세계의 칩렛 시장 : 프로세서별, 패키징 기술별 예측(-2030년)

The chiplet market is projected to reach USD 157.23 billion by 2030 from USD 51.94 billion in 2025, at a CAGR of 24.8% during the forecast period.

The chiplet market is driven by the increasing demand for high-performance, power-efficient, and cost-effective semiconductor solutions in AI, data center, and HPC applications. Its modular design enables faster development cycles and better scalability compared to traditional monolithic chips. However, the market faces challenges such as complex design integration, interoperability issues, and high initial development costs. Additionally, the absence of standardized interfaces among chiplets from different vendors limits broader ecosystem adoption.

"AI ASIC coprocessor segment of chiplet market to witness high growth during forecast period."

The AI ASIC processor segment is expected to record the highest growth rate during the forecast period due to increasing demand for specialized hardware optimized for AI and machine learning workloads. These processors provide superior performance, lower latency, and greater energy efficiency compared to general-purpose CPUs or GPUs. The growing use of AI in data centers, autonomous systems, and edge devices is further speeding up their adoption. Additionally, advancements in chiplet-based AI ASIC designs are allowing for better scalability and quicker delivery of AI-driven applications.

"Enterprise electronics segment will hold the largest share in the chiplet market during the forecast period."

The enterprise sector is expected to significantly drive the chiplet market as organizations increasingly adopt high-performance computing and AI-driven solutions for data analytics, cloud services, and automation. Enterprises need scalable, energy-efficient processors to manage complex workloads, making chiplet-based architectures an ideal choice. The modularity of chiplets allows for customized computing solutions tailored to specific enterprise needs, boosting performance and cost efficiency. Growing investments in data centers, digital transformation, and edge computing further increase demand. Additionally, leading tech companies are utilizing chiplet designs to accelerate innovation and optimize infrastructure performance, fueling market growth.

"China is expected to witness the fastest growth in the chiplet market during the forecast period."

Asia Pacific is expected to dominate the chiplet market during the forecast period. China is predicted to hold the largest share within the Asia Pacific chiplet market due to its rapidly growing semiconductor manufacturing and packaging ecosystem. The country is heavily investing in domestic chip production through government initiatives like the "Made in China 2025" plan to reduce reliance on foreign technologies. Major Chinese companies are increasingly adopting chiplet architectures to improve computing performance and design flexibility for AI, 5G, and consumer electronics applications. A strong electronics supply chain and high consumer demand further support market growth. Additionally, partnerships between Chinese foundries and global semiconductor firms are speeding up technology adoption and expanding production capacity.

Extensive primary interviews were conducted with key industry experts in the chiplet market to determine and verify the market size for various segments and subsegments gathered through secondary research. The breakdown of primary participants for the report is shown below:

By Company Type: Tier 1 - 50%, Tier 2 - 30%, and Tier 3 - 20%

By Designation: C Level - 20%, Director Level - 50%, Others-30%

By Region: North America - 30%, Europe - 20%, Asia Pacific - 40%, ROW- 10%

The report highlights key players in the chiplet market along with their market rankings. Prominent companies profiled include Intel Corporation (US), Advanced Micro Devices, Inc. (US), Apple Inc. (US), IBM (US), Marvell (US), MediaTek Inc. (Taiwan), NVIDIA Corporation (US), Achronix Semiconductor Corporation (US), Ranovus (Canada), and ASE Technology Holding Co., Ltd. (Taiwan).

Besides these, Netronome (US), Cadence Design Systems, Inc. (US), and Synopsys, Inc. (US), SiFive, Inc. (US), ALPHAWAVE SEMI (UK), Eliyan (US), Ayar Labs, Inc. (US), Tachyum (US), X-Celeprint (Ireland), Kandou Bus SA (Switzerland), NHanced Semiconductors (US), Tenstorrent (Canada), Chipuller (China), and Rain Neuromorphics (US) are among the emerging companies in the chiplet market.

