세계의 첨단 IC 기판 시장 규모, 점유율, 동향, 예측 : 유형, 용도, 지역별(2025-2033년)

The global advanced IC substrate market size reached USD 10.58 Billion in 2024. Looking forward, the market is expected to reach USD 17.26 Billion by 2033, exhibiting a growth rate (CAGR) of 5.31% during 2025-2033. Asia Pacific currently dominates the market in 2024. The market is primarily driven by the growing demand for high-performance electronic devices, rising adoption of smaller, lighter, and more energy-efficient devices, and the increasing number of data centers and cloud computing services across the globe.

An advanced integrated circuit (IC) substrate is a crucial component that serves as a foundation for mounting and interconnecting ICs within electronic devices. It utilizes advanced materials and technologies to provide optimal electrical performance, thermal management, and signal integrity. It is designed to meet the specific requirements of high-performance applications that are found in smartphones, tablets, computers, and other electronic devices. As it assists in offering enhanced connectivity, reduced power consumption, and efficient heat dissipation, the demand for advanced IC substrates is rising across the globe.

At present, the increasing adoption of advanced IC substrate, as it enables the seamless functioning of intricate electronic systems, is influencing the market positively. Moreover, the rising emergence of fifth-generation (5G) technology, along with the increasing adoption of artificial intelligence (AI), is strengthening the growth of the market. Apart from this, the growing demand for advanced IC substrates that can accommodate higher data transfer rates and more complex processing tasks is offering a favorable market outlook. Additionally, the rising need for remote-controlled electrical equipment in industrial applications is offering lucrative growth opportunities to industry investors. Besides this, the increasing consumer preferences for advanced features, such as augmented reality (AR), virtual reality (VR), and high-definition (HD) displays, are contributing to the growth of the market. In addition, the rising utilization of the Internet of Things (IoT) devices around the world is impelling the growth of the market.

Advanced IC Substrate Market Trends/Drivers:

Rising demand for high-performance electronic devices

The rising demand for advanced electronic devices, such as smartphones, tablets, personal computers (PCs), wearable devices, and laptops, is contributing to the growth of the market. In addition, consumers are increasingly preferring electronic devices that assist in providing seamless multitasking, high-speed connectivity, and enhanced graphics performance. They are also adopting devices that provide immersive experiences to individuals. Apart from this, there is an increase in the demand for advanced IC substrates that can accommodate the integration of powerful processors, memory modules, and communication components. As a result, manufacturers are investing in substrates with optimized electrical pathways and signal integrity that ensure efficient data transfer with minimal latency.

Increasing popularity of miniaturization

The increasing demand for smaller, lighter, and more energy-efficient devices among individuals, along with the rising popularity of miniaturization around the world, is supporting the growth of the market. In line with this, there is a rise in the need for compact and high-density advanced IC substrates. Besides this, these substrates benefit by enabling the stacking of multiple layers of components and reducing the footprint of devices while maintaining optimal functionality. The ability to integrate various components on a single substrate enhances efficiency, reduces the risk of signal interference, and improves the overall device performance, which is offering a positive market outlook.

Growing number of data centers

The rising number of data centers and cloud computing services across the globe is bolstering the growth of the market. Businesses and individuals rely increasingly on cloud computing, big data analysis, and online services for storing and managing vast volumes of information. Data centers have countless servers, storage systems, and networking equipment that generate substantial heat. In line with this, there is a need for efficient thermal dissipation to prevent overheating and ensure uninterrupted operation. Besides this, advanced IC substrates offer enhanced thermal management capabilities and heat-spreading properties that assist in maintaining the reliability and longevity of these systems. Furthermore, the increasing demand for high-performance substrates that can manage heat effectively is strengthening the growth of the market.

Advanced IC Substrate Industry Segmentation:

Breakup by Type:

• FC BGA
• FC CSP

FC BGA represents the largest market segment

Breakup by Application:

• Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Others

Consumer electronics accounts for the majority of the market share

Breakup by Region:

• North America
• United States
• Canada
• Asia Pacific
• China
• Japan
• India
• South Korea
• Australia
• Indonesia
• Others
• Europe
• Germany
• France
• United Kingdom
• Italy
• Spain
• Russia
• Others
• Latin America
• Brazil
• Mexico
• Others
• Middle East and Africa

Asia Pacific exhibits a clear dominance, accounting for the largest advanced IC substrate market share

The market research report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific accounted for the largest market share.

