 2018 to 1H 2024 eSIM IC vendor market shares.
Who Should Read This?
- Strategy planners within smart card, secure IC, M2M module, and other organizations reliant on cellular connectivity.
- Sales and marketing leaders looking to understand and benchmark organizational performance.
- Other ecosystem players working in strategy, sales, and marketing capacities, including module vendors looking to understand the Total Addressable Market (TAM) size.
TABLE OF CONTENTS
Tables
- Table 1 Total eSIM Shipments - Consumer Versus M2MIoT
- Table 2 Total eSIM Shipments by Application
- Table 3 Total RSP-Capable eSIM Shipments
- Table 4 eSIM Profile Downloads by Specification Type
- Table 5 eSIM Shipments by Form Factor
- Table 6 Total eSIM IC Shipments by Application
- Table 7 eSIM in the Consumer Market Shipments by Device Type
- Table 8 eSIM Smartphone Penetration
- Table 9 eSIM Smartphone Shipments by OEM
- Table 10 eSIM Wearable Device Penetration
- Table 11 eSIM Tablet Penetration
- Table 12 eSIM Laptop Penetration
- Table 13 eSIM in the Consumer Market IC Shipments by Application
- Table 14 eSIM Smartphone Shipments by Region
- Table 15 eSIM Apple Smartphone Shipments by Region
- Table 16 eSIM Samsung Smartphone Shipments by Region
- Table 17 eSIM Google Smartphone Shipments by Region
- Table 18 eSIM Other Smartphone Shipments by Region
- Table 19 eSIM Smartphone Shipments by OEM
- Table 20 eSIM Smartphone Shipments by OEM
- Table 21 eSIM Smartphone Shipments by OEM
- Table 22 eSIM Smartphone Shipments by OEM
- Table 23 eSIM Smartphone Shipments by OEM
- Table 24 Total M2MIoT eMFF SIM Shipments by Application
- Table 25 Total RSP-Capable M2MIoT eMFF Shipments by Application
- Table 26 Total RSP-Capable M2MIoT eMFF Shipments
- Table 27 eSIM M2MIoT IC Shipments by Application
- Table 28 eSIM IC Vendor Market Shares
- Table 29 iUICC Shipments - Consumer Versus M2MIoT
- Table 30 iUICC Shipments by Device TypeEnd Market
Charts
- Chart 1 eSIM in the Consumer Market Shipments by Device Type
- Chart 2 eSIM in the Consumer Market Shipment Penetration by Device Type
- Chart 3 eSIM Smartphone Shipments by OEM
- Chart 4 eSIM Smartphone Shipment Penetration by OEM
- Chart 5 Total M2MIoT eMFF SIM Shipments by Application
- Chart 6 Total RSP-Capable M2MIoT eMFF SIM Shipments
- Chart 7 eSIM IC Vendor Market Shares
- Chart 8 iUICC Shipments - Consumer Versus M2MIoT
- Chart 9 iUICC Shipments by Device TypeEnd Market