샘플 요청 목록

 카트 문의
시장보고서
상품코드
1747675

3D 관통 전극(TSV) 패키지 시장

3D Through-Silicon Via (TSV) Package
발행일: | 리서치사: Market Glass, Inc. (Formerly Global Industry Analysts, Inc.) | 페이지 정보: 영문 182 Pages | 배송안내 : 1-2일 (영업일 기준)

    
    
    



※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

세계의 3D 관통 전극(TSV) 패키지 시장은 2030년까지 239억 달러에 이를 전망

2024년에 98억 달러로 추정되는 3D 관통 전극(TSV) 패키지 세계 시장은 2024-2030년간 CAGR 16.0%로 성장하여 2030년에는 239억 달러에 이를 것으로 예측됩니다. 본 보고서에서 분석한 부문 중 하나인 웨이퍼 레벨 패키징은 CAGR14.3%를 나타내고, 분석 기간 종료까지 141억 달러에 이를 것으로 예측됩니다. 실리콘 관통 전극(Through Silicon Via) 부문의 성장률은 분석 기간중 CAGR 18.7%로 추정됩니다.

미국 시장은 26억 달러, 중국은 CAGR 15.1%로 성장 예측

미국의 3D 관통 전극(TSV) 패키지 시장은 2024년에 26억 달러로 추정됩니다. 세계 2위 경제대국인 중국은 2030년까지 37억 달러 규모에 이를 것으로 예측되며, 분석 기간인 2024-2030년 CAGR은 15.1%로 추정됩니다. 기타 주목해야 할 지역별 시장으로서는 일본과 캐나다가 있으며, 분석 기간중 CAGR은 각각 14.5%와 14.0%를 보일 것으로 예측됩니다. 유럽에서는 독일이 CAGR 11.9%를 보일 전망입니다.

세계의 3D 관통 전극(TSV) 패키지 시장 - 주요 동향과 촉진요인 정리

첨단 반도체 집적화에서 3D TSV 패키징이 주목받는 이유

3D 스루 실리콘 비아(TSV) 패키징은 실리콘 웨이퍼를 직접 통과하는 초단파 배선을 통해 집적회로를 수직으로 적층할 수 있게 함으로써 반도체 아키텍처에 혁명을 일으키고 있습니다. 이러한 접근 방식은 신호 지연을 크게 줄이고, 대역폭을 향상시키며, 전자 장치의 전체 실적를 줄여 컴퓨팅, IT 및 통신, 가전제품의 고성능 용도에 적합한 솔루션입니다.

무어의 법칙이 느려지고 전통적인 2D 스케일링이 물리적, 경제적 한계에 다다르면서 TSV 기반 3D 집적은 시스템 레벨 미세화 및 성능 향상을 위한 중요한 수단으로 부상하고 있습니다. AI 가속기, 고대역폭 메모리(HBM), 첨단 모바일 프로세서, 네트워크 인프라 구성요소에 대한 중요한 수요를 충족시킬 수 있습니다.

성능 요건, 전력 효율 및 폼팩터 최적화가 TSV 채택을 어떻게 촉진하고 있는가?

데이터 처리 속도 향상, 메모리 밀도 향상, 에너지 효율적인 컴퓨팅에 대한 요구는 TSV 지원 아키텍처로의 전환을 가속화하고 있습니다. 와이어 본딩이나 스루몰드 비아 기술에 비해 TSV는 전기 경로가 짧고, 기생 손실이 적으며, 열 방출이 우수합니다. 따라서 AI 추론, 엣지 컴퓨팅, 고성능 컴퓨팅(HPC) 등 데이터 집약적인 워크로드에 적합합니다.

TSV 패키지는 메모리 적층, 특히 HBM 및 와이드 I/O DRAM의 기술 혁신을 주도하고 있으며, 수직 통합은 열 성능 저하 없이 데이터 처리량을 향상시킵니다. 모바일 및 웨어러블 기기에서 TSV는 더 얇고 가벼운 설계를 촉진하는 동시에 기능 증가에 대응할 수 있습니다. 에지 디바이스가 더 작은 실적에서 더 많은 처리 능력을 요구함에 따라 TSV 통합은 차세대 패키징 전략의 핵심이 되고 있습니다.

