5G 칩셋 시장

The global market for 5G chipset is expected to grow from $46.2 billion in 2026 and is projected to reach $84.6 billion by the end of 2031, at a compound annual growth rate (CAGR) of 12.8% during the forecast period of 2026 to 2031.

Report Scope

This report provides an overview of the global 5G chipset market and analyzes the market trends. It provides the global revenue (in $ millions) for segments and regions, considering 2025 as the base year, along with estimated market data for 2026 through the end of 2031. The market is segmented by chipset type, frequency type, industry, and region. The report also focuses on emerging technologies and the vendor landscape, concluding with profiles of the major companies in the market.

Report Includes

• 70 data tables and 32 additional tables
• In-depth analysis of the global 5G chipset market
• Analyses of the global market trends, with revenue from 2025, estimates for 2026, and projections of compound annual growth rates (CAGRs) through 2031
• Estimates of the current market size and revenue forecasts for the global market, accompanied by a corresponding market share analysis based on deployment, wafer material type, integrated circuit (IC) type, application and region
• Facts and figures pertaining to market dynamics, technological advances, regulations, prospects and the impact of macroeconomic variables
• Insights derived from Porter's Five Forces model, as well as global supply chain analyses
• Identification of viable technology drivers through a holistic review of various platform technologies, major types of end user markets, and adoption of 5G chipsets across a broad spectrum of industry verticals
• Review of key patent publications, emerging trends and new developments in the 5G chipsets market
• Overview of sustainability trends and ESG developments, with emphasis on consumer attitudes, as well as the ESG risk ratings and practices of leading companies
• Analysis of the industry structure, including companies' market shares, product mappings analysis, strategic initiatives, M&A activity and a venture funding outlook
• Profiles of the leading global companies, including Qualcomm Technologies Inc., MediaTek, Samsung, Huawei Technologies Co. Ltd., and Broadcom

Table of Contents

Chapter 1 Executive Summary

• Market Outlook
• Scope of Report
• Market Summary
• Market Dynamics and Growth Factors
• Emerging Technologies
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion

Chapter 2 Market Overview

• Current Market Scenario
• Future Expectations
• Market Dynamics
• Market Drivers
• Market Restraints
• Market Opportunities
• Macro-Economic Factors Analysis
• Global Supply Chain Disruptions and Component Cost Inflation
• Currency Exchange Rate Volatility and Geographic Revenue Exposure
• Interest Rate Environment and Capital Investment Constraints
• Slowing GDP Growth and Market Demand
• Impact of the U.S. Tariffs on the 5G Chipset Market
• Value Chain Analysis
• Primary Research Analysis
• Key Parameters in Primary Research Methodology
• Respondents Profile
• Data Collection Methodology
• Primary Adoption Drivers
• Respondent Verbatims

Chapter 3 Regulatory Framework

• Overview
• Market Regulation

Chapter 4 Emerging Technologies

• Overview
• Emerging Technology Trends
• Integration of AI Capabilities in 5G Modems
• Development Toward 5G-Advanced and Release 18 Specifications
• 2nm Semiconductor Technology
• Specialized 5G Chipsets
• Emerging Startups
• Patent Analysis
• Geographical Patterns
• Key Takeaways

Chapter 5 Market Breakdown by Chipset Type

• Key Takeaways
• 5G Modem
• RF Front-End
• RF Transceiver

Chapter 6 Market Breakdown by Frequency Type

• Key Takeaways
• Sub-6 GHz
• mmWave

Chapter 7 Market Breakdown by Industry

• Key Takeaways
• Consumer Electronics
• Industrial/Manufacturing
• Automotive
• IT and Telecom
• Other Industries

Chapter 8 Market Breakdown by Geographic Region

• Key Takeaways
• North America
• Asia-Pacific
• Europe
• Rest of the World

Chapter 9 Competitive Intelligence

• Key Takeaways
• Market Ecosystem Analysis
• Standards and Architecture
• Chipset Design, Integration, and Differentiation
• Semiconductor IP Licensing and Toolchain Enablement
• Assembly, Testing, and Packaging Optimization
• RF Front-End and Component Integration
• Device and Module Manufacturing as Demand Aggregators
• Network Infrastructure and Operator Enablement
• Regulatory, Certification, and Security Enforcement
• Government Programs and Strategic Intervention
• Emerging Software, AI, and Cloud Convergence
• Analysis of Key Companies
• BCC Viewpoint on Key Companies
• Strategic Analysis
• Product Development
• Partnership and M&A
• Product Demonstration
• Capacity and Innovation Hub Expansion
• Strategic Focus: 5G Advanced and 6G Transition

Chapter 10 Company Profiles

• ANALOG DEVICES INC.
• BROADCOM
• HUAWEI TECHNOLOGIES CO. LTD.
• INFINEON TECHNOLOGIES AG
• INTEL CORP.
• MEDIATEK
• MURATA MANUFACTURING CO. LTD.
• QORVO INC.
• QUALCOMM TECHNOLOGIES INC.
• SAMSUNG
• Other Companies

Chapter 11 Appendix

• Methodology
• Abbreviations