비교리스트

 카트 문의
시장보고서
상품코드
1571984

세계의 고밀도 상호 연결 시장

High Density Interconnect
발행일: | 리서치사: Global Industry Analysts, Inc. | 페이지 정보: 영문 92 Pages | 배송안내 : 1-2일 (영업일 기준)

    
    
    



※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

고밀도 인터커넥트 시장은 2030년까지 449억 달러에 달할 전망입니다.

2023년에 209억 달러로 추정된 고밀도 상호연결 시장은 예측 기간 동안 복합 연간 성장률(CAGR) 11.5%로 성장할 전망이며 2030년에는 449억 달러에 달할 것으로 예측됩니다. 이 보고서에서 분석한 부문 중 하나인 4-6층은 복합 연간 성장률(CAGR) 9.6%로 성장을 지속하고, 분석 기간이 끝날 때 104억 달러에 도달할 것으로 예상됩니다. 8-10 레이어 부문의 성장률은 분석 기간 동안 복합 연간 성장률(CAGR) 11.6%로 추정됩니다.

미국 시장은 57억 달러로 추정되며 중국은 복합 연간 성장률(CAGR) 10.9%로 성장할 것으로 예측됩니다.

미국의 고밀도 인터커넥트 시장은 2023년 57억 달러로 추정됩니다. 세계 2위 경제대국인 중국은 2030년까지 69억 달러 규모에 이를 것으로 예측되며, 예측 기간 동안 복합 연간 성장률(CAGR)은 10.9%입니다. 기타 주목할 만한 지역별 시장으로는 일본과 캐나다가 있으며, 분석 기간 중 복합 연간 성장률(CAGR)은 각각 9.7%와 9.8%로 예측되고 있습니다. 유럽에서는 독일이 복합 연간 성장률(CAGR) 약 8.2%로 성장할 것으로 예측됩니다.

세계의 고밀도 상호 연결 시장 - 주요 동향과 촉진요인 요약

왜 고밀도 인터커넥트(HDI) 기술이 일렉트로닉스에 필수적인가?

고밀도 인터커넥트(HDI) 기술은 특히 스마트폰, 노트북, 웨어러블 단말기, 차량용 전자기기, 의료기기에 사용되는 프린트 기판(PCB)의 설계, 제조에 있어서 현대의 일렉트로닉스에 필수적인 요소가 되었습니다 있습니다. HDI PCB는 보다 미세한 라인과 공간, 보다 작은 비아, 보다 고밀도로 장착된 부품을 통합함으로써 보다 복잡한 회로 설계를 가능하게 합니다. 이를 통해 제조업체는 더 작고 가볍고 빠른 장치를 생산하고 성능을 향상시킬 수 있습니다. HDI 기술은 큰 연산 능력과 연결성을 필요로 하는 고성능 일렉트로닉스의 개발에 필수적이며 공간의 제약과 신뢰성이 최우선인 IT 및 통신, 항공우주, 자동차 등 업계에 필수적인 기술 되어 있습니다.

기술의 진보는 HDI 시장을 어떻게 견인하고 있는가?

소형화와 전자 설계의 기술 진보가 HDI 기술 수요를 견인하고 있습니다. 소비자용 전자기기의 소형화와 다기능화에 따라 보다 작고 효율적인 PCB에 대한 요구가 커지고 있습니다. 레이저 드릴이나 스택드 마이크로비아와 같은 첨단 제조 기술의 개발로 HDI PCB의 기능이 강화되어 신호 무결성을 손상시키지 않고 회로 밀도를 높일 수 있게 되었습니다. 게다가 5G 네트워크와 사물 인터넷(IoT)의 상승으로 인해 디바이스는 더 빠른 데이터 전송과 높은 연결성을 필요로 하므로 HDI 기술에 대한 수요가 증가하고 있습니다. 이러한 발전으로 HDI PCB의 제조 비용 효율성이 향상되고 보다 광범위한 용도에 대한 채택이 확대되고 있습니다.

시장 세분화는 HDI 시장의 성장을 어떻게 규정하고 있는가?

