열전도 재료 시장(2027-2037년)

Thermal interface materials fill the microscopic voids between a heat-generating component and the surface carrying heat away, and they have moved from a commodity consumable to a rate-limiting factor in electronics design. Demand is set by power density rather than device count. GPUs running AI workloads dissipate heat fluxes on the order of 140 W/cm², while three-dimensional stacked architectures record average fluxes near 300 W/cm² with localised hotspots between 500 and 1,000 W/cm². Filled polymers, adequate when packages dissipated around 100 W, are reaching their ceiling as advanced packages approach 1,000 W. Metal interfaces, indium alloys in particular, are increasingly specified above roughly 400 W, where switching from polymer has been shown to cut junction temperature by more than 10°C - significant given a 10°C rise typically halves die lifetime.

This report provides a comprehensive technical and commercial assessment of thermal interface materials across eleven end markets. The market is analysed from the materials up. Coverage spans greases and pastes, gap pads, dispensed gap fillers, potting compounds and encapsulants, adhesive tapes, phase change materials, metal-based interfaces including solders, sintered silver and copper, and liquid metals, and the full range of carbon-based options from graphite sheet to vertically aligned nanotube arrays and graphene composites. Filler chemistry is treated separately, covering alumina, boron nitride, aluminium nitride, diamond, graphene and boron nitride nanotubes, with pricing and adoption barriers for each.

A dedicated chapter addresses emerging materials and processes, organised by the engineering problem each solves rather than by chemistry. It covers TIM0 through TIM3 nomenclature and the collapse in allowable application pressure for large HPC modules, hybrid and confined liquid metal architectures, warpage-tolerant phase change materials for AI server dies, anchored nanocarbon interfaces, very high density graphite, boron arsenide, liquid-infused nanowire composites, die backside power delivery, immersion cooling compatibility, AI-directed formulation discovery, circularity, and the shift from datasheet-based specification to knowledge-based qualification.

Market forecasts are provided for consumer electronics, electric vehicles, data centres, advanced semiconductor packaging, ADAS sensors, EMI shielding, 5G infrastructure, aerospace and defence, industrial electronics, renewable energy and medical electronics, segmented by material type at annual granularity. Area forecasts in m² are given for server boards, ADAS die attach, 5G antennas, baseband units and power supplies, alongside a 5G power consumption model.

The report profiles 118 companies across the value chain, from multinational formulators to venture-backed materials startups, with recent product launches, partnerships and corporate developments. An accompanying Excel workbook contains all underlying data as live, editable models.

Contents include:

• Introduction - active and passive thermal management, TIM types and thermal conductivity, comparative properties, pads versus grease, advantages and disadvantages by type, performance, prices, supply chain, raw material analysis and pricing, environmental regulations and sustainability, system-level performance, thermal conductivity versus thermal resistance, TIM chemistry
• Materials - advanced and multi-functional TIMs, fillers and trends, greases and pastes, gap pads, gap fillers, potting compounds and encapsulants, adhesive tapes, phase change materials, metal-based TIMs, carbon-based TIMs, metamaterials, self-healing TIMs, dispensing equipment and methods
• Emerging materials and processes - interface as constraint, TIM0-TIM3 nomenclature, hybrid and confined liquid metals, next-generation PCMs, anchored nanocarbon, graphene and VHD graphite, boron nitride and boron arsenide, liquid-infused and nanowire composites, metal TIM1, heterogeneous integration and backside power, immersion cooling, AI-directed discovery, sustainability and circularity, metrology and qualification, networking silicon
• Markets - consumer electronics, electric vehicles, data centres, advanced semiconductor packaging, ADAS sensors, EMI shielding, 5G, aerospace and defence, industrial electronics, renewable energy, medical electronics
• 118 Company profiles. Companies profiled include 3M, ADA Technologies, Aismalibar, AI Technology, Alpha Assembly, AluChem, AOK Technologies, AOS Thermal Compounds, Arkema, Arieca, ATP Adhesive Systems, Aztrong, Bando Chemical Industries, Bdtronic, BestGraphene, BNNano, BNNT, Boston Materials, Boyd Corporation, BYK, Cambridge Nanotherm, Carbice, Carbon Waters, Carbodeon, CondAlign, Denka, Detakta, Dexerials, Deyang Carbonene Technology, Discovered Materials, Dow Corning, Dowa Electronics Materials, Dymax, Dynex Semiconductor (CRRC), ELANTAS, Elkem Silcones, Enerdyne Thermal Solutions, Epoxies Etc., First Graphene, Fujipoly, Fujitsu Laboratories, GCS Thermal, GLPOLY, Global Graphene Group, Goodfellow, Graphmatech, Green Critical Minerals, GuangDong KingBali New Material, HALA Contec, Hamamatsu Carbonics, H.B. Fuller, Henkel, Hitek Electronic Materials, Honeywell, Hongfucheng New Materials, Huber Martinswerk, HyMet Thermal Interfaces, Indium Corporation, Inkron, KB Element, Kerafol, Kitagawa and more.....

