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Global Underfill Materials Market to Reach US$648.8 Million by 2030

The global market for Underfill Materials estimated at US$434.4 Million in the year 2024, is expected to reach US$648.8 Million by 2030, growing at a CAGR of 6.9% over the analysis period 2024-2030. Capillary Underfill Material (CUF), one of the segments analyzed in the report, is expected to record a 7.5% CAGR and reach US$384.6 Million by the end of the analysis period. Growth in the No Flow Underfill Material (NUF) segment is estimated at 6.4% CAGR over the analysis period.

The U.S. Market is Estimated at US$120.8 Million While China is Forecast to Grow at 6.4% CAGR

The Underfill Materials market in the U.S. is estimated at US$120.8 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$100.0 Million by the year 2030 trailing a CAGR of 6.4% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 6.5% and 5.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.5% CAGR.

Global Underfill Materials Market - Key Trends & Growth Drivers Explored

Why Are Underfill Materials Crucial in Modern Electronics Manufacturing?

Underfill materials have become indispensable in the electronics manufacturing industry, serving a critical role in enhancing the performance, reliability, and longevity of electronic devices. But what exactly are these materials, and why are they so essential? Underfill materials are specialized epoxy or resin compounds used to fill the space between a microchip and its substrate in flip-chip, ball grid array (BGA), and chip-scale package (CSP) assemblies. This process, known as underfilling, significantly strengthens the mechanical integrity of solder joints, protecting them from stress and thermal-induced failures caused by mismatched thermal expansion between the chip and substrate. As electronic devices become increasingly miniaturized and powerful, the need for robust interconnects that can withstand mechanical shocks, thermal cycling, and moisture ingress has grown exponentially. Underfill materials, with their ability to distribute stress evenly across the microelectronic package, have emerged as a vital solution in ensuring device reliability and performance.

The adoption of underfill materials is driven by the rapid development of high-density electronic packages and the growing complexity of integrated circuits (ICs). As the demand for smaller, lighter, and more powerful devices increases, manufacturers are relying on advanced packaging technologies like flip-chip and 3D packaging, which necessitate the use of underfill materials to stabilize the structure and prevent warpage or cracking during operation. In applications such as smartphones, tablets, automotive electronics, and IoT devices, where mechanical stability and thermal management are crucial, underfill materials help maintain the functionality of critical components even under challenging conditions. The market’s growth is further propelled by the trend towards increased miniaturization and higher performance requirements, which place additional stress on solder joints and necessitate more advanced underfill solutions. As electronic components become smaller and their power density increases, the role of underfill materials in providing structural support and enhancing heat dissipation is becoming even more prominent.

How Are Technological Advancements Shaping the Development of Underfill Materials?

The underfill materials market has witnessed significant technological advancements aimed at meeting the evolving demands of modern electronics manufacturing. But what are the key innovations driving these developments? One major breakthrough is the development of low-temperature cure and high-flow underfill materials, which have enhanced the ease and efficiency of underfilling processes. Traditional underfill materials often required prolonged curing times at high temperatures, which could lead to thermal stress and warping in sensitive components. In contrast, new formulations with lower curing temperatures and faster flow characteristics enable a more controlled and efficient underfilling process, minimizing the risk of damage to delicate substrates and reducing cycle times. These advancements have been particularly beneficial in applications involving fine-pitch components and high-density interconnects, where precise application and uniform distribution of underfill are critical.

Additionally, the introduction of no-flow underfills has revolutionized the assembly of flip-chip packages by eliminating the separate dispensing and curing steps typically required in traditional underfilling. No-flow underfills are applied directly to the substrate before the placement of the chip, and they cure simultaneously with the reflow soldering process. This innovation simplifies the manufacturing workflow, reduces process steps, and enhances production efficiency. The development of reworkable underfill materials, which allow for the easy removal and replacement of defective components without damaging the substrate, has further expanded the versatility and applicability of these materials. Reworkable underfills are particularly valuable in high-cost assemblies, such as those used in aerospace, defense, and telecommunications, where component repair and reusability are essential for maintaining production yield and reducing overall costs. These technological advancements have enabled the development of next-generation underfill materials that meet the stringent requirements of modern electronic packaging while offering greater flexibility and performance.

What Market Trends Are Driving the Adoption of Underfill Materials in Electronics Manufacturing?

