세계의 열 인터페이스 재료 시장 보고서 : 제품 유형, 용도, 지역별(2024-2032년)

The global thermal interface materials market size reached US$ 3.5 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 7.3 Billion by 2032, exhibiting a growth rate (CAGR) of 8.3% during 2024-2032. The market is majorly driven by significant growth in the consumer electronics sector, rising investments in renewable energy, continual advancements in automotive technology, increasing adoption of 5G technology, rapid expansion in aerospace and defense sectors, and an enhanced focus on medical device innovations.

Thermal Interface Materials Market Analysis:

Major Market Drivers: The rising need for efficient heat dissipation due to the miniaturization of electronic components and the augmenting demand for powerful computing devices is driving the global market for thermal interface materials (TIMs). Additionally, the increasing adoption of electric vehicles (EVs) and renewable energy systems requires advanced thermal management solutions to enhance battery performance and reliability.

Key Market Trends: The proliferation of 5G technology due to the expansion of telecommunications infrastructure that demand advanced thermal management solutions such as TIMs is a significant trend in the market. Considerable developments in wearable technologies and the Internet of Things (IoT) devices, which require compact and efficient thermal management solutions, is another major market trend.

Geographical Trends: The Asia Pacific region leads the market, driven by rapid industrialization, expanding electronics sector, and the presence of major manufacturing hubs in countries, such as China, Japan, and South Korea. The region's dominance is bolstered by favorable government policies and significant investments in technological advancements, which fuel the demand for TIMs in various applications. The thermal interface materials market overview highlights the critical role of Asia Pacific in shaping the global market landscape.

Competitive Landscape: The competitive landscape of the market includes leading companies such as 3M Company, Dow Inc., Henkel AG & Co. KGaA, Honeywell International Inc., Indium Corporation, Kitagawa Industries America Inc., Laird Technologies Inc. Momentive Performance Materials Inc., Parker-Hannifin Corporation, and Zalman Tech Co. Ltd. These key players are heavily investing in research and development to innovate and expand their product portfolios. Their efforts aim to capture a larger market share and address the growing demand for efficient thermal management solutions. These activities result in the creation of numerous thermal interface materials market recent opportunities for growth and advancement, showcasing the industry's dynamic and competitive nature.

Challenges and Opportunities: The market faces multiple challenges, such as the augmenting need to innovate materials in line with emerging technologies and the increasing pressure to manufacture environmentally friendly products. However, these challenges also present significant growth opportunities. The growth in emerging applications, such as renewable energy and electric vehicles (EVs), requires more sophisticated thermal technologies. With TIMs being rapidly adopted across industries seeking more efficient and sustainable technologies, the market presents numerous growth and opportunities in multiple sectors. These dynamics highlight the market recent opportunities for innovation and growth, positioning the industry for a promising future amid evolving technological and environmental landscapes.

Thermal Interface Materials Market Trends:

Significant growth in the consumer electronics sector

The rising demand for high-performance electronic devices among the masses is driving the market. As electronic devices become more compact and powerful, effective heat dissipation is crucial to maintain their performance and longevity. TIMs are essential elements in managing heat by improving thermal conductivity between the components and heatsinks. This need is especially noticeable in the consumer electronics, automotive, and telecom industries where modern-day TIMs ensure greater reliability and efficiency. All of these trends are empowering the demand for advanced thermal management solutions, in addition to high-performance computing devices and gaming. As a result, the thermal interface materials market forecast remains positive, with continuous advancements driving its expansion.

Rising Investments in Renewable Energy

The growing investments made for the development of renewable energy sources are supporting the market growth. The transition towards renewable energy, such as solar and wind power, involves the deployment of sophisticated electronic systems that require efficient thermal management. The power electronics equipment such as solar inverters, wind turbine controllers and other associated devices produce considerable amount of heat in course of operation and hence, require the usage of high-performance TIMs to meet the performance requirement. This is due to the continuing interest for sustainable energy and the global trend towards utilizing renewable energy to reduce carbon footprint, thus stimulating the usage of thermal interface materials for renewable energy projects. With the growth of renewable energy sectors, demand for high-tech thermal management solutions is continuously increasing and consequently propelling the thermal interface materials demand significantly.