TSV 패키지에 대한 수요를 가속화하고 있는 응용 분야와 지역 시장은?

고성능 프로세서, 메모리 모듈, 이미지 센서, RF 부품은 TSV의 채택을 촉진하는 주요 응용 분야 중 하나이며, AI 하드웨어에서 TSV는 컴퓨팅 리소스와 메모리 리소스를 긴밀하게 결합하여 지연시간과 전력 소비를 줄이는 데 필수적입니다. 가전제품 제조업체들은 스마트폰, 태블릿, AR/VR 기기의 속도, 응답성, 배터리 수명에 대한 기대치가 높아짐에 따라 TSV 기반 부품을 통합하고 있습니다.

아시아태평양은 대만, 한국, 일본, 중국의 선진 반도체 생태계가 주도하는 TSV 생산과 소비를 주도하고 있습니다. 이 지역의 주요 파운드리 및 OSAT는 3D IC 개발을 목표로 하는 칩 제조업체를 지원하기 위해 TSV 생산 능력을 강화하고 있습니다. 북미는 데이터센터 인프라, 항공우주 등급 전자제품, 차세대 자동차 시스템 수요에 힘입어 그 뒤를 잇고 있습니다. 유럽은 특히 산업용 및 센서가 많은 용도에서 견인력을 높이고 있습니다.

제조의 복잡성, 비용, 생태계 성숙도는 시장 성장에 어떤 영향을 미치고 있는가?

TSV는 우수한 전기적 및 열적 성능을 제공하지만, 높은 제조 비용, 수율 문제, 공정의 복잡성으로 인해 상업적 보급에 어려움을 겪어왔습니다. 그러나 웨이퍼의 박형화, 정렬 정확도, 비아필링 기술의 발전으로 이러한 문제들이 완화되고 있으며, TSV 통합은 더욱 확장 가능하고 비용 경쟁력이 높아지고 있습니다. 파운드리 업체들은 개발 기간을 단축하고 팹리스 디자인하우스의 진입 장벽을 낮추기 위해 턴키 TSV 플랫폼을 도입하고 있습니다.

TSV 인터포저의 표준화, 검사 도구의 개선, 열 관리 재료의 개선으로 공급망의 성숙도도 향상되고 있습니다. 수율이 향상되고 단가가 낮아짐에 따라 TSV 패키징은 고급 디바이스뿐만 아니라 메인스트림 및 산업용 전자제품에 이르기까지 더욱 광범위한 용도에 적용되고 있으며, IC 설계자, OSAT 및 EDA 툴 제공업체 간의 협력은 설계에서 제조까지 설계에서 제조까지의 사이클을 더욱 가속화하고 있습니다.

3D TSV 패키지 시장의 성장 요인은 무엇인가?

3D TSV 패키지 시장은 칩 제조업체들이 기존 플래너 설계의 한계를 극복하기 위해 수직 통합 아키텍처를 추구함에 따라 성장세를 보이고 있습니다. 주요 촉진요인으로는 성능 중심의 용도에서 더 높은 대역폭, 에너지 효율 개선, 폼팩터 축소, TSV 제조의 기술적 향상과 성숙한 공급 에코시스템이 결합되어 확장성과 상업적 실현 가능성을 높이고 있습니다. 을 높이고 있습니다.

TSV 생태계가 통합의 복잡성과 설계 유연성, 비용 효율성, 시장 출시 시간 압박을 얼마나 잘 조화시킬 수 있느냐에 따라 향후 성장에 영향을 미칠 것입니다. 반도체 산업이 이기종 및 3D 아키텍처로 전환하는 가운데, TSV 패키징이 칩 수준의 성능과 혁신의 다음 시대로 가는 기초적인 다리가 될 수 있을까?

