세계의 화합물 반도체 시장 : 규모, 점유율, 성장 및 산업 분석, 유형별, 용도별, 지역별 인사이트 및 예측(2024-2032년)

Growth Factors of compound semiconductor market

The global compound semiconductor market is witnessing steady expansion, driven by rapid advancements in communication technologies, growing demand for energy-efficient electronics, and increasing adoption across consumer electronics, automotive, and industrial applications. In 2024, the global compound semiconductor market size was valued at USD 39.68 billion, reflecting strong demand for materials that offer superior performance compared to traditional silicon-based semiconductors. The market is projected to grow to USD 42.36 billion in 2025 and further reach USD 72.89 billion by 2032, highlighting sustained growth throughout the forecast period.

Compound semiconductors are made from two or more elements, such as gallium nitride, silicon carbide, gallium arsenide, and indium phosphide. These materials exhibit unique properties, including high thermal stability, faster electron mobility, improved frequency response, and strong optoelectronic performance. As a result, they are increasingly used in high-speed communication systems, power electronics, LEDs, and radio frequency devices.

Market Growth Drivers

One of the primary drivers of the compound semiconductor market is the rapid evolution of 5G infrastructure. The deployment of next-generation wireless networks requires high-frequency, high-power, and energy-efficient components, making compound semiconductors essential for power amplifiers and RF devices. In 2024, the growing number of 5G base stations worldwide significantly boosted demand for gallium nitride and silicon carbide solutions.

The increasing adoption of LEDs in consumer electronics and automotive lighting is another major growth factor. LEDs based on compound semiconductors offer superior brightness, efficiency, and longevity compared to traditional lighting technologies. Their growing use in displays, general lighting, and vehicle headlamps continues to support market expansion in 2025 and beyond.

Impact of Generative AI

The emergence of generative artificial intelligence is creating new growth opportunities in the compound semiconductor market. Generative AI enhances material discovery, device design, and performance optimization by simulating material behavior under various operating conditions. This capability accelerates the development of advanced compound semiconductor materials such as GaN, SiC, and InP.

In 2024, AI-driven design tools increasingly supported the optimization of power electronics and photonic devices, enabling higher efficiency and improved reliability. By reducing development cycles and improving energy efficiency, generative AI is expected to support innovation and market growth through 2032.

Market Trends

A key trend shaping the market is the growing adoption of LiDAR technology. LiDAR systems rely on high-performance laser diodes and photonic components, which are commonly built using compound semiconductors. GaN and InP materials are widely used in LiDAR due to their ability to operate at high power and frequency levels with enhanced reliability.

The expanding use of LiDAR in autonomous vehicles, industrial automation, and environmental monitoring is increasing demand for advanced compound semiconductor materials. This trend is expected to remain strong across 2025 and 2032, supporting long-term market growth.

Segmentation Insights

By type, gallium nitride (GaN) dominated the compound semiconductor market in 2024, driven by its superior performance in power electronics, RF applications, and LED lighting. GaN offers high efficiency, thermal stability, and compact design advantages, making it a preferred choice across multiple industries. Meanwhile, indium phosphide (InP) is expected to register the fastest growth due to its extensive use in optoelectronics, lasers, and photonic integrated circuits.

By product, the LED segment accounted for the largest market share in 2024, supported by widespread adoption in residential, commercial, and automotive lighting. The power electronics segment is projected to grow at the fastest pace through 2032, as compound semiconductors enable efficient power conversion in electric vehicles, renewable energy systems, and industrial equipment.

Industry Analysis

The consumer electronics sector led the market in 2024, driven by demand for compact, lightweight, and energy-efficient devices. Compound semiconductors support device miniaturization while improving battery life and thermal performance, making them essential for smartphones, laptops, and wearables.

The energy and power sector is expected to witness the fastest growth through 2032, as compound semiconductors play a critical role in photovoltaics, electric vehicles, and energy storage systems. Their ability to operate at high voltages and temperatures supports sustainable energy solutions.