Asia Pacific held the biggest market share due to the presence of improved manufacturing units. In line with this, the rising demand for innovative electronic devices among individuals is bolstering the growth of the market in the Asia Pacific region. Moreover, favorable government initiatives in the region are supporting the growth of the market. Apart from this, the rising popularity of automotive electronics due to the increasing demand for electric vehicles (EVs) is contributing to the growth of the market in the region.

Competitive Landscape:

Major players are consistently investing in research and development (R&D) activities to develop advanced IC substrate materials and technologies. This includes exploring novel materials with improved thermal conductivity, signal integrity, and electrical performance to cater to high-performance applications. Additionally, semiconductor manufacturers and consumer electronics companies are engaging in collaboration that enables the exchange of expertise, technology, and resources, that is leading to the development of tailored solutions that meet specific market needs. Besides this, companies are constantly refining their manufacturing processes to enhance the precision, scalability, and cost-efficiency of producing advanced IC substrates. This includes adopting advanced technologies, such as lithography, laser drilling, and advanced packaging techniques.

The report has provided a comprehensive analysis of the competitive landscape in the market. Detailed profiles of all major companies have also been provided. Some of the key players in the market include:

• ASE Group
• AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
• Fujitsu Limited
• Ibiden Co. Ltd.
• JCET Group Co. Ltd
• Kinsus Interconnect Technology Corp.
• Korea Circuit Co. Ltd.
• KYOCERA Corporation
• LG Innotek Co. Ltd.
• Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation)
• TTM Technologies Inc.
• Unimicron Technology Corporation (United Microelectronics Corporation)

Recent Developments:

In 2023, LG Innotek unveiled the latest FC-BGA for the first time at the 'CES 2023'. It is highly integrated, multi layered, large scaled, and has fine patterning and a lot of micro vias.

In 2021, Advanced Semiconductor Engineering, Inc. (ASE) collaborated with Siemens Digital Industries Software to generate two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical design implementation.

In 2021, AT&S AG, one of the leading manufacturers of high-end printed circuit boards and IC substrates, announced the development of a new production site for IC substrates in Southeast Asia, subject to the approval of the Supervisory Board.

Key Questions Answered in This Report

• 1.How big is the global advanced IC substrate market?
• 2.What is the future outlook of the global advanced IC substrate market?
• 3.What are the key factors driving the global advanced IC substrate market?
• 4.Which region accounts for the largest advanced IC substrate market share?
• 5.Which are the leading companies in the global advanced IC substrate market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Advanced IC Substrate Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Type

• 6.1 FC BGA
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 FC CSP
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast

7 Market Breakup by Application

• 7.1 Consumer Electronics
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 Automotive and Transportation
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 IT and Telecom
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast
• 7.4 Others
  • 7.4.1 Market Trends
  • 7.4.2 Market Forecast

