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Global Smart Card IC Market Size Study & Forecast, by Type, by Architecture, by Interface, by Application, by End-user Industry and Regional Analysis, 2023-2030

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ksm 23.09.19

Global Smart Card IC Market is valued approximately at USD 2.9 billion in 2022 and is anticipated to grow with a growth rate of more than 6.3% over the forecast period 2023-2030. A smart card IC, also known as a smart card chip or a microcontroller chip, is a small electronic device that contains a microprocessor or microcontroller along with other components such as memory, input/output interfaces, and security features. The increasing use of Subscriber identity Module (SIM) cards for mobile phones, expanding use of electronic identity cards for various e-governance initiatives, and growing use of smart cards in the payment and banking industries are the main factors driving the growth of this market across the globe.

The expansion of the smart card IC market is associated to the increasing trend of contactless payments and widespread adoption of ID cards in diverse organizations and educational institutions. According to the Electronic Transactions Association, the market for contactless payments is expected to experience significant growth between 2023 and 2026, rising from its present market worth of over USD 40 billion to over USD 100 billion. Another important factor for the market is the rising adoption of IoT in the telecommunications, BFSI, transportation, and retail end-user industries, which has increased demand for low-cost, highly effective smart card ICs used for secure data transfer and storage. In addition, the focus of governments in many nations on switching from paper-based ID cards to chip-based ID cards to stop illicit activity and safeguard citizens from identity theft can be credited to the growth and development of the market. However, eSIM data security issues and a global supply shortage of semiconductor chips may be the main factors limiting the industry's growth throughout the forecast period of 2023-2030.

The key regions considered for the Global Smart Card IC Market study include Asia Pacific, North America, Europe, Latin America, and Middle East & Africa. Asia Pacific dominated the market in 2022 and is also anticipated to experience the highest growth during the forecast period due to ongoing technological advancements in the telecommunications, BFSI, government, healthcare, and transportation verticals, the growing adoption of digital technologies, and the region's quick urbanization and industrialization. Other significant factors include the expanding use of IoT devices, the expansion of digital technology use in the retail, corporate, educational, and entertainment sectors, and the expansion of electrification in the transportation sector.

Major market players included in this report are:

  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Samsung Electronics Co., Ltd.
  • STMicroelectronics N.V.
  • Microchip Technology Incorporated
  • CEC Huada Electronic Design Co., Ltd.
  • Analog Devices, Inc.
  • Sony Group Corporation
  • Toshiba Corporation (Japan)
  • ON Semiconductor Corporation

Recent Developments in the Market:

  • In July 2022, with the introduction of OPTIGA Trust M Express, an advanced security solution from Infineon Technologies AG, every IoT device has a distinct identity and an anchor of trust for connecting to the cloud. It is perfect for linked consumer gadgets, smart homes, and building and industrial automation applications.
  • In June 2022, The ST4SIM-201 embedded SIM (eSIM) for machine-to-machine (M2M) communication was introduced by STMicroelectronics N.V., and it complies with the most recent standards for 5G network access, M2M security, and adaptable remote provisioning and management.
  • In December 2021, Maxim Integrated Products, Inc. was purchased by Analogue Devices, Inc. (ADI) in order to bolster ADI's position as a manufacturer of high-performance analogue semiconductors.

Global Smart Card IC Market Report Scope:

  • Historical Data: 2020 - 2021
  • Base Year for Estimation: 2022
  • Forecast period: 2023-2030
  • Report Coverage: Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
  • Segments Covered: Type, Architecture, Interface, Application, End-user, Region
  • Regional Scope: North America; Europe; Asia Pacific; Latin America; Middle East & Africa
  • Customization Scope: Free report customization (equivalent up to 8 analyst's working hours) with purchase. Addition or alteration to country, regional & segment scope*

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Type:

  • Microprocessor
  • Memory

By Architecture:

  • 16-bit
  • 32-bit

By Interface:

  • Contact
  • Contactless
  • Dual Interface

By Application:

  • USIMs/eSIMs
  • ID Cards
  • Financial Cards

By End User:

  • Telecommunications
  • BFSI
  • Government & Healthcare
  • Transportation
  • Education
  • Others

By Region:

  • North America
  • U.S.
  • Canada
  • Europe
  • UK
  • Germany
  • France
  • Spain
  • Italy
  • ROE
  • Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • RoAPAC
  • Latin America
  • Brazil
  • Mexico
  • Middle East & Africa
  • Saudi Arabia
  • South Africa
  • Rest of Middle East & Africa