Regional Insights

Asia Pacific dominated the global compound semiconductor market in 2024, accounting for a 44.32% market share and generating USD 17.59 billion in revenue. The region benefits from low manufacturing costs, a strong electronics manufacturing base, and rapid expansion of 5G infrastructure, particularly in China.

Europe is expected to record the highest growth rate through 2032, supported by strong automotive manufacturing, rising automation, and government initiatives to strengthen semiconductor production. North America is projected to witness steady growth, driven by advanced research capabilities and rapid 5G deployment.

Competitive Landscape

The compound semiconductor market is highly competitive, with key players focusing on capacity expansion, strategic partnerships, and technological innovation. Investments in advanced materials, wafer manufacturing, and power device development are expected to shape competition through 2025 and 2032.

Segmentation By Type

• GaN (AIGaN, INGaN)
• SiC
• GaAs
• InP
• Others (SiGe, GaP, InSb, etc.)

By Product

• LED
• Optoelectronics
• Power Electronics
• RF Devices

By Industry

• Consumer Electronics
• Telecommunications
• Energy and Power
• Automotive
• Aerospace and Defense
• Others (Healthcare, etc.)

By Region

• North America (By Type, Product, Industry, and Country)
  • U.S. (By Industry)
  • Canada (By Industry)
  • Mexico (By Industry)
• South America (By Type, Product, Industry, and Country)
  • Brazil (By Industry)
  • Argentina (By Industry)
  • Rest of South America
• Europe (By Type, Product, Industry, and Country)
  • U.K. (By Industry)
  • Germany (By Industry)
  • France (By Industry)
  • Italy (By Industry)
  • Spain (By Industry)
  • Russia (By Industry)
  • Benelux (By Industry)
  • Nordics (By Industry)
  • Rest of Europe
• Middle East & Africa (By Type, Product, Industry, and Country)
  • Turkey (By Industry)
  • Israel (By Industry)
  • GCC (By Industry)
  • North Africa (By Industry)
  • South Africa (By Industry)
  • Rest of the Middle East & Africa
• Asia Pacific (By Type, Product, Industry, and Country)
  • China (By Industry)
  • Japan (By Industry)
  • India (By Industry)
  • South Korea (By Industry)
  • ASEAN (By Industry)
  • Oceania (By Industry)
  • Rest of Asia Pacific

Table of Content

1. Introduction

• 1.1. Definition, By Segment
• 1.2. Research Methodology/Approach
• 1.3. Data Sources

2. Executive Summary

3. Market Dynamics

• 3.1. Macro and Micro Economic Indicators
• 3.2. Drivers, Restraints, Opportunities and Trends
• 3.3. Impact of Generative AI

4. Competition Landscape

• 4.1. Business Strategies Adopted by Key Players
• 4.2. Consolidated SWOT Analysis of Key Players
• 4.3. Global Compound Semiconductor Key Players (Top 3 - 5) Market Share/Ranking, 2024

5. Global Compound Semiconductor Market Size Estimates and Forecasts, By Segments, 2019-2032

• 5.1. Key Findings
• 5.2. By Type (USD)
  • 5.2.1. GaN (AIGaN, INGaN)
  • 5.2.2. SiC
  • 5.2.3. GaAs
  • 5.2.4. InP
  • 5.2.5. Others (SiGe, GaP, InSb, etc.)
• 5.3. By Product (USD)
  • 5.3.1. LED
  • 5.3.2. Optoelectronics
  • 5.3.3. Power Electronics
  • 5.3.4. RF Devices
• 5.4. By Industry (USD)
  • 5.4.1. Consumer Electronics
  • 5.4.2. Telecommunications
  • 5.4.3. Energy and Power
  • 5.4.4. Automotive
  • 5.4.5. Aerospace and Defense
  • 5.4.6. Others (Healthcare, etc.)
• 5.5. By Region (USD)
  • 5.5.1. North America
  • 5.5.2. South America
  • 5.5.3. Europe
  • 5.5.4. Middle East & Africa
  • 5.5.5. Asia Pacific