The adoption of underfill materials in the electronics manufacturing industry is being shaped by several emerging market trends that reflect the changing priorities of manufacturers and consumers alike. One of the most prominent trends is the increasing shift towards miniaturization and higher functionality in electronic devices. As consumer electronics continue to evolve, there is a growing need for compact, lightweight devices with enhanced processing power and reduced energy consumption. This trend has led to the widespread adoption of advanced packaging technologies, such as flip-chip and 3D integrated circuits, which provide greater space efficiency and performance compared to traditional wire-bonding methods. Underfill materials play a critical role in these packaging technologies by providing mechanical reinforcement, protecting delicate solder joints from thermal and mechanical stress, and enhancing overall device reliability. The growing demand for miniaturized electronics in applications such as wearable devices, portable medical equipment, and IoT devices has therefore accelerated the use of underfill materials in electronic assemblies.

Another significant trend driving the adoption of underfill materials is the increasing complexity of automotive electronics. As vehicles become more connected, automated, and electrified, the number of electronic control units (ECUs) and sensors integrated into vehicles has surged. These components operate under harsh environmental conditions, including wide temperature variations, mechanical vibrations, and exposure to moisture and chemicals. Underfill materials are being used extensively in automotive electronics to protect critical components from these stresses, ensuring long-term reliability and performance. The rise of electric vehicles (EVs) and autonomous driving systems has further increased the demand for advanced underfill materials that can withstand high power densities and provide effective thermal management. As automotive manufacturers continue to push the boundaries of vehicle technology, underfill materials are becoming an essential element in safeguarding the integrity of complex electronic systems.

What Factors Are Driving the Growth of the Global Underfill Materials Market?

The growth in the global underfill materials market is driven by several factors, including advancements in electronic packaging technologies, increased adoption in high-reliability applications, and the growing demand for miniaturized electronics. One of the primary growth drivers is the rising adoption of flip-chip and 3D packaging technologies in response to the need for more compact and powerful electronic devices. These advanced packaging solutions provide enhanced performance and functionality but also require robust underfill materials to ensure structural integrity and thermal stability. As electronic devices continue to shrink in size and increase in complexity, the need for high-performance underfill materials that can provide mechanical reinforcement and thermal management has become more critical. The expansion of industries such as consumer electronics, telecommunications, and automotive electronics has also contributed to the growth of the underfill materials market, as these sectors require reliable interconnects that can withstand the rigors of daily operation and environmental exposure.

Another key growth driver is the increasing use of underfill materials in high-reliability applications, such as aerospace, defense, and medical devices, where product failure is not an option. In these industries, underfill materials are used to enhance the mechanical robustness and reliability of critical electronic assemblies, ensuring consistent performance under extreme conditions. The rise of electric vehicles and autonomous driving technologies has further boosted the demand for underfill materials in the automotive sector, as electronic components in these systems must withstand high power loads and challenging thermal environments. Moreover, the development of reworkable and no-flow underfill materials has expanded their applicability and reduced the cost and complexity of manufacturing processes. These materials offer greater flexibility in component assembly and repair, making them an attractive choice for manufacturers looking to optimize production yields and reduce waste. As technological advancements continue to push the boundaries of electronic packaging, the global underfill materials market is poised for sustained growth, driven by a dynamic interplay of innovation, industry demand, and evolving application requirements.

SCOPE OF STUDY:

The report analyzes the Underfill Materials market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Application (Flip Chips, Ball Grid Array (BGA), Chip Scale Packaging (CSP)); Product Type (Capillary Underfill Material (CUF), No Flow Underfill Material (NUF), Molded Underfill Material (MUF))

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 42 Featured) -

• ELANTAS GmbH
• Epoxy Technology, Inc.
• H.B. Fuller Company
• Henkel AG & Co. KGaA
• Inkron Limited
• MacDermid Alpha Electronics Solutions
• NAMICS Corporation
• NORDSON Corporation
• Panasonic Industry Co., Ltd.
• VIETNAM PROS TECHNOLOGY CO., LTD.

AI INTEGRATIONS

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Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

