세계의 열계면 재료(TMI) 시장(-2029년) : 재료별(실리콘, 에폭시, 폴리마이드), 유형별(그리스 및 접착제, 테이프 및 필름, 갭 필러, 상변화물질), 용도별(컴퓨터, 통신, 내구소비재), 지역별

The global thermal interface materials market size is projected to grow from USD 3.56 billion in 2024 to USD 5.64 billion by 2029, at a CAGR of 9.7% during the forecast period.

The thermal interface materials market is growing due to increase in the use of thermal interface materials in computers and electric vehciles. It is being seen in this application in computer component parts because a lot of people all around the world are purchasing computers. The new trend of electric vehicles is also taking place slowly, which can induse growth for thermal interface materials which are used in various automotive parts.

The epoxy material of Thermal interface materials projected to be second largest growing segment in the global Thermal interface materials market during the forecast period

The epoxy type of material is used because it offers good thermal conductivity along with strong adhesion. Epoxy hardens after application which makes it impact resistant material. Therefore, we can see its use in printed circuit boards, electronics, semiconductors, and insulators. The thermal conductivity depends on curing agent and condition. Furthermore, the epoxy material can be customised based on application depending on levelof viscosity required. The material is resistant to cracking or degradation, making it a strong material.

By Type, Tapes & films segment to hold second fastest share during forecast period

Tapes and films are convenient to use because they can easily be applied especially in small spaces where heat dissipation is required. They come in come in pre-formed sheets or rolls which makes it easy to handle too. Besides thermal conductivity, it also provides electric insulation. They are also used in telecommunication infrastructure components. The problem of uneven surface is not seen in tapes and films like greases or adhesives, avoiding unevenness in heat transfer. Applying tapes and films is a mess-free process, eliminating the mess associated with liquid TIMs.

By Application, Telecom segment to hold second largest share during forecast period

Telecom industry uses global thermal interface materials in base stations, data routers, and antennas. Nextly, telecom equipment operates continuously, requiring durable thermal interface materials that maintain performance under prolonged thermal and mechanical stress. And modern technologies have developed high-power processing units which produce a lot of heat. Therefore, thermal interface materials are important for managing heat in these units. Using thermal interface materials also helps in increasing the overall life of the telecom product by proper heat dissipation.

By Region, North America to register the second largest and fastest growth rate during the forecast period

North America is the second largest and fastest region for thermal interface materials. This is due to the growing sectors of aerospace & defense, automotive, and energy & power in this region. There is also a demand seen from the medical devices industry especially in high-power equipment. The electric vehicles market is also seeing a growth in this region, developing the need for TIMs in battery packs, inverters, and motor controllers. The aerospace and defense sector is a major sector using thermal interface materials, and with the growth of this sector in the coming years, thermal interface materials can grow as well.

In-depth interviews have been conducted with chief executive officers (CEOs), Directors, and other executives from various key organizations operating in the thermal interface materials marketplace.

• By Company Type - Tier 1 - 55 %, Tier 2 - 25% and Tier 3 - 20%
• By Designation - Directors - 50%, Managers- 30%, Others - 20%
• By Region - North America - 20%, Europe - 25%, APAC - 45%, RoW - 10%

Honeywell International Inc. (US), 3M (US), Henkel AG & Co. KGaA (Germany), Parker Hannifin Corporation (US), DOW (US), Laird Technologies Inc. (US), Momentive (US), Wakefield Thermal Inc. (US), Indium Corporation (US), and Zalma Tech Co. Ltd. (South Korea), Arieca Inc. (US), U-MAP Co., Ltd. (Japan), Boston Materials (US), Tenutec AB (Sweden), Calogy Solutions (Canada), NanoWired GmbH (Germany), TCPoly, Inc. (US), Semikron Danfoss (Germany), Redtec Industries Pte Ltd (Singapore), Timtronics (US), Schlegel Electronic Materials, Inc. (US), Thermal Grizzly (Germany), Universal Science (UK), Aremco Products Inc. (US), E-SONG EMC Co., Ltd. (South Korea) are some of the key players in the thermal interface materials market.