Continual advancements in automotive technology

Emerging innovations in the development of new vehicles are a significant factor impelling the global market. The rising popularity of electric vehicles and self-driving vehicles has led to the augmenting demand for effective thermal management solutions. Thermal management is particularly crucial for electric vehicles as batteries and ECUs need stringent control of temperature. The use of TIMs is vital in regulating the thermal design of these components and increasing the efficiency and safety of EVs. Also, modern vehicles incorporate features such as ADAS and infotainment that require good thermal management in their operation. This trend is further contributing to the thermal interface materials market growth.

Thermal Interface Materials Market Segmentation:

IMARC Group provides an analysis of the key trends in each segment of the market, along with forecasts at the global, regional, and country levels for 2024-2032. Our report has categorized the market based on product type and application.

Breakup by Product Type:

Tapes and Films

Elastomeric Pads

Greases and Adhesives

Phase Change Materials

Metal Based Materials

Others

Greases and adhesives accounts for the majority of the market share

The report has provided a detailed breakup and analysis of the market based on the product type. This includes tapes and films, elastomeric pads, greases and adhesives, phase change materials, metal-based materials, and others. According to the report, greases and adhesives represented the largest segment.

Greases and adhesives dominate the market due to their high thermal conductivity and easy-to-apply properties. Greases offer high thermal performance and can fill small gaps between surfaces to ensure efficient heat transfer. Adhesives, in contrast, have a combination of thermal conductivity and mechanical bonding capacity, making them suitable for different applications. As a result, these products have a major market share in the TIMs market due to their performance and versatility. On account of the increasing demand for high-performance devices in various industries, greases and adhesives are expected to continue generating high thermal interface materials market revenue.

Breakup by Application:

Telecom

Computer

Medical Devices

Industrial Machinery

Consumer Durables

Automotive Electronics

Others

Computer holds the largest share of the industry

A detailed breakup and analysis of the market based on the application have also been provided in the report. This includes telecom, computer, medical devices, industrial machinery, consumer durables, automotive electronics, and others. According to the report, computer accounted for the largest market share.

The computer segment holds the largest share of the market. Growing demand for high-performance computing (HPC) and the miniaturization of electronic modules drive heat removal innovations. With ongoing advancements in computer processors, including the development of faster processors and more powerful graphics cards, the demand for effective thermal management solutions is rising. Furthermore, the growing usage of gaming PCs, workstations, and data centers further accelerates the demand for high-performance TIMs. The thermal interface materials market outlook remains favorable due to these technological advancements and the increasing complexity of computer systems.

Breakup by Region:

North America

United States

Canada

Asia Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Asia Pacific leads the market, accounting for the largest thermal interface materials market share

The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific represents the largest regional market for thermal interface materials.

Asia Pacific holds the largest segment in the market due to the region's rapid industrialization, significant growth of the electronics industries, and the expansion of major manufacturing hubs such as China, Japan, and South Korea. The increasing production of consumer electronics, automotive electronics, and other advanced technologies in this region also drives the demand for the product. Furthermore, continual investments by key players in the production of EVs and technological innovations are further playing a significant role in enhancing the thermal interface materials market.

Competitive Landscape:

The market research report has also provided a comprehensive analysis of the competitive landscape in the market. Detailed profiles of all major companies have also been provided. Some of the major market players in the thermal interface materials industry include 3M Company, Dow Inc., Henkel AG & Co. KGaA, Honeywell International Inc., Indium Corporation, Kitagawa Industries America Inc., Laird Technologies Inc. Momentive Performance Materials Inc., Parker-Hannifin Corporation, and Zalman Tech Co. Ltd.

(Please note that this is only a partial list of the key players, and the complete list is provided in the report.)