부문

기술(웨이퍼 레벨 패키징, 실리콘 관통 전극(Through Silicon Via)), 용도(메모리 기반 용도, 로직 기반 용도, 멤스＆센서), 최종 용도(소비자 일렉트로닉스, 자동차, 헬스케어, 항공우주 및 방위, 기타 최종 용도)

조사 대상 기업 예(총 48개사)

  • 3M Company
  • Advanced Micro Devices, Inc.(AMD)
  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding Co., Ltd.
  • ASML Holding N.V.
  • Broadcom Inc.
  • Dialog Semiconductor plc
  • GLOBALFOUNDRIES Inc.
  • IBM Corporation
  • Infineon Technologies AG
  • Intel Corporation
  • JCET Group Co., Ltd.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Micron Technology, Inc.
  • Monolithic 3D Inc.
  • NXP Semiconductors N.V.
  • Panasonic Corporation
  • Powertech Technology Inc.
  • Qualcomm Incorporated

관세 영향 계수

Global Industry Analysts는 본사의 국가, 제조거점, 수출입(완제품 및 OEM)을 기반으로 기업의 경쟁력 변화를 예측했습니다. 이러한 복잡하고 다면적인 시장 역학은 인위적인 수익원가 증가, 수익성 감소, 공급망 재편 등 미시적 및 거시적 시장 역학 중에서도 특히 경쟁사들에게 영향을 미칠 것으로 예측됩니다.

Global Industry Analysts는 세계 주요 수석 이코노미스트(1,4,949명), 싱크탱크(62개 기관), 무역 및 산업 단체(171개 기관)의 전문가들의 의견을 면밀히 검토하여 생태계에 미치는 영향을 평가하고 새로운 시장 현실에 대응하고 있습니다. 모든 주요 국가의 전문가와 경제학자들이 관세와 그것이 자국에 미치는 영향에 대한 의견을 추적 조사했습니다.

Global Industry Analysts는 이러한 혼란이 향후 2-3개월 내에 마무리되고 새로운 세계 질서가 보다 명확하게 확립될 것으로 예상하고 있으며, Global Industry Analysts는 이러한 상황을 실시간으로 추적하고 있습니다.

2025년 4월: 협상 단계

이번 4월 보고서에서는 관세가 세계 시장 전체에 미치는 영향과 지역별 시장 조정에 대해 소개합니다. 당사의 예측은 과거 데이터와 진화하는 시장 영향요인을 기반으로 합니다.

2025년 7월: 최종 관세 재설정

각국의 최종 리셋이 발표되는 7월에도 고객님들께 무료 업데이트를 제공할 예정입니다. 최종 업데이트 버전에는 명확하게 정의된 관세 영향 분석이 포함되어 있습니다.

상호 및 양자 간 무역과 관세의 영향 분석 :

미국 <>& 중국 <>& 멕시코 <>& 캐나다 <>&EU <>& 일본 <>& 인도 <>& 기타 176개국

업계 최고의 이코노미스트: Global Industry Analysts의 지식 기반은 국가, 싱크탱크, 무역 및 산업 단체, 대기업, 그리고 세계 계량 경제 상황의 전례 없는 패러다임 전환의 영향을 공유하는 분야별 전문가 등 가장 영향력 있는 수석 이코노미스트 그룹을 포함한 14,949명의 이코노미스트를 추적하고 있습니다. 16,491개 이상의 보고서 대부분에 마일스톤에 기반한 2단계 출시 일정을 적용하고 있습니다.

목차

제1장 조사 방법

제2장 주요 요약

  • 시장 개요
  • 주요 기업
  • 시장 동향과 촉진요인
  • 세계 시장 전망

제3장 시장 분석

  • 미국
  • 캐나다
  • 일본
  • 중국
  • 유럽
  • 프랑스
  • 독일
  • 이탈리아
  • 영국
  • 기타 유럽
  • 아시아태평양
  • 기타 지역

제4장 경쟁

LSH 25.06.20

Global 3D Through-Silicon Via (TSV) Package Market to Reach US$23.9 Billion by 2030

The global market for 3D Through-Silicon Via (TSV) Package estimated at US$9.8 Billion in the year 2024, is expected to reach US$23.9 Billion by 2030, growing at a CAGR of 16.0% over the analysis period 2024-2030. Wafer Level Packaging, one of the segments analyzed in the report, is expected to record a 14.3% CAGR and reach US$14.1 Billion by the end of the analysis period. Growth in the Through Silicon Via segment is estimated at 18.7% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.6 Billion While China is Forecast to Grow at 15.1% CAGR

The 3D Through-Silicon Via (TSV) Package market in the U.S. is estimated at US$2.6 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$3.7 Billion by the year 2030 trailing a CAGR of 15.1% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 14.5% and 14.0% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 11.9% CAGR.

