세계의 첨단 IC 기판 시장 규모, 점유율, 동향 분석 보고서 : 유형별, 기술별, 용도별, 지역별, 부문 예측(2025-2033년)

Advanced IC Substrates Market Summary

The global advanced IC substrates market size was estimated at USD 16.73 billion in 2024, and is projected to reach USD 37.20 billion by 2033, growing at a CAGR of 9.4% from 2025 to 2033. The rising adoption of heterogeneous integration and chiplet-based architectures has emerged as a significant trend in the global advanced IC substrates industry, driving demand for high-density.

These multi-layer substrates enable compact, energy-efficient, and high-performance semiconductor packaging across AI, 5G, and automotive applications. The global push toward electric mobility and cleaner transportation is significantly boosting the demand for advanced IC substrates. The adoption of wide bandgap semiconductors such as silicon carbide and gallium nitride is becoming central to electric vehicle powertrains and high-voltage industrial systems. Silicon carbide has gained widespread traction since its use in electric vehicle inverters by major manufacturers like Tesla. Its superior properties, such as higher electric field tolerance and thermal conductivity, make it ideal for demanding automotive environments. This shift is further supported by projections that semiconductors will account for over 20 percent of a premium vehicle's total value by 2030, up from just four percent in 2019. As a result, demand for robust substrate materials that support high voltage and temperature performance is propelling the market growth in the automotive sector.

The surge in artificial intelligence applications is reshaping the semiconductor landscape, placing intense performance demands on packaging and substrate technologies. AI chips now require rapid data transfer, lower power consumption, and enhanced thermal performance, which is pushing the industry to develop more sophisticated packaging solutions. The National Advanced Packaging Manufacturing Program has identified artificial intelligence as a key driver requiring innovation in equipment, power delivery, and chiplet support systems. Government-backed investments are accelerating research in these areas, with expectations of one hundred million dollars in funding over the next five years. These developments are boosting the demand for high-density and thermally efficient substrates, particularly those optimized for AI-centric hardware in data centers and edge devices, thereby propelling the overall market growth.

The semiconductor industry is undergoing a major transformation as it shifts toward heterogeneous integration and chiplet-based system architectures. Traditional monolithic chip designs are being replaced with modular chiplet configurations that improve yield and lower costs. This evolution requires advanced IC substrates to serve as the high-performance interconnect platform supporting seamless communication between diverse chiplets. Research forecasts indicate that the future of packaging will move toward simplified hierarchy with direct chiplet-to-substrate assembly, replacing the need for intermediary layers like interposers. Substrate technologies are being adapted to include silicon and glass cores, along with embedded passive and active components. This architectural shift is boosting the market by enabling more efficient, scalable, and cost-effective semiconductor design and manufacturing.

The transition from round wafer-based processing to large area panel-level packaging is redefining the substrate manufacturing process. Panel sizes reaching up to six hundred fifty millimeters by six hundred fifty millimeters are enabling manufacturers to process more devices per cycle, significantly improving throughput and lowering production costs. This evolution is particularly impactful for high-volume sectors such as mobile electronics, medical wearables, and flexible hybrid devices. The use of larger panels also allows for the integration of more complex designs on thinner substrates, expanding the range of potential applications.

In response to recent supply chain disruptions, several governments are focusing on reshoring and domesticating the production of advanced IC substrates. The U.S. currently has minimal capacity to manufacture high-end substrates like Flip Chip Ball Grid Array or Flip Chip Chip Scale Package, which are critical to leading-edge chip packaging. As part of the CHIPS and Science Act, federal support totaling nearly three hundred million dollars is being directed toward building domestic capabilities. These efforts include investment in emerging technologies such as additive manufacturing and three-dimensional printing for substrate prototyping. The aim is to reduce dependence on foreign suppliers and establish a more resilient and secure supply network for the semiconductor industry. These strategic moves are boosting the market by ensuring consistent access to advanced packaging technologies and driving long-term growth across key verticals.

Global Advanced IC Substrates Market Report Segmentation

This report forecasts revenue growth at the global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the global advanced IC substrates market report based on type, technology, application, and region:

• Type Outlook (Revenue, USD Million, 2021 - 2033)
• Flip Chip Ball Grid Array (FCBGA) Substrates
• Flip Chip Chip Scale Package (FCCSP) Substrates
• Wire Bond Substrates
• Embedded Substrates
• Others
• Technology Outlook (Revenue, USD Million, 2021 - 2033)
• High-Density Interconnect (HDI) Substrates
• Build-Up Substrates
• Coreless Substrates
• Organic Substrates
• Ceramic Substrates
• Application Outlook (Revenue, USD Million, 2021 - 2033)
• Mobile and Consumer Electronics
• Automotive Electronics
• Networking and Communication Devices
• Computing and Data Centers
• Others
• Regional Outlook (Revenue, USD Million, 2021 - 2033)
• North America
  • U.S.
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • France
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
• Latin America
  • Brazil
• Middle East and Africa (MEA)
  • KSA
  • UAE
  • South Africa

Table of Contents

Chapter 1. Methodology and Scope

• 1.1. Market Segmentation and Scope
• 1.2. Research Methodology
  • 1.2.1. Information Procurement
• 1.3. Information or Data Analysis
• 1.4. Methodology
• 1.5. Research Scope and Assumptions
• 1.6. Market Formulation & Validation
• 1.7. Country Based Segment Share Calculation
• 1.8. List of Data Sources