Leading thermal interface materials companies are allocating significant amounts of resources towards research and development as they seek to develop newer and better TIMs characterized by better thermal conductivity, reliability, and installation. This comprises of preparing substrates, adhesives, and protective coatings with improved characteristics like reduced thermal resistance and increased thermal endurance to accommodate the increasing market requirements of different industries. Moreover, several companies are promoting businesses, mergers, and acquisitions to promote their global reach as these collaborations assist businesses in understanding the strength of the respective business partners, thus even helping them in bringing cutting-edge technology to thermal management solutions precisely. With reference to thermal interface materials market recent developments, some of the market players are launching environmentally friendly and sustainable TIMs. They are also paying special attention to digital and industrial advancement in production lines to achieve maximum returns on their investments. Additionally, the constant incorporation of advanced materials and technologies such as nanotechnology is also perceived to be on the rise, which is augmenting the market.

Thermal Interface Materials Market News:

On 21st February 2023, Indium Corporation announced that it will feature its high-performance metal thermal interface materials (TIMs) for burn-in and test at TestConX during March 5th to 8th in Mesa, Arizona, U.S. The indium-containing TIMs offer superior thermal conductivity over non-metals with pure indium metal delivering 86W/mK. Its indium-containing TIMs are available as pure indium, indium-silver alloys, and indium-tin.

On 29th March 2024, Resonac Corporation announced the decision to increase its capacity to produce materials for high-performance semiconductor chips, which are to be used mainly as CPUs for artificial intelligence (AI), to 3.5 to 5 times of the current level. The company aims to escalate the production of non-conductive film (NCF) and thermal interface material (TIM). It plans to invest 15 billion yen in facilities to produce these materials and will commence operation of the expanded facilities in and after 2024.

Key Questions Answered in This Report

• 1. What was the size of the global thermal interface materials market in 2023?
• 2. What is the expected growth rate of the global thermal interface materials market during 2024-2032?
• 3. What are the key factors driving the global thermal interface materials market?
• 4. What has been the impact of COVID-19 on the global thermal interface materials market?
• 5. What is the breakup of the global thermal interface materials market based on the product type?
• 6. What is the breakup of the global thermal interface materials market based on the application?
• 7. What are the key regions in the global thermal interface materials market?
• 8. Who are the key players/companies in the global thermal interface materials market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Thermal Interface Materials Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Product Type

• 6.1 Tapes and Films
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 Elastomeric Pads
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast
• 6.3 Greases and Adhesives
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast
• 6.4 Phase Change Materials
  • 6.4.1 Market Trends
  • 6.4.2 Market Forecast
• 6.5 Metal Based Materials
  • 6.5.1 Market Trends
  • 6.5.2 Market Forecast
• 6.6 Others
  • 6.6.1 Market Trends
  • 6.6.2 Market Forecast

7 Market Breakup by Application

• 7.1 Telecom
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 Computer
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 Medical Devices
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast
• 7.4 Industrial Machinery
  • 7.4.1 Market Trends
  • 7.4.2 Market Forecast
• 7.5 Consumer Durables
  • 7.5.1 Market Trends
  • 7.5.2 Market Forecast
• 7.6 Automotive Electronics
  • 7.6.1 Market Trends
  • 7.6.2 Market Forecast
• 7.7 Others
  • 7.7.1 Market Trends
  • 7.7.2 Market Forecast