Research Coverage:

This research report classifies the chiplet market based on processor type, packaging technology, end-use application, and region. It outlines the major drivers, restraints, challenges, and opportunities related to the chiplet market and provides forecasts through 2030. Additionally, the report includes leadership mapping and analysis of all the companies involved in the chiplet ecosystem.

Reason to Buy This Report

The report will assist market leaders and new entrants by providing approximate revenue figures for the overall chiplet market and its subsegments. It will help stakeholders understand the competitive landscape, gain insights to better position their businesses, and develop effective go-to-market strategies. Additionally, the report offers stakeholders an understanding of market trends and key factors such as drivers, restraints, challenges, and opportunities.

The report provides insights on the following pointers:

• Analysis of key drivers (adoption of high-performance computing servers in various sectors, proliferation of data centers worldwide, adoption of advanced packaging technologies), restraints (heat management issues, lack of industry-wide interoperability standards), opportunities (development of quantum chiplets, rapid expansion of 5G infrastructure, rising incorporation of high-performance and power-efficient chiplets in medical devices, adoption of chiplets in AI and edge computing applications, increasing investments in autonomous vehicles) and challenges (challenges related to intellectual property (IP) protection and licensing, cybersecurity and vulnerability issues associated with chiplet-based systems) influencing the growth of the chiplet market.
• Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product & service launches in the chiplet market
• Market Development: Comprehensive information about lucrative markets - the report analyzes the chiplet market across varied regions
• Market Diversification: Exhaustive information about new products & services, untapped geographies, recent developments, and investments in the chiplet market
• Competitive Assessment: In-depth assessment of market share, growth strategies and service offerings of leading players such as Intel Corporation (US), Advanced Micro Devices, Inc. (US), Apple Inc. (US), IBM (US), and Marvell (US), among others in the chiplet market

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 STUDY OBJECTIVES
• 1.2 MARKET DEFINITION
• 1.3 STUDY SCOPE
  • 1.3.1 MARKETS COVERED AND REGIONAL SCOPE
  • 1.3.2 INCLUSIONS AND EXCLUSIONS
  • 1.3.3 YEARS CONSIDERED
• 1.4 CURRENCY CONSIDERED
• 1.5 UNIT CONSIDERED
• 1.6 LIMITATIONS
• 1.7 STAKEHOLDERS
• 1.8 SUMMARY OF CHANGES

2 RESEARCH METHODOLOGY

• 2.1 RESEARCH DATA
  • 2.1.1 SECONDARY DATA
    • 2.1.1.1 List of major secondary sources
    • 2.1.1.2 Key data from secondary sources
  • 2.1.2 PRIMARY DATA
    • 2.1.2.1 List of key interview participants
    • 2.1.2.2 Key data from primary sources
    • 2.1.2.3 Key industry insights
    • 2.1.2.4 Breakdown of primaries
  • 2.1.3 SECONDARY AND PRIMARY RESEARCH
• 2.2 MARKET SIZE ESTIMATION METHODOLOGY
  • 2.2.1 BOTTOM-UP APPROACH
    • 2.2.1.1 Approach to estimate market size using bottom-up analysis (demand side)
  • 2.2.2 TOP-DOWN APPROACH
    • 2.2.2.1 Approach to estimate market size using top-down analysis (supply side)
    • 2.2.2.2 Supply-side analysis
• 2.3 DATA TRIANGULATION
• 2.4 RESEARCH ASSUMPTIONS
• 2.5 RISK ASSESSMENT
• 2.6 RESEARCH LIMITATIONS

3 EXECUTIVE SUMMARY

4 PREMIUM INSIGHTS

• 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN CHIPLET MARKET
• 4.2 CHIPLET MARKET, BY PROCESSOR
• 4.3 CHIPLET MARKET, BY PACKAGING TECHNOLOGY AND END-USE APPLICATION
• 4.4 CHIPLET MARKET, BY COUNTRY