Table of Contents

Chapter 1. Executive Summary

  • 1.1. Market Snapshot
  • 1.2. Global & Segmental Market Estimates & Forecasts, 2020-2030 (USD Billion)
    • 1.2.1. Smart Card IC Market, by region, 2020-2030 (USD Billion)
    • 1.2.2. Smart Card IC Market, by Type, 2020-2030 (USD Billion)
    • 1.2.3. Smart Card IC Market, by Architecture, 2020-2030 (USD Billion)
    • 1.2.4. Smart Card IC Market, by Interface, 2020-2030 (USD Billion)
    • 1.2.5. Smart Card IC Market, by Application, 2020-2030 (USD Billion)
    • 1.2.6. Smart Card IC Market, by End User, 2020-2030 (USD Billion)
  • 1.3. Key Trends
  • 1.4. Estimation Methodology
  • 1.5. Research Assumption

Chapter 2. Global Smart Card IC Market Definition and Scope

  • 2.1. Objective of the Study
  • 2.2. Market Definition & Scope
    • 2.2.1. Industry Evolution
    • 2.2.2. Scope of the Study
  • 2.3. Years Considered for the Study
  • 2.4. Currency Conversion Rates

Chapter 3. Global Smart Card IC Market Dynamics

  • 3.1. Smart Card IC Market Impact Analysis (2020-2030)
    • 3.1.1. Market Drivers
      • 3.1.1.1. Rising usage of SIMs and eSIMs in smartphones
      • 3.1.1.2. Rise in contactless payments
    • 3.1.2. Market Challenges
      • 3.1.2.1. Data security concerns related to eSIMs
      • 3.1.2.2. Global semiconductor chip supply shortage
    • 3.1.3. Market Opportunities
      • 3.1.3.1. Government agencies promoting digitalization
      • 3.1.3.2. Increased adoption of IoT by end-user industries

Chapter 4. Global Smart Card IC Market: Industry Analysis

  • 4.1. Porter's 5 Force Model
    • 4.1.1. Bargaining Power of Suppliers
    • 4.1.2. Bargaining Power of Buyers
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
  • 4.2. Porter's 5 Force Impact Analysis
  • 4.3. PEST Analysis
    • 4.3.1. Political
    • 4.3.2. Economic
    • 4.3.3. Social
    • 4.3.4. Technological
    • 4.3.5. Environmental
    • 4.3.6. Legal
  • 4.4. Top investment opportunity
  • 4.5. Top winning strategies
  • 4.6. COVID-19 Impact Analysis
  • 4.7. Disruptive Trends
  • 4.8. Industry Expert Perspective
  • 4.9. Analyst Recommendation & Conclusion

Chapter 5. Global Smart Card IC Market, by Type

  • 5.1. Market Snapshot
  • 5.2. Global Smart Card IC Market by Type, Performance - Potential Analysis
  • 5.3. Global Smart Card IC Market Estimates & Forecasts by Type 2020-2030 (USD Billion)
  • 5.4. Smart Card IC Market, Sub Segment Analysis
    • 5.4.1. Microprocessor
    • 5.4.2. Memory

Chapter 6. Global Smart Card IC Market, by Architecture

  • 6.1. Market Snapshot
  • 6.2. Global Smart Card IC Market by Architecture, Performance - Potential Analysis
  • 6.3. Global Smart Card IC Market Estimates & Forecasts by Architecture 2020-2030 (USD Billion)
  • 6.4. Smart Card IC Market, Sub Segment Analysis
    • 6.4.1. 16-bit
    • 6.4.2. 32-bit

Chapter 7. Global Smart Card IC Market, by Interface

  • 7.1. Market Snapshot
  • 7.2. Global Smart Card IC Market by Interface, Performance - Potential Analysis
  • 7.3. Global Smart Card IC Market Estimates & Forecasts by Interface 2020-2030 (USD Billion)
  • 7.4. Smart Card IC Market, Sub Segment Analysis
    • 7.4.1. Contact
    • 7.4.2. Contactless
    • 7.4.3. Dual Interface