8 Market Breakup by Region

• 8.1 North America
  • 8.1.1 United States
    • 8.1.1.1 Market Trends
    • 8.1.1.2 Market Forecast
  • 8.1.2 Canada
    • 8.1.2.1 Market Trends
    • 8.1.2.2 Market Forecast
• 8.2 Asia Pacific
  • 8.2.1 China
    • 8.2.1.1 Market Trends
    • 8.2.1.2 Market Forecast
  • 8.2.2 Japan
    • 8.2.2.1 Market Trends
    • 8.2.2.2 Market Forecast
  • 8.2.3 India
    • 8.2.3.1 Market Trends
    • 8.2.3.2 Market Forecast
  • 8.2.4 South Korea
    • 8.2.4.1 Market Trends
    • 8.2.4.2 Market Forecast
  • 8.2.5 Australia
    • 8.2.5.1 Market Trends
    • 8.2.5.2 Market Forecast
  • 8.2.6 Indonesia
    • 8.2.6.1 Market Trends
    • 8.2.6.2 Market Forecast
  • 8.2.7 Others
    • 8.2.7.1 Market Trends
    • 8.2.7.2 Market Forecast
• 8.3 Europe
  • 8.3.1 Germany
    • 8.3.1.1 Market Trends
    • 8.3.1.2 Market Forecast
  • 8.3.2 France
    • 8.3.2.1 Market Trends
    • 8.3.2.2 Market Forecast
  • 8.3.3 United Kingdom
    • 8.3.3.1 Market Trends
    • 8.3.3.2 Market Forecast
  • 8.3.4 Italy
    • 8.3.4.1 Market Trends
    • 8.3.4.2 Market Forecast
  • 8.3.5 Spain
    • 8.3.5.1 Market Trends
    • 8.3.5.2 Market Forecast
  • 8.3.6 Russia
    • 8.3.6.1 Market Trends
    • 8.3.6.2 Market Forecast
  • 8.3.7 Others
    • 8.3.7.1 Market Trends
    • 8.3.7.2 Market Forecast
• 8.4 Latin America
  • 8.4.1 Brazil
    • 8.4.1.1 Market Trends
    • 8.4.1.2 Market Forecast
  • 8.4.2 Mexico
    • 8.4.2.1 Market Trends
    • 8.4.2.2 Market Forecast
  • 8.4.3 Others
    • 8.4.3.1 Market Trends
    • 8.4.3.2 Market Forecast
• 8.5 Middle East and Africa
  • 8.5.1 Market Trends
  • 8.5.2 Market Breakup by Country
  • 8.5.3 Market Forecast

9 SWOT Analysis

• 9.1 Overview
• 9.2 Strengths
• 9.3 Weaknesses
• 9.4 Opportunities
• 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

• 11.1 Overview
• 11.2 Bargaining Power of Buyers
• 11.3 Bargaining Power of Suppliers
• 11.4 Degree of Competition
• 11.5 Threat of New Entrants
• 11.6 Threat of Substitutes

12 Price Indicators

13 Competitive Landscape

• 13.1 Market Structure
• 13.2 Key Players
• 13.3 Profiles of Key Players
  • 13.3.1 3M Company
    • 13.3.1.1 Company Overview
    • 13.3.1.2 Product Portfolio
    • 13.3.1.3 Financials
    • 13.3.1.4 SWOT Analysis
  • 13.3.2 Dow Inc.
    • 13.3.2.1 Company Overview
    • 13.3.2.2 Product Portfolio
    • 13.3.2.3 Financials
  • 13.3.3 Henkel AG & Co. KGaA
    • 13.3.3.1 Company Overview
    • 13.3.3.2 Product Portfolio
    • 13.3.3.3 Financials
    • 13.3.3.4 SWOT Analysis
  • 13.3.4 Honeywell International Inc.
    • 13.3.4.1 Company Overview
    • 13.3.4.2 Product Portfolio
    • 13.3.4.3 Financials
    • 13.3.4.4 SWOT Analysis
  • 13.3.5 Indium Corporation
    • 13.3.5.1 Company Overview
    • 13.3.5.2 Product Portfolio
  • 13.3.6 Kitagawa Industries America Inc.
    • 13.3.6.1 Company Overview
    • 13.3.6.2 Product Portfolio
  • 13.3.7 Laird Technologies Inc.
    • 13.3.7.1 Company Overview
    • 13.3.7.2 Product Portfolio
  • 13.3.8 Momentive Performance Materials Inc.
    • 13.3.8.1 Company Overview
    • 13.3.8.2 Product Portfolio
  • 13.3.9 Parker-Hannifin Corporation
    • 13.3.9.1 Company Overview
    • 13.3.9.2 Product Portfolio
    • 13.3.9.3 Financials
    • 13.3.9.4 SWOT Analysis
  • 13.3.10 Zalman Tech Co., Ltd.
    • 13.3.10.1 Company Overview
    • 13.3.10.2 Product Portfolio