6. North America Compound Semiconductor Market Size Estimates and Forecasts, By Segments, 2019-2032

• 6.1. Key Findings
• 6.2. By Type (USD)
  • 6.2.1. GaN (AIGaN, INGaN)
  • 6.2.2. SiC
  • 6.2.3. GaAs
  • 6.2.4. InP
  • 6.2.5. Others (SiGe, GaP, InSb, etc.)
• 6.3. By Product (USD)
  • 6.3.1. LED
  • 6.3.2. Optoelectronics
  • 6.3.3. Power Electronics
  • 6.3.4. RF Devices
• 6.4. By Industry (USD)
  • 6.4.1. Consumer Electronics
  • 6.4.2. Telecommunications
  • 6.4.3. Energy and Power
  • 6.4.4. Automotive
  • 6.4.5. Aerospace and Defense
  • 6.4.6. Others (Healthcare, etc.)
• 6.5. By Country (USD)
  • 6.5.1. U.S.
    • 6.5.1.1. By Industry
  • 6.5.2. Canada
    • 6.5.2.1. By Industry
  • 6.5.3. Mexico
    • 6.5.3.1. By Industry

7. South America Compound Semiconductor Market Size Estimates and Forecasts, By Segments, 2019-2032

• 7.1. Key Findings
• 7.2. By Type (USD)
  • 7.2.1. GaN (AIGaN, INGaN)
  • 7.2.2. SiC
  • 7.2.3. GaAs
  • 7.2.4. InP
  • 7.2.5. Others (SiGe, GaP, InSb, etc.)
• 7.3. By Product (USD)
  • 7.3.1. LED
  • 7.3.2. Optoelectronics
  • 7.3.3. Power Electronics
  • 7.3.4. RF Devices
• 7.4. By Industry (USD)
  • 7.4.1. Consumer Electronics
  • 7.4.2. Telecommunications
  • 7.4.3. Energy and Power
  • 7.4.4. Automotive
  • 7.4.5. Aerospace and Defense
  • 7.4.6. Others (Healthcare, etc.)
• 7.5. By Country (USD)
  • 7.5.1. Brazil
    • 7.5.1.1. By Industry
  • 7.5.2. Argentina
    • 7.5.2.1. By Industry
  • 7.5.3. Rest of South America

8. Europe Compound Semiconductor Market Size Estimates and Forecasts, By Segments, 2019-2032

• 8.1. Key Findings
• 8.2. By Type (USD)
  • 8.2.1. GaN (AIGaN, INGaN)
  • 8.2.2. SiC
  • 8.2.3. GaAs
  • 8.2.4. InP
  • 8.2.5. Others (SiGe, GaP, InSb, etc.)
• 8.3. By Product (USD)
  • 8.3.1. LED
  • 8.3.2. Optoelectronics
  • 8.3.3. Power Electronics
  • 8.3.4. RF Devices
• 8.4. By Industry (USD)
  • 8.4.1. Consumer Electronics
  • 8.4.2. Telecommunications
  • 8.4.3. Energy and Power
  • 8.4.4. Automotive
  • 8.4.5. Aerospace and Defense
  • 8.4.6. Others (Healthcare, etc.)
• 8.5. By Country (USD)
  • 8.5.1. U.K.
    • 8.5.1.1. By Industry
  • 8.5.2. Germany
    • 8.5.2.1. By Industry
  • 8.5.3. France
    • 8.5.3.1. By Industry
  • 8.5.4. Italy
    • 8.5.4.1. By Industry
  • 8.5.5. Spain
    • 8.5.5.1. By Industry
  • 8.5.6. Russia
    • 8.5.6.1. By Industry
  • 8.5.7. Benelux
    • 8.5.7.1. By Industry
  • 8.5.8. Nordics
    • 8.5.8.1. By Industry
  • 8.5.9. Rest of Europe

