DRAM 패키징용 열전도성 인터페이스 재료 : 시장 점유율 분석, 업계 동향 및 통계, 성장 예측(2026-2031년)

According to Mordor Intelligence, the thermal interface materials market for DRAM packaging industry size was valued at USD 0.39 billion in 2025 and is estimated to grow from USD 0.49 billion in 2026 to reach USD 1.32 billion by 2031, at a CAGR of 21.92% during the forecast period 2026-2031.

This report is Segmented by Material Type (Thermal Greases and Pastes, Thermal Pads / Gap Pads, and More), DRAM Packaging / Product Application (HBM Stacks, Advanced DRAM Packages, Server DRAM Modules, and More), End-Use Platform (AI Servers and Accelerators, and More), and Geography (North America, and More). The Market Forecasts are Provided in Terms of Value (USD).

Insights and Trends of Thermal Interface Materials Market For DRAM Packaging

Rising HBM Stack Height and D2D Heat Density

The thermal interface materials market for DRAM packaging industry is responding directly to the rise in stacked memory architectures, where more dies are being placed within tighter vertical limits. Taller HBM structures increase serial thermal resistance from the lower dies to the package lid, which makes heat removal harder even when external cooling improves. Siemens EDA noted that HBM4 design targets raise both stack height and I/O density, which increases localized heat concentration in the die-to-die physical layer. Imec showed the scale of this thermal challenge in 2025, reporting a peak GPU temperature of 141.7°C in a 3D HBM-on-GPU setup without mitigation, versus 69.1°C in a 2.5D baseline. SK hynix responded in May 2026 by introducing its iHBM solution with integrated cooling elements in the D2D PHY area, which cut thermal resistance by 30% while staying compatible with existing System-in-Package structures. As a result, the thermal interface materials market for DRAM packaging industry is moving toward materials that can support tighter gaps, more stable bond lines, and higher conductivity at multiple interface positions inside the package.

Shift To Hybrid Bonding and Thermal Co-Optimization

The thermal interface materials market for DRAM packaging industry is also being reshaped by the move from thermal compression bonding toward hybrid copper bonding in advanced memory assembly. This shift changes where heat builds up and how material selection affects both package integrity and thermal performance. A 2025 review in Electronics described how SiCN dielectrics, nano-twinned copper, and polymer composites each bring different tradeoffs in thermal resistance, warpage control, and coefficient of thermal expansion mismatch. Imec's cross-technology co-optimization work showed that hybrid-bonded 3D systems can move closer to 2.5D thermal behavior when technology and system cooling decisions are modeled together, not in isolation. That development is splitting product demand into separate tracks for intra-stack materials and lid-interface materials, which makes supplier portfolios more specialized. In practical terms, the thermal interface materials market for DRAM packaging industry is seeing procurement shift from a single material decision toward a broader package-level thermal design decision.

Cost Pressure from Premium Filler And Resin Inputs

The thermal interface materials market for DRAM packaging industry faces clear cost pressure from premium fillers and silicone-based carrier systems used in high-performance formulations. Shin-Etsu announced in April 2026 that it would raise prices on all silicone products by 10% or more, citing crude oil and naphtha cost increases linked to Middle East supply conditions. That matters because silicone-based systems still account for much of the qualified material base in DRAM packaging. The effect is stronger in thinner bond lines, where high-purity and tightly controlled filler systems are needed to keep performance stable in compact geometries. Larger suppliers can absorb some of this pressure through scale and broader sourcing networks, while smaller formulators have less room to protect margins. As a result, the thermal interface materials market for DRAM packaging industry is seeing higher input costs reinforce incumbent strength at the same time that next-generation products require more specialized ingredients.

Other drivers and restraints analyzed in the detailed report include:

1. Expansion of AI Server Memory Content Per System
2. Reliability Requirements In 24/7 Enterprise Memory Systems
3. Qualification Risk in Advanced DRAM Packaging Lines

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Thermal pads/gap pads held 34.67% of the thermal interface materials market for DRAM packaging industry share in 2025, which kept them as the leading material category. Their strong position came from established use in server DRAM modules and enterprise memory systems, where consistent bond-line control and easier handling remained valuable. They also fit well with automated assembly flows and support rework needs better than several alternative formats. That combination kept pad-based products central to conventional DRAM module assembly even as packaging demands became more complex. The thermal interface materials for DRAM packaging market still relies on these formats where manufacturability and qualification history matter as much as peak conductivity.

