세계의 압전 MEMS 시장(2025-2035년)

Piezoelectric microelectromechanical sensors and actuators are used in a wide variety of applications. Compared to traditional capacitive MEMS, piezoelectric MEMS deliver superior performance and manufacturing efficiency. Piezoelectric thin films, particularly PZT, form the new basis for high-growth MEMS products such as microphones and micromirrors, gas sensors, image stabilizers, ultrasonic transducers, piezo printers that deliver excellent printing results, AR glasses and RF filters for enhanced telecommunications.

The piezoMEMS sector represents a significant segment within the broader MEMS industry, with particularly strong presence in consumer electronics, telecommunications, and emerging IoT applications.

The piezoMEMS market is expected to grow significantly faster than the broader MEMS driven by:

• Expansion of 5G networks and eventual 6G development
• Increasing adoption in automotive safety and autonomous systems
• Growth in medical imaging and diagnostic applications
• Emergence of new consumer electronics applications

The emergence of new applications, particularly in IoT, automotive, and medical sectors, is expected to drive sustained growth through 2035, with potential for breakthrough applications in emerging fields such as quantum computing and advanced sensing systems.

"The Global PiezoMEMS Market 2025-2035" report analyzes the global piezoelectric MEMS (PiezoMEMS) sector, providing detailed insights into technology developments, market trends, and growth opportunities from 2025 to 2035. The study examines the entire value chain from materials and manufacturing to end-user applications, with particular focus on emerging technologies and market dynamics.

Report contents include:

• Extensive analysis of the PiezoMEMS industry, including detailed market forecasts, technology assessments, and competitive analysis.
• Key applications such as RF filters, sensors, actuators, and transducers across various sectors including consumer electronics, automotive, medical, and industrial applications.
• Key Market Segments covered include:
  • Sensors (microphones, accelerometers, force sensors)
  • Actuators (inkjet printheads, microspeakers, optical MEMS)
  • Transducers (ultrasonic fingerprint sensors, medical imaging)
  • RF Filters (BAW technology, FBAR/SMR solutions)
• Detailed market analysis including:
  • Global revenue projections (2025-2035)
  • Volume forecasts by device type
  • Regional market analysis
  • Production capacity assessment
  • Wafer-level analysis
  • Supply chain evaluation
• Technology roadmaps and development trends
• Manufacturing strategies and challenges
• Regional market dynamics
• Detailed analysis of key application areas:
  • Consumer electronics (smartphones, wearables)
  • Automotive sensors and actuators
  • Medical devices and imaging systems
  • Industrial applications
  • IoT and emerging applications
• Manufacturing and Production:
  • Wafer fabrication processes
  • Integration technologies
  • Quality control methods
  • Capacity utilization
  • Regional production distribution
  • Cost analysis
• Technology Trends and Innovation:
  • Material innovations and enhancements
  • Manufacturing advances
  • Device miniaturization
  • Performance improvements
  • Novel applications
  • Integration strategies
• Market opportunities and growth drivers:
  • Technical barriers and solutions
  • Market adoption factors
  • Competition analysis
  • Environmental considerations
  • Regulatory compliance
  • Future opportunities
  • Comprehensive profiles of over 100 companies including:
  • Major MEMS manufacturers
  • Material suppliers
  • Equipment providers
  • Technology developers
  • End-product manufacturers

Companies covered include:

and more......

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. The Global MEMS market
  • 1.1.1. Historical
  • 1.1.2. Current market (2024-2025)
• 1.2. Overview of Piezoelectric Technology
  • 1.2.1. Fundamentals of Piezoelectricity
  • 1.2.2. Direct and Inverse Piezoelectric Effects
  • 1.2.3. Key Parameters and Measurements
  • 1.2.4. Design Considerations
• 1.3. Evolution of PiezoMEMS Technology
• 1.4. PiezoMEMS Market 2020-2024
  • 1.4.1. Market Size and Growth Trends
  • 1.4.2. Application Development
  • 1.4.3. Technology Advancement
• 1.5. Technology Landscape
  • 1.5.1. Core Technologies
  • 1.5.2. PiezoMEMS technology as a key enabler for implementing generative AI capabilities in edge devices
  • 1.5.3. Integration Approaches
  • 1.5.4. Competing Technologies
  • 1.5.5. Technology Readiness Levels
• 1.6. Regulatory Framework
  • 1.6.1. Environmental Regulations
  • 1.6.2. Safety Requirements
  • 1.6.3. Certification Processes
  • 1.6.4. Future Regulatory Trends