8 Market Breakup by Region

• 8.1 North America
  • 8.1.1 United States
    • 8.1.1.1 Market Trends
    • 8.1.1.2 Market Forecast
  • 8.1.2 Canada
    • 8.1.2.1 Market Trends
    • 8.1.2.2 Market Forecast
• 8.2 Asia-Pacific
  • 8.2.1 China
    • 8.2.1.1 Market Trends
    • 8.2.1.2 Market Forecast
  • 8.2.2 Japan
    • 8.2.2.1 Market Trends
    • 8.2.2.2 Market Forecast
  • 8.2.3 India
    • 8.2.3.1 Market Trends
    • 8.2.3.2 Market Forecast
  • 8.2.4 South Korea
    • 8.2.4.1 Market Trends
    • 8.2.4.2 Market Forecast
  • 8.2.5 Australia
    • 8.2.5.1 Market Trends
    • 8.2.5.2 Market Forecast
  • 8.2.6 Indonesia
    • 8.2.6.1 Market Trends
    • 8.2.6.2 Market Forecast
  • 8.2.7 Others
    • 8.2.7.1 Market Trends
    • 8.2.7.2 Market Forecast
• 8.3 Europe
  • 8.3.1 Germany
    • 8.3.1.1 Market Trends
    • 8.3.1.2 Market Forecast
  • 8.3.2 France
    • 8.3.2.1 Market Trends
    • 8.3.2.2 Market Forecast
  • 8.3.3 United Kingdom
    • 8.3.3.1 Market Trends
    • 8.3.3.2 Market Forecast
  • 8.3.4 Italy
    • 8.3.4.1 Market Trends
    • 8.3.4.2 Market Forecast
  • 8.3.5 Spain
    • 8.3.5.1 Market Trends
    • 8.3.5.2 Market Forecast
  • 8.3.6 Russia
    • 8.3.6.1 Market Trends
    • 8.3.6.2 Market Forecast
  • 8.3.7 Others
    • 8.3.7.1 Market Trends
    • 8.3.7.2 Market Forecast
• 8.4 Latin America
  • 8.4.1 Brazil
    • 8.4.1.1 Market Trends
    • 8.4.1.2 Market Forecast
  • 8.4.2 Mexico
    • 8.4.2.1 Market Trends
    • 8.4.2.2 Market Forecast
  • 8.4.3 Others
    • 8.4.3.1 Market Trends
    • 8.4.3.2 Market Forecast
• 8.5 Middle East and Africa
  • 8.5.1 Market Trends
  • 8.5.2 Market Breakup by Country
  • 8.5.3 Market Forecast

9 SWOT Analysis

• 9.1 Overview
• 9.2 Strengths
• 9.3 Weaknesses
• 9.4 Opportunities
• 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

• 11.1 Overview
• 11.2 Bargaining Power of Buyers
• 11.3 Bargaining Power of Suppliers
• 11.4 Degree of Competition
• 11.5 Threat of New Entrants
• 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

• 13.1 Market Structure
• 13.2 Key Players
• 13.3 Profiles of Key Players
  • 13.3.1 ASE Group
    • 13.3.1.1 Company Overview
    • 13.3.1.2 Product Portfolio
    • 13.3.1.3 Financials
  • 13.3.2 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    • 13.3.2.1 Company Overview
    • 13.3.2.2 Product Portfolio
    • 13.3.2.3 Financials
  • 13.3.3 Fujitsu Limited
    • 13.3.3.1 Company Overview
    • 13.3.3.2 Product Portfolio
    • 13.3.3.3 Financials
    • 13.3.3.4 SWOT Analysis
  • 13.3.4 Ibiden Co. Ltd.
    • 13.3.4.1 Company Overview
    • 13.3.4.2 Product Portfolio
    • 13.3.4.3 Financials
    • 13.3.4.4 SWOT Analysis
  • 13.3.5 JCET Group Co. Ltd
    • 13.3.5.1 Company Overview
    • 13.3.5.2 Product Portfolio
    • 13.3.5.3 Financials
  • 13.3.6 Kinsus Interconnect Technology Corp.
    • 13.3.6.1 Company Overview
    • 13.3.6.2 Product Portfolio
    • 13.3.6.3 Financials
  • 13.3.7 Korea Circuit Co. Ltd.
    • 13.3.7.1 Company Overview
    • 13.3.7.2 Product Portfolio
    • 13.3.7.3 Financials
  • 13.3.8 KYOCERA Corporation
    • 13.3.8.1 Company Overview
    • 13.3.8.2 Product Portfolio
    • 13.3.8.3 Financials
    • 13.3.8.4 SWOT Analysis
  • 13.3.9 LG Innotek Co. Ltd.
    • 13.3.9.1 Company Overview
    • 13.3.9.2 Product Portfolio
    • 13.3.9.3 Financials
    • 13.3.9.4 SWOT Analysis
  • 13.3.10 Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation)
    • 13.3.10.1 Company Overview
    • 13.3.10.2 Product Portfolio
    • 13.3.10.3 Financials
  • 13.3.11 TTM Technologies Inc.
    • 13.3.11.1 Company Overview
    • 13.3.11.2 Product Portfolio
    • 13.3.11.3 Financials
    • 13.3.11.4 SWOT Analysis
  • 13.3.12 Unimicron Technology Corporation (United Microelectronics Corporation)
    • 13.3.12.1 Company Overview
    • 13.3.12.2 Product Portfolio
    • 13.3.12.3 Financials