Table of Contents

1 EXECUTIVE SUMMARY

• 1.1 Scope of this edition
• 1.2 Market size and growth
• 1.3 Key findings
• 1.4 Technology outlook to
• 1.5 What has changed in this edition

2 INTRODUCTION

• 2.1 Thermal Management-active and passive
• 2.2 What are Thermal Interface Materials (TIMs)?
  • 2.2.1 Types of TIMs
  • 2.2.2 Thermal conductivity
• 2.3 Comparative properties of TIMs
• 2.4 Thermal Pads and Thermal Grease
• 2.5 Advantages and Disadvantages of TIMs, by type
• 2.6 Performance
• 2.7 Prices
• 2.8 Emerging Technologies in TIMs
• 2.9 Supply Chain for TIMs
• 2.10 Raw Material Analysis and Pricing
• 2.11 Environmental Regulations and Sustainability
• 2.12 System Level Performance
• 2.13 Thermal Conductivity vs Thermal Resistance
• 2.14 TIM Chemistry

3 MATERIALS

• 3.1 Advanced and Multi-Functional TIMs
  • 3.1.1 Carbon-based TIMs
    • 3.1.1.1 Overview
  • 3.1.2 Thermal Conductivity By Filler Type
  • 3.1.3 Thermal Conductivity By Matrix
• 3.2 TIM fillers
  • 3.2.1 Trends
  • 3.2.2 Pros and Cons
  • 3.2.3 Thermal Conductivity
  • 3.2.4 Spherical Alumina
  • 3.2.5 Alumina Fillers
  • 3.2.6 Boron nitride (BN)
    • 3.2.6.1 Overview
    • 3.2.6.2 Suppliers
    • 3.2.6.3 Nano Boron Nitride
  • 3.2.7 Filler and polymer TIMs
  • 3.2.8 Diamond
  • 3.2.9 Filler Sizes
• 3.3 Thermal Greases and Pastes
  • 3.3.1 Overview and properties
  • 3.3.2 SWOT analysis
• 3.4 Thermal Gap Pads
  • 3.4.1 Overview and properties
  • 3.4.2 Application in EV Batteries
  • 3.4.3 Transitioning to Gap fillers from Pads
  • 3.4.4 SWOT analysis
• 3.5 Thermal Gap Fillers
  • 3.5.1 Overview and properties
  • 3.5.2 Products
  • 3.5.3 SWOT analysis
• 3.6 Potting Compounds/Encapsulants
  • 3.6.1 Overview and properties
  • 3.6.2 SWOT analysis
• 3.7 Adhesive Tapes
  • 3.7.1 Overview and properties
  • 3.7.2 Application in EV Batteries
  • 3.7.3 TCA Requirements
  • 3.7.4 SWOT analysis
• 3.8 Phase Change Materials
  • 3.8.1 Overview
  • 3.8.2 Products
  • 3.8.3 Properties
  • 3.8.4 Types
    • 3.8.4.1 Organic/biobased phase change materials
      • 3.8.4.1.1 Advantages and disadvantages
      • 3.8.4.1.2 Paraffin wax
      • 3.8.4.1.3 Non-Paraffins/Bio-based
    • 3.8.4.2 Inorganic phase change materials
      • 3.8.4.2.1 Salt hydrates
        • 3.8.4.2.1.1 Advantages and disadvantages
      • 3.8.4.2.2 Metal and metal alloy PCMs (High-temperature)
    • 3.8.4.3 Eutectic mixtures
    • 3.8.4.4 Encapsulation of PCMs