5 MARKET OVERVIEW

• 5.1 INTRODUCTION
• 5.2 MARKET DYNAMICS
  • 5.2.1 DRIVERS
    • 5.2.1.1 Adoption of HPC servers in various sectors
    • 5.2.1.2 Increasing number of data centers
    • 5.2.1.3 Transition to advanced packaging technologies
  • 5.2.2 RESTRAINTS
    • 5.2.2.1 Heat management issues
    • 5.2.2.2 Lack of industry-wide interoperability standards
  • 5.2.3 OPPORTUNITIES
    • 5.2.3.1 Development of quantum chiplets
    • 5.2.3.2 Rapid expansion of 5G infrastructure
    • 5.2.3.3 Rising incorporation of high-performance and power-efficient chiplets into medical devices
    • 5.2.3.4 Adoption of chiplets in AI and edge computing applications
    • 5.2.3.5 Increasing investments in autonomous vehicles
  • 5.2.4 CHALLENGES
    • 5.2.4.1 Challenges related to IP protection and licensing
    • 5.2.4.2 Cybersecurity and vulnerability issues associated with chiplet-based systems
• 5.3 TECHNOLOGY ANALYSIS
  • 5.3.1 KEY TECHNOLOGIES
    • 5.3.1.1 Heterogeneous integration via chiplets
  • 5.3.2 COMPLEMENTARY TECHNOLOGIES
    • 5.3.2.1 SoIC-COW
    • 5.3.2.2 Infinity architecture
  • 5.3.3 ADJACENT TECHNOLOGIES
    • 5.3.3.1 FDX FD-SOI
• 5.4 VALUE CHAIN ANALYSIS
• 5.5 ECOSYSTEM MAPPING
• 5.6 INVESTMENT AND FUNDING SCENARIO
• 5.7 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
• 5.8 PORTER'S FIVE FORCES ANALYSIS
  • 5.8.1 THREAT OF NEW ENTRANTS
  • 5.8.2 THREAT OF SUBSTITUTES
  • 5.8.3 BARGAINING POWER OF SUPPLIERS
  • 5.8.4 BARGAINING POWER OF BUYERS
  • 5.8.5 INTENSITY OF COMPETITIVE RIVALRY
• 5.9 PRICING ANALYSIS
  • 5.9.1 AVERAGE SELLING PRICE OF PROCESSORS, BY KEY PLAYER, 2024
  • 5.9.2 AVERAGE SELLING PRICE TREND OF GPUS, BY REGION, 2021-2024
• 5.10 CASE STUDY ANALYSIS
  • 5.10.1 INTEL AND SIEMENS HEALTHINEERS DEVELOPED STATE-OF-THE-ART AI-POWERED IMAGING SOLUTIONS USING CHIPLETS
  • 5.10.2 ACHRONIX'S EMBEDDED FPGAS (EFPGAS) EMPOWERED HETEROGENEOUS CHIPLET INTEGRATION
  • 5.10.3 ELIYAN PARTNERED WITH TMSC TO ADVANCE CHIPLET INTEGRATION
• 5.11 TRADE ANALYSIS
• 5.12 STANDARDS AND REGULATORY LANDSCAPE
  • 5.12.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • 5.12.2 STANDARDS
  • 5.12.3 REGULATIONS
• 5.13 PATENT ANALYSIS
• 5.14 KEY CONFERENCES AND EVENTS, 2025-2026
• 5.15 KEY STAKEHOLDERS AND BUYING CRITERIA
  • 5.15.1 KEY STAKEHOLDERS IN BUYING PROCESS
  • 5.15.2 BUYING CRITERIA
• 5.16 IMPACT OF AI/GEN AI ON CHIPLET MARKET
• 5.17 IMPACT OF 2025 US TARIFF ON CHIPLET MARKET
  • 5.17.1 INTRODUCTION
  • 5.17.2 KEY TARIFF RATES
  • 5.17.3 PRICE IMPACT ANALYSIS
  • 5.17.4 IMPACT ON COUNTRIES/REGIONS
    • 5.17.4.1 US
    • 5.17.4.2 Europe
    • 5.17.4.3 Asia Pacific
  • 5.17.5 IMPACT ON END-USE APPLICATIONS

