전자 접착제 시장 : 형태별, 제품 유형별, 수지 유형별, 용도별, 지역별(2025-2033년)

The global electronic adhesives market size reached USD 5.8 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 9.2 Billion by 2033, exhibiting a growth rate (CAGR) of 5.2% during 2025-2033. The growing adoption of electric vehicles (EVs) that relies on electronics for battery systems, sensors, and connectivity solutions, rising construction of renewable energy systems, such as solar panels and wind turbines, and advancements in adhesive technology are some of the factors impelling the market growth.

Electronic adhesives are substances used for bonding and holding electrical components together. They provide a strong bond during electronics assembly while protecting components against potential damage. They are widely used in surface-mounting, assembling substrates on printed circuit boards (PCBs) and semiconductors, potting and encapsulations, and manufacturing and assembly of electronic circuits and products. Electronic adhesives are manufactured using polyurethanes, cyanoacrylate, polysulfide, silicones, and epoxies. They help to protect the circuit board from harmful environmental factors, including moisture, and corrosion. They improve the performance by providing excellent protection and layered security. As a result, electronic adhesives have applications across the consumer electronics, communications, industrial, medical, and automotive industries.

Electronic Adhesives Market Trends:

The rapidly growing electronics industry across the globe is one of the key factors creating a positive outlook for the market. In line with this, the increasing digitization and rising automobile sales with ease and security features via electronic systems are favoring the market growth. Additionally, the widespread product utilization in the automotive industry for collision avoidance systems, engine status displays, anti-theft systems, power electronic modules, and LED packaging is driving the market growth. Apart from this, the introduction of bio-based electronic adhesives that reduce carbon dioxide (CO2) emissions, increase operational efficiency, and promote a cleaner work environment is providing an impetus to the market growth. Moreover, the increasing expenditure capacities of consumers and the rising demand for smartphones and other electronic devices are acting as other growth-inducing factors. Along with this, the rising product application to manage the precision and protection of electronic components in display and telecommunication devices is providing a considerable boost to the market growth. Furthermore, the widespread product utilization in encapsulation and conformal coating applications due to the growing inclination toward the miniaturization of mobile devices, laptops, touchscreens, and displays is facilitating the market growth. Besides this, the increasing product application in medical devices, gadgets, and wearables is positively influencing the market growth. Other factors, including an enhanced focus on the production of sustainable and environmentally friendly products, such as halogen-free, solvent-free, lead-free, and low volatile organic compound (VOC) content, and extensive research and development (R&D) activities, are anticipated to drive the market growth.

Key Market Segmentation:

Form Insights:

• Paste
• Solid
• Liquid

Product Type Insights:

• Electrically Conductive Adhesives
• Thermally Conductive Adhesives
• Others

Resin Type Insights:

• Epoxy
• Silicone
• Acrylics
• PU
• Others

Application Insights:

• Consumer Electronics
• Computers and Servers
• Industrial
• Medical
• Automotive
• Communication
• Others

Regional Insights:

• North America
• United States
• Canada
• Asia Pacific
• China
• Japan
• India
• South Korea
• Australia
• Indonesia
• Others
• Europe
• Germany
• France
• United Kingdom
• Italy
• Spain
• Russia
• Others
• Latin America
• Brazil
• Mexico
• Others
• Middle East and Africa
• The report has also provided a comprehensive analysis of all the major regional markets that include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and Middle East and Africa. According to the report, Asia Pacific was the largest market for electronic adhesives. Some of the factors driving the Asia Pacific electronic adhesives market included rising expenditure capacities of consumers, technological advancements, an increasing demand for consumer electronics, and extensive research and development (R&D) activities.