The study includes an in-depth competitive analysis of these key players in the thermal interface materials market, with their company profiles, recent developments, and key market strategies.

Research Coverage

This research report categorizes the thermal interface materials market by material (silicone, epoxy,polymide), by type (greases & adhesives, tapes & films, gap fillers, phase change materials,metal based tims), by application (computers & data centers , automotive, telecommunications, industrial applications, healthcare and medical devices, consumer durables, other applications) and by region (Asia Pacific, North America, South America,Europe, Middle East & Africa). The scope of the report covers detailed information regarding the major factors, such as drivers, restraints, challenges, and opportunities, influencing the growth of the thermal interface materials market. A detailed analysis of the key industry players has been done to provide insights into their business overview, solutions, and services; key strategies; Contracts, partnerships, agreements. new product & service launches, mergers and acquisitions, and recent developments associated with the thermal interface materials market. Competitive analysis of upcoming startups in the thermal interface materials market ecosystem is covered in this report.

Reasons to buy the report

The report will help the market leaders/new entrants in this market with information on the closest approximations of the revenue numbers for the overall thermal interface materials market and the subsegments. This report will help stakeholders understand the competitive landscape and gain more insights to position their businesses better and to plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, challenges, and opportunities.

The report provides insights on the following pointers:

• Analysis of key drivers (Increasing demand for consumer electronicsand growing LED market to drive demand for TIMs), restraints (physical properties limiting performance of thermal interface materials), opportunities (electrification in transportation industry high performance tims in the form of nanodiamonds) and challenges (finding optimum operating cost for end users and granule size and amount of thermal interface materials applied).
• Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product & service launches in the thermal interface materials market
• Market Development: Comprehensive information about profitable markets - the report analyses the thermal interface materials market across varied regions.

Market Diversification: Exhaustive information about new products & services, untapped geographies, recent developments, and investments in the thermal interface materials market.

• Competitive Assessment: In-depth assessment of market shares, growth strategies, and service offerings of leading players Honeywell International Inc. (US), 3M (US), Henkel AG & Co. KGaA (Germany), Parker Hannifin Corporation (US), DOW (US), Laird Technologies Inc. (US), Momentive (US), Wakefield Thermal Inc. (US), Indium Corporation (US), and Zalma Tech Co. Ltd. (South Korea) among others in the thermal interface materials market.

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 STUDY OBJECTIVES
• 1.2 MARKET DEFINITION
• 1.3 STUDY SCOPE
  • 1.3.1 MARKETS COVERED AND REGIONAL SCOPE
  • 1.3.2 INCLUSIONS AND EXCLUSIONS OF STUDY
  • 1.3.3 YEARS CONSIDERED
• 1.4 CURRENCY
• 1.5 STAKEHOLDERS
• 1.6 SUMMARY OF CHANGES

2 RESEARCH METHODOLOGY

• 2.1 RESEARCH DATA
  • 2.1.1 SECONDARY DATA
    • 2.1.1.1 Key data from secondary sources
  • 2.1.2 PRIMARY DATA
    • 2.1.2.1 Key data from primary sources
    • 2.1.2.2 Primary interviews - demand and supply side
    • 2.1.2.3 Key industry insights
    • 2.1.2.4 Breakdown of interviews with experts
• 2.2 MARKET SIZE ESTIMATION
  • 2.2.1 BOTTOM-UP APPROACH
  • 2.2.2 TOP-DOWN APPROACH
• 2.3 FORECAST NUMBER CALCULATION
• 2.4 DATA TRIANGULATION
• 2.5 FACTOR ANALYSIS
• 2.6 ASSUMPTIONS
• 2.7 LIMITATIONS & RISKS

3 EXECUTIVE SUMMARY

4 PREMIUM INSIGHTS

• 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN THERMAL INTERFACE MATERIALS MARKET
• 4.2 ASIA PACIFIC: THERMAL INTERFACE MATERIALS MARKET, BY APPLICATION AND COUNTRY

