6G 무선 기술용 반도체의 성장 기회

AI Chipsets and Compound Semiconductors Will Play a Transformational Role, Enabling the Operational and Economic Targets of Next-gen Cellular Wireless Technology

Wireless communication systems rely on semiconductor components, such as PAs, LNAs, and transceivers (together known as RF FEMs), to process signals to and from the radio unit (RU), baseband unit (BBU), and the network core to ensure customers receive the radio signals that carry the data and services.

The communication system relies on other semiconductor components, such as antenna integrated circuits (ICs), envelope trackers, microprocessors, analog devices, and optical components, to process signals as necessary. The type of semiconductors that wireless telecom communication uses has not changed much with the 2G to 5G evolution of technologies. However, the semiconductor components' performance requirements have increased. Hence, the designs, materials, manufacturing, and packaging technologies have evolved with each new wireless communication generation.

Because 5G wireless technology is in the deployment stage, industry leaders have begun discussions about developing the next-gen wireless technology (6G) and plan to begin early commercialization in 2030. The dawn of 6G will represent a new era of communication that will provide new services beyond data. The study discusses distributed and federated learning at the edge, co-inferencing between edge and core, autonomous functioning of end devices, the development of AI-powered human-centric telecom services, joint communication, computing, sensing, and control, and several other concepts, which represent a transformation from radio access network (RAN) architecture to services.

To develop 6G, industry stakeholders are collaborating to plan the components and building blocks of each sub-technology that will lead to the development of the next-gen wireless technology. Initial stakeholder discussions are leading to an understanding that advanced semiconductors with high-performance capabilities (in computing and RF) will be necessary to enable high-speed data transfer and operate at high frequencies.

• This analysis aims to understand the changes expected in 6G wireless communication from a context of the semiconductor industry, with specific focus on RAN, and the edge.
• From a component perspective, the analysis focuses on the AI-processors, and the key RF components required at the network RAN and the edge.
• The analysis does not cover the changes expected in discrete, analog, memory, optical, and sensing products.
• It aims to provide a qualitative view based on the developments during the study period and is subject to change in the future.
• It does not aim to provide a quantitative overview of the market potential.

Table of Contents

Strategic Imperatives

• Why is it Increasingly Difficult to Grow?
• The Strategic Imperative 8™
• The Impact of the Top 3 Strategic Imperatives on the 6G Semiconductors Industry
• Growth Opportunities Fuel the Growth Pipeline Engine™

Growth Opportunity Analysis in Semiconductors for 6G-6G Overview

• Primary Findings
• Scope of Analysis
• 6G-Overview of Cellular Evolution and Desired 6G Network Characteristics
• Why 6G? Why Now?
• 6G Roadmap to Commercialization
• 6G-Integrated Technology Roadmap
• Growth Drivers
• Growth Restraints
• 6G Ecosystem

Growth Opportunity Analysis in Semiconductors for 6G-AI-Processor Semiconductors

• Why are AI Processors Critical for 6G?
• Infusing AI into RAN for the Future of Telecom-Open Radio Access Network (ORAN) Infrastructure
• AI in 6G Network Infrastructure-Emergence of AI-RAN
• Edge Computing
• Edge AI in 6G-Potential Application Universe
• Primary Focus Areas for Edge AI Chipsets in the 6G Network
• Understanding Current Processors to Evaluate 6G Requirements- Primary Companies and Products
• AI in 6G-How to Determine Compute Performance Requirements
• The Coming of Silicon Photonics (SiPh)
• Regional Competency of AI Semiconductors for 6G Networking
• Notable Developments, Initiatives, Activities, and Collaborations to Realize 6G Technology
• Notable Investments in AI by Semiconductor Companies
• The AI-Semiconductor Ecosystem for 6G
• Expected Research Efforts in the Next 5 Years
• AI in 6G-The Significance of Cybersecurity and Sustainability

6G Semiconductor Growth Opportunity-RF Semiconductors

• RF Semiconductors in 6G-Enabling 100 GHz and Higher Operational Frequencies
• RF Semiconductors in 6G-Process Node Trajectory
• RF Semiconductors in 6G-Exploring Materials Beyond Si
• RF Semiconductors in 6G-Exploring Materials Beyond Si: GaN
• RF Semiconductors in 6G-Exploring Materials Beyond Si: InP
• RF Semiconductors in 6G-Advanced Packaging Technologies
• RF Semiconductors in 6G-GaN and InP Gaining R&D Traction for Application in Next-gen Wireless Technology
• RF in 6G-Primary Products Enabling the Research and Development of 6G
• RF in 6G Investments and R&D Initiatives that Semiconductor Companies Have Announced
• RF in 6G-Primary Regional Initiatives and Investments
• RF in 6G-Ultra-wide Bandgap (UWBG) Semiconductors
• The AI Semiconductor Ecosystem in 6G

Growth Opportunity Universe-6G Research Initiatives by Region

• 6G Research and Collaboration Initiatives by Primary Regions
• 6G Patent Applications by Region (2019-2021)

Growth Opportunity Universe-Key Applications and Context of the imperative for 6G Semiconductors

• Semiconductors for 6G-Context of Opportunities by Primary Applications: AVs and Smart Manufacturing
• Semiconductors for 6G-Context of Opportunity by Primary Applications: Healthcare and Smart Cities
• Application Profile-Industry Metaverse
• Application Profile-Mobility

Growth Opportunity Universe

• Growth Opportunity 1-Cognitive Intelligence at the Core and Edge
• Growth Opportunity 2-Application-specific Chipsets
• Growth Opportunity 3-Leverage Government Funding and Policies
• List of Exhibits
• Legal Disclaimer