Global 3D Through-Silicon Via (TSV) Package Market - Key Trends & Drivers Summarized

Why Is 3D TSV Packaging Gaining Prominence in Advanced Semiconductor Integration?

3D Through-Silicon Via (TSV) packaging is revolutionizing semiconductor architecture by enabling vertical stacking of integrated circuits with ultra-short interconnects that pass directly through silicon wafers. This approach drastically reduces signal latency, enhances bandwidth, and shrinks the overall footprint of electronic devices, making it a preferred solution for high-performance applications in computing, telecommunications, and consumer electronics.

As Moore’s Law slows and conventional 2D scaling approaches their physical and economic limits, TSV-based 3D integration is emerging as a key enabler of system-level miniaturization and performance gains. It allows for heterogeneous integration of logic, memory, and sensor dies in compact form factors, addressing critical demands in AI accelerators, high-bandwidth memory (HBM), advanced mobile processors, and network infrastructure components.

How Are Performance Requirements, Power Efficiency, and Form Factor Optimization Driving TSV Adoption?

The demand for faster data processing, greater memory density, and energy-efficient computing is accelerating the transition to TSV-enabled architectures. Compared to wire bonding or through-mold via technologies, TSVs offer shorter electrical paths, reduced parasitic loss, and superior thermal dissipation. This makes them ideal for data-intensive workloads such as AI inference, edge computing, and high-performance computing (HPC).

TSV packaging is also driving innovation in memory stacking-particularly HBM and wide I/O DRAM-where vertical integration enhances data throughput without compromising thermal performance. In mobile and wearable devices, TSV facilitates thinner, lighter designs while accommodating growing functionality. As edge devices demand more processing power within smaller footprints, TSV integration is becoming central to next-generation packaging strategies.

Which Application Areas and Regional Markets Are Accelerating TSV Package Demand?

High-performance processors, memory modules, image sensors, and RF components are among the key applications driving TSV adoption. In AI hardware, TSV enables tight coupling of compute and memory resources, which is essential for reducing latency and power consumption. Consumer electronics manufacturers are integrating TSV-based components to meet rising expectations for speed, responsiveness, and battery life in smartphones, tablets, and AR/VR gear.

Asia-Pacific dominates TSV production and consumption, led by advanced semiconductor ecosystems in Taiwan, South Korea, Japan, and China. Major foundries and OSATs in the region are ramping TSV capacity to support chipmakers targeting 3D IC development. North America follows closely, driven by demand in data center infrastructure, aerospace-grade electronics, and next-gen automotive systems. Europe is also showing increased traction, especially in industrial and sensor-rich applications.

How Are Manufacturing Complexity, Cost Considerations, and Ecosystem Maturity Influencing Market Growth?

While TSV offers superior electrical and thermal performance, its commercial adoption has historically been hindered by high fabrication costs, yield challenges, and process complexity. However, advances in wafer thinning, alignment precision, and via filling techniques are mitigating these issues, making TSV integration more scalable and cost-competitive. Foundries are introducing turnkey TSV platforms to reduce development timelines and lower barriers to entry for fabless design houses.

Supply chain maturity is also improving, with standardization of TSV interposers, improved inspection tools, and better thermal management materials. As yield rates increase and unit costs decline, TSV packaging is becoming viable for a broader range of applications, extending beyond premium devices to mainstream and industrial-grade electronics. Collaborative efforts between IC designers, OSATs, and EDA tool providers are further accelerating design-to-manufacture cycles.

What Are the Factors Driving Growth in the 3D TSV Package Market?