5 MARKET OVERVIEW

• 5.1 INTRODUCTION
• 5.2 MARKET DYNAMICS
  • 5.2.1 DRIVERS
    • 5.2.1.1 Increasing demand for consumer electronics
    • 5.2.1.2 Rise in EV adoption
    • 5.2.1.3 Growing LED market
    • 5.2.1.4 Expansion of data centers
  • 5.2.2 RESTRAINTS
    • 5.2.2.1 Physical properties limiting performance
    • 5.2.2.2 High cost of advanced thermal interface materials
  • 5.2.3 OPPORTUNITIES
    • 5.2.3.1 Adoption of 5G technology
    • 5.2.3.2 Increasing adoption of nanodiamonds
  • 5.2.4 CHALLENGES
    • 5.2.4.1 Finding optimum operating costs for end users
    • 5.2.4.2 Maintaining optimal granule size and amount of thermal interface material applied
    • 5.2.4.3 Stringent regulatory compliance

6 INDUSTRY TRENDS

• 6.1 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
• 6.2 PRICING ANALYSIS
  • 6.2.1 AVERAGE SELLING PRICE TREND OF KEY PLAYERS, BY APPLICATION
  • 6.2.2 AVERAGE SELLING PRICE TREND, BY REGION
• 6.3 VALUE CHAIN ANALYSIS
• 6.4 ECOSYSTEM ANALYSIS
• 6.5 IMPACT OF GEN AI ON THERMAL INTERFACE MATERIALS MARKET
• 6.6 TECHNOLOGY ANALYSIS
  • 6.6.1 KEY TECHNOLOGIES
    • 6.6.1.1 Nanotechnology-enhanced thermal interface materials
    • 6.6.1.2 Phase change materials
  • 6.6.2 COMPLEMENTARY TECHNOLOGIES
    • 6.6.2.1 Advanced manufacturing techniques
    • 6.6.2.2 Advanced driver assistance systems
    • 6.6.2.3 Sustainable and eco-friendly thermal interface materials
• 6.7 PATENT ANALYSIS
• 6.8 TRADE ANALYSIS
  • 6.8.1 EXPORT DATA RELATED TO HS CODE 3919
  • 6.8.2 IMPORT DATA RELATED TO HS CODE 3919
  • 6.8.3 EXPORT DATA RELATED TO HS CODE 3910
  • 6.8.4 IMPORT DATA RELATED TO HS CODE 3910
• 6.9 KEY CONFERENCES AND EVENTS IN 2024-2025
• 6.10 REGULATORY LANDSCAPE
  • 6.10.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
• 6.11 PORTER'S FIVE FORCES ANALYSIS
• 6.12 KEY STAKEHOLDERS AND BUYING CRITERIA
• 6.13 CASE STUDY ANALYSIS
  • 6.13.1 PROTECTING MISSILES FROM ELECTROMAGNETIC INTERFERENCE USING ADVANCED SOLUTIONS
  • 6.13.2 ERROR-PROOFING THERMAL INTERFACE MATERIAL APPLICATION FOR EV BATTERY PACKS
  • 6.13.3 NON-SILICONE DISPENSABLE THERMAL GEL FOR AUTOMOTIVE INFOTAINMENT AND CAMERA MODULES
• 6.14 MACROECONOMIC ANALYSIS
  • 6.14.1 INTRODUCTION
  • 6.14.2 GDP TRENDS AND FORECASTS
• 6.15 INVESTMENT AND FUNDING SCENARIO

7 THERMAL INTERFACE MATERIALS MARKET, BY TYPE

• 7.1 INTRODUCTION
• 7.2 GREASE & ADHESIVES
  • 7.2.1 SUPERIOR PROPERTIES AND LOW MANUFACTURING COST TO DRIVE MARKET
• 7.3 TAPES & FILMS
  • 7.3.1 INCREASING DEMAND IN TELECOM SECTOR TO BOOST MARKET
• 7.4 GAP FILLERS
  • 7.4.1 GROWING END-USE INDUSTRIES IN EUROPE TO SUPPORT MARKET GROWTH
• 7.5 METAL-BASED THERMAL INTERFACE MATERIALS
  • 7.5.1 GROWING APPLICATIONS IN COMPUTER HARDWARE DEVICES TO PROPEL MARKET
• 7.6 PHASE CHANGE MATERIALS
  • 7.6.1 WIDESPREAD APPLICATION IN PERSONAL COMPUTERS TO DRIVE MARKET
• 7.7 OTHER TYPES