6 CHIPLET MARKET, BY END-USE APPLICATION

• 6.1 INTRODUCTION
• 6.2 ENTERPRISE ELECTRONICS
  • 6.2.1 INCREASING DEMAND FOR ENERGY EFFICIENCY IN ORGANIZATIONAL OPERATIONS TO DRIVE SEGMENTAL GROWTH
• 6.3 CONSUMER ELECTRONICS
  • 6.3.1 RAPID TRANSITION TO DIGITAL ELECTRONICS TO DRIVE MARKET
• 6.4 AUTOMOTIVE
  • 6.4.1 EMPHASIS ON ENHANCING VEHICLE SAFETY TO FOSTER MARKET GROWTH
• 6.5 INDUSTRIAL AUTOMATION
  • 6.5.1 IMPLEMENTATION OF INDUSTRY 4.0 TECHNOLOGIES TO FUEL MARKET GROWTH
• 6.6 HEALTHCARE
  • 6.6.1 EVOLUTION OF PERSONALIZED MEDICINE TO OFFER GROWTH OPPORTUNITIES
• 6.7 MILITARY & AEROSPACE
  • 6.7.1 ABILITY TO FUNCTION EFFICIENTLY IN HARSH CONDITIONS TO BOOST DEMAND
• 6.8 OTHER END-USE APPLICATIONS

7 CHIPLET MARKET, BY PACKAGING TECHNOLOGY

• 7.1 INTRODUCTION
• 7.2 SYSTEM-IN-PACKAGE (SIP)
  • 7.2.1 GROWING APPLICATION IN CONSUMER ELECTRONICS, AUTOMOTIVE, HEALTHCARE, AND INDUSTRIAL IOT TO DRIVE MARKET
• 7.3 FLIP CHIP CHIP SCALE PACKAGE (FCCSP)
  • 7.3.1 IMPROVED ELECTRICAL AND THERMAL PERFORMANCE TO BOOST DEMAND
• 7.4 FLIP CHIP BALL GRID ARRAY (FCBGA)
  • 7.4.1 ABILITY TO DISSIPATE HEAT EFFICIENTLY TO FUEL MARKET GROWTH
• 7.5 2.5D/3D
  • 7.5.1 ABILITY TO INTEGRATE MULTIPLE ICS INTO SINGLE PACKAGE TO DRIVE MARKET
• 7.6 WAFER-LEVEL CHIP-SCALE PACKAGE (WLCSP)
  • 7.6.1 ENHANCED PERFORMANCE WITH SHORTER INTERCONNECTS, AND COST-EFFECTIVENESS TO FUEL MARKET GROWTH
• 7.7 FAN-OUT (FO)
  • 7.7.1 SIMPLIFIED INTEGRATION OF SENSORS AND RF COMPONENTS TO FOSTER MARKET GROWTH

8 CHIPLET MARKET, BY PROCESSOR

• 8.1 INTRODUCTION
• 8.2 FPGA
  • 8.2.1 ABILITY TO ENHANCE DEVICE PERFORMANCE, FLEXIBILITY, AND CUSTOMIZATION TO DRIVE MARKET
• 8.3 GPU
  • 8.3.1 GROWING DEPLOYMENT IN AI, ML, AND DATA CENTERS TO BOOST DEMAND
• 8.4 CPU
  • 8.4.1 ABILITY TO ENHANCE THERMAL MANAGEMENT TO FUEL MARKET GROWTH
• 8.5 APU
  • 8.5.1 ENHANCED OVERALL COMPUTING PERFORMANCE TO FOSTER MARKET GROWTH
• 8.6 AI ASIC COPROCESSOR
  • 8.6.1 PENETRATION OF AI IN AUTONOMOUS VEHICLES, HEALTHCARE, AND FINANCE TO DRIVE MARKET