The 3D TSV package market is gaining momentum as chipmakers pursue vertically integrated architectures to overcome the limitations of traditional planar designs. Key drivers include the need for higher bandwidth, improved energy efficiency, and form factor reduction across performance-critical applications. Technological improvements in TSV manufacturing, coupled with a maturing supply ecosystem, are enhancing scalability and commercial viability.

Looking ahead, growth will be influenced by how well the TSV ecosystem can balance integration complexity with design flexibility, cost efficiency, and time-to-market pressures. As the semiconductor industry shifts toward heterogeneous and 3D architectures, could TSV packaging become the foundational bridge to the next era of chip-level performance and innovation?

SCOPE OF STUDY:

The report analyzes the 3D Through-Silicon Via (TSV) Package market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Technology (Wafer Level Packaging, Through Silicon Via); Application (Memory Based Application, Logic Based Application, Mems & Sensors); End-Use (Consumer Electronics, Automotive, Healthcare, Aerospace & Defense, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 48 Featured) -

  • 3M Company
  • Advanced Micro Devices, Inc. (AMD)
  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding Co., Ltd.
  • ASML Holding N.V.
  • Broadcom Inc.
  • Dialog Semiconductor plc
  • GLOBALFOUNDRIES Inc.
  • IBM Corporation
  • Infineon Technologies AG
  • Intel Corporation
  • JCET Group Co., Ltd.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Micron Technology, Inc.
  • Monolithic 3D Inc.
  • NXP Semiconductors N.V.
  • Panasonic Corporation
  • Powertech Technology Inc.
  • Qualcomm Incorporated

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by artificially increasing the COGS, reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

We are diligently following expert opinions of leading Chief Economists (14,949), Think Tanks (62), Trade & Industry bodies (171) worldwide, as they assess impact and address new market realities for their ecosystems. Experts and economists from every major country are tracked for their opinions on tariffs and how they will impact their countries.

We expect this chaos to play out over the next 2-3 months and a new world order is established with more clarity. We are tracking these developments on a real time basis.

As we release this report, U.S. Trade Representatives are pushing their counterparts in 183 countries for an early closure to bilateral tariff negotiations. Most of the major trading partners also have initiated trade agreements with other key trading nations, outside of those in the works with the United States. We are tracking such secondary fallouts as supply chains shift.

To our valued clients, we say, we have your back. We will present a simplified market reassessment by incorporating these changes!

APRIL 2025: NEGOTIATION PHASE

Our April release addresses the impact of tariffs on the overall global market and presents market adjustments by geography. Our trajectories are based on historic data and evolving market impacting factors.

JULY 2025 FINAL TARIFF RESET

Complimentary Update: Our clients will also receive a complimentary update in July after a final reset is announced between nations. The final updated version incorporates clearly defined Tariff Impact Analyses.

Reciprocal and Bilateral Trade & Tariff Impact Analyses:

USA <> CHINA <> MEXICO <> CANADA <> EU <> JAPAN <> INDIA <> 176 OTHER COUNTRIES.

Leading Economists - Our knowledge base tracks 14,949 economists including a select group of most influential Chief Economists of nations, think tanks, trade and industry bodies, big enterprises, and domain experts who are sharing views on the fallout of this unprecedented paradigm shift in the global econometric landscape. Most of our 16,491+ reports have incorporated this two-stage release schedule based on milestones.

