플립칩 기술 시장 보고서 : 제품, 포장 기술, 범프 기술, 업계별, 지역별(2024-2032년)

The global flip chip technology market size reached US$ 31.1 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 51.4 Billion by 2032, exhibiting a growth rate (CAGR) of 5.5% during 2024-2032.

Flip chip, or direct chip attach, technology is a semiconductor packaging solution that involves flipping the active area of a chip to cover all interconnections, package leads and metallic solders. It is a controlled collapse chip connection (C4)-based solution that uses bumps or balls soldered into the circuit board and underfilled with epoxy. Flip chip technology is used for interconnecting semiconductor devices, integrated circuit chips and micro-electromechanical systems (MEMS) to the external circuitry. In comparison to the traditionally used wire-based systems, flip chip technology consumes lesser space, enables a larger number of interconnects with shorter distances and enhances the efficiency of ultrasonic and microwave operations. As a result, it is widely used in the assembly of laptops, desktops, gaming devices, central processing units (CPUs) and chipsets.

Flip Chip Technology Market Trends:

Significant growth in the electronics industry across the globe is one of the key factors creating a positive outlook for the market. Flip chip technology is widely used in consumer electronics and robotic solutions for device miniaturization, enhanced electrical efficiency and minimal power consumption. Moreover, the increasing requirement for multi-functional devices in various industries, such as automotive, telecommunication, medical and military, is providing a thrust to the market growth. For instance, the global positioning system (GPS), satellite-based navigation and radio detection and ranging (RADAR) systems use the technology for geo-sensing and operating military devices. In line with this, the emerging trend of real-world gaming is also contributing to the growth of the market. Flip chip technology is extensively used for embedding sensors and processors in gaming consoles and graphic cards for improved data transmission. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), and the utilization of flip chip technology for improved microwave and ultrasonic operations, are favoring the growth of the market. Other factors, including the increasing requirement for circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market toward growth.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global flip chip technology market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on product, packaging technology, bumping technology and industry vertical.

Breakup by Product:

• Memory
• CMOS Image Sensor
• LED
• CPU
• RF, Analog, Mixed Signal and Power IC
• GPU
• SOC

Breakup by Packaging Technology:

• 3D IC
• 2.5D IC
• 2D IC

Breakup by Bumping Technology:

• Copper Pillar
• Solder Bumping
• Gold Bumping
• Others

Breakup by Industry Vertical:

• Electronics
• Healthcare
• Automotive and Transport
• IT and Telecommunication
• Aerospace and Defense
• Others

Breakup by Region:

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
• Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
• Latin America
  • Brazil
  • Mexico
  • Others
• Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being 3M Company, Amkor Technology Inc., ASE Group, Fujitsu Limited, Intel Corporation, Jiangsu Changdian Technology Co. Ltd., Powertech Technology Inc., Samsung Electronics Co.Ltd., Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated and United Microelectronics Corporation.

Key Questions Answered in This Report:

• How has the global flip chip technology market performed so far and how will it perform in the coming years?
• What has been the impact of COVID-19 on the global flip chip technology market?
• What are the key regional markets?
• What is the breakup of the market based on the product?
• What is the breakup of the market based on the packaging technology?
• What is the breakup of the market based on the bumping technology?
• What is the breakup of the market based on the industry vertical?
• What are the various stages in the value chain of the industry?
• What are the key driving factors and challenges in the industry?
• What is the structure of the global flip chip technology market and who are the key players?
• What is the degree of competition in the industry?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Flip Chip Technology Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Product

• 6.1 Memory
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 CMOS Image Sensor
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast
• 6.3 LED
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast
• 6.4 CPU
  • 6.4.1 Market Trends
  • 6.4.2 Market Forecast
• 6.5 RF, Analog, Mixed Signal and Power IC
  • 6.5.1 Market Trends
  • 6.5.2 Market Forecast
• 6.6 GPU
  • 6.6.1 Market Trends
  • 6.6.2 Market Forecast
• 6.7 SOC
  • 6.7.1 Market Trends
  • 6.7.2 Market Forecast

7 Market Breakup by Packaging Technology

• 7.1 3D IC
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 2.5D IC
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 2D IC
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast

8 Market Breakup by Bumping Technology

• 8.1 Copper Pillar
  • 8.1.1 Market Trends
  • 8.1.2 Market Forecast
• 8.2 Solder Bumping
  • 8.2.1 Market Trends
  • 8.2.2 Market Forecast
• 8.3 Gold Bumping
  • 8.3.1 Market Trends
  • 8.3.2 Market Forecast
• 8.4 Others
  • 8.4.1 Market Trends
  • 8.4.2 Market Forecast

9 Market Breakup by Industry Vertical

• 9.1 Electronics
  • 9.1.1 Market Trends
  • 9.1.2 Market Forecast
• 9.2 Healthcare
  • 9.2.1 Market Trends
  • 9.2.2 Market Forecast
• 9.3 Automotive and Transport
  • 9.3.1 Market Trends
  • 9.3.2 Market Forecast
• 9.4 IT and Telecommunication
  • 9.4.1 Market Trends
  • 9.4.2 Market Forecast
• 9.5 Aerospace and Defense
  • 9.5.1 Market Trends
  • 9.5.2 Market Forecast
• 9.6 Others
  • 9.6.1 Market Trends
  • 9.6.2 Market Forecast