9 CHIPLET MARKET, BY REGION

• 9.1 INTRODUCTION
• 9.2 NORTH AMERICA
  • 9.2.1 MACROECONOMIC OUTLOOK FOR NORTH AMERICA
  • 9.2.2 US
    • 9.2.2.1 Growing need for cost-effective manufacturing approach to drive market
  • 9.2.3 CANADA
    • 9.2.3.1 Government-led initiatives to boost domestic semiconductor industry to fuel market growth
  • 9.2.4 MEXICO
    • 9.2.4.1 Expanding automotive industry to foster market growth
• 9.3 EUROPE
  • 9.3.1 MACROECONOMIC OUTLOOK FOR EUROPE
  • 9.3.2 GERMANY
    • 9.3.2.1 Surging semiconductor production to drive market
  • 9.3.3 UK
    • 9.3.3.1 Rising demand for consumer electronics to fuel market growth
  • 9.3.4 FRANCE
    • 9.3.4.1 Optimization of interconnection technologies to foster market growth
  • 9.3.5 ITALY
    • 9.3.5.1 Optimization of interconnection technologies to support market growth
  • 9.3.6 SPAIN
    • 9.3.6.1 Growing importance of advanced packaging to foster market growth
  • 9.3.7 POLAND
    • 9.3.7.1 Focus on building local R&D centers and pilot production lines to boost demand
  • 9.3.8 NORDICS
    • 9.3.8.1 Emphasis on startups focusing on AI, edge computing, and 5G to boost demand
  • 9.3.9 REST OF EUROPE
• 9.4 ASIA PACIFIC
  • 9.4.1 MACROECONOMIC OUTLOOK FOR ASIA PACIFIC
  • 9.4.2 CHINA
    • 9.4.2.1 Emphasis on reducing dependence on foreign semiconductor innovations to fuel market growth
  • 9.4.3 JAPAN
    • 9.4.3.1 Technological advancements across automotive sector to fuel market growth
  • 9.4.4 SOUTH KOREA
    • 9.4.4.1 Thriving consumer electronics industry to drive demand
  • 9.4.5 INDIA
    • 9.4.5.1 Emphasis on IoT, telecom infrastructure, and automotive electronics to support market growth
  • 9.4.6 AUSTRALIA
    • 9.4.6.1 Focus on producing specialized high-reliability and low-power chiplet to boost demand
  • 9.4.7 MALAYSIA
    • 9.4.7.1 Rising foreign investments from global OSAT players to support market growth
  • 9.4.8 THAILAND
    • 9.4.8.1 Growing investments in infrastructure to drive market
  • 9.4.9 VIETNAM
    • 9.4.9.1 Rising FDIs and infrastructure development to fuel market growth
  • 9.4.10 REST OF ASIA PACIFIC
• 9.5 ROW
  • 9.5.1 MACROECONOMIC OUTLOOK FOR ROW
  • 9.5.2 SOUTH AMERICA
    • 9.5.2.1 Increased need for data centers to drive market growth
  • 9.5.3 MIDDLE EAST
    • 9.5.3.1 Bahrain
      • 9.5.3.1.1 Expanding telecom and automotive sectors to fuel market growth
    • 9.5.3.2 Kuwait
      • 9.5.3.2.1 Growing importance of local manufacturing to offer growth opportunities
    • 9.5.3.3 Oman
      • 9.5.3.3.1 Initiatives to boost electronics manufacturing to support market growth
    • 9.5.3.4 Qatar
      • 9.5.3.4.1 Development of smart infrastructure to fuel market growth
    • 9.5.3.5 Saudi Arabia
      • 9.5.3.5.1 Emphasis on developing diversified tech ecosystem to boost demand
    • 9.5.3.6 UAE
      • 9.5.3.6.1 Rising focus on digital transformation to drive market
    • 9.5.3.7 Rest of Middle East
  • 9.5.4 AFRICA
    • 9.5.4.1 Emphasis on smart agriculture, connectivity, and industrial automation to foster market growth
    • 9.5.4.2 South Africa
      • 9.5.4.2.1 Focus on data center modernization to boost demand
    • 9.5.4.3 Rest of Africa