      • 3.8.4.4.1 Macroencapsulation
      • 3.8.4.4.2 Micro/nanoencapsulation
    • 3.8.4.5 Nanomaterial phase change materials
  • 3.8.5 Thermal energy storage (TES)
    • 3.8.5.1 Sensible heat storage
    • 3.8.5.2 Latent heat storage
  • 3.8.6 Application in TIMs
    • 3.8.6.1 Thermal pads
    • 3.8.6.2 Low Melting Alloys (LMAs)
    • 3.8.6.3 Thermal storage units
    • 3.8.6.4 Thermal energy storage panels
    • 3.8.6.5 Space systems
  • 3.8.7 SWOT analysis
• 3.9 Metal-based TIMs
  • 3.9.1 Overview
    • 3.9.1.1 Metal-Based TIM1 and TIM2
    • 3.9.1.2 Metal Filled Polymer TIMs
  • 3.9.2 Solders and low melting temperature alloy TIMs
    • 3.9.2.1 Solder TIM1
    • 3.9.2.2 Sintering
  • 3.9.3 Liquid metals
    • 3.9.3.1 Liquid metal for high-performance GPU
    • 3.9.3.2 Challenges
  • 3.9.4 Solid liquid hybrid (SLH) metals
    • 3.9.4.1 Hybrid liquid metal pastes
    • 3.9.4.2 SLH created during chip assembly (m2TIMs)
    • 3.9.4.3 Die-attach materials
      • 3.9.4.3.1 Solder Alloys and Conductive Adhesives
      • 3.9.4.3.2 Silver-Sintered Paste
      • 3.9.4.3.3 Copper (Cu) sintered TIMs
        • 3.9.4.3.3.1 TIM1 - Sintered Copper
        • 3.9.4.3.3.2 Cu Sinter Materials
        • 3.9.4.3.3.3 Copper Sintering Challenges
        • 3.9.4.3.3.4 Commercial Use
      • 3.9.4.3.4 Sintered Copper Die-Bonding Paste
        • 3.9.4.3.4.1 Commercial activity
      • 3.9.4.3.5 Graphene Enhanced Sintered Copper TIMs
    • 3.9.4.4 Laminar Metal Form With High Softness
  • 3.9.5 SWOT analysis
• 3.10 Carbon-based TIMs
  • 3.10.1 Carbon nanotube (CNT) TIM Fabrication
  • 3.10.2 Challenges
  • 3.10.3 Market players
  • 3.10.4 Multi-walled nanotubes (MWCNT)
    • 3.10.4.1 Properties
    • 3.10.4.2 Application as thermal interface materials
  • 3.10.5 Single-walled carbon nanotubes (SWCNTs)
    • 3.10.5.1 Properties
    • 3.10.5.2 Application as thermal interface materials
  • 3.10.6 Vertically aligned CNTs (VACNTs)
    • 3.10.6.1 Properties
    • 3.10.6.2 Applications
    • 3.10.6.3 Application as thermal interface materials
  • 3.10.7 BN nanotubes (BNNT) and nanosheets (BNNS)
    • 3.10.7.1 Properties
    • 3.10.7.2 Application as thermal interface materials
  • 3.10.8 Graphene
    • 3.10.8.1 Properties
    • 3.10.8.2 Application as thermal interface materials
      • 3.10.8.2.1 Graphene fillers
      • 3.10.8.2.2 Graphene foam
      • 3.10.8.2.3 Graphene aerogel
      • 3.10.8.2.4 Graphene Heat Spreaders
