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Automotive Power Electronics Market By Device, By Application, By Drive Type : Global Opportunity Analysis and Industry Forecast, 2023-2032

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Automotive Power Electronics Market-IMG1

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  • Continental Aktiengesellschaft.
  • Danfoss A/S
  • BorgWarner Inc.
  • Denso Corporation
  • Infineon Technologies AG.
  • Mitsubishi Electric Corporation
  • NXP Semiconductors
  • Semiconductor Components Industries, LLC.
  • Renesas Electronics Corporation
  • Robert Bosch GmbH
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The Automotive Power Electronics Market is expected to experience a significant growth rate of 5.1% from 2023 to 2032 owing to rise in trend of electrification across the automotive domain and rising regulations for safety systems - Allied Market Research

Automotive Power Electronics Market - IMG1

At present, countries across the globe are focusing on shifting to greener and sustainable alternatives to conventional means of transportation. Electric vehicles fulfil all the requirements as they produce zero tailpipe emissions, which helps to improve air quality and reduce greenhouse gas emissions, which results in a cleaner and healthier environment. In addition, electric vehicles have lower operating costs than conventional internal combustion engine powered vehicles as electricity is less expensive than gasoline, and electric motors are more efficient than internal combustion engines.

These benefits make them an attractive option for consumers, businesses, and governments looking to reduce emissions and save on money. According to the findings of the International Energy Agency (IEA) from the Global EV Outlook, 2022, the sales of electric cars doubled in 2021 to a new record of 6.6 million. Such factors are expected to create ample demands for power electronics for use across automotive applications.

Moreover, the rise in trend of electrification across the automotive industry is expected to result in increased demands for automotive power electronics. In addition, rise in demand for high efficiency electronic components and rise in advancements in autonomous driving technologies are expected to open new market opportunities for the major players in the industry.

However, the manufacturing process of power electronics necessitates high infrastructure costs. This is due to the requirement of specialized equipment, materials, and production methods for the manufacturing of power electronics components. In addition, there is requirement of cleanroom facilities for manufacturing of power electronics. Such facilities are costly to build and maintain, and they often take up a lot of floor space. In addition, power electronics must undergo extensive testing and quality control to ensure that they work properly and dependably during operation. Specialized equipment and qualified specialists are necessary to carry out the testing and quality control activities. Such factors are expected to hinder the growth of the automotive power electronics market.

The automotive power electronics market is segmented into device, application, drive type, and region. By device, the market is bifurcated into power IC and module/discrete. By application, the market is classified into chassis & powertrain, safety & security system, infotainment & telematics, body electronics, and others. By drive type, the market is divided into ICE vehicle and electric vehicle. By region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA. The leading players that have been studied across the automotive power electronics market include BorgWarner Inc., Continental AG, Danfoss A/S, Denso Corporation, Infineon Technologies AG, Mitsubishi Electric Corporation, NXP Semiconductors, ON Semiconductors, Renesas Electronics Corporation and Robert Bosch. These companies hold a prominent share in the global automotive power electronics market due to their wider range of products for use across the automotive industry.

Key Benefits For Stakeholders

  • This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the automotive power electronics market analysis from 2022 to 2032 to identify the prevailing automotive power electronics market opportunities.
  • The market research is offered along with information related to key drivers, restraints, and opportunities.
  • Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
  • In-depth analysis of the automotive power electronics market segmentation assists to determine the prevailing market opportunities.
  • Major countries in each region are mapped according to their revenue contribution to the global market.
  • Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
  • The report includes the analysis of the regional as well as global automotive power electronics market trends, key players, market segments, application areas, and market growth strategies.

Key Market Segments

By Device

  • Power IC
  • Module/Discrete

By Application

  • Chassis and Powertrain
  • Safety and Security System
  • Infotainment and Telematics
  • Body Electronics
  • Others

By Drive Type

  • ICE Vehicle
  • Electric Vehicle

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

Key Market Players:

    • Danfoss A/S
    • Denso Corporation
    • Mitsubishi Electric Corporation
    • NXP Semiconductors
    • Continental Aktiengesellschaft.
    • Robert Bosch GmbH
    • BorgWarner Inc.
    • Semiconductor Components Industries, LLC.
    • Renesas Electronics Corporation
    • Infineon Technologies AG.