Competitive Landscape:

• The report has also provided a comprehensive analysis of the competitive landscape in the global electronic adhesives market. Detailed profiles of all major companies have also been provided. Some of the companies covered include 3M Company, Avery Dennison Corporation, Bondline Electronic Adhesives Inc., Dow Inc., Dymax Corporation, Evonik Industries AG, H.B. Fuller Company, Henkel Ag & Co. KGaA, Heraeus Holding, Huntsman Corporation, Master Bond Inc. Permabond LLC, etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report:

• How has the global electronic adhesives market performed so far and how will it perform in the coming years?
• What are the drivers, restraints, and opportunities in the global electronic adhesives market?
• What are the key regional markets?
• Which countries represent the most attractive electronic adhesives markets?
• What is the breakup of the market based on the form?
• What is the breakup of the market based on the product type?
• What is the breakup of the market based on the resin type?
• What is the breakup of the market based on the application?
• What is the competitive structure of the global electronic adhesives market?
• Who are the key players/companies in the global electronic adhesives market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Electronic Adhesives Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Form

• 6.1 Paste
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 Solid
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast
• 6.3 Liquid
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast

7 Market Breakup by Product Type

• 7.1 Electrically Conductive Adhesives
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 Thermally Conductive Adhesives
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 Others
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast

8 Market Breakup by Resin Type

• 8.1 Epoxy
  • 8.1.1 Market Trends
  • 8.1.2 Market Forecast
• 8.2 Silicone
  • 8.2.1 Market Trends
  • 8.2.2 Market Forecast
• 8.3 Acrylics
  • 8.3.1 Market Trends
  • 8.3.2 Market Forecast
• 8.4 PU
  • 8.4.1 Market Trends
  • 8.4.2 Market Forecast
• 8.5 Others
  • 8.5.1 Market Trends
  • 8.5.2 Market Forecast

9 Market Breakup by Application

• 9.1 Consumer Electronics
  • 9.1.1 Market Trends
  • 9.1.2 Market Forecast
• 9.2 Computers and Servers
  • 9.2.1 Market Trends
  • 9.2.2 Market Forecast
• 9.3 Industrial
  • 9.3.1 Market Trends
  • 9.3.2 Market Forecast
• 9.4 Medical
  • 9.4.1 Market Trends
  • 9.4.2 Market Forecast
• 9.5 Automotive
  • 9.5.1 Market Trends
  • 9.5.2 Market Forecast
• 9.6 Communication
  • 9.6.1 Market Trends
  • 9.6.2 Market Forecast
• 9.7 Others
  • 9.7.1 Market Trends
  • 9.7.2 Market Forecast

10 Market Breakup by Region

• 10.1 North America
  • 10.1.1 United States
    • 10.1.1.1 Market Trends
    • 10.1.1.2 Market Forecast
  • 10.1.2 Canada
    • 10.1.2.1 Market Trends
    • 10.1.2.2 Market Forecast
• 10.2 Asia-Pacific
  • 10.2.1 China
    • 10.2.1.1 Market Trends
    • 10.2.1.2 Market Forecast
  • 10.2.2 Japan
    • 10.2.2.1 Market Trends
    • 10.2.2.2 Market Forecast
  • 10.2.3 India
    • 10.2.3.1 Market Trends
    • 10.2.3.2 Market Forecast
  • 10.2.4 South Korea
    • 10.2.4.1 Market Trends
    • 10.2.4.2 Market Forecast
  • 10.2.5 Australia
    • 10.2.5.1 Market Trends
    • 10.2.5.2 Market Forecast
  • 10.2.6 Indonesia
    • 10.2.6.1 Market Trends
    • 10.2.6.2 Market Forecast
  • 10.2.7 Others
    • 10.2.7.1 Market Trends
    • 10.2.7.2 Market Forecast
• 10.3 Europe
  • 10.3.1 Germany
    • 10.3.1.1 Market Trends
    • 10.3.1.2 Market Forecast
  • 10.3.2 France
    • 10.3.2.1 Market Trends
    • 10.3.2.2 Market Forecast
  • 10.3.3 United Kingdom
    • 10.3.3.1 Market Trends
    • 10.3.3.2 Market Forecast
  • 10.3.4 Italy
    • 10.3.4.1 Market Trends
    • 10.3.4.2 Market Forecast
  • 10.3.5 Spain
    • 10.3.5.1 Market Trends
    • 10.3.5.2 Market Forecast
  • 10.3.6 Russia
    • 10.3.6.1 Market Trends
    • 10.3.6.2 Market Forecast
  • 10.3.7 Others
    • 10.3.7.1 Market Trends
    • 10.3.7.2 Market Forecast
• 10.4 Latin America
  • 10.4.1 Brazil
    • 10.4.1.1 Market Trends
    • 10.4.1.2 Market Forecast
  • 10.4.2 Mexico
    • 10.4.2.1 Market Trends
    • 10.4.2.2 Market Forecast
  • 10.4.3 Others
    • 10.4.3.1 Market Trends
    • 10.4.3.2 Market Forecast
• 10.5 Middle East and Africa
  • 10.5.1 Market Trends
  • 10.5.2 Market Breakup by Country
  • 10.5.3 Market Forecast