COMPLIMENTARY PREVIEW

Contact your sales agent to request an online 300+ page complimentary preview of this research project. Our preview will present full stack sources, and validated domain expert data transcripts. Deep dive into our interactive data-driven online platform.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • 3D Through-Silicon Via (TSV) Package - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Increasing Need for High-Performance and Compact IC Architectures Throws the Spotlight on 3D TSV Packaging
    • Surge in AI, HPC, and Data Center Applications Spurs Demand for Advanced TSV-Based Semiconductor Integration
    • TSVs Ability to Enable Faster Signal Transmission Strengthens Business Case in High-Speed Computing Environments
    • Rising Demand for Memory Stacking and Logic Integration Propels Growth of 3D TSV Packaging
    • Continued Shrinking of Semiconductor Nodes Bodes Well for TSV as an Enabler of Vertical Scaling
    • Growing Interest in Heterogeneous Integration Drives Adoption of 3D TSV in Advanced Packaging Roadmaps
    • Expansion of IoT and Edge Devices Sets the Stage for TSV Packaging in Ultra-Compact System Designs
    • Thermal Management Capabilities of TSVs Crucial for Market Growth in High-Power Applications
    • Demand for Miniaturized Consumer Electronics Generates Momentum for 3D TSV in Wearables and Mobile Devices
    • TSVs Role in Enabling Chiplets and Multi-Die Integration Expands Addressable Market Opportunities
    • Emerging Trends in 3D ICs and Fan-Out Technologies Drive Co-Development with TSV Packaging
    • Increased R&D Activity in TSV Wafer Bonding and Etching Techniques Fuels Next-Gen Innovation in the Market
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World 3D Through-Silicon Via (TSV) Package Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2025 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Wafer Level Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 5: World 6-Year Perspective for Wafer Level Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 6: World Recent Past, Current & Future Analysis for Through Silicon Via by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 7: World 6-Year Perspective for Through Silicon Via by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World 6-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 11: World 6-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 12: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 13: World 6-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Healthcare by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World 6-Year Perspective for Healthcare by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 17: World 6-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 18: World Recent Past, Current & Future Analysis for Memory Based Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 19: World 6-Year Perspective for Memory Based Application by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Logic Based Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World 6-Year Perspective for Logic Based Application by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Mems & Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 23: World 6-Year Perspective for Mems & Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 24: USA Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 25: USA 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 26: USA Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 27: USA 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 28: USA Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 29: USA 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • CANADA
    • TABLE 30: Canada Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 31: Canada 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 32: Canada Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Canada 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 34: Canada Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 35: Canada 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • JAPAN
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 36: Japan Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 37: Japan 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 38: Japan Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: Japan 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 40: Japan Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 41: Japan 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • CHINA
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 42: China Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 43: China 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 44: China Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: China 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 46: China Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 47: China 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • EUROPE
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 48: Europe Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 49: Europe 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2025 & 2030
    • TABLE 50: Europe Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Europe 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 52: Europe Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 53: Europe 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 54: Europe Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 55: Europe 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • FRANCE
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 56: France Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: France 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 58: France Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 59: France 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 60: France Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 61: France 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • GERMANY
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 62: Germany Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Germany 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 64: Germany Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 65: Germany 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 66: Germany Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 67: Germany 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • ITALY
    • TABLE 68: Italy Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Italy 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 70: Italy Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 71: Italy 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 72: Italy Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 73: Italy 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • UNITED KINGDOM
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 74: UK Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 75: UK 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 76: UK Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 77: UK 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 78: UK Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 79: UK 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • REST OF EUROPE
    • TABLE 80: Rest of Europe Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Rest of Europe 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 82: Rest of Europe Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 83: Rest of Europe 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 84: Rest of Europe Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 85: Rest of Europe 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • ASIA-PACIFIC
    • 3D Through-Silicon Via (TSV) Package Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 86: Asia-Pacific Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Asia-Pacific 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 88: Asia-Pacific Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 89: Asia-Pacific 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 90: Asia-Pacific Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 91: Asia-Pacific 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030
  • REST OF WORLD
    • TABLE 92: Rest of World Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Technology - Wafer Level Packaging and Through Silicon Via - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Rest of World 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Technology - Percentage Breakdown of Value Sales for Wafer Level Packaging and Through Silicon Via for the Years 2025 & 2030
    • TABLE 94: Rest of World Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by End-Use - Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 95: Rest of World 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Consumer Electronics, Automotive, Healthcare and Aerospace & Defense for the Years 2025 & 2030
    • TABLE 96: Rest of World Recent Past, Current & Future Analysis for 3D Through-Silicon Via (TSV) Package by Application - Memory Based Application, Logic Based Application and Mems & Sensors - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 97: Rest of World 6-Year Perspective for 3D Through-Silicon Via (TSV) Package by Application - Percentage Breakdown of Value Sales for Memory Based Application, Logic Based Application and Mems & Sensors for the Years 2025 & 2030

IV. COMPETITION

샘플 요청 목록
0 건의 상품을 선택 중
목록 보기
전체삭제