HDI의 유형에는 4-6층, 8-10층, 10층 이상이 있어, 스마트폰이나 태블릿등의 소비자용 전자 기기에의 응용에 의해 4-6층 부문이 우위를 차지하고 있습니다. HDI PCB의 최종 이용 산업에는 통신, 자동차, 항공우주, 헬스케어, 산업용 전자 장비 등이 있습니다. 통신은 스마트폰과 5G 인프라의 보급에 견인되어 여전히 최대 부문입니다. 자동차 업계도 특히 ADAS(선진운전지원시스템)와 전기자동차(EV)의 개발로 HDI기술의 채용이 급증하고 있습니다. 지역별로는 아시아태평양이 시장을 선도하고 있으며, 중국, 일본, 한국 등이 일렉트로닉스 제조의 주요 거점이 되고 있습니다.

고밀도 상호접속 시장의 성장을 가속하는 요인이란?

고밀도 인터커넥트 시장의 성장은 소형화된 전자기기에 대한 수요 증가, 5G 네트워크 확대, PCB 제조 기술의 발전 등 여러 요인들에 의해 견인되고 있습니다. 특히 스마트폰이나 웨어러블 단말 등의 소비자용 전자기기 분야는 제조업체가 보다 소형, 고속, 고성능인 디바이스의 실현을 목표로 하는 가운데, HDI 채용의 큰 원동력이 되고 있습니다. 자동차 업계에서는 ADAS와 자동차 인포테인먼트 시스템에 첨단 전자 회로가 필요하기 때문에 전동화와 자동화를 추진하는 움직임이 HDI 기술 수요를 끌어 올리고 있습니다. 게다가, 5G 네트워크의 배치는 고속 데이터 전송과 대기 시간의 단축이 중요한 통신 인프라에서 HDI PCB의 필요성을 높이고 있습니다. 레이저 드릴링 및 재료 개선 등 HDI 제조의 기술 혁신은 HDI PCB의 성능 향상과 비용 절감을 통해 시장 성장을 더욱 촉진하고 있습니다.

조사 대상 기업 예(주목의 36사)

  • Austria Technologie & Systemtechnik
  • CMK
  • Compeq Co.,
  • Daeduck GDS Co.,
  • EPEC
  • Fujitsu Interconnect Technologies
  • Kingboard Holdings
  • Meiko Electronics Co.,
  • Multek
  • Ncab Group
  • Shenzhen Kinwong Electronic Co.,
  • Sierra Circuits
  • TTM Technologies
  • Unimicron
  • Zhen Ding Tech

목차

제1장 조사 방법

제2장 주요 요약

  • 시장 개요
  • 주요 기업
  • 시장 동향과 촉진요인
  • 시장 전망

제3장 시장 분석

  • 미국
  • 캐나다
  • 일본
  • 중국
  • 유럽
  • 프랑스
  • 독일
  • 이탈리아
  • 영국
  • 기타 유럽
  • 아시아태평양
  • 기타 지역

제4장 경쟁

BJH 24.10.24

Global High Density Interconnect Market to Reach US$44.9 Billion by 2030

The global market for High Density Interconnect estimated at US$20.9 Billion in the year 2023, is expected to reach US$44.9 Billion by 2030, growing at a CAGR of 11.5% over the analysis period 2023-2030. 4-6 Layers, one of the segments analyzed in the report, is expected to record a 9.6% CAGR and reach US$10.4 Billion by the end of the analysis period. Growth in the 8-10 Layers segment is estimated at 11.6% CAGR over the analysis period.

The U.S. Market is Estimated at US$5.7 Billion While China is Forecast to Grow at 10.9% CAGR

The High Density Interconnect market in the U.S. is estimated at US$5.7 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$6.9 Billion by the year 2030 trailing a CAGR of 10.9% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 9.7% and 9.8% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 8.2% CAGR.

Global High Density Interconnect Market - Key Trends and Drivers Summarized

Why Is High Density Interconnect (HDI) Technology Crucial for Electronics?