11 Drivers, Restraints, and Opportunities

• 11.1 Overview
• 11.2 Drivers
• 11.3 Restraints
• 11.4 Opportunities

12 Value Chain Analysis

13 Porters Five Forces Analysis

• 13.1 Overview
• 13.2 Bargaining Power of Buyers
• 13.3 Bargaining Power of Suppliers
• 13.4 Degree of Competition
• 13.5 Threat of New Entrants
• 13.6 Threat of Substitutes

14 Price Analysis

15 Competitive Landscape

• 15.1 Market Structure
• 15.2 Key Players
• 15.3 Profiles of Key Players
  • 15.3.1 3M Company
    • 15.3.1.1 Company Overview
    • 15.3.1.2 Product Portfolio
    • 15.3.1.3 Financials
    • 15.3.1.4 SWOT Analysis
  • 15.3.2 Avery Dennison Corporation
    • 15.3.2.1 Company Overview
    • 15.3.2.2 Product Portfolio
    • 15.3.2.3 Financials
    • 15.3.2.4 SWOT Analysis
  • 15.3.3 Bondline Electronic Adhesives Inc.
    • 15.3.3.1 Company Overview
    • 15.3.3.2 Product Portfolio
  • 15.3.4 Dow Inc.
    • 15.3.4.1 Company Overview
    • 15.3.4.2 Product Portfolio
    • 15.3.4.3 Financials
    • 15.3.4.4 SWOT Analysis
  • 15.3.5 Dymax Corporation
    • 15.3.5.1 Company Overview
    • 15.3.5.2 Product Portfolio
  • 15.3.6 Evonik Industries AG
    • 15.3.6.1 Company Overview
    • 15.3.6.2 Product Portfolio
    • 15.3.6.3 Financials
    • 15.3.6.4 SWOT Analysis
  • 15.3.7 H.B. Fuller Company
    • 15.3.7.1 Company Overview
    • 15.3.7.2 Product Portfolio
    • 15.3.7.3 Financials
    • 15.3.7.4 SWOT Analysis
  • 15.3.8 Henkel Ag & Co. KGaA
    • 15.3.8.1 Company Overview
    • 15.3.8.2 Product Portfolio
    • 15.3.8.3 Financials
    • 15.3.8.4 SWOT Analysis
  • 15.3.9 Heraeus Holding
    • 15.3.9.1 Company Overview
    • 15.3.9.2 Product Portfolio
    • 15.3.9.3 SWOT Analysis
  • 15.3.10 Huntsman Corporation
    • 15.3.10.1 Company Overview
    • 15.3.10.2 Product Portfolio
    • 15.3.10.3 Financials
    • 15.3.10.4 SWOT Analysis
  • 15.3.11 Master Bond Inc.
    • 15.3.11.1 Company Overview
    • 15.3.11.2 Product Portfolio
  • 15.3.12 Permabond LLC
    • 15.3.12.1 Company Overview
    • 15.3.12.2 Product Portfolio

Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report.