9. Middle East & Africa Compound Semiconductor Market Size Estimates and Forecasts, By Segments, 2019-2032

• 9.1. Key Findings
• 9.2. By Type (USD)
  • 9.2.1. GaN (AIGaN, INGaN)
  • 9.2.2. SiC
  • 9.2.3. GaAs
  • 9.2.4. InP
  • 9.2.5. Others (SiGe, GaP, InSb, etc.)
• 9.3. By Product (USD)
  • 9.3.1. LED
  • 9.3.2. Optoelectronics
  • 9.3.3. Power Electronics
  • 9.3.4. RF Devices
• 9.4. By Industry (USD)
  • 9.4.1. Consumer Electronics
  • 9.4.2. Telecommunications
  • 9.4.3. Energy and Power
  • 9.4.4. Automotive
  • 9.4.5. Aerospace and Defense
  • 9.4.6. Others (Healthcare, etc.)
• 9.5. By Country (USD)
  • 9.5.1. Turkey
    • 9.5.1.1. By Industry
  • 9.5.2. Israel
    • 9.5.2.1. By Industry
  • 9.5.3. GCC
    • 9.5.3.1. By Industry
  • 9.5.4. North Africa
    • 9.5.4.1. By Industry
  • 9.5.5. South Africa
    • 9.5.5.1. By Industry
  • 9.5.6. Rest of Middle East & Africa

10. Asia Pacific Compound Semiconductor Market Size Estimates and Forecasts, By Segments, 2019-2032

• 10.1. Key Findings
• 10.2. By Type (USD)
  • 10.2.1. GaN (AIGaN, INGaN)
  • 10.2.2. SiC
  • 10.2.3. GaAs
  • 10.2.4. InP
  • 10.2.5. Others (SiGe, GaP, InSb, etc.)
• 10.3. By Product (USD)
  • 10.3.1. LED
  • 10.3.2. Optoelectronics
  • 10.3.3. Power Electronics
  • 10.3.4. RF Devices
• 10.4. By Industry (USD)
  • 10.4.1. Consumer Electronics
  • 10.4.2. Telecommunications
  • 10.4.3. Energy and Power
  • 10.4.4. Automotive
  • 10.4.5. Aerospace and Defense
  • 10.4.6. Others (Healthcare, etc.)
• 10.5. By Country (USD)
  • 10.5.1. China
    • 10.5.1.1. By Industry
  • 10.5.2. Japan
    • 10.5.2.1. By Industry
  • 10.5.3. India
    • 10.5.3.1. By Industry
  • 10.5.4. South Korea
    • 10.5.4.1. By Industry
  • 10.5.5. ASEAN
    • 10.5.5.1. By Industry
  • 10.5.6. Oceania
    • 10.5.6.1. By Industry
  • 10.5.7. Rest of Asia Pacific

