3-D TSV : 중요 과제에 관한 인사이트와 시장 분석

Introduction

The TSV advanced packaging sector of the semiconductor industry is currently undergoing rapid evolution and expansion, driven by the increasing demand for higher computing power and efficiency in electronic devices. Here are some critical insights and implications based on the information provided:

Technological Innovations in Advanced Packaging: Redistribution Layer (RDL), Through-Silicon Via (TSV), Bump Technology, and Hybrid Bonding are at the forefront of advanced packaging technologies. Each plays a crucial role in enhancing chip performance by improving connection efficiency and reducing power consumption.

These technologies address the physical limitations encountered with traditional scaling methods, notably the quantum tunneling effect, which makes further miniaturization impractical due to high R&D costs and low yield rates.

Impact on Computing Power: Advanced packaging significantly boosts computing power by increasing processor integration and enhancing the bandwidth and efficiency of processormemory connections. This is critical for overcoming the "memory wall" and "power consumption wall," enabling more sophisticated computing applications, including AI and machine learning models.

Supply and Demand Dynamics: The demand for advanced packaging is outstripping supply, partly due to the explosive growth in computing requirements for AI applications. Leading companies like Nvidia and TSMC are struggling to meet this demand, indicating a significant bottleneck in production capacity.

This supply shortage highlights the urgency for expanding advanced packaging capabilities to keep pace with technological advancements and market needs.

Market Barriers and Industry Dynamics: The high barriers to entry in the advanced packaging market, due to the complexity and precision required in manufacturing processes, favor established players with comprehensive fabrication and design capabilities.

While leading global companies are expanding their capacities, the lengthy expansion cycle and equipment shortages present challenges. This situation opens opportunities for domestic companies in various regions to accelerate their development and potentially gain market share.

Future Outlook: The ongoing efforts to expand production capabilities and the active R&D in new materials and techniques are essential for the future growth of the semiconductor industry.

Domestic companies, especially in regions with strong government support for the semiconductor industry, have a unique opportunity to leverage the current market dynamics for "domestic substitution" and reduce reliance on international suppliers.

About This Report

This 175-page report covers the following:

The "3-D TSV: Insight On Critical Issues and Market Analysis" report covers a comprehensive examination of technology trends that are central to the development and deployment of Through-Silicon Via (TSV) in semiconductor packaging, focusing on the pivotal role of 3D and 2.5D TSV technologies. A key highlight of the report is the detailed exploration of advanced packaging solutions that incorporate 3D or 2.5D TSV, such as Chip-on-Wafer-on-Substrate (CoWoS) and Feveros.

These advanced packaging technologies are pushing the boundaries of semiconductor performance and efficiency. CoWoS, for instance, enables high-density integration of heterogeneous chips by stacking them vertically, significantly improving performance and reducing power consumption. This is particularly beneficial for applications requiring high computational power, like data centers and AI processing. Feveros, although not detailed in your initial information, can be inferred as another innovative packaging solution leveraging 3D or 2.5D TSV technologies to meet the growing demands for faster, more efficient computing across various sectors.

The report delves into how these technologies address critical industry challenges, including the need for greater bandwidth, reduced latency, and lower energy consumption. It emphasizes the strategic importance of these advanced packaging methods in overcoming the limitations of traditional scaling laws, thus enabling the continued evolution of semiconductor devices in line with Moore's Law.

Moreover, the analysis presents a market overview that reflects the growing demand for 3D and 2.5D TSV solutions, driven by their application in high-performance computing, consumer electronics, and automotive systems. The report underscores the competitive landscape, highlighting the technological advancements and strategies employed by key industry players to capitalize on these emerging opportunities.

Table of Contents

Chapter 1. Introduction

Chapter 2. Insight Into Critical Issues

• 2.1. Driving Forces In 3-D TSV
• 2.2. Benefits of 3-D ICs With TSVs
• 2.3. Requirements For A Cost Effective 3-D Die Stacking Technology
• 2.4. TSV Technology Challenges
• 2.5. TSV Supply Chain Challenge
• 2.6. Limitations of 3-D Packaging Technology
  • 2.6.1. Thermal Management
  • 2.6.2. Cost
  • 2.6.3. Design Complexity
  • 2.6.4. Time to Delivery

Chapter 3. Cost Structure

• 3.1. Cost Structure of 3-D chip Stacks
• 3.2. Cost of Ownership

Chapter 4. Critical Processing Technologies

• 4.1. Introduction
• 4.2. Cu Plating
• 4.3. Lithography
  • 4.3.1. Optical Lithography
  • 4.3.2. Imprint Lithography
  • 4.3.3. Resist Coat
• 4.4. Plasma Etch Technology
• 4.5. Stripping/Cleaning
• 4.6. Thin Wafer Bonding
• 4.7. Wafer Thinning/CMP
• 4.8. Stacking
• 4.9. Metrology/Inspection

Chapter 5. Evaluation Of Critical Development Segments

• 5.1. Introduction
• 5.2. Via-first
  • 5.2.1. Equipment Requirements
  • 5.2.2. Material Requirements
• 5.3. Via-Middle
  • 5.3.1. Equipment Requirements
  • 5.3.2. Material Requirements
• 5.4. Via-Last
  • 5.4.1. Equipment Requirements
  • 5.4.2. Material Requirements
• 5.5. Interposers

Chapter 6. Profiles Of Participants

• 6.1. Chip Manufacturers/Packaging Houses/Services
• 6.2. Equipment Suppliers
• 6.3. Material Suppliers
• 6.4. R&D

Chapter 7. Market Analysis

• 7.1. TSV Device Roadmap
• 7.2. TSV Device Forecast
• 7.3. Equipment Forecast
• 7.4. Material Forecast