      • 3.10.8.2.5 Graphene in Thermal Interface Pads
    • 3.10.8.3 Advantages of Graphene
    • 3.10.8.4 Through-Plane Alignment
  • 3.10.9 Nanodiamonds
    • 3.10.9.1 Properties
    • 3.10.9.2 Application as thermal interface materials
  • 3.10.10 Graphite
    • 3.10.10.1 Properties
    • 3.10.10.2 Natural graphite
      • 3.10.10.2.1 Classification
      • 3.10.10.2.2 Processing
      • 3.10.10.2.3 Flake
        • 3.10.10.2.3.1 Grades
        • 3.10.10.2.3.2 Applications
    • 3.10.10.3 Synthetic graphite
      • 3.10.10.3.1 Classification
        • 3.10.10.3.1.1 Primary synthetic graphite
        • 3.10.10.3.1.2 Secondary synthetic graphite
        • 3.10.10.3.1.3 Processing
    • 3.10.10.4 Applications as thermal interface materials
      • 3.10.10.4.1 Graphite Sheets
      • 3.10.10.4.2 Vertical graphite
      • 3.10.10.4.3 Graphite pastes
    • 3.10.10.5 Challenges
      • 3.10.10.5.1 Through-plane thermal conductivity limitations
      • 3.10.10.5.2 Interfacing with Heat Source and Disrupting Alignment
  • 3.10.11 Hexagonal Boron Nitride
    • 3.10.11.1 Properties
    • 3.10.11.2 Application as thermal interface materials
  • 3.10.12 SWOT analysis
• 3.11 Metamaterials
  • 3.11.1 Types and properties
    • 3.11.1.1 Electromagnetic metamaterials
      • 3.11.1.1.1 Double negative (DNG) metamaterials
      • 3.11.1.1.2 Single negative metamaterials
      • 3.11.1.1.3 Electromagnetic bandgap metamaterials (EBG)
      • 3.11.1.1.4 Bi-isotropic and bianisotropic metamaterials
      • 3.11.1.1.5 Chiral metamaterials
      • 3.11.1.1.6 Electromagnetic “Invisibility” cloak
    • 3.11.1.2 Terahertz metamaterials
    • 3.11.1.3 Photonic metamaterials
    • 3.11.1.4 Tunable metamaterials
    • 3.11.1.5 Frequency selective surface (FSS) based metamaterials
    • 3.11.1.6 Nonlinear metamaterials
    • 3.11.1.7 Acoustic metamaterials
  • 3.11.2 Application as thermal interface materials
• 3.12 Self-healing thermal interface materials
  • 3.12.1 Extrinsic self-healing
  • 3.12.2 Capsule-based
  • 3.12.3 Vascular self-healing
  • 3.12.4 Intrinsic self-healing
  • 3.12.5 Healing volume
  • 3.12.6 Types of self-healing materials, polymers and coatings
  • 3.12.7 Applications in thermal interface materials
• 3.13 TIM Dispensing
  • 3.13.1 Low-volume Dispensing Methods
  • 3.13.2 High-volume Dispensing Methods
  • 3.13.3 Meter, Mix, Dispense (MMD) Systems
  • 3.13.4 TIM Dispensing Equipment Suppliers