8 THERMAL INTERFACE MATERIALS MARKET, BY MATERIAL

• 8.1 INTRODUCTION
• 8.2 SILICONE
  • 8.2.1 SUPERIOR PROPERTIES TO DRIVE DEMAND
• 8.3 EPOXY
  • 8.3.1 GREATER FILLER LOADING RESULTS IN GREATER THERMAL CONDUCTIVITY-KEY FACTOR DRIVING MARKET GROWTH
• 8.4 POLYIMIDE
  • 8.4.1 GROWTH IN ELECTRONICS INDUSTRY TO INCREASE DEMAND
• 8.5 OTHER MATERIALS

9 THERMAL INTERFACE MATERIALS MARKET, BY APPLICATION

• 9.1 INTRODUCTION
• 9.2 COMPUTERS & DATA CENTERS
  • 9.2.1 ADVANCEMENTS IN SUPERCOMPUTING TECHNOLOGIES TO DRIVE MARKET
• 9.3 TELECOMMUNICATIONS
  • 9.3.1 RISING ADOPTION OF 5G NETWORK TECHNOLOGIES TO FUEL DEMAND
• 9.4 INDUSTRIAL
  • 9.4.1 INCREASED DEMAND FROM POWER ELECTRONICS TO SUPPORT MARKET GROWTH
• 9.5 HEALTHCARE & MEDICAL DEVICES
  • 9.5.1 INNOVATION AND DEVELOPMENT IN HEALTHCARE INDUSTRY TO BOOST MARKET
• 9.6 CONSUMER DURABLES
  • 9.6.1 INCREASING ADOPTION OF ADVANCED HOME APPLIANCES TO DRIVE MARKET
• 9.7 AUTOMOTIVE
  • 9.7.1 INCREASING DEMAND FOR ELECTRIC AND HYBRID VEHICLES TO PROPEL MARKET
• 9.8 OTHER APPLICATIONS

10 THERMAL INTERFACE MATERIALS MARKET, BY REGION

• 10.1 INTRODUCTION
• 10.2 ASIA PACIFIC
  • 10.2.1 CHINA
    • 10.2.1.1 Growth in various end-use applications to boost demand
  • 10.2.2 INDIA
    • 10.2.2.1 Growth in automotive sector to drive market
  • 10.2.3 JAPAN
    • 10.2.3.1 Rise in electronics exports to boost growth
  • 10.2.4 SOUTH KOREA
    • 10.2.4.1 Growing semiconductor business to support market growth
  • 10.2.5 INDONESIA
    • 10.2.5.1 Government tax incentives on EVs and hybrid cars to boost demand
  • 10.2.6 REST OF ASIA PACIFIC
• 10.3 NORTH AMERICA
  • 10.3.1 US
    • 10.3.1.1 Presence of major players to support market growth
  • 10.3.2 CANADA
    • 10.3.2.1 Government support and investments in AI to propel market
  • 10.3.3 MEXICO
    • 10.3.3.1 Increase in EV sales to drive market
• 10.4 EUROPE
  • 10.4.1 GERMANY
    • 10.4.1.1 Rise in AI startups to boost market growth
  • 10.4.2 UK
    • 10.4.2.1 Growth in renewable energy projects to drive market
  • 10.4.3 FRANCE
    • 10.4.3.1 Growth in digital economy to boost demand
  • 10.4.4 RUSSIA
    • 10.4.4.1 Increased digitization to drive market
  • 10.4.5 TURKEY
    • 10.4.5.1 Favorable startup ecosystem to support market growth
  • 10.4.6 POLAND
    • 10.4.6.1 Growth in aerospace & defense industry to drive market
  • 10.4.7 REST OF EUROPE
• 10.5 SOUTH AMERICA
  • 10.5.1 BRAZIL
    • 10.5.1.1 Increasing automotive production, internet penetration, and government investments to propel market
  • 10.5.2 ARGENTINA
    • 10.5.2.1 Increased investments in AI and renewable energy sector to boost growth
  • 10.5.3 REST OF SOUTH AMERICA
• 10.6 MIDDLE EAST & AFRICA
  • 10.6.1 GCC COUNTRIES
    • 10.6.1.1 SAUDI ARABIA
      • 10.6.1.1.1 Domestic EV manufacturing and increase in customs duty on electric items to increase demand
    • 10.6.1.2 UAE
      • 10.6.1.2.1 Increased investments in manufacturing industry to boost demand
    • 10.6.1.3 REST OF GCC COUNTRIES
  • 10.6.2 SOUTH AFRICA
    • 10.6.2.1 Increasing investments in renewable energy to drive growth
  • 10.6.3 REST OF MIDDLE EAST & AFRICA