Thermal gels and dispensable gap fillers are forecast to grow at a 22.15% CAGR through 2031, reflecting their better fit with tighter interface geometries in HBM stacks and 2.5D interposer-based packages. Dow's launch of DOWSIL TC-3120 Thermal Gel in May 2026 showed how suppliers are positioning dispensable chemistries for dense, high-speed electronics with lower oil bleeding and lower condensed outgassing. Phase change materials are also gaining ground in lid-interface positions because they reduce pump-out risk during repeated cycling. Greases and pastes continue to serve conventional server platforms, but they face more pressure in advanced nodes where bond-line variation and migration risk are less acceptable. The Others category remains small in current revenue, yet it is drawing attention because carbon-based, graphite-based, and other novel materials could address interface positions that standard polymer systems serve less effectively.

Complete Report Scope:

• By Material Type
  • Thermal Greases and Pastes
  • Phase Change Materials
  • Thermal Gels / Dispensable Gap Fillers
  • Thermal Pads / Gap Pads
  • Others (Graphite / Carbon-Based TIMs, Advanced Nano-Composite TIMs)
• By DRAM Packaging / Product Application
  • HBM Stacks
  • Advanced DRAM Packages
  • Server DRAM Modules
  • Client DRAM Modules
  • CXL Attached DRAM Modules
• By End-Use Platform
  • AI Servers and Accelerators
  • High-Performance Computing
  • Enterprise and Hyperscale Data Centers
  • High-End Workstations
  • Client PCs and Notebooks
  • Industrial and Embedded Computing
• By Geography
  • North America
  • Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Taiwan
    • Rest of Asia-Pacific
  • Rest of the World

Geography Analysis

Asia-Pacific held 82.67% of the thermal interface materials market for DRAM packaging industry market share in 2025, which made the region the clear center of global demand. This concentration reflects the geographic clustering of DRAM production, HBM assembly, and advanced outsourced semiconductor assembly and test capacity across South Korea, Taiwan, Japan, and China. South Korea remains the most important country position because Samsung Electronics and SK hynix combine large HBM output with direct involvement in next-generation package thermal design. SK hynix's 2026 iHBM launch shows how memory producers in the region are shaping both package architecture and the interface material requirements that sit around it. Taiwan adds further weight through its advanced packaging ecosystem, where interposer-based assembly and co-packaged structures increase the number of thermally sensitive interfaces that must be managed.

Japan supports the thermal interface materials market for DRAM packaging industry through high-purity materials supply and memory-related packaging operations, while China is expanding its position through domestic OSAT growth and localization efforts. At the same time, Asia-Pacific still depends on imported high-performance formulations in some premium applications, especially where specialized filler systems or low-outgassing behavior are required. North America is forecast to grow at a 22.87% CAGR through 2031, which makes it the fastest-rising regional market. This growth is being driven by AI infrastructure investment, custom qualification needs from hyperscalers, and policy support for domestic semiconductor capacity. Carbice's partnership with DarkNX in February 2026 and its U.S. Navy qualification contract in April 2026 reflect how North American suppliers are targeting premium thermal positions that require high reliability and application-specific validation.

Demand in North America is concentrated more in qualification, deployment, and performance assurance than in large-scale DRAM die production, which lifts value intensity per approved material. Europe remains a smaller but stable part of the thermal interface materials market for DRAM packaging industry, supported by enterprise data center demand and specialized industrial computing uses. European customers place greater emphasis on compliance-sensitive formulations, which keeps interest high in silicone-free and low-outgassing products. The Rest of the World remains a smaller revenue pool, but countries in Southeast Asia and India could add relevance as packaging ambitions grow and regional electronics manufacturing broadens.