Chapter 2. Executive Summary

• 2.1. Market Outlook
• 2.2. Segment Outlook
• 2.3. Competitive Insights

Chapter 3. Advanced IC Substrates Market Variables, Trends, & Scope

• 3.1. Market Lineage Outlook
• 3.2. Market Dynamics
  • 3.2.1. Market Driver Analysis
  • 3.2.2. Market Restraint Analysis
  • 3.2.3. Industry Challenge
• 3.3. Advanced IC Substrates Market Analysis Tools
  • 3.3.1. Industry Analysis - Porter's
    • 3.3.1.1. Bargaining power of the suppliers
    • 3.3.1.2. Bargaining power of the buyers
    • 3.3.1.3. Threats of substitution
    • 3.3.1.4. Threats from new entrants
    • 3.3.1.5. Competitive rivalry
  • 3.3.2. PESTEL Analysis
    • 3.3.2.1. Political landscape
    • 3.3.2.2. Economic landscape
    • 3.3.2.3. Social landscape
    • 3.3.2.4. Technological landscape
    • 3.3.2.5. Environmental landscape
    • 3.3.2.6. Legal landscape

Chapter 4. Advanced IC Substrates Market: Type Estimates & Trend Analysis

• 4.1. Segment Dashboard
• 4.2. Advanced IC Substrates Market: Type Movement Analysis, 2024 & 2033 (USD Million)
• 4.3. Flip Chip Ball Grid Array (FCBGA) Substrates
  • 4.3.1. Flip Chip Ball Grid Array (FCBGA) Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 4.4. Flip Chip Chip Scale Package (FCCSP) Substrates
  • 4.4.1. Flip Chip Chip Scale Package (FCCSP) Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 4.5. Wire Bond Substrates
  • 4.5.1. Wire Bond Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 4.6. Embedded Substrates
  • 4.6.1. Embedded Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 4.7. Others
  • 4.7.1. Others Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 5. Advanced IC Substrates Market: Technology Estimates & Trend Analysis

• 5.1. Segment Dashboard
• 5.2. Advanced IC Substrates Market: Technology Movement Analysis, 2024 & 2033 (USD Million)
• 5.3. High-Density Interconnect (HDI) Substrates
  • 5.3.1. High-Density Interconnect (HDI) Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 5.4. Build-Up Substrates
  • 5.4.1. Build-Up Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 5.5. Coreless Substrates
  • 5.5.1. Coreless Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 5.6. Organic Substrates
  • 5.6.1. Organic Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 5.7. Ceramic Substrates
  • 5.7.1. Ceramic Substrates Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 6. Advanced IC Substrates Market: Application Estimates & Trend Analysis

• 6.1. Segment Dashboard
• 6.2. Advanced IC Substrates Market: Application Movement Analysis, 2024 & 2033 (USD Million)
• 6.3. Mobile and Consumer Electronics
  • 6.3.1. Mobile and Consumer Electronics Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 6.4. Automotive Electronics
  • 6.4.1. Automotive Electronics Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 6.5. Networking and Communication Devices
  • 6.5.1. Networking and Communication Devices Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 6.6. Computing and Data Centers
  • 6.6.1. Computing and Data Centers Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
• 6.7. Others
  • 6.7.1. Others Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 7. Advanced IC Substrates Market: Regional Estimates & Trend Analysis

• 7.1. Advanced IC Substrates Market Share, By Region, 2024 & 2033, USD Million
• 7.2. North America
  • 7.2.1. North America Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.2.2. U.S.
    • 7.2.2.1. U.S. Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.2.3. Canada
    • 7.2.3.1. Canada Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.2.4. Mexico
    • 7.2.4.1. Mexico Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
• 7.3. Europe
  • 7.3.1. Europe Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.3.2. UK
    • 7.3.2.1. UK Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.3.3. Germany
    • 7.3.3.1. Germany Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.3.4. France
    • 7.3.4.1. France Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
• 7.4. Asia Pacific
  • 7.4.1. Asia Pacific Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.4.2. China
    • 7.4.2.1. China Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.4.3. Japan
    • 7.4.3.1. Japan Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.4.4. India
    • 7.4.4.1. India Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.4.5. South Korea
    • 7.4.5.1. South Korea Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.4.6. Australia
    • 7.4.6.1. Australia Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
• 7.5. Latin America
  • 7.5.1. Latin America Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.5.2. Brazil
    • 7.5.2.1. Brazil Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
• 7.6. Middle East and Africa
  • 7.6.1. Middle East and Africa Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.6.2. UAE
    • 7.6.2.1. UAE Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.6.3. KSA
    • 7.6.3.1. KSA Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 7.6.4. South Africa
    • 7.6.4.1. South Africa Advanced IC Substrates Market Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 8. Competitive Landscape

• 8.1. Company Categorization
• 8.2. Company Market Positioning
• 8.3. Company Heat Map Analysis
• 8.4. Company Profiles/Listing
  • 8.4.1. ASE TECHNOLOGY HOLDING
    • 8.4.1.1. Participant's Overview
    • 8.4.1.2. Financial Performance
    • 8.4.1.3. Product Benchmarking
    • 8.4.1.4. Strategic Initiatives
  • 8.4.2. AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    • 8.4.2.1. Participant's Overview
    • 8.4.2.2. Financial Performance
    • 8.4.2.3. Product Benchmarking
    • 8.4.2.4. Strategic Initiatives
  • 8.4.3. Fujitsu
    • 8.4.3.1. Participant's Overview
    • 8.4.3.2. Financial