11 COMPETITIVE LANDSCAPE

• 11.1 OVERVIEW
• 11.2 KEY PLAYERS STRATEGIES/RIGHT TO WIN
• 11.3 REVENUE ANALYSIS
• 11.4 MARKET SHARE ANALYSIS
• 11.5 COMPANY VALUATION AND FINANCIAL METRICS
  • 11.5.1 COMPANY VALUATION
  • 11.5.2 FINANCIAL METRICS
• 11.6 BRAND/PRODUCT COMPARISON
• 11.7 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023
  • 11.7.1 STARS
  • 11.7.2 EMERGING LEADERS
  • 11.7.3 PERVASIVE PLAYERS
  • 11.7.4 PARTICIPANTS
  • 11.7.5 COMPANY FOOTPRINT: KEY PLAYERS, 2023
    • 11.7.5.1 Company footprint
    • 11.7.5.2 Material footprint
    • 11.7.5.3 Type footprint
    • 11.7.5.4 Application footprint
    • 11.7.5.5 Region footprint
• 11.8 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023
  • 11.8.1 PROGRESSIVE COMPANIES
  • 11.8.2 RESPONSIVE COMPANIES
  • 11.8.3 DYNAMIC COMPANIES
  • 11.8.4 STARTING BLOCKS
  • 11.8.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2023
    • 11.8.5.1 Detailed list of key startups/SMEs
    • 11.8.5.2 Competitive benchmarking of key startups/SMEs
• 11.9 COMPETITIVE SCENARIO
  • 11.9.1 PRODUCT LAUNCHES
  • 11.9.2 DEALS
  • 11.9.3 EXPANSIONS
  • 11.9.4 OTHER DEVELOPMENTS

