첨단 칩 패키징 기술 : 세계 시장

The global market for advanced chip packaging was valued at $43.8 billion in 2025 and, is estimated to reach $57 billion by 2027 and $87.6 billion by 2030, at a compound annual growth rate (CAGR) of 14.8% from 2025 through 2030.

Report Scope

This report provides an overview of the global advanced chip packaging technologies market and analyzes market trends, including global revenue (in $ millions) for segments and regions. The base year is 2024, with estimated market data for 2025 through 2030. The market is segmented by technology, application, and region. The geographical segments covered are North America, Europe, Asia-Pacific, and the Rest of the World. The report also focuses on emerging technologies and the vendor landscape, and concludes with profiles of the major companies in the market.

Report Includes

• 39 data tables and 50 additional tables
• An overview of the global market for advanced chip packaging technologies
• In-depth analysis of global market trends, featuring historical revenue data for 2024, estimated figures for 2025, as well as forecasts for 2027, 2029. This analysis includes projections of compound annual growth rates (CAGRs) through 2030
• Evaluation of the current market size and revenue growth prospects specific to the advanced chip packaging technologies, accompanied by a market share analysis by technology, application, and region
• Analysis of current and future demand in the global advanced chip packaging, along with a detailed analysis of the competitive environment, market regulations and reimbursement practices
• Analysis of drivers, challenges, and opportunities affecting market growth
• Coverage of evolving technologies, the current and future market potential, R&D activities, growth strategies, new product pipeline, regulatory framework and reimbursement scenarios, and ESG trends of the market
• Market share analysis of the key market participants in the advanced chip packaging industry, along with their research priorities, product portfolios, global rankings and company competitive landscape
• Company profiles of major players within the industry, including Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), Amkor Technology, ASE, and Intel Corp.

Table of Contents

Chapter 1 Executive Summary

• Market Outlook
• Scope of Report
• Market Summary
• Market Dynamics and Growth Factors
• Emerging Technologies
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion

Chapter 2 Market Overview

• Current Market Scenario
• Future Outlook
• Macroeconomic Factors Analysis
• Global Economic Uncertainty and Supply Chain Disruptions
• Inflationary Pressures and Interest Rate Volatility
• Trade Policy Shifts
• Impact of the U.S. Tariff on the Advanced Chip Packaging Market
• Porter's Five Forces Analysis
• Threat of New Entrants
• Bargaining Power of Suppliers
• Bargaining Power of Buyers
• Threat of Substitutes
• Competitive Rivalry
• Value Chain Analysis
• Raw and Substrate Materials
• Semiconductor Wafer Supply
• Package Design and Electronic Design Automation (EDA) Tools
• Advanced Chip Packaging Equipment (Assembly and Bonding)
• Wafer Processing and Dicing Equipment
• Testing and Inspection Equipment
• Outsourced Semiconductor Assembly and Test (OSAT)
• End-Use Integration and Original Equipment Manufacturers (OEMs)
• Regulatory Landscape

Chapter 3 Market Dynamics

• Key Takeaways
• Market Drivers
• Exponential Growth in AI and HPC Demand
• Miniaturization and Heterogeneous Integration Requirements
• Vehicle Electrification and Automotive Electronics Expansion
• Market Restraints
• High Capital Investment and Infrastructure Requirements
• Complex Yield Management and Thermal Challenges in Multi-Chiplet Integration
• Market Opportunities
• Expansion of 5G/6G Infrastructure and AI-Native Wireless Networks
• Smart Cities and IoT Ecosystem Development
• AR/VR/MR Applications and Immersive Technologies

Chapter 4 Emerging Trends and Technologies

• Overview
• Emerging Trends
• GenAI and HPC Fuel Advanced Packaging Demand
• Geographical Expansion and Localized Manufacturing
• Shift from Wafer-Level to Panel-Level Packaging
• AI-Driven Infrastructure Expansion Accelerating Advanced Packaging Capacity
• Emerging Technologies
• 2.5D and 3D Stacking Technologies
• Heterogeneous Integration
• Patent Analysis
• Geographical Patterns

Chapter 5 Market Segmentation Analysis

• Segmentation Breakdown
• Market Breakdown by Technology
• Key Takeaways
• 2.5D/3D Packaging
• Flip-Chip
• Fan-Out WLP
• System-in-Package (SiP)
• Embedded Die
• Others
• Market Breakdown by Application
• Key Takeaways
• AI and High-Performance Computing
• Smartphones and Mobile Devices
• Telecom and Infrastructure
• Automotive
• Others
• Geographic Breakdown
• Market Breakdown by Region
• Key Takeaways
• North America
• Asia-Pacific
• Europe
• Rest of the World

Chapter 6 Competitive Intelligence

• Key Takeaways
• Market Ecosystem Analysis
• Analysis of Key Companies
• TSMC
• Amkor Technology
• ASE Technology Holding
• Intel Corp.
• JCET Group Co. Ltd.
• Strategic Analysis

Chapter 7 Appendix

• Methodology
• Abbreviations
• Company Profiles
• AMKOR TECHNOLOGY
• ASE
• CHIPMOS TECHNOLOGIES INC.
• HANA MICRON INC.
• INTEL CORP.
• JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD.
• KING YUAN ELECTRONICS CO. LTD.
• POWERTECH TECHNOLOGY INC.
• SAMSUNG
• SILICON BOX PTE LTD.
• SILICONWARE PRECISION INDUSTRIES Co. Ltd.
• STATS CHIPPAC MANAGEMENT PTE. LTD.
• TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
• TIANSHUI HUATIAN TECHNOLOGY CO. LTD.
• TONGFU MICROELECTRONICS CO. LTD.
• UNISEM