TABLE OF CONTENTS

CHAPTER 1: INTRODUCTION

  • 1.1. Report description
  • 1.2. Key market segments
  • 1.3. Key benefits to the stakeholders
  • 1.4. Research Methodology
    • 1.4.1. Primary research
    • 1.4.2. Secondary research
    • 1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

  • 2.1. CXO Perspective

CHAPTER 3: MARKET OVERVIEW

  • 3.1. Market definition and scope
  • 3.2. Key findings
    • 3.2.1. Top impacting factors
    • 3.2.2. Top investment pockets
  • 3.3. Porter's five forces analysis
    • 3.3.1. Low bargaining power of suppliers
    • 3.3.2. Low threat of new entrants
    • 3.3.3. Low threat of substitutes
    • 3.3.4. Low intensity of rivalry
    • 3.3.5. Low bargaining power of buyers
  • 3.4. Market dynamics
    • 3.4.1. Drivers
      • 3.4.1.1. Rise in demands for electric vehicles
      • 3.4.1.2. Increasing trend for electrification across the automotive industry
      • 3.4.1.3. Government regulations for vehicle safety systems
    • 3.4.2. Restraints
      • 3.4.2.1. High investment cost
      • 3.4.2.2. High infrastructure requirement
    • 3.4.3. Opportunities
      • 3.4.3.1. Rise in demand for high efficiency electronic components
      • 3.4.3.2. Rise in advancements in autonomous driving technologies
      • 3.4.3.3. Rise in demands for connected cars
  • 3.5. COVID-19 Impact Analysis on the market

CHAPTER 4: AUTOMOTIVE POWER ELECTRONICS MARKET, BY DEVICE

  • 4.1. Overview
    • 4.1.1. Market size and forecast
  • 4.2. Power IC
    • 4.2.1. Key market trends, growth factors and opportunities
    • 4.2.2. Market size and forecast, by region
    • 4.2.3. Market share analysis by country
  • 4.3. Module/Discrete
    • 4.3.1. Key market trends, growth factors and opportunities
    • 4.3.2. Market size and forecast, by region
    • 4.3.3. Market share analysis by country

CHAPTER 5: AUTOMOTIVE POWER ELECTRONICS MARKET, BY APPLICATION

  • 5.1. Overview
    • 5.1.1. Market size and forecast
  • 5.2. Chassis and Powertrain
    • 5.2.1. Key market trends, growth factors and opportunities
    • 5.2.2. Market size and forecast, by region
    • 5.2.3. Market share analysis by country
  • 5.3. Safety and Security System
    • 5.3.1. Key market trends, growth factors and opportunities
    • 5.3.2. Market size and forecast, by region
    • 5.3.3. Market share analysis by country
  • 5.4. Infotainment and Telematics
    • 5.4.1. Key market trends, growth factors and opportunities
    • 5.4.2. Market size and forecast, by region
    • 5.4.3. Market share analysis by country
  • 5.5. Body Electronics
    • 5.5.1. Key market trends, growth factors and opportunities
    • 5.5.2. Market size and forecast, by region
    • 5.5.3. Market share analysis by country
  • 5.6. Others
    • 5.6.1. Key market trends, growth factors and opportunities
    • 5.6.2. Market size and forecast, by region
    • 5.6.3. Market share analysis by country

CHAPTER 6: AUTOMOTIVE POWER ELECTRONICS MARKET, BY DRIVE TYPE

  • 6.1. Overview
    • 6.1.1. Market size and forecast
  • 6.2. ICE Vehicle
    • 6.2.1. Key market trends, growth factors and opportunities
    • 6.2.2. Market size and forecast, by region
    • 6.2.3. Market share analysis by country
  • 6.3. Electric Vehicle
    • 6.3.1. Key market trends, growth factors and opportunities
    • 6.3.2. Market size and forecast, by region
    • 6.3.3. Market share analysis by country

