공지 : 도쿄증권거래소 JASDAQ 스탠다드 시장 신규 상장 관련 안내

Global Information
회사소개 | 문의 | 비교리스트

세계의 반도체 장비 : 시장, 시장 점유율, 시장 예측

Global Semiconductor Equipment: Markets, Market Shares and Market Forecasts

리서치사 Information Network
발행일 2021년 03월 상품 코드 604352
페이지 정보 영문
가격
US $ 7,495 ₩ 8,445,000 PDF


세계의 반도체 장비 : 시장, 시장 점유율, 시장 예측 Global Semiconductor Equipment: Markets, Market Shares and Market Forecasts
발행일 : 2021년 03월 페이지 정보 : 영문

본 상품은 영문 자료로 한글과 영문목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문목차를 참고해주시기 바랍니다.

30개 부문 이상의 반도체 장비(Semiconductor Equipment) 시장에 대해 조사했으며, 미국, 유럽 및 아시아의 주요 장비 공급업체 49개사 개요 등의 정보를 전해드립니다.

제1장 서론

제2장 반도체 산업 촉진요인

  • 서론
  • 파운드리
  • DRAM
  • NAND
  • 중국

제3장 마켓 비지니스 부문의 점유율과 예측

  • AMHS 시장 점유율과 예측
  • CMP 시장 점유율과 예측
  • 이온 주입 시장 점유율과 예측
  • 리소그래피 시장 점유율과 예측
  • 산화/확산 시장 점유율과 예측
  • 포토레지스트 처리(트랙) 시장 점유율과 예측
  • RTP 시장 점유율과 예측
  • 플라즈마 식각(Plasma Etch) 시장 점유율과 예측
  • 프로세스 컨트롤 시장 점유율과 예측
  • 웨이퍼 레벨 패키징 시장 점유율과 예측

제4장 미국의 반도체 장비 공급업체 : 개요

  • Applied Materials
  • Axcelis Technologies
  • KLA-Tencor
  • Lam Research
  • Mattson Technology
  • Nanometrics
  • Rudolph Technologies
  • Ultratech
  • Veeco

제5장 유럽의 반도체 장비 공급업체 : 개요

  • Aixtron
  • ASM International
  • ASML
  • Carl Zeiss
  • Camtek
  • EV Group
  • LPE
  • Mycronic
  • Nova Measuring Instruments
  • Oerlikon / Evatec
  • Semilab

제6장 아시아의 반도체 장비 공급업체 : 개요

  • Advantest
  • Canon
  • Canon Anelva
  • Daifuku
  • Ebara
  • Hermes Microvision
  • Hitachi High-Technologies
  • Hitachi Kokusai Electric
  • JEOL
  • Jusung Engineering
  • KC Tech
  • Lasertec
  • Murata Machinery
  • Nikon
  • Nippon Sanso
  • Nissin Ion Equipment
  • NuFlare Technology
  • PSK
  • Screen Semiconductor Solutions
  • SEMES
  • SEN
  • TES
  • Tokyo Electron
  • Tokyo Seimitsu
  • Topcon Technohouse
  • Toray Engineering
  • Ulvac
  • Ushio
  • Wonik IPS
KSM 18.03.02

