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Semiconductor Machinery Manufacturing: Global Markets

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  • APPLIED MATERIALS INC.
  • ASM INTERNATIONAL N.V.
  • ASML
  • CANON INC.
  • DISCO CORP.
  • ENTEGRIS INC.
  • HITACHI LTD.
  • KLA CORP.
  • KULICKE AND SOFFA INDUSTRIES INC.
  • LAM RESEARCH CORP.
  • NIKON CORP.
  • SCREEN HOLDINGS CO. LTD.
  • TERADYNE INC.
  • TOKYO ELECTRON LTD.
KSA 24.06.04

The global market for semiconductor machinery manufacturing is expected to grow from $121.5 billion in 2024 and is projected to reach $223.8 billion by the end of 2029, at a compound annual growth rate (CAGR) of 13.0% during the forecast period of 2024 to 2029.

The global market for semiconductor machinery manufacturing for logic IC applications is expected to grow from $42.9 billion in 2024 and is projected to reach $82.3 billion by the end of 2029, at a CAGR of 13.9% during the forecast period of 2024 to 2029.

The global market for semiconductor machinery manufacturing for memory IC applications is expected to grow from $28.3 billion in 2024 and is projected to reach $56.9 billion by the end of 2029, at a CAGR of 15.0% during the forecast period of 2024 to 2029.

Report Scope

This report provides an overview of the global market for semiconductor machinery manufacturing and an analysis of market trends, updating the previous version of the report, which came out in 2018. Using 2023 as the base year, the report provides estimated market data for the forecast period 2024 through 2029. Revenue forecasts are segmented by equipment type, application and geographic region. In this report, the global market consists of four regions: North America, Europe, Asia-Pacific and the Rest of the World (RoW). The report covers emerging technologies and the current competitive landscape, and concludes with profiles of the major players in the market.

Note: ICs, which come in dimensions such as 2D, 2.5D and 3D, are built on semiconductor machinery; however, the scope of this report does not include a market breakdown by IC dimension, as some equipment is exclusive to either 2D or 3D IC production and some are not. Primary interviews with industry experts confirmed the possibility of overlap in equipment used for each IC dimension.

Report Includes

  • 29 data tables and 54 additional tables
  • An overview of the global market for semiconductor machinery manufacturing
  • Analysis of global market trends, featuring revenue data for 2023, estimated figures for 2024, forecasts for 2025, 2026, 2029 and projected CAGRs through 2029
  • Evaluation of the current market size and revenue growth prospects, along with a market share analysis by equipment type, application, and region
  • Coverage of the history and development of semiconductor machinery, a life cycle assessment, and the value chain processes for semiconductor machinery manufacturing
  • An assessment of market dynamics and factors and recent innovations affecting the market
  • Identification of the market segments with the highest growth potential
  • Discussion of the major manufacturers in each region
  • Profiles of leading market participants, including ASML Holding N.V., Applied Materials, Inc., Lam Research Corp., Tokyo Electron Ltd., and KLA Corp.

Table of Contents

Chapter 1 Executive Summary

  • Market Outlook
  • Scope of Report
  • Market Summary

Chapter 2 Market Overview

  • Current Market Scenario
  • Macro-economic Factors
  • Ongoing Ukraine-Russia War
  • Water Shortage in Taiwan
  • Shifting Regulations and Global Investments
  • Impact of the U.S.-China Trade War
  • Porter's Five Forces Model

Chapter 3 Market Dynamics

  • Overview
  • Market Drivers
  • Spending on Fabrication Equipment
  • Electrification of Vehicles and Industrial Equipment
  • Proliferation of AI, IoT, 5G and AR/VR
  • Market Restraints
  • Complexity and High Costs of Semiconductor Fabrication
  • Complexity and Reduced Yields of Semiconductor Manufacturing
  • Market Opportunities
  • Evolution of Chip Packaging
  • Growing Government Efforts to Boost Semiconductor Manufacturing

Chapter 4 Emerging Technologies and Developments

  • Emerging Technologies and Trends
  • Technological Advances and New Products
  • Green and Sustainable Chemical Vapor Deposition (CVD)
  • More Complex Designs and Advanced Manufacturing Techniques
  • AI and Machine Learning in Semiconductor Manufacturing
  • Patent Analysis

Chapter 5 Market Segmentation Analysis

  • Segmentation Breakdown
  • Market Breakdown by Equipment Type
  • Wafer Fabrication Equipment
  • Test Equipment
  • Assembly and Packaging
  • Market Breakdown by Application
  • Logic
  • Memory
  • Other Applications
  • Geographic Breakdown
  • Market Breakdown by Region
  • North America
  • Europe
  • Asia-Pacific
  • Rest of the World

Chapter 6 Competitive Intelligence

  • Overview
  • Market Rankings
  • Strategic Analysis

Chapter 7 Sustainability in the Semiconductor Machinery Manufacturing Industry: An ESG Perspective

  • ESG Issues
  • Greenhouse Gas Emissions and Energy Consumption
  • Employee Health and Safety
  • Diversity and Equal Opportunity
  • Ethical Sourcing
  • ESG Performance Analysis
  • Environmental Performance
  • Social Performance
  • Governance Performance
  • Current Status of ESG
  • ESG Practices in the Industry
  • Concluding Remarks from BCC

Chapter 8 Appendix

  • Methodology
  • Abbreviations
  • References
  • Company Profiles
  • ADVANTEST CORP.
  • APPLIED MATERIALS INC.
  • ASM INTERNATIONAL N.V.
  • ASML
  • CANON INC.
  • DISCO CORP.
  • ENTEGRIS INC.
  • HITACHI LTD.
  • KLA CORP.
  • KULICKE AND SOFFA INDUSTRIES INC.
  • LAM RESEARCH CORP.
  • NIKON CORP.
  • SCREEN HOLDINGS CO. LTD.
  • TERADYNE INC.
  • TOKYO ELECTRON LTD.
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