CHAPTER 7: AUTOMOTIVE POWER ELECTRONICS MARKET, BY REGION

  • 7.1. Overview
    • 7.1.1. Market size and forecast By Region
  • 7.2. North America
    • 7.2.1. Key trends and opportunities
    • 7.2.2. Market size and forecast, by Device
    • 7.2.3. Market size and forecast, by Application
    • 7.2.4. Market size and forecast, by Drive Type
    • 7.2.5. Market size and forecast, by country
      • 7.2.5.1. U.S.
      • 7.2.5.1.1. Key market trends, growth factors and opportunities
      • 7.2.5.1.2. Market size and forecast, by Device
      • 7.2.5.1.3. Market size and forecast, by Application
      • 7.2.5.1.4. Market size and forecast, by Drive Type
      • 7.2.5.2. Canada
      • 7.2.5.2.1. Key market trends, growth factors and opportunities
      • 7.2.5.2.2. Market size and forecast, by Device
      • 7.2.5.2.3. Market size and forecast, by Application
      • 7.2.5.2.4. Market size and forecast, by Drive Type
      • 7.2.5.3. Mexico
      • 7.2.5.3.1. Key market trends, growth factors and opportunities
      • 7.2.5.3.2. Market size and forecast, by Device
      • 7.2.5.3.3. Market size and forecast, by Application
      • 7.2.5.3.4. Market size and forecast, by Drive Type
  • 7.3. Europe
    • 7.3.1. Key trends and opportunities
    • 7.3.2. Market size and forecast, by Device
    • 7.3.3. Market size and forecast, by Application
    • 7.3.4. Market size and forecast, by Drive Type
    • 7.3.5. Market size and forecast, by country
      • 7.3.5.1. UK
      • 7.3.5.1.1. Key market trends, growth factors and opportunities
      • 7.3.5.1.2. Market size and forecast, by Device
      • 7.3.5.1.3. Market size and forecast, by Application
      • 7.3.5.1.4. Market size and forecast, by Drive Type
      • 7.3.5.2. Germany
      • 7.3.5.2.1. Key market trends, growth factors and opportunities
      • 7.3.5.2.2. Market size and forecast, by Device
      • 7.3.5.2.3. Market size and forecast, by Application
      • 7.3.5.2.4. Market size and forecast, by Drive Type
      • 7.3.5.3. France
      • 7.3.5.3.1. Key market trends, growth factors and opportunities
      • 7.3.5.3.2. Market size and forecast, by Device
      • 7.3.5.3.3. Market size and forecast, by Application
      • 7.3.5.3.4. Market size and forecast, by Drive Type
      • 7.3.5.4. Italy
      • 7.3.5.4.1. Key market trends, growth factors and opportunities
      • 7.3.5.4.2. Market size and forecast, by Device
      • 7.3.5.4.3. Market size and forecast, by Application
      • 7.3.5.4.4. Market size and forecast, by Drive Type
      • 7.3.5.5. Rest of Europe
      • 7.3.5.5.1. Key market trends, growth factors and opportunities
      • 7.3.5.5.2. Market size and forecast, by Device
      • 7.3.5.5.3. Market size and forecast, by Application
      • 7.3.5.5.4. Market size and forecast, by Drive Type
  • 7.4. Asia-Pacific
    • 7.4.1. Key trends and opportunities
    • 7.4.2. Market size and forecast, by Device
    • 7.4.3. Market size and forecast, by Application
    • 7.4.4. Market size and forecast, by Drive Type
    • 7.4.5. Market size and forecast, by country
      • 7.4.5.1. China
      • 7.4.5.1.1. Key market trends, growth factors and opportunities
      • 7.4.5.1.2. Market size and forecast, by Device
      • 7.4.5.1.3. Market size and forecast, by Application
      • 7.4.5.1.4. Market size and forecast, by Drive Type
      • 7.4.5.2. Japan
      • 7.4.5.2.1. Key market trends, growth factors and opportunities
      • 7.4.5.2.2. Market size and forecast, by Device
      • 7.4.5.2.3. Market size and forecast, by Application
      • 7.4.5.2.4. Market size and forecast, by Drive Type
      • 7.4.5.3. India
      • 7.4.5.3.1. Key market trends, growth factors and opportunities
      • 7.4.5.3.2. Market size and forecast, by Device
      • 7.4.5.3.3. Market size and forecast, by Application
      • 7.4.5.3.4. Market size and forecast, by Drive Type
      • 7.4.5.4. South Korea
      • 7.4.5.4.1. Key market trends, growth factors and opportunities
      • 7.4.5.4.2. Market size and forecast, by Device
      • 7.4.5.4.3. Market size and forecast, by Application
      • 7.4.5.4.4. Market size and forecast, by Drive Type
      • 7.4.5.5. Rest of Asia-Pacific
      • 7.4.5.5.1. Key market trends, growth factors and opportunities
      • 7.4.5.5.2. Market size and forecast, by Device
      • 7.4.5.5.3. Market size and forecast, by Application
      • 7.4.5.5.4. Market size and forecast, by Drive Type
  • 7.5. LAMEA
    • 7.5.1. Key trends and opportunities
    • 7.5.2. Market size and forecast, by Device
    • 7.5.3. Market size and forecast, by Application
    • 7.5.4. Market size and forecast, by Drive Type
    • 7.5.5. Market size and forecast, by country
      • 7.5.5.1. Latin America
      • 7.5.5.1.1. Key market trends, growth factors and opportunities
      • 7.5.5.1.2. Market size and forecast, by Device
      • 7.5.5.1.3. Market size and forecast, by Application
      • 7.5.5.1.4. Market size and forecast, by Drive Type
      • 7.5.5.2. Middle East
      • 7.5.5.2.1. Key market trends, growth factors and opportunities
      • 7.5.5.2.2. Market size and forecast, by Device
      • 7.5.5.2.3. Market size and forecast, by Application
      • 7.5.5.2.4. Market size and forecast, by Drive Type
      • 7.5.5.3. Africa
      • 7.5.5.3.1. Key market trends, growth factors and opportunities
      • 7.5.5.3.2. Market size and forecast, by Device
      • 7.5.5.3.3. Market size and forecast, by Application
      • 7.5.5.3.4. Market size and forecast, by Drive Type