LIST OF TABLES

  • 2.1. Foundry Capex ($ Billions) And Shares (%)
  • 2.2. Foundry Forecast
  • 2.3. Pure Play Foundry Revenue Shares
  • 2.4. Global Foundry Market By Application
  • 2.5. Global Foundry Market By Customer Type
  • 2.6. Global Foundry Market By Device Type
  • 2.7. Technology Roadmaps For China Foundries
  • 2.8. Global Foundry Market By Linewidth
  • 2.9. Foundry Capacity By Region
  • 2.10. DRAM Wafer Capacity Forecast by Fab - Wafers
  • 2.11. DRAM Bit Growth Demand Forecast by Application
  • 2.12. DRAM Revenue Demand Forecast by Application
  • 2.13. DRAM Market Shares
  • 2.14. DRAM Capex Forecast by Company
  • 2.15. NAND Wafer Capacity by Company Fab
  • 2.16. NAND Bit Growth Supply Forecast by Company
  • 2.17. NAND Bit Growth Demand Forecast by Application
  • 2.18. NAND Market Shares
  • 2.19. 3D NAND Wafer Capacity Forecast by Fab
  • 2-20. Capex Forecast By Memory And Other Ic Manufacturers
  • 2-21. China's 8- And 12-Inch Fabs and Foundries
  • 3.1. AMHS Market Forecast
  • 3.2. CMP Market Forecast
  • 3.3. Plasma Strip Market Forecast
  • 3.4. Spray Processors Market Forecast
  • 3.5. Wet Stations Market Forecast
  • 3.6. ALD Market Forecast
  • 3.7. Epitaxy Market Forecast
  • 3.8. MOCVD Market Forecast
  • 3.9. LPCVD (non-tube) Market Forecast
  • 3.10. LPCVD (tube) Market Forecast
  • 3.11. PECVD Market Forecast
  • 3.12. PVD Market Forecast
  • 3.13. High-Current Ion Implantation Market Forecast
  • 3.14. High-Voltage Ion Implantation Market Forecast
  • 3.15. Medium-Current Ion Implantation Market Forecast
  • 3.16. Direct-Write E-Beam Lithography Market Forecast
  • 3.17. Mask-Making Lithography Market Forecast
  • 3.18. Steppers Market Forecast
  • 3.19. Oxidation Market Forecast
  • 3.20. Photoresist Processing (Track) Market Forecast
  • 3.21. RTP Market Forecast
  • 3.22. Dielectric Etch Market Forecast
  • 3.23. Conductive Etch Market Forecast
  • 3.24. Lithography Metrology Market Forecast
  • 3.25. Thin-Film Metrology Market Forecast
  • 3.26. Wafer Inspection and Defect Review Market Forecast
  • 3.27. Wafer-Level Packaging Market Forecast

LIST OF FIGURES

  • 2.1. China's IC Production Forecast
  • 2.2. China's IC Consumption
  • 2.3. China's IC Production/Consumption Ratio
  • 2.4. China's IC Import Requirements
  • 2.5. China's IC Supply/Demand
  • 2.6. China's IC Fab Capacity
  • 2.7. China's IC Fab Capacity by Region
  • 2.8. China's IC Fab Capacity by Wafer Size
  • 2.9. China's IC Fab Capacity by Geometry
  • 2.10. China's IC Production by Type
  • 3.1. AMHS Market Shares
  • 3.2. CMP Market Shares
  • 3.3. Plasma Strip Market Shares
  • 3.4. Spray Processors Market Shares
  • 3.5. Wet Stations Market Shares
  • 3.6. ALD Market Shares
  • 3.7. Epitaxy Market Shares
  • 3.8. MOCVD Market Shares
  • 3.9. LPCVD (non-tube) Market Shares
  • 3.10. LPCVD (tube) Market Shares
  • 3.11. PECVD Market Shares
  • 3.12. PVD Market Shares
  • 3.13. High-Current Ion Implantation Market Shares
  • 3.14. High-Voltage Ion Implantation Market Shares
  • 3.15. Medium-Current Ion Implantation Market Shares
  • 3.16. Direct-Write E-Beam Lithography Market Shares
  • 3.17. Mask-Making Lithography Market Shares
  • 3.18. Steppers Market Shares
  • 3.19. Oxidation Market Shares
  • 3.20. Photoresist Processing (Track) Market Shares
  • 3.21. RTP Market Shares
  • 3.22. Dielectric Etch Market Shares
  • 3.23. Conductive Etch Market Shares
  • 3.24. Lithography Metrology Market Shares
  • 3.25. Thin-Film Metrology Market Shares
  • 3.26. Wafer Inspection and Defect Review Market Shares
  • 3.27. Wafer-Level Packaging Market Shares

This report describes the semiconductor equipment markets for more than 30 different sectors and profiles 49 leading equipment suppliers in the U.S., Europe, and Asia. Market shares for each company for each sector are presented, and each sector is forecast.