11. Company Profiles for Top 10 Players (Based on data availability in public domain and/or on paid databases)

• 11.1. Texas Instruments Inc.
  • 11.1.1. Overview
    • 11.1.1.1. Key Management
    • 11.1.1.2. Headquarters
    • 11.1.1.3. Offerings/Business Segments
  • 11.1.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.1.2.1. Employee Size
    • 11.1.2.2. Past and Current Revenue
    • 11.1.2.3. Geographical Share
    • 11.1.2.4. Business Segment Share
    • 11.1.2.5. Recent Developments
• 11.2. Qorvo, Inc.
  • 11.2.1. Overview
    • 11.2.1.1. Key Management
    • 11.2.1.2. Headquarters
    • 11.2.1.3. Offerings/Business Segments
  • 11.2.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.2.2.1. Employee Size
    • 11.2.2.2. Past and Current Revenue
    • 11.2.2.3. Geographical Share
    • 11.2.2.4. Business Segment Share
    • 11.2.2.5. Recent Developments
• 11.3. Skyworks Solutions Inc.
  • 11.3.1. Overview
    • 11.3.1.1. Key Management
    • 11.3.1.2. Headquarters
    • 11.3.1.3. Offerings/Business Segments
  • 11.3.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.3.2.1. Employee Size
    • 11.3.2.2. Past and Current Revenue
    • 11.3.2.3. Geographical Share
    • 11.3.2.4. Business Segment Share
    • 11.3.2.5. Recent Developments
• 11.4. Broadcom Inc.
  • 11.4.1. Overview
    • 11.4.1.1. Key Management
    • 11.4.1.2. Headquarters
    • 11.4.1.3. Offerings/Business Segments
  • 11.4.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.4.2.1. Employee Size
    • 11.4.2.2. Past and Current Revenue
    • 11.4.2.3. Geographical Share
    • 11.4.2.4. Business Segment Share
    • 11.4.2.5. Recent Developments
• 11.5. Taiwan Semiconductor Manufacturing Company Limited
  • 11.5.1. Overview
    • 11.5.1.1. Key Management
    • 11.5.1.2. Headquarters
    • 11.5.1.3. Offerings/Business Segments
  • 11.5.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.5.2.1. Employee Size
    • 11.5.2.2. Past and Current Revenue
    • 11.5.2.3. Geographical Share
    • 11.5.2.4. Business Segment Share
    • 11.5.2.5. Recent Developments
• 11.6. NXP Semiconductors N.V.
  • 11.6.1. Overview
    • 11.6.1.1. Key Management
    • 11.6.1.2. Headquarters
    • 11.6.1.3. Offerings/Business Segments
  • 11.6.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.6.2.1. Employee Size
    • 11.6.2.2. Past and Current Revenue
    • 11.6.2.3. Geographical Share
    • 11.6.2.4. Business Segment Share
    • 11.6.2.5. Recent Developments
• 11.7. Infineon Technologies AG
  • 11.7.1. Overview
    • 11.7.1.1. Key Management
    • 11.7.1.2. Headquarters
    • 11.7.1.3. Offerings/Business Segments
  • 11.7.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.7.2.1. Employee Size
    • 11.7.2.2. Past and Current Revenue
    • 11.7.2.3. Geographical Share
    • 11.7.2.4. Business Segment Share
    • 11.7.2.5. Recent Developments
• 11.8. Renesas Electronics Corporation
  • 11.8.1. Overview
    • 11.8.1.1. Key Management
    • 11.8.1.2. Headquarters
    • 11.8.1.3. Offerings/Business Segments
  • 11.8.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.8.2.1. Employee Size
    • 11.8.2.2. Past and Current Revenue
    • 11.8.2.3. Geographical Share
    • 11.8.2.4. Business Segment Share
    • 11.8.2.5. Recent Developments
• 11.9. Wolfspeed, Inc.
  • 11.9.1. Overview
    • 11.9.1.1. Key Management
    • 11.9.1.2. Headquarters
    • 11.9.1.3. Offerings/Business Segments
  • 11.9.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.9.2.1. Employee Size
    • 11.9.2.2. Past and Current Revenue
    • 11.9.2.3. Geographical Share
    • 11.9.2.4. Business Segment Share
    • 11.9.2.5. Recent Developments
• 11.10. ams-OSRAM AG
  • 11.10.1. Overview
    • 11.10.1.1. Key Management
    • 11.10.1.2. Headquarters
    • 11.10.1.3. Offerings/Business Segments
  • 11.10.2. Key Details (Key details are consolidated data and not product/service specific)
    • 11.10.2.1. Employee Size
    • 11.10.2.2. Past and Current Revenue
    • 11.10.2.3. Geographical Share
    • 11.10.2.4. Business Segment Share
    • 11.10.2.5. Recent Developments