1. 3M
2. Henkel AG and Co. KGaA
3. The Dow Chemical Company
4. Shin-Etsu Chemical Co., Ltd.
5. Indium Corporation
6. Parker-Hannifin Corporation
7. Laird Thermal Systems, Inc.
8. Henkel Adhesive Technologies
9. Fujipoly, a division of Fuji Polymer Industries Co., Ltd.
10. Momentive Performance Materials Inc.
11. Boyd Corporation
12. Momentive Technologies
13. DuPont de Nemours, Inc.
14. Wacker Chemie AG
15. Honeywell International Inc.
16. Saint-Gobain S.A.
17. Aavid Thermalloy, LLC
18. Wakefield-Vette, Inc.
19. Carbice Corporation
20. Fujipoly America Corporation

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

• 4.1 Market Overview
• 4.2 Impact of Macroeconomic Factors on the Market
• 4.3 Market Drivers
  • 4.3.1 Rising HBM Stack Height and D2D Heat Density
  • 4.3.2 Shift to Hybrid Bonding and Thermal Co-Optimization
  • 4.3.3 Expansion of AI Server Memory Content Per System
  • 4.3.4 Reliability Requirements in 24/7 Enterprise Memory Systems
  • 4.3.5 High Thermal Conductivity Demand in Ultra-Thin Interface Gaps
  • 4.3.6 Qualification of Silicone-Free and Low-Outgassing TIM Formulations
• 4.4 Market Restraints
  • 4.4.1 Cost Pressure from Premium Filler and Resin Inputs
  • 4.4.2 Qualification Risk in Advanced DRAM Packaging Lines
  • 4.4.3 Substrate Warpage and Process Window Narrowing
  • 4.4.4 Competition from Integrated Cooling and Package-Level Thermal Designs
• 4.5 Industry Value Chain Analysis
• 4.6 Regulatory Landscape
• 4.7 Technological Outlook
• 4.8 Porter's Five Forces Analysis
  • 4.8.1 Bargaining Power of Suppliers
  • 4.8.2 Bargaining Power of Buyers
  • 4.8.3 Threat of New Entrants
  • 4.8.4 Threat of Substitutes
  • 4.8.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

• 5.1 By Material Type
  • 5.1.1 Thermal Greases and Pastes
  • 5.1.2 Phase Change Materials
  • 5.1.3 Thermal Gels / Dispensable Gap Fillers
  • 5.1.4 Thermal Pads / Gap Pads
  • 5.1.5 Others (Graphite / Carbon-Based TIMs, Advanced Nano-Composite TIMs)
• 5.2 By DRAM Packaging / Product Application
  • 5.2.1 HBM Stacks
  • 5.2.2 Advanced DRAM Packages
  • 5.2.3 Server DRAM Modules
  • 5.2.4 Client DRAM Modules
  • 5.2.5 CXL Attached DRAM Modules
• 5.3 By End-Use Platform
  • 5.3.1 AI Servers and Accelerators
  • 5.3.2 High-Performance Computing
  • 5.3.3 Enterprise and Hyperscale Data Centers
  • 5.3.4 High-End Workstations
  • 5.3.5 Client PCs and Notebooks
  • 5.3.6 Industrial and Embedded Computing
• 5.4 By Geography
  • 5.4.1 North America
  • 5.4.2 Europe
  • 5.4.3 Asia-Pacific
    • 5.4.3.1 China
    • 5.4.3.2 Japan
    • 5.4.3.3 South Korea
    • 5.4.3.4 Taiwan
    • 5.4.3.5 Rest of Asia-Pacific
  • 5.4.4 Rest of the World

6 COMPETITIVE LANDSCAPE

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
  • 6.4.1 3M
  • 6.4.2 Henkel AG and Co. KGaA
  • 6.4.3 The Dow Chemical Company
  • 6.4.4 Shin-Etsu Chemical Co., Ltd.
  • 6.4.5 Indium Corporation
  • 6.4.6 Parker-Hannifin Corporation
  • 6.4.7 Laird Thermal Systems, Inc.
  • 6.4.8 Henkel Adhesive Technologies
  • 6.4.9 Fujipoly, a division of Fuji Polymer Industries Co., Ltd.
  • 6.4.10 Momentive Performance Materials Inc.
  • 6.4.11 Boyd Corporation
  • 6.4.12 Momentive Technologies
  • 6.4.13 DuPont de Nemours, Inc.
  • 6.4.14 Wacker Chemie AG
  • 6.4.15 Honeywell International Inc.
  • 6.4.16 Saint-Gobain S.A.
  • 6.4.17 Aavid Thermalloy, LLC
  • 6.4.18 Wakefield-Vette, Inc.
  • 6.4.19 Carbice Corporation
  • 6.4.20 Fujipoly America Corporation

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

• 7.1 White-Space and Unmet-Need Assessment