Table of Contents

Chapter 1 Introduction

Chapter 2 Semiconductor Industry Driving Forces

  • 2.1. Introduction
  • 2.2. Foundries
    • 2.2.1. Foundry Capex Trends
    • 2.2.2. Foundry Revenue Growth
    • 2.2.3. Foundry Market Share
    • 2.2.4. Revenue Growth by Foundry
    • 2.2.5. Global Foundry Market Trend by Application
    • 2.2.6. Global Foundry Market Trend by Customer Type
    • 2.2.7. Global Foundry Market Trend by Device
    • 2.2.8. Foundry Technology Linewidth Roadmap
    • 2.2.9. Capacity trend by linewidth
    • 2.2.10. Capacity ratio by region
  • 2.3. DRAM
    • 2.3.1. Present and Future Capacity of DRAM by Manufacturer
    • 2.3.2. DRAM Revenue Demand Forecast By Application
    • 2.3.3. DRAM Market Shares
    • 2.3.4. DRAM Capex
  • 2.4. NAND
    • 2.4.1. NAND Revenue Demand Forecast By Applications
    • 2.4.2. NAND Market Shares
    • 2.4.3. 3D NAND Capacity
  • 2.5. China
    • 2.5.1. China's Semiconductor Infrastructure
    • 2.5.2. China's Semiconductor Market
    • 2.5.3. China's IC Production
    • 2.5.4. China's IC Consumption
    • 2.5.5. China's IC Production/Consumption Ratio
    • 2.5.6. China's IC Import Requirements
    • 2.5.7. China's IC Supply/Demand
    • 2.5.8. China's IC Fab Capacity
    • 2.5.9. China's IC Fab Capacity by Region
    • 2.5.10. China's 8- And 12-Inch Fabs and Foundries
    • 2.5.11. China's IC Fab Capacity by Wafer Size
    • 2.5.12. China's IC Fab Capacity by Geometry
    • 2.5.13. China's IC Production by Type

Chapter 3 Market Business Sectors Shares and Forecast

  • 3.1. AMHS Market Shares and Forecast
  • 3.2. CMP Market Shares and Forecast
  • 3.3. Clean Market Shares and Forecast
    • 3.3.1. Plasma Strip
    • 3.3.2. Spray Processors
    • 3.3.3. Wet Stations
  • 3.4. Deposition Market Shares and Forecast
    • 3.4.1. ALD
    • 3.4.2. Epitaxy
    • 3.4.3. MOCVD
    • 3.4.4. LPCVD (non-tube)
    • 3.4.5. LPCVD (tube)
    • 3.4.6. PECVD
    • 3.4.7. PVD
  • 3.5. Ion Implantation Market Shares and Forecast
    • 3.5.1. High-Current
    • 3.5.2. High-Energy
    • 3.5.3. Medium-Current
  • 3.6. Lithography Market Shares and Forecast
    • 3.6.1. Direct-Write E-Beam Lithography
    • 3.6.2. Mask-Making Lithography
    • 3.6.3. Steppers
  • 3.7. Oxidation/Diffusion Market Shares and Forecast
  • 3.8. Photoresist Processing (Track) Market Shares and Forecast
  • 3.9. RTP Market Shares and Forecast
  • 3.10. Plasma Etch Market Shares and Forecast
    • 3.10.1. Dielectric
    • 3.10.2. Conductive
  • 3.11. Process Control Market Shares and Forecast
    • 3.11.1. Lithography Metrology
    • 3.11.2. Thin-Film Metrology
    • 3.11.3. Wafer Inspection and Defect Review
  • 3.12. Wafer-Level Packaging Market Shares and Forecast

Chapter 4 U.S. Semiconductor Equipment Suppliers - Profiles

  • 4.1. Applied Materials
    • 4.1.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.1.2. Company Profile
    • 4.1.3. Company Financials
  • 4.2. Axcelis Technologies
    • 4.1.2. Business Sectors Covered In The Market Analysis Chapter
    • 4.2.2. Company Profile
    • 4.2.3. Company Financials
  • 4.3. KLA-Tencor
    • 4.3.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.3.2. Company Profile
    • 4.3.3. Company Financials
  • 4.4. Lam Research
    • 4.4.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.4.2. Company Profile
    • 4.4.3. Company Financials
  • 4.5. Nanometrics
    • 4.5.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.5.2. Company Profile
    • 4.5.3. Company Financials
  • 4.6. Rudolph Technologies
    • 4.6.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.6.2. Company Profile
    • 4.6.3. Company Financials
  • 4.7. Veeco
    • 4.7.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.7.2. Company Profile
    • 4.7.3. Company Financials

