세계의 전자빔 웨이퍼 검사 시스템 시장 보고서 - 해상도, 용도, 최종 용도, 지역별(2024-2032년)

The global e-beam wafer inspection system market size reached US$ 759.9 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 3,459.6 Million by 2032, exhibiting a growth rate (CAGR) of 17.8% during 2024-2032.

E-beam wafer inspection system refers to a semiconductor fabrication tool based on electron beam scanning of integrated circuit (IC) components or wafers. It is used for detecting any defects in the wafers before final packaging and is ideal for scanning small sections of a die to identify specific hard-to-detect systematic and random defects. The inspection system scans the wafer and determines coordinates of the defects by comparing it to the image of the adjacent dies. This technique is commonly used while manufacturing compact gadgets, smartphones, laptops and tablets. It is also used for lithographic qualification, wafer dispositioning and reticle quality optimization.

Significant growth in the electronics industry, along with rapid industrialization, is one of the key factors creating a positive outlook for the market. Semiconductor wafers are widely used for manufacturing specialized devices and consumer electronics, thereby increasing the demand for efficient inspection systems. Furthermore, the electrification and automation in automobiles is also driving the market growth. Numerous kinds of wafers are used in automobile components, such as airbag controls, global positioning systems (GPS), anti-lock braking systems (ABS), navigation and display systems and power down and window controls. They are also used for improving automated driving and collision detection technologies, which, in turn, have increased the demand for wafer inspection systems. Moreover, various technological advancements, such as the development of multi-beam e-beam inspection systems that are more efficient and minimize the overall time required for mass production, are projected to drive the market further.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global e-beam wafer inspection system market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on resolution, application and end use.

Breakup by Resolution:

Less than 1 nm

1 nm to 10 nm

More than 10 nm

Breakup by Application:

Defect Imaging

Lithographic Qualification

Bare Wafer OQC/IQC

Wafer Dispositioning

Reticle Quality Inspection

Inspector Recipe Optimization

Breakup by End Use:

Communication Devices

Consumer Electronic Equipments

Automotive Parts

Others

Breakup by Region:

North America

United States

Canada

Asia Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Competitive Landscape:

The report has also analysed the competitive landscape of the market with some of the key players being Aerotech Inc., Applied Materials Inc., ASML Holding N.V., Hitachi Ltd., KLA-Tener Corporation, Lam Research Corporation, Nanotronics Imaging Inc., NXP Semiconductors N.V. (Qualcomm Incorporated), Renesas Electronics Corporation, Synopsys Inc., Taiwan Semiconductor and Teledyne Technologies.

Key Questions Answered in This Report:

• How has the global e-beam wafer inspection system market performed so far and how will it perform in the coming years?
• What has been the impact of COVID-19 on the global e-beam wafer inspection system market?
• What are the key regional markets?
• What is the breakup of the market based on the resolution?
• What is the breakup of the market based on the application?
• What is the breakup of the market based on the end use?
• What are the various stages in the value chain of the industry?
• What are the key driving factors and challenges in the industry?
• What is the structure of the global e-beam wafer inspection system market and who are the key players?
• What is the degree of competition in the industry?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global E-Beam Wafer Inspection System Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Resolution

• 6.1 Less than 1 nm
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 1 nm to 10 nm
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast
• 6.3 More than 10 nm
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast

7 Market Breakup by Application

• 7.1 Defect Imaging
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 Lithographic Qualification
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 Bare Wafer OQC/IQC
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast
• 7.4 Wafer Dispositioning
  • 7.4.1 Market Trends
  • 7.4.2 Market Forecast
• 7.5 Reticle Quality Inspection
  • 7.5.1 Market Trends
  • 7.5.2 Market Forecast
• 7.6 Inspector Recipe Optimization
  • 7.6.1 Market Trends
  • 7.6.2 Market Forecast

8 Market Breakup by End Use

• 8.1 Communication Devices
  • 8.1.1 Market Trends
  • 8.1.2 Market Forecast
• 8.2 Consumer Electronic Equipments
  • 8.2.1 Market Trends
  • 8.2.2 Market Forecast
• 8.3 Automotive Parts
  • 8.3.1 Market Trends
  • 8.3.2 Market Forecast
• 8.4 Others
  • 8.4.1 Market Trends
  • 8.4.2 Market Forecast