• 1. MARKET OVERVIEW
  • Influencer Market Insights
  • Tariff Impact on Global Supply Chain Patterns
  • Underfill Materials - Global Key Competitors Percentage Market Share in 2025 (E)
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
• 2. FOCUS ON SELECT PLAYERS
• 3. MARKET TRENDS & DRIVERS
  • Increased Adoption of Underfill Materials in Semiconductor Packaging Expands Addressable Market
  • Surge in Use of Underfill Materials in Flip-Chip and Ball Grid Array (BGA) Applications Fuels Market Growth
  • Rising Adoption of Underfill Materials in Mobile and Consumer Electronics Sets the Stage for Market Growth
  • Surge in Demand for Underfill Materials in Automotive and Advanced Driver Assistance Systems (ADAS) Fuels Market Demand
  • Innovations in Low-Temperature and Fast-Curing Underfill Formulations Propel Market Growth
  • Rising Adoption of Underfill Materials in LED and Display Technologies Expands Market Opportunities
  • Surge in Demand for Underfill Materials in Flexible and Wearable Electronics Fuels Market Growth
  • Growing Use of Underfill Materials in Military and Aerospace Electronics Strengthens Business Case
  • Surge in Demand for Underfill Materials in Data Centers and Networking Equipment Expands Market Opportunities
• 4. GLOBAL MARKET PERSPECTIVE
  • TABLE 1: World Underfill Materials Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
  • TABLE 2: World Recent Past, Current & Future Analysis for Underfill Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 3: World Historic Review for Underfill Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 4: World 15-Year Perspective for Underfill Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2025 & 2030
  • TABLE 5: World Recent Past, Current & Future Analysis for Capillary Underfill Material (CUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 6: World Historic Review for Capillary Underfill Material (CUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 7: World 15-Year Perspective for Capillary Underfill Material (CUF) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
  • TABLE 8: World Recent Past, Current & Future Analysis for No Flow Underfill Material (NUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 9: World Historic Review for No Flow Underfill Material (NUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 10: World 15-Year Perspective for No Flow Underfill Material (NUF) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
  • TABLE 11: World Recent Past, Current & Future Analysis for Molded Underfill Material (MUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 12: World Historic Review for Molded Underfill Material (MUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 13: World 15-Year Perspective for Molded Underfill Material (MUF) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
  • TABLE 14: World Recent Past, Current & Future Analysis for Flip Chips by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 15: World Historic Review for Flip Chips by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 16: World 15-Year Perspective for Flip Chips by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
  • TABLE 17: World Recent Past, Current & Future Analysis for Ball Grid Array (BGA) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 18: World Historic Review for Ball Grid Array (BGA) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 19: World 15-Year Perspective for Ball Grid Array (BGA) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
  • TABLE 20: World Recent Past, Current & Future Analysis for Chip Scale Packaging (CSP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 21: World Historic Review for Chip Scale Packaging (CSP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 22: World 15-Year Perspective for Chip Scale Packaging (CSP) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

III. MARKET ANALYSIS

• UNITED STATES
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
  • TABLE 23: USA Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 24: USA Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 25: USA 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
  • TABLE 26: USA Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 27: USA Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 28: USA 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
• CANADA
  • TABLE 29: Canada Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 30: Canada Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 31: Canada 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
  • TABLE 32: Canada Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 33: Canada Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 34: Canada 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
• JAPAN
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
  • TABLE 35: Japan Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 36: Japan Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 37: Japan 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
  • TABLE 38: Japan Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 39: Japan Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 40: Japan 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
• CHINA
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
  • TABLE 41: China Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 42: China Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 43: China 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
  • TABLE 44: China Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 45: China Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 46: China 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
• EUROPE
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
  • TABLE 47: Europe Recent Past, Current & Future Analysis for Underfill Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
  • TABLE 48: Europe Historic Review for Underfill Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 49: Europe 15-Year Perspective for Underfill Materials by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2025 & 2030
  • TABLE 50: Europe Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 51: Europe Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 52: Europe 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
  • TABLE 53: Europe Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 54: Europe Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 55: Europe 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
• FRANCE
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
  • TABLE 56: France Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 57: France Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 58: France 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
  • TABLE 59: France Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 60: France Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 61: France 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
• GERMANY
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
  • TABLE 62: Germany Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 63: Germany Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 64: Germany 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
  • TABLE 65: Germany Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 66: Germany Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 67: Germany 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
• ITALY
  • TABLE 68: Italy Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 69: Italy Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 70: Italy 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
  • TABLE 71: Italy Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 72: Italy Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 73: Italy 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
• UNITED KINGDOM
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
  • TABLE 74: UK Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 75: UK Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 76: UK 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
  • TABLE 77: UK Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 78: UK Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 79: UK 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
• REST OF EUROPE
  • TABLE 80: Rest of Europe Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 81: Rest of Europe Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 82: Rest of Europe 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
  • TABLE 83: Rest of Europe Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 84: Rest of Europe Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 85: Rest of Europe 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
• ASIA-PACIFIC
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
  • TABLE 86: Asia-Pacific Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 87: Asia-Pacific Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 88: Asia-Pacific 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
  • TABLE 89: Asia-Pacific Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 90: Asia-Pacific Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 91: Asia-Pacific 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
• REST OF WORLD
  • TABLE 92: Rest of World Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 93: Rest of World Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 94: Rest of World 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
  • TABLE 95: Rest of World Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
  • TABLE 96: Rest of World Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
  • TABLE 97: Rest of World 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030

IV. COMPETITION