CHAPTER 8: COMPETITIVE LANDSCAPE

  • 8.1. Introduction
  • 8.2. Top winning strategies
  • 8.3. Product Mapping of Top 10 Player
  • 8.4. Competitive Dashboard
  • 8.5. Competitive Heatmap
  • 8.6. Top player positioning, 2022

CHAPTER 9: COMPANY PROFILES

  • 9.1. Continental Aktiengesellschaft.
    • 9.1.1. Company overview
    • 9.1.2. Key Executives
    • 9.1.3. Company snapshot
    • 9.1.4. Operating business segments
    • 9.1.5. Product portfolio
    • 9.1.6. Business performance
  • 9.2. Danfoss A/S
    • 9.2.1. Company overview
    • 9.2.2. Key Executives
    • 9.2.3. Company snapshot
    • 9.2.4. Operating business segments
    • 9.2.5. Product portfolio
    • 9.2.6. Business performance
    • 9.2.7. Key strategic moves and developments
  • 9.3. BorgWarner Inc.
    • 9.3.1. Company overview
    • 9.3.2. Key Executives
    • 9.3.3. Company snapshot
    • 9.3.4. Operating business segments
    • 9.3.5. Product portfolio
    • 9.3.6. Business performance
    • 9.3.7. Key strategic moves and developments
  • 9.4. Denso Corporation
    • 9.4.1. Company overview
    • 9.4.2. Key Executives
    • 9.4.3. Company snapshot
    • 9.4.4. Operating business segments
    • 9.4.5. Product portfolio
    • 9.4.6. Business performance
    • 9.4.7. Key strategic moves and developments
  • 9.5. Infineon Technologies AG.
    • 9.5.1. Company overview
    • 9.5.2. Key Executives
    • 9.5.3. Company snapshot
    • 9.5.4. Operating business segments
    • 9.5.5. Product portfolio
    • 9.5.6. Business performance
    • 9.5.7. Key strategic moves and developments
  • 9.6. Mitsubishi Electric Corporation
    • 9.6.1. Company overview
    • 9.6.2. Key Executives
    • 9.6.3. Company snapshot
    • 9.6.4. Operating business segments
    • 9.6.5. Product portfolio
    • 9.6.6. Business performance
    • 9.6.7. Key strategic moves and developments
  • 9.7. NXP Semiconductors
    • 9.7.1. Company overview
    • 9.7.2. Key Executives
    • 9.7.3. Company snapshot
    • 9.7.4. Operating business segments
    • 9.7.5. Product portfolio
    • 9.7.6. Business performance
    • 9.7.7. Key strategic moves and developments
  • 9.8. Semiconductor Components Industries, LLC.
    • 9.8.1. Company overview
    • 9.8.2. Key Executives
    • 9.8.3. Company snapshot
    • 9.8.4. Operating business segments
    • 9.8.5. Product portfolio
    • 9.8.6. Business performance
    • 9.8.7. Key strategic moves and developments
  • 9.9. Renesas Electronics Corporation
    • 9.9.1. Company overview
    • 9.9.2. Key Executives
    • 9.9.3. Company snapshot
    • 9.9.4. Operating business segments
    • 9.9.5. Product portfolio
    • 9.9.6. Business performance
    • 9.9.7. Key strategic moves and developments
  • 9.10. Robert Bosch GmbH
    • 9.10.1. Company overview
    • 9.10.2. Key Executives
    • 9.10.3. Company snapshot
    • 9.10.4. Operating business segments
    • 9.10.5. Product portfolio
    • 9.10.6. Business performance
    • 9.10.7. Key strategic moves and developments
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