4 EMERGING MATERIALS AND PROCESSES

• 4.1 Why the interface has become the constraint
• 4.2 Nomenclature
• 4.3 Hybrid and confined liquid metal architectures
  • 4.3.1 Fibre-reinforced liquid metal composites
  • 4.3.2 Liquid metal embedded elastomers
  • 4.3.3 Hybrid dam architectures
  • 4.3.4 Phase change metal alloys
• 4.4 Next-generation phase change materials
• 4.5 Anchored nanocarbon interfaces
• 4.6 Graphene, graphite and very high density carbon
• 4.7 Boron nitride, boron arsenide and engineered fillers
• 4.8 Liquid-infused and nanowire composites
• 4.9 Metal TIM1: solder, sintering and indium
• 4.10 Packaging architecture: heterogeneous integration and backside power
• 4.11 Immersion cooling compatibility
• 4.12 AI-directed formulation discovery
• 4.13 Sustainability and circularity
• 4.14 Metrology, reliability and qualification practice
• 4.15 Thermal demand beyond compute: networking silicon

5 MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs)

• 5.1 Consumer Electronics
  • 5.1.1 Market overview
    • 5.1.1.1 Market drivers
    • 5.1.1.2 Applications
      • 5.1.1.2.1 Smartphones and tablets
        • 5.1.1.2.1.1 Graphitic Heat Spreaders
        • 5.1.1.2.1.2 Liquid metals
      • 5.1.1.2.2 Wearable electronics
  • 5.1.2 Global market 2022-2037, by TIM type
• 5.2 Electric Vehicles (EV)
  • 5.2.1 Market overview
    • 5.2.1.1 Market drivers
    • 5.2.1.2 Applications
      • 5.2.1.2.1 EV Battery Packs
        • 5.2.1.2.1.1 TIM Pack and Module
        • 5.2.1.2.1.2 TIM Application by Cell Format
        • 5.2.1.2.1.3 Thermal Interface Material Fillers for EV Batteries
        • 5.2.1.2.1.4 Factors Impacting TIM Pricing
        • 5.2.1.2.1.5 TIM Pricing
        • 5.2.1.2.1.6 Companies
      • 5.2.1.2.2 Lithium-ion batteries
        • 5.2.1.2.2.1 Cell-to-pack designs
        • 5.2.1.2.2.2 Cell-to-chassis/body
      • 5.2.1.2.3 Power electronics
        • 5.2.1.2.3.1 Types
        • 5.2.1.2.3.2 Trends
        • 5.2.1.2.3.3 Properties for TIM2 Properties in EV power electronics
        • 5.2.1.2.3.4 TIM1s
        • 5.2.1.2.3.5 TIM2 in SiC MOSFET
      • 5.2.1.2.4 Charging stations
  • 5.2.2 Global market 2022-2037, by TIM type
• 5.3 Data Centers
  • 5.3.1 Market overview
    • 5.3.1.1 Market drivers
    • 5.3.1.2 Applications
      • 5.3.1.2.1 Router, switches and line cards
        • 5.3.1.2.1.1 Transceivers
        • 5.3.1.2.1.2 Server Boards
        • 5.3.1.2.1.3 Switches and Routers
      • 5.3.1.2.2 AI Servers
        • 5.3.1.2.2.1 Overview
        • 5.3.1.2.2.2 Trends
        • 5.3.1.2.2.3 TRL
      • 5.3.1.2.3 Power supply converters
        • 5.3.1.2.3.1 Overview
        • 5.3.1.2.3.2 Laminar metal form TIMs
        • 5.3.1.2.3.3 TIM Consumption in Data Center Power Supplies
        • 5.3.1.2.3.4 Immersion cooling
  • 5.3.2 Global market 2022-2037, by TIM type
• 5.4 Advanced Semiconductor Packaging
  • 5.4.1 Market Overview
  • 5.4.2 TIM1
    • 5.4.2.1 Indium foil TIM1
    • 5.4.2.2 Products
      • 5.4.2.2.1 Thermal Gel
      • 5.4.2.2.2 Thermal grease
      • 5.4.2.2.3 Graphene
      • 5.4.2.2.4 Liquid metal
      • 5.4.2.2.5 Diamond thermal interface materials in TIM0 applications