Chapter 5 European Semiconductor Equipment Suppliers - Profiles

  • 5.1. Aixtron
    • 5.1.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.1.2. Company Profile
    • 5.1.3. Company Financials
  • 5.2. ASM International
    • 5.2.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.2.2. Company Profile
    • 5.2.3. Company Financials
  • 5.3. ASML
    • 5.3.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.3.2. Company Profile
    • 5.3.3. Company Financials
  • 5.4. Carl Zeiss
    • 5.4.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.4.2. Company Profile
    • 5.4.3. Company Financials
  • 5.5. Camtek
    • 5.5.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.5.2. Company Profile
    • 5.5.3. Company Financials
  • 5.6. EV Group
    • 5.6.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.6.2. Company Profile
    • 5.6.3. Company Financials
  • 5.7. LPE
    • 5.7.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.7.2. Company Profile
    • 5.7.3. Company Financials
  • 5.8. Mycronic
    • 5.8.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.8.2. Company Profile
    • 5.8.3. Company Financials
  • 5.9. Nova Measuring Instruments
    • 5.9.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.9.2. Company Profile
    • 5.9.3. Company Financials
  • 5.10. Oerlikon / Evatec
    • 5.10.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.10.2. Company Profile
    • 5.10.3. Company Financials
  • 5.11. Semilab
    • 5.11.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.11.2. Company Profile
    • 5.11.3. Company Financials

Chapter 6 Asian Semiconductor Equipment Suppliers - Profiles

  • 6.1. Advantest
    • 6.1.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.1.2. Company Profile
    • 6.1.3. Company Financials
  • 6.2. Canon
    • 6.2.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.2.2. Company Profile
    • 6.2.3. Company Financials
  • 6.3. Canon Anelva
    • 6.3.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.3.2. Company Profile
    • 6.3.3. Company Financials
  • 6.4. Daifuku
    • 6.4.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.4.2. Company Profile
    • 6.4.3. Company Financials
  • 6.5. Ebara
    • 6.5.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.5.2. Company Profile
    • 6.5.3. Company Financials
  • 6.6. Eugene Technology
    • 6.6.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.6.2. Company Profile
    • 6.6.3. Company Financials
  • 6.7. Hitachi High-Technologies
    • 6.7.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.7.2. Company Profile
    • 6.7.3. Company Financials
  • 6.8. Hitachi Kokusai Electric
    • 6.8.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.8.2. Company Profile
    • 6.8.3. Company Financials
  • 6.9. JEOL
    • 6.9.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.9.2. Company Profile
    • 6.9.3. Company Financials
  • 6.10. Jusung Engineering
    • 6.10.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.10.2. Company Profile
    • 6.10.3. Company Financials
  • 6.11. KC Tech
    • 6.11.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.11.2. Company Profile
    • 6.11.3. Company Financials
  • 6.12. Lasertec
    • 6.12.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.12.2. Company Profile
    • 6.12.3. Company Financials
  • 6.13. Murata Machinery
    • 6.13.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.13.2. Company Profile
    • 6.13.3. Company Financials
  • 6.14. Nikon
    • 6.14.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.14.2. Company Profile
    • 6.14.3. Company Financials
  • 6.15. Nippon Sanso
    • 6.15.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.15.2. Company Profile
    • 6.15.3. Company Financials
  • 6.16. Nissin Ion Equipment
    • 6.16.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.16.2. Company Profile
    • 6.16.3. Company Financials
  • 6.17. NuFlare Technology
    • 6.17.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.17.2. Company Profile
    • 6.17.3. Company Financials
  • 6.18. PSK
    • 6.18.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.18.2. Company Profile
    • 6.18.3. Company Financials
  • 6.19. Screen Semiconductor Solutions
    • 6.19.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.19.2. Company Profile
    • 6.19.3. Company Financials
  • 6.20. SEMES
    • 6.20.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.20.2. Company Profile
    • 6.20.3. Company Financials
  • 6.21. SEN
    • 6.21.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.21.2. Company Profile
    • 6.21.3. Company Financials
  • 6.22. TES
    • 6.22.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.22.2. Company Profile
    • 6.22.3. Company Financials
  • 6.23. Tokyo Electron
    • 6.23.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.23.2. Company Profile
    • 6.23.3. Company Financials
  • 6.24. Tokyo Seimitsu
    • 6.24.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.24.2. Company Profile
    • 6.24.3. Company Financials
  • 6.25. Topcon Technohouse
    • 6.25.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.25.2. Company Profile
    • 6.25.3. Company Financials
  • 6.26. Toray Engineering
    • 6.26.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.26.2. Company Profile
    • 6.26.3. Company Financials
  • 6.27. Ulvac
    • 6.27.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.27.2. Company Profile
    • 6.27.3. Company Financials
  • 6.28. Ushio
    • 6.28.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.28.2. Company Profile
    • 6.28.3. Company Financials
  • 6.29. Wonik IPS
    • 6.29.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.29.2. Company Profile
    • 6.29.3. Company Financials
Back to Top
전화 문의
F A Q