9 Market Breakup by Region

• 9.1 North America
  • 9.1.1 United States
    • 9.1.1.1 Market Trends
    • 9.1.1.2 Market Forecast
  • 9.1.2 Canada
    • 9.1.2.1 Market Trends
    • 9.1.2.2 Market Forecast
• 9.2 Asia Pacific
  • 9.2.1 China
    • 9.2.1.1 Market Trends
    • 9.2.1.2 Market Forecast
  • 9.2.2 Japan
    • 9.2.2.1 Market Trends
    • 9.2.2.2 Market Forecast
  • 9.2.3 India
    • 9.2.3.1 Market Trends
    • 9.2.3.2 Market Forecast
  • 9.2.4 South Korea
    • 9.2.4.1 Market Trends
    • 9.2.4.2 Market Forecast
  • 9.2.5 Australia
    • 9.2.5.1 Market Trends
    • 9.2.5.2 Market Forecast
  • 9.2.6 Indonesia
    • 9.2.6.1 Market Trends
    • 9.2.6.2 Market Forecast
  • 9.2.7 Others
    • 9.2.7.1 Market Trends
    • 9.2.7.2 Market Forecast
• 9.3 Europe
  • 9.3.1 Germany
    • 9.3.1.1 Market Trends
    • 9.3.1.2 Market Forecast
  • 9.3.2 France
    • 9.3.2.1 Market Trends
    • 9.3.2.2 Market Forecast
  • 9.3.3 United Kingdom
    • 9.3.3.1 Market Trends
    • 9.3.3.2 Market Forecast
  • 9.3.4 Italy
    • 9.3.4.1 Market Trends
    • 9.3.4.2 Market Forecast
  • 9.3.5 Spain
    • 9.3.5.1 Market Trends
    • 9.3.5.2 Market Forecast
  • 9.3.6 Russia
    • 9.3.6.1 Market Trends
    • 9.3.6.2 Market Forecast
  • 9.3.7 Others
    • 9.3.7.1 Market Trends
    • 9.3.7.2 Market Forecast
• 9.4 Latin America
  • 9.4.1 Brazil
    • 9.4.1.1 Market Trends
    • 9.4.1.2 Market Forecast
  • 9.4.2 Mexico
    • 9.4.2.1 Market Trends
    • 9.4.2.2 Market Forecast
  • 9.4.3 Others
    • 9.4.3.1 Market Trends
    • 9.4.3.2 Market Forecast
• 9.5 Middle East and Africa
  • 9.5.1 Market Trends
  • 9.5.2 Market Breakup by Country
  • 9.5.3 Market Forecast

10 SWOT Analysis

• 10.1 Overview
• 10.2 Strengths
• 10.3 Weaknesses
• 10.4 Opportunities
• 10.5 Threats

11 Value Chain Analysis

12 Porters Five Forces Analysis

• 12.1 Overview
• 12.2 Bargaining Power of Buyers
• 12.3 Bargaining Power of Suppliers
• 12.4 Degree of Competition
• 12.5 Threat of New Entrants
• 12.6 Threat of Substitutes

13 Price Analysis

14 Competitive Landscape

• 14.1 Market Structure
• 14.2 Key Players
• 14.3 Profiles of Key Players
  • 14.3.1 Aerotech Inc.
    • 14.3.1.1 Company Overview
    • 14.3.1.2 Product Portfolio
  • 14.3.2 Applied Materials Inc.
    • 14.3.2.1 Company Overview
    • 14.3.2.2 Product Portfolio
    • 14.3.2.3 Financials
    • 14.3.2.4 SWOT Analysis
  • 14.3.3 ASML Holding N.V.
    • 14.3.3.1 Company Overview
    • 14.3.3.2 Product Portfolio
    • 14.3.3.3 Financials
    • 14.3.3.4 SWOT Analysis
  • 14.3.4 Hitachi Ltd.
    • 14.3.4.1 Company Overview
    • 14.3.4.2 Product Portfolio
    • 14.3.4.3 Financials
    • 14.3.4.4 SWOT Analysis
  • 14.3.5 KLA-Tener Corporation
    • 14.3.5.1 Company Overview
    • 14.3.5.2 Product Portfolio
    • 14.3.5.3 Financials
    • 14.3.5.4 SWOT Analysis
  • 14.3.6 Lam Research Corporation
    • 14.3.6.1 Company Overview
    • 14.3.6.2 Product Portfolio
    • 14.3.6.3 Financials
    • 14.3.6.4 SWOT Analysis
  • 14.3.7 Nanotronics Imaging Inc.
    • 14.3.7.1 Company Overview
    • 14.3.7.2 Product Portfolio
  • 14.3.8 NXP Semiconductors N.V. (Qualcomm Incorporated)
    • 14.3.8.1 Company Overview
    • 14.3.8.2 Product Portfolio
    • 14.3.8.3 Financials
    • 14.3.8.4 SWOT Analysis
  • 14.3.9 Renesas Electronics Corporation
    • 14.3.9.1 Company Overview
    • 14.3.9.2 Product Portfolio
    • 14.3.9.3 Financials
    • 14.3.9.4 SWOT Analysis
  • 14.3.10 Synopsys Inc.
    • 14.3.10.1 Company Overview
    • 14.3.10.2 Product Portfolio
    • 14.3.10.3 Financials
    • 14.3.10.4 SWOT Analysis
  • 14.3.11 Taiwan Semiconductor
    • 14.3.11.1 Company Overview
    • 14.3.11.2 Product Portfolio
    • 14.3.11.3 Financials
    • 14.3.11.4 SWOT Analysis
  • 14.3.12 Teledyne Technologies
    • 14.3.12.1 Company Overview
    • 14.3.12.2 Product Portfolio
    • 14.3.12.3 Financials
    • 14.3.12.4 SWOT Analysis