      • 5.4.2.2.6 Integrated silicon micro-cooler systems
      • 5.4.2.2.7 Copper nanowire (CuNWs)
  • 5.4.3 Global market 2022-2037, by TIM type
• 5.5 ADAS Sensors
  • 5.5.1 Market overview
    • 5.5.1.1 Market drivers
      • 5.5.1.1.1 Sensor Suite for Autonomous Cars
      • 5.5.1.1.2 Thermal Management in ADAS Sensors
    • 5.5.1.2 Applications
      • 5.5.1.2.1 ADAS Cameras
        • 5.5.1.2.1.1 Commercial examples
      • 5.5.1.2.2 ADAS Radar
        • 5.5.1.2.2.1 Radar technology
        • 5.5.1.2.2.2 Radar boards
        • 5.5.1.2.2.3 Commercial examples
      • 5.5.1.2.3 ADAS LiDAR
        • 5.5.1.2.3.1 Role of TIMs
        • 5.5.1.2.3.2 Commercial examples
      • 5.5.1.2.4 Electronic control units (ECUs) and computers
        • 5.5.1.2.4.1 Overview
        • 5.5.1.2.4.2 Commercial examples
      • 5.5.1.2.5 Die attach materials
        • 5.5.1.2.5.1 Overview
        • 5.5.1.2.5.2 Commercial examples
    • 5.5.1.3 Companies
  • 5.5.2 Global market 2022-2037, by TIM type
• 5.6 EMI shielding
  • 5.6.1 Market overview
    • 5.6.1.1 Market drivers
    • 5.6.1.2 Applications
      • 5.6.1.2.1 Dielectric Constant
      • 5.6.1.2.2 ADAS
        • 5.6.1.2.2.1 Radar
        • 5.6.1.2.2.2 5G
      • 5.6.1.2.3 Commercial examples
• 5.7 5G
  • 5.7.1 Market overview
    • 5.7.1.1 Market drivers
    • 5.7.1.2 Applications
      • 5.7.1.2.1 EMI shielding and EMI gaskets
      • 5.7.1.2.2 Antenna
      • 5.7.1.2.3 Base Band Unit (BBU)
      • 5.7.1.2.4 Liquid TIMs
      • 5.7.1.2.5 Power supplies
        • 5.7.1.2.5.1 Increased power consumption in 5G
  • 5.7.2 Market players
  • 5.7.3 Global market 2022-2037, by TIM type
• 5.8 Aerospace & Defense
  • 5.8.1 Market overview
    • 5.8.1.1 Market drivers
    • 5.8.1.2 Applications
      • 5.8.1.2.1 Satellite thermal management
        • 5.8.1.2.1.1 Temperature range
        • 5.8.1.2.1.2 Heat Spreaders
        • 5.8.1.2.1.3 Carbon fiber reinforced TIM
        • 5.8.1.2.1.4 Thermal pads
        • 5.8.1.2.1.5 Thermal straps
        • 5.8.1.2.1.6 Graphene
        • 5.8.1.2.1.7 Challenges
      • 5.8.1.2.2 Avionics cooling
      • 5.8.1.2.3 Military electronics
    • 5.8.1.3 Global market 2022-2037, by TIM type
• 5.9 Industrial Electronics
  • 5.9.1 Market overview
    • 5.9.1.1 Market drivers
    • 5.9.1.2 Applications
      • 5.9.1.2.1 Industrial automation
      • 5.9.1.2.2 Power supplies
      • 5.9.1.2.3 Motor drives
      • 5.9.1.2.4 LED lighting
  • 5.9.2 Global market 2022-2037, by TIM type
• 5.10 Renewable Energy
  • 5.10.1 Market overview
    • 5.10.1.1 Market drivers
    • 5.10.1.2 Applications
      • 5.10.1.2.1 Solar inverters
      • 5.10.1.2.2 Wind power electronics
      • 5.10.1.2.3 Energy storage systems
  • 5.10.2 Global market 2022-2037, by TIM type
• 5.11 Medical Electronics
  • 5.11.1 Market overview
    • 5.11.1.1 Market drivers
    • 5.11.1.2 Applications
      • 5.11.1.2.1 Diagnostic equipment
      • 5.11.1.2.2 Medical imaging systems
      • 5.11.1.2.3 Patient monitoring devices
  • 5.11.2 Global market 2022-2037, by TIM type

6 COMPANY PROFILES (119 company profiles)

7 RESEARCH METHODOLOGY

8 REFERENCES