2. PIEZOELECTRIC MATERIALS AND TECHNOLOGIES

• 2.1. Fundamentals of Piezoelectric Materials
  • 2.1.1. Working Principles
    • 2.1.1.1. Crystal Structure
    • 2.1.1.2. Polarization Mechanisms
    • 2.1.1.3. Electromechanical Coupling
    • 2.1.1.4. Material Physics
  • 2.1.2. Key Performance Metrics
    • 2.1.2.1. Piezoelectric Coefficients
    • 2.1.2.2. Coupling Factors
    • 2.1.2.3. Quality Factors
    • 2.1.2.4. Temperature Stability
    • 2.1.2.5. Reliability Metrics
  • 2.1.3. Manufacturing Processes
    • 2.1.3.1. Thin Film Deposition
    • 2.1.3.2. Material Processing
    • 2.1.3.3. Quality Control
    • 2.1.3.4. Process Integration
    • 2.1.3.5. Yield Management
• 2.2. Material Categories
  • 2.2.1. Aluminum Nitride (AlN)
    • 2.2.1.1. Properties and Characteristics
    • 2.2.1.2. Applications
    • 2.2.1.3. Cost Structure
  • 2.2.2. Scandium-doped AlN
    • 2.2.2.1. Doping Effects
    • 2.2.2.2. Performance Improvements
    • 2.2.2.3. Manufacturing Challenges
    • 2.2.2.4. Cost-Benefit Analysis
    • 2.2.2.5. Market Adoption
  • 2.2.3. Lead Zirconate Titanate (PZT)
    • 2.2.3.1. Material Properties
    • 2.2.3.2. Processing Methods
    • 2.2.3.3. Performance Characteristics
    • 2.2.3.4. Environmental Concerns
    • 2.2.3.5. Application Areas
  • 2.2.4. Emerging Materials
    • 2.2.4.1. KNN
    • 2.2.4.2. LiNbO3
• 2.3. Processing Technologies
  • 2.3.1. Thin-film Deposition
    • 2.3.1.1. Sputtering Techniques
    • 2.3.1.2. Chemical Vapor Deposition
    • 2.3.1.3. Sol-Gel Processing
    • 2.3.1.4. Other Methods
  • 2.3.2. Integration Techniques
    • 2.3.2.1. CMOS Integration
    • 2.3.2.2. Wafer Bonding
    • 2.3.2.3. Packaging Solutions
    • 2.3.2.4. Novel Approaches
  • 2.3.3. Quality Control Methods

3. MARKET ANALYSIS AND FORECASTS 2025-2035

• 3.1. Market Size and Growth
  • 3.1.1. Global Revenue Projections
  • 3.1.2. Volume Forecasts
    • 3.1.2.1. Unit Production Trends
    • 3.1.2.2. Volume by Device Type
    • 3.1.2.3. Production Capacity Analysis
    • 3.1.2.4. Capacity Utilization Rates
  • 3.1.3. Regional Analysis
    • 3.1.3.1. North America
    • 3.1.3.2. Europe
    • 3.1.3.3. Asia Pacific
    • 3.1.3.4. China
• 3.2. Market Segmentation
  • 3.2.1. By Device Type
  • 3.2.2. By Material Type
  • 3.2.3. By End-user Industry
• 3.3. Wafer-level Analysis
  • 3.3.1. Wafer Starts by Material
  • 3.3.2. Wafer Size Trends
  • 3.3.3. Manufacturing Capacity
  • 3.3.4. Regional Production Distribution

4. APPLICATION SEGMENTS

• 4.1. Sensors
  • 4.1.1. Microphones
  • 4.1.2. Accelerometers
  • 4.1.3. Force Sensors
  • 4.1.4. Market Forecast
• 4.2. Actuators
  • 4.2.1. Inkjet Printheads
  • 4.2.2. Microspeakers
  • 4.2.3. Optical MEMS
  • 4.2.4. Market Forecast
• 4.3. Transducers
  • 4.3.1. Ultrasonic Fingerprint Sensors
  • 4.3.2. Medical Imaging
  • 4.3.3. Market Forecast
• 4.4. RF Filters
  • 4.4.1. BAW Technology
  • 4.4.2. FBAR/SMR Solutions
  • 4.4.3. Market Forecast

5. SUPPLY CHAIN

6. TECHNOLOGY TRENDS AND INNOVATION

• 6.1. Material Innovations
  • 6.1.1. Enhanced Performance Materials
  • 6.1.2. Lead-free Alternatives
  • 6.1.3. Novel Compositions
• 6.2. Manufacturing Advances
  • 6.2.1. Process Improvements
  • 6.2.2. Integration Technologies
  • 6.2.3. Quality Control Methods
• 6.3. Device Innovations
  • 6.3.1. Miniaturization Trends
  • 6.3.2. Performance Enhancements
  • 6.3.3. New Applications

7. CHALLENGES AND OPPORTUNITIES

• 7.1. Technical Challenges
• 7.2. Market Barriers
• 7.3. Growth Opportunities
• 7.4. Future Applications

8. COMPANY PROFILES (106 company profiles)

9. APPENDICES

• 9.1. Research Methodology
• 9.2. Abbreviations

10. REFERENCES