High Density Interconnect (HDI) technology has become an essential component of modern electronics, particularly in the design and manufacturing of printed circuit boards (PCBs) used in smartphones, laptops, wearables, automotive electronics, and medical devices. HDI PCBs allow for more complex circuit designs by incorporating finer lines and spaces, smaller vias, and more densely packed components. This enables manufacturers to produce smaller, lighter, and faster devices with enhanced performance. HDI technology is critical in the development of high-performance electronics that require significant computing power and connectivity, making it indispensable for industries like telecommunications, aerospace, and automotive, where space constraints and reliability are paramount.

How Are Technological Advancements Driving the HDI Market?

Technological advancements in miniaturization and electronic design are driving the demand for HDI technology. As consumer electronics become more compact and feature-rich, the need for smaller, more efficient PCBs has increased. The development of advanced fabrication techniques, such as laser drilling and stacked microvias, has enhanced the capabilities of HDI PCBs, allowing for higher circuit density without compromising signal integrity. Additionally, the rise of 5G networks and the Internet of Things (IoT) has increased the demand for HDI technology, as devices require faster data transmission and greater connectivity. These advancements are also making HDI PCBs more cost-effective to produce, expanding their adoption across a wider range of applications.

How Are Market Segments Defining the Growth of the HDI Market?

HDI types include 4-6 layers, 8-10 layers, and 10+ layers, with the 4-6 layer segment dominating due to its application in consumer electronics such as smartphones and tablets. The end-use industries for HDI PCBs include telecommunications, automotive, aerospace, healthcare, and industrial electronics. Telecommunications remains the largest segment, driven by the proliferation of smartphones and 5G infrastructure. The automotive industry is also witnessing rapid growth in the adoption of HDI technology, particularly in the development of advanced driver assistance systems (ADAS) and electric vehicles (EVs). Regionally, Asia-Pacific leads the market, with countries like China, Japan, and South Korea being major hubs for electronics manufacturing.

What Factors Are Driving the Growth in the High Density Interconnect Market?

The growth in the high density interconnect market is driven by several factors, including the increasing demand for miniaturized electronic devices, the expansion of 5G networks, and advancements in PCB fabrication technologies. The consumer electronics sector, particularly smartphones and wearables, is a major driver of HDI adoption as manufacturers seek to create smaller, faster, and more powerful devices. The automotive industry's push toward electrification and automation is also boosting demand for HDI technology, as more sophisticated electronics are required for ADAS and in-car infotainment systems. Additionally, the rollout of 5G networks is driving the need for HDI PCBs in telecommunications infrastructure, where high-speed data transmission and reduced latency are critical. Technological innovations in HDI fabrication, such as laser drilling and improved materials, are further propelling market growth by enhancing the performance and reducing the costs of HDI PCBs.

Select Competitors (Total 36 Featured) -

  • Austria Technologie & Systemtechnik
  • CMK
  • Compeq Co.,
  • Daeduck GDS Co.,
  • EPEC
  • Fujitsu Interconnect Technologies
  • Kingboard Holdings
  • Meiko Electronics Co.,
  • Multek
  • Ncab Group
  • Shenzhen Kinwong Electronic Co.,
  • Sierra Circuits
  • TTM Technologies
  • Unimicron
  • Zhen Ding Tech