10 COMPETITIVE LANDSCAPE

• 10.1 OVERVIEW
• 10.2 KEY STRATEGIES ADOPTED BY MAJOR PLAYERS, JANUARY 2021-OCTOBER 2025
• 10.3 REVENUE ANALYSIS, 2021-2024
• 10.4 MARKET SHARE ANALYSIS, 2024
• 10.5 COMPANY VALUATION AND FINANCIAL METRICS, 2024
• 10.6 BRAND/PRODUCT COMPARISON
• 10.7 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2024
  • 10.7.1 STARS
  • 10.7.2 EMERGING LEADERS
  • 10.7.3 PERVASIVE PLAYERS
  • 10.7.4 PARTICIPANTS
  • 10.7.5 COMPANY FOOTPRINT: KEY PLAYERS, 2024
    • 10.7.5.1 Company footprint
    • 10.7.5.2 Region footprint
    • 10.7.5.3 Processor footprint
    • 10.7.5.4 End-use application footprint
    • 10.7.5.5 Packaging technology footprint
• 10.8 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2024
  • 10.8.1 PROGRESSIVE COMPANIES
  • 10.8.2 RESPONSIVE COMPANIES
  • 10.8.3 DYNAMIC COMPANIES
  • 10.8.4 STARTING BLOCKS
  • 10.8.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2024
    • 10.8.5.1 List of key startups/SMEs
    • 10.8.5.2 Competitive benchmarking of key startups/SMEs
• 10.9 COMPETITIVE SCENARIO
  • 10.9.1 PRODUCT LAUNCHES
  • 10.9.2 DEALS
  • 10.9.3 OTHER DEVELOPMENTS