Chapter 8. Global Smart Card IC Market, by Application

  • 8.1. Market Snapshot
  • 8.2. Global Smart Card IC Market by Application, Performance - Potential Analysis
  • 8.3. Global Smart Card IC Market Estimates & Forecasts by Application 2020-2030 (USD Billion)
  • 8.4. Smart Card IC Market, Sub Segment Analysis
    • 8.4.1. USIMs/eSIMs
    • 8.4.2. ID Cards
    • 8.4.3. Financial Cards

Chapter 9. Global Smart Card IC Market, by End User

  • 9.1. Market Snapshot
  • 9.2. Global Smart Card IC Market by End User, Performance - Potential Analysis
  • 9.3. Global Smart Card IC Market Estimates & Forecasts by End User 2020-2030 (USD Billion)
  • 9.4. Smart Card IC Market, Sub Segment Analysis
    • 9.4.1. Telecommunications
    • 9.4.2. BFSI
    • 9.4.3. Government & Healthcare
    • 9.4.4. Transportation
    • 9.4.5. Education
    • 9.4.6. Others

Chapter 10. Global Smart Card IC Market, Regional Analysis

  • 10.1. Top Leading Countries
  • 10.2. Top Emerging Countries
  • 10.3. Smart Card IC Market, Regional Market Snapshot
  • 10.4. North America Smart Card IC Market
    • 10.4.1. U.S. Smart Card IC Market
      • 10.4.1.1. Type breakdown estimates & forecasts, 2020-2030
      • 10.4.1.2. Architecture breakdown estimates & forecasts, 2020-2030
      • 10.4.1.3. Interface breakdown estimates & forecasts, 2020-2030
      • 10.4.1.4. Application breakdown estimates & forecasts, 2020-2030
      • 10.4.1.5. End-User breakdown estimates & forecasts, 2020-2030
    • 10.4.2. Canada Smart Card IC Market
  • 10.5. Europe Smart Card IC Market Snapshot
    • 10.5.1. U.K. Smart Card IC Market
    • 10.5.2. Germany Smart Card IC Market
    • 10.5.3. France Smart Card IC Market
    • 10.5.4. Spain Smart Card IC Market
    • 10.5.5. Italy Smart Card IC Market
    • 10.5.6. Rest of Europe Smart Card IC Market
  • 10.6. Asia-Pacific Smart Card IC Market Snapshot
    • 10.6.1. China Smart Card IC Market
    • 10.6.2. India Smart Card IC Market
    • 10.6.3. Japan Smart Card IC Market
    • 10.6.4. Australia Smart Card IC Market
    • 10.6.5. South Korea Smart Card IC Market
    • 10.6.6. Rest of Asia Pacific Smart Card IC Market
  • 10.7. Latin America Smart Card IC Market Snapshot
    • 10.7.1. Brazil Smart Card IC Market
    • 10.7.2. Mexico Smart Card IC Market
  • 10.8. Middle East & Africa Smart Card IC Market
    • 10.8.1. Saudi Arabia Smart Card IC Market
    • 10.8.2. South Africa Smart Card IC Market
    • 10.8.3. Rest of Middle East & Africa Smart Card IC Market

Chapter 11. Competitive Intelligence

  • 11.1. Key Company SWOT Analysis
    • 11.1.1. Company 1
    • 11.1.2. Company 2
    • 11.1.3. Company 3
  • 11.2. Top Market Strategies
  • 11.3. Company Profiles
    • 11.3.1. Infineon Technologies AG
      • 11.3.1.1. Key Information
      • 11.3.1.2. Overview
      • 11.3.1.3. Financial (Subject to Data Availability)
      • 11.3.1.4. Product Summary
      • 11.3.1.5. Recent Developments
    • 11.3.2. NXP Semiconductors N.V.
    • 11.3.3. Samsung Electronics Co., Ltd.
    • 11.3.4. STMicroelectronics N.V.
    • 11.3.5. Microchip Technology Incorporated
    • 11.3.6. CEC Huada Electronic Design Co., Ltd.
    • 11.3.7. Analog Devices, Inc.
    • 11.3.8. Sony Group Corporation
    • 11.3.9. Toshiba Corporation (Japan)
    • 11.3.10. ON Semiconductor Corporation

Chapter 12. Research Process

  • 12.1. Research Process
    • 12.1.1. Data Mining
    • 12.1.2. Analysis
    • 12.1.3. Market Estimation
    • 12.1.4. Validation
    • 12.1.5. Publishing
  • 12.2. Research Attributes
  • 12.3. Research Assumption
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