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Global Economic Update
    • High Density Interconnect - Global Key Competitors Percentage Market Share in 2024 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Rising Demand for Miniaturized Electronic Devices Drives Growth in HDI Technology
    • Technological Advancements in PCB Manufacturing Propel Adoption of HDI Solutions
    • Increasing Focus on Lightweight and Compact Consumer Electronics Expands Addressable Market for HDI
    • Growing Adoption of HDI in Automotive Electronics Spurs Market Innovation
    • Surge in Demand for High-Speed and High-Performance PCBs Strengthens Business Case for HDI
    • Rising Use of HDI in Medical Devices and Wearable Electronics Propels Market Growth
    • Technological Integration of HDI with IoT and 5G Networks Expands Market Opportunities
    • Growing Focus on Reducing PCB Weight and Thickness Spurs Innovation in HDI Designs
    • Expansion of Advanced Driver Assistance Systems (ADAS) Drives Demand for HDI in Automotive Sector
    • Increasing Use of HDI in Aerospace and Defense Applications Sustains Market Growth
    • Rising Popularity of Flexible and Rigid-Flex HDI PCBs Expands Market Opportunities
    • Surge in Demand for Multilayer PCBs in Telecommunications Propels Growth in HDI Market
    • Regulatory Approvals for HDI PCBs in Medical and Automotive Sectors Drive Adoption
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for High Density Interconnect by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 2: World Historic Review for High Density Interconnect by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 3: World 16-Year Perspective for High Density Interconnect by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2024 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for 4-6 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 5: World Historic Review for 4-6 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 6: World 16-Year Perspective for 4-6 Layers by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 7: World Recent Past, Current & Future Analysis for 8-10 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 8: World Historic Review for 8-10 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 9: World 16-Year Perspective for 8-10 Layers by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for 10+ Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 11: World Historic Review for 10+ Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 12: World 16-Year Perspective for 10+ Layers by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 13: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 14: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 15: World 16-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for Computer & Display by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 17: World Historic Review for Computer & Display by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 18: World 16-Year Perspective for Computer & Display by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 19: World Recent Past, Current & Future Analysis for Communication Devices & Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 20: World Historic Review for Communication Devices & Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 21: World 16-Year Perspective for Communication Devices & Equipment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Automotive Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 23: World Historic Review for Automotive Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 24: World 16-Year Perspective for Automotive Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 25: World Recent Past, Current & Future Analysis for Connected Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 26: World Historic Review for Connected Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 27: World 16-Year Perspective for Connected Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 28: World Recent Past, Current & Future Analysis for Wearable Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 29: World Historic Review for Wearable Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 30: World 16-Year Perspective for Wearable Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 31: World High Density Interconnect Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for Audio / Audiovisual (AV) Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 33: World Historic Review for Audio / Audiovisual (AV) Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 34: World 16-Year Perspective for Audio / Audiovisual (AV) Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
    • TABLE 35: USA Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 36: USA Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 37: USA 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 38: USA Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 39: USA Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 40: USA 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • CANADA
    • TABLE 41: Canada Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 42: Canada Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 43: Canada 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 44: Canada Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 45: Canada Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 46: Canada 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • JAPAN
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
    • TABLE 47: Japan Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 48: Japan Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 49: Japan 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 50: Japan Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 51: Japan Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 52: Japan 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • CHINA
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
    • TABLE 53: China Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 54: China Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 55: China 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 56: China Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 57: China Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 58: China 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • EUROPE
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
    • TABLE 59: Europe Recent Past, Current & Future Analysis for High Density Interconnect by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 60: Europe Historic Review for High Density Interconnect by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 61: Europe 16-Year Perspective for High Density Interconnect by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2024 & 2030
    • TABLE 62: Europe Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 63: Europe Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 64: Europe 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 65: Europe Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 66: Europe Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 67: Europe 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • FRANCE
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
    • TABLE 68: France Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 69: France Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 70: France 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 71: France Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 72: France Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 73: France 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • GERMANY
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
    • TABLE 74: Germany Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 75: Germany Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 76: Germany 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 77: Germany Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 78: Germany Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 79: Germany 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • ITALY
    • TABLE 80: Italy Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 81: Italy Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 82: Italy 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 83: Italy Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 84: Italy Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 85: Italy 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • UNITED KINGDOM
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
    • TABLE 86: UK Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 87: UK Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 88: UK 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 89: UK Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 90: UK Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 91: UK 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • REST OF EUROPE
    • TABLE 92: Rest of Europe Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 93: Rest of Europe Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 94: Rest of Europe 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 96: Rest of Europe Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 97: Rest of Europe 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • ASIA-PACIFIC
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
    • TABLE 98: Asia-Pacific Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 99: Asia-Pacific Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 100: Asia-Pacific 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 102: Asia-Pacific Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 103: Asia-Pacific 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • REST OF WORLD
    • TABLE 104: Rest of World Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 105: Rest of World Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 106: Rest of World 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 107: Rest of World Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 108: Rest of World Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 109: Rest of World 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030

IV. COMPETITION

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