12 COMPANY PROFILES

• 12.1 KEY PLAYERS
  • 12.1.1 HONEYWELL INTERNATIONAL INC.
    • 12.1.1.1 Business overview
    • 12.1.1.2 Products offered
    • 12.1.1.3 Recent developments
      • 12.1.1.3.1 Other developments
    • 12.1.1.4 MnM view
      • 12.1.1.4.1 Key strengths
      • 12.1.1.4.2 Strategic choices
      • 12.1.1.4.3 Weaknesses and competitive threats
  • 12.1.2 3M
    • 12.1.2.1 Business overview
    • 12.1.2.2 Products offered
    • 12.1.2.3 Recent developments
      • 12.1.2.3.1 Product launches
      • 12.1.2.3.2 Deals
      • 12.1.2.3.3 Expansions
    • 12.1.2.4 MnM view
      • 12.1.2.4.1 Key strengths
      • 12.1.2.4.2 Strategic choices
      • 12.1.2.4.3 Weaknesses and competitive threats
  • 12.1.3 HENKEL AG & CO. KGAA
    • 12.1.3.1 Business overview
    • 12.1.3.2 Products offered
    • 12.1.3.3 Recent developments
      • 12.1.3.3.1 Product launches
      • 12.1.3.3.2 Deals
      • 12.1.3.3.3 Expansions
    • 12.1.3.4 MnM view
      • 12.1.3.4.1 Key strengths
      • 12.1.3.4.2 Strategic choices
      • 12.1.3.4.3 Weaknesses and competitive threats
  • 12.1.4 PARKER HANNIFIN CORPORATION
    • 12.1.4.1 Business overview
    • 12.1.4.2 Products offered
    • 12.1.4.3 Recent developments
      • 12.1.4.3.1 Product launches
      • 12.1.4.3.2 Deals
    • 12.1.4.4 MnM view
      • 12.1.4.4.1 Key strengths
      • 12.1.4.4.2 Strategic choices
      • 12.1.4.4.3 Weaknesses and competitive threats
  • 12.1.5 DOW
    • 12.1.5.1 Business overview
    • 12.1.5.2 Products offered
    • 12.1.5.3 Recent developments
      • 12.1.5.3.1 Product launches
      • 12.1.5.3.2 Deals
      • 12.1.5.3.3 Other developments
    • 12.1.5.4 MnM view
      • 12.1.5.4.1 Key strengths
      • 12.1.5.4.2 Strategic choices
      • 12.1.5.4.3 Weaknesses and competitive threats
  • 12.1.6 LAIRD TECHNOLOGIES, INC.
    • 12.1.6.1 Business overview
    • 12.1.6.2 Products offered
    • 12.1.6.3 Recent developments
      • 12.1.6.3.1 Product launches
    • 12.1.6.4 MnM view
  • 12.1.7 MOMENTIVE
    • 12.1.7.1 Business overview
    • 12.1.7.2 Products offered
    • 12.1.7.3 Recent developments
      • 12.1.7.3.1 Deals
      • 12.1.7.3.2 Expansions
    • 12.1.7.4 MnM view
  • 12.1.8 INDIUM CORPORATION
    • 12.1.8.1 Business overview
    • 12.1.8.2 Products offered
    • 12.1.8.3 Recent developments
      • 12.1.8.3.1 Product launches
      • 12.1.8.3.2 Deals
    • 12.1.8.4 MnM view
  • 12.1.9 WAKEFIELD THERMAL, INC.
    • 12.1.9.1 Business overview
    • 12.1.9.2 Products offered
    • 12.1.9.3 Recent developments
    • 12.1.9.4 MnM view
  • 12.1.10 ZALMAN TECH CO., LTD.
    • 12.1.10.1 Business overview
    • 12.1.10.2 Products offered
    • 12.1.10.3 Recent developments
      • 12.1.10.3.1 Product launches
    • 12.1.10.4 MnM view
• 12.2 OTHER PLAYERS
  • 12.2.1 ARIECA INC.
  • 12.2.2 U-MAP CO., LTD.
  • 12.2.3 BOSTON MATERIALS
  • 12.2.4 TENUTEC AB
  • 12.2.5 CALOGY SOLUTIONS
  • 12.2.6 NANOWIRED GMBH
  • 12.2.7 TCPOLY, INC.
  • 12.2.8 CARBICE
  • 12.2.9 HIGH-TEMPERATURE MATERIAL SYSTEMS LIMITED
  • 12.2.10 NEXT-ION ENERGY, INC.
  • 12.2.11 SEMIKRON DANFOSS
  • 12.2.12 REDTEC INDUSTRIES PTE LTD.
  • 12.2.13 TIMTRONICS
  • 12.2.14 SCHLEGEL ELECTRONIC MATERIALS, INC.
  • 12.2.15 THERMAL GRIZZLY
  • 12.2.16 UNIVERSAL SCIENCE
  • 12.2.17 AREMCO PRODUCTS INC.
  • 12.2.18 E-SONG EMC CO., LTD.

13 APPENDIX

• 13.1 DISCUSSION GUIDE
• 13.2 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
• 13.3 CUSTOMIZATION OPTIONS
• 13.4 RELATED REPORTS
• 13.5 AUTHOR DETAILS