10 Market Breakup by Region

• 10.1 North America
  • 10.1.1 United States
    • 10.1.1.1 Market Trends
    • 10.1.1.2 Market Forecast
  • 10.1.2 Canada
    • 10.1.2.1 Market Trends
    • 10.1.2.2 Market Forecast
• 10.2 Asia-Pacific
  • 10.2.1 China
    • 10.2.1.1 Market Trends
    • 10.2.1.2 Market Forecast
  • 10.2.2 Japan
    • 10.2.2.1 Market Trends
    • 10.2.2.2 Market Forecast
  • 10.2.3 India
    • 10.2.3.1 Market Trends
    • 10.2.3.2 Market Forecast
  • 10.2.4 South Korea
    • 10.2.4.1 Market Trends
    • 10.2.4.2 Market Forecast
  • 10.2.5 Australia
    • 10.2.5.1 Market Trends
    • 10.2.5.2 Market Forecast
  • 10.2.6 Indonesia
    • 10.2.6.1 Market Trends
    • 10.2.6.2 Market Forecast
  • 10.2.7 Others
    • 10.2.7.1 Market Trends
    • 10.2.7.2 Market Forecast
• 10.3 Europe
  • 10.3.1 Germany
    • 10.3.1.1 Market Trends
    • 10.3.1.2 Market Forecast
  • 10.3.2 France
    • 10.3.2.1 Market Trends
    • 10.3.2.2 Market Forecast
  • 10.3.3 United Kingdom
    • 10.3.3.1 Market Trends
    • 10.3.3.2 Market Forecast
  • 10.3.4 Italy
    • 10.3.4.1 Market Trends
    • 10.3.4.2 Market Forecast
  • 10.3.5 Spain
    • 10.3.5.1 Market Trends
    • 10.3.5.2 Market Forecast
  • 10.3.6 Russia
    • 10.3.6.1 Market Trends
    • 10.3.6.2 Market Forecast
  • 10.3.7 Others
    • 10.3.7.1 Market Trends
    • 10.3.7.2 Market Forecast
• 10.4 Latin America
  • 10.4.1 Brazil
    • 10.4.1.1 Market Trends
    • 10.4.1.2 Market Forecast
  • 10.4.2 Mexico
    • 10.4.2.1 Market Trends
    • 10.4.2.2 Market Forecast
  • 10.4.3 Others
    • 10.4.3.1 Market Trends
    • 10.4.3.2 Market Forecast
• 10.5 Middle East and Africa
  • 10.5.1 Market Trends
  • 10.5.2 Market Breakup by Country
  • 10.5.3 Market Forecast

11 SWOT Analysis

• 11.1 Overview
• 11.2 Strengths
• 11.3 Weaknesses
• 11.4 Opportunities
• 11.5 Threats

12 Value Chain Analysis

13 Porters Five Forces Analysis

• 13.1 Overview
• 13.2 Bargaining Power of Buyers
• 13.3 Bargaining Power of Suppliers
• 13.4 Degree of Competition
• 13.5 Threat of New Entrants
• 13.6 Threat of Substitutes

14 Price Analysis

15 Competitive Landscape

• 15.1 Market Structure
• 15.2 Key Players
• 15.3 Profiles of Key Players
  • 15.3.1 3M Company
    • 15.3.1.1 Company Overview
    • 15.3.1.2 Product Portfolio
    • 15.3.1.3 Financials
    • 15.3.1.4 SWOT Analysis
  • 15.3.2 Amkor Technology Inc.
    • 15.3.2.1 Company Overview
    • 15.3.2.2 Product Portfolio
    • 15.3.2.3 Financials
    • 15.3.2.4 SWOT Analysis
  • 15.3.3 ASE Group
    • 15.3.3.1 Company Overview
    • 15.3.3.2 Product Portfolio
    • 15.3.3.3 Financials
  • 15.3.4 Fujitsu Limited
    • 15.3.4.1 Company Overview
    • 15.3.4.2 Product Portfolio
    • 15.3.4.3 Financials
    • 15.3.4.4 SWOT Analysis
  • 15.3.5 Intel Corporation
    • 15.3.5.1 Company Overview
    • 15.3.5.2 Product Portfolio
    • 15.3.5.3 Financials
    • 15.3.5.4 SWOT Analysis
  • 15.3.6 Jiangsu Changdian Technology Co. Ltd.
    • 15.3.6.1 Company Overview
    • 15.3.6.2 Product Portfolio
    • 15.3.6.3 Financials
  • 15.3.7 Powertech Technology Inc.
    • 15.3.7.1 Company Overview
    • 15.3.7.2 Product Portfolio
    • 15.3.7.3 Financials
    • 15.3.7.4 SWOT Analysis
  • 15.3.8 Samsung Electronics Co.Ltd.
    • 15.3.8.1 Company Overview
    • 15.3.8.2 Product Portfolio
    • 15.3.8.3 Financials
    • 15.3.8.4 SWOT Analysis
  • 15.3.9 Taiwan Semiconductor Manufacturing Company Limited
    • 15.3.9.1 Company Overview
    • 15.3.9.2 Product Portfolio
    • 15.3.9.3 Financials
    • 15.3.9.4 SWOT Analysis
  • 15.3.10 Texas Instruments Incorporated
    • 15.3.10.1 Company Overview
    • 15.3.10.2 Product Portfolio
    • 15.3.10.3 Financials
    • 15.3.10.4 SWOT Analysis
  • 15.3.11 United Microelectronics Corporation
    • 15.3.11.1 Company Overview
    • 15.3.11.2 Product Portfolio
    • 15.3.11.3 Financials
    • 15.3.11.4 SWOT Analysis