11 COMPANY PROFILES

• 11.1 KEY PLAYERS
  • 11.1.1 INTEL CORPORATION
    • 11.1.1.1 Business overview
    • 11.1.1.2 Products/Solutions/Services offered
    • 11.1.1.3 Recent developments
      • 11.1.1.3.1 Product launches
      • 11.1.1.3.2 Deals
      • 11.1.1.3.3 Other developments
    • 11.1.1.4 MnM view
      • 11.1.1.4.1 Key strengths/Right to win
      • 11.1.1.4.2 Strategic choices
      • 11.1.1.4.3 Weaknesses/Competitive threats
  • 11.1.2 ADVANCED MICRO DEVICES, INC.
    • 11.1.2.1 Business overview
    • 11.1.2.2 Products/Solutions/Services offered
    • 11.1.2.3 Recent developments
      • 11.1.2.3.1 Product launches
      • 11.1.2.3.2 Deals
      • 11.1.2.3.3 Other developments
    • 11.1.2.4 MnM view
      • 11.1.2.4.1 Key strengths/Right to win
      • 11.1.2.4.2 Strategic choices
      • 11.1.2.4.3 Weaknesses/Competitive threats
  • 11.1.3 APPLE INC.
    • 11.1.3.1 Business overview
    • 11.1.3.2 Products/Solutions/Services offered
    • 11.1.3.3 Recent developments
      • 11.1.3.3.1 Product launches
      • 11.1.3.3.2 Deals
      • 11.1.3.3.3 Other developments
    • 11.1.3.4 MnM view
      • 11.1.3.4.1 Key strengths/Right to win
      • 11.1.3.4.2 Strategic choices
      • 11.1.3.4.3 Weaknesses/Competitive threats
  • 11.1.4 IBM
    • 11.1.4.1 Business overview
    • 11.1.4.2 Products/Solutions/Services offered
    • 11.1.4.3 Recent developments
      • 11.1.4.3.1 Product launches
      • 11.1.4.3.2 Deals
    • 11.1.4.4 MnM view
      • 11.1.4.4.1 Key strengths/Right to win
      • 11.1.4.4.2 Strategic choices
      • 11.1.4.4.3 Weaknesses/Competitive threats
  • 11.1.5 MARVELL
    • 11.1.5.1 Business overview
    • 11.1.5.2 Products/Solutions/Services offered
    • 11.1.5.3 Recent developments
      • 11.1.5.3.1 Product launches
      • 11.1.5.3.2 Deals
    • 11.1.5.4 MnM view
      • 11.1.5.4.1 Key strengths/Right to win
      • 11.1.5.4.2 Strategic choices
      • 11.1.5.4.3 Weaknesses/Competitive threats
  • 11.1.6 MEDIATEK INC.
    • 11.1.6.1 Business overview
    • 11.1.6.2 Products/Solutions/Services offered
    • 11.1.6.3 Recent developments
      • 11.1.6.3.1 Product launches
      • 11.1.6.3.2 Deals
      • 11.1.6.3.3 Other developments
  • 11.1.7 NVIDIA CORPORATION
    • 11.1.7.1 Business overview
    • 11.1.7.2 Products/Solutions/Services offered
    • 11.1.7.3 Recent developments
      • 11.1.7.3.1 Product launches
      • 11.1.7.3.2 Deals
  • 11.1.8 ACHRONIX SEMICONDUCTOR CORPORATION
    • 11.1.8.1 Business overview
    • 11.1.8.2 Products/Solutions/Services offered
    • 11.1.8.3 Recent developments
      • 11.1.8.3.1 Product launches
      • 11.1.8.3.2 Deals
  • 11.1.9 RANOVUS
    • 11.1.9.1 Business overview
    • 11.1.9.2 Products/Solutions/Services offered
    • 11.1.9.3 Recent developments
      • 11.1.9.3.1 Product launches
      • 11.1.9.3.2 Deals
  • 11.1.10 ASE
    • 11.1.10.1 Business overview
    • 11.1.10.2 Products/Solutions/Services offered
    • 11.1.10.3 Recent developments
      • 11.1.10.3.1 Product launches
      • 11.1.10.3.2 Deals
      • 11.1.10.3.3 Other developments
• 11.2 OTHER PLAYERS
  • 11.2.1 CADENCE DESIGN SYSTEMS, INC.
  • 11.2.2 SYNOPSYS, INC.
  • 11.2.3 ALPHAWAVE SEMI
  • 11.2.4 ELIYAN
  • 11.2.5 NETRONOME
  • 11.2.6 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
  • 11.2.7 NHANCED SEMICONDUCTORS
  • 11.2.8 CHIPULLER
  • 11.2.9 SIFIVE, INC.
  • 11.2.10 RAMBUS
  • 11.2.11 AYAR LABS, INC.
  • 11.2.12 TACHYUM
  • 11.2.13 X-CELEPRINT
  • 11.2.14 KANDOU BUS SA
  • 11.2.15 RAIN NEUROMORPHICS
  • 11.2.16 TENSTORRENT
  • 11.2.17 RENESAS ELECTRONICS CORPORATION
  • 11.2.18 BAYA SYSTEMS
  • 11.2.19 VEEVX

12 APPENDIX

• 12.1 DISCUSSION GUIDE
• 12.2 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
• 12.3 CUSTOMIZATION OPTIONS
• 12.4 RELATED REPORTS
• 12.5 AUTHOR DETAILS