세계의 칩렛 시장

This report assesses the chiplets market by processor, packaging technology, end-user, and regions. It also analyzes related companies and service providers. The report also discusses market dynamics, such as drivers, opportunities, and restraints. The study forecasts the market value ($ million) of chiplets for key geographies. The report also focuses on the key emerging technologies that will fuel their adoption in the near future.

Report Scope

This report offers a comprehensive analysis of chiplets, with a focus on five processor segments: CPUs, GPUs, field-programmable gate arrays (FPGAs), AI-application-specific integrated circuit (AI-ASIC) coprocessors and application processing units (APUs). The report further segments the market by packaging technology, specifically 2.5D/3D, system-in-package (SiP), wafer-level chip-scale package (WLCSP), flip chip chip-scale package (FCCSP), flip chip ball grid array (FCBGA) and fan-out (FO). In addition, the chiplet market is segmented by end users: enterprise electronics, consumer electronics, industrial automation, automotive, healthcare, military and aerospace. The use of chiplets in other sectors, such as IT and telecommunication, scientific research and gaming, is also analyzed. Regions covered include North America, Europe, Asia-Pacific and the rest of the world (RoW), which includes Latin America, the Middle East and Africa.

The study also analyzes the key drivers, macroeconomic factors and regional dynamics of the chiplet market. The report concludes by providing profiles of the leading chiplet manufacturers. The base year for the study is 2023, with market forecasts for 2024 through 2029, including projections of the compound annual growth rates (CAGRs) for the forecast period 2024-2029.

Report Includes

• In-depth assessment of the global market for semiconductor chiplets
• Analyses of global market trends, with market revenue data for 2023, estimates for 2024, forecasts for 2025 and 2027, and projected CAGRs through 2029
• Estimates of the market size and revenue growth prospects, along with a market share analysis by processor type, packaging technology, end use (application) industry and region
• Facts and figures pertaining to the market dynamics, technical advances, regulations, and the impact of macroeconomic factors
• Analysis of the industry structure, including companies' market shares and rankings, strategic alliances, M&A activities, and a venture funding outlook
• Company profiles

Table of Contents

Chapter 1 Executive Summary

• Market Outlook
• Scope of the Report
• Market Summary

Chapter 2 Market Overview

• Overview
• Macroeconomic Factors
• Advanced Packaging Technologies
• Geopolitical Tensions
• Outlook

Chapter 3 Market Dynamics

• Overview
• Market Drivers
• High-Performance Computing
• 5G's Growing Need for Chiplets
• Market Restraints/Challenges
• Shortage of Skilled Labor
• Global Political and Financial Crises
• Market Opportunities
• Continuing Investment in the Semiconductor Industry
• Use in Advanced Driver-Assistance Systems (ADAS)

Chapter 4 Regulatory Landscape

• Overview
• North America
• Asia-Pacific
• Europe
• RoW

Chapter 5 Emerging Technologies

• Emerging Technologies
• Heterogeneous Integration
• 3D Integration
• Advanced Packaging
• Co-Packaged Optics
• Chiplet-Based Systems-on-Chip

Chapter 6 Market Segmentation Analysis

• Segmentation Breakdown
• Market Breakdown by Processor
• CPUs
• Graphics Processing Units
• Field-Programmable Gate Arrays
• AI-ASIC Coprocessors
• Application Processing Units
• Market Breakdown by Packaging Technology
• 2.5D/3D
• System-in-Package
• Wafer-Level Chip-Scale Packaging
• Flip Chip Chip-Scale Package
• Flip Chip Ball Grid Array
• Fan-Out
• Market Breakdown by End-User Industry
• Enterprise Electronics
• Consumer Electronics
• Industrial Automation
• Automotive
• Healthcare
• Military and Aerospace
• Other End-User Industries
• Geographical Breakdown
• Market Breakdown by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World

Chapter 7 Competitive Landscape

• Market Ecosystem Analysis
• Analysis of Leading Companies
• Strategic Analysis
• Recent Developments

Chapter 8 Appendix

• Research Methodology
• References
• Abbreviations
• Company Profiles
• ACHRONIX SEMICONDUCTOR CORP.
• ADVANCED MICRO DEVICES INC.
• BROADCOM
• GLOBALFOUNDRIES INC.
• IBM CORP.
• INTEL CORP.
• NVIDIA CORP.
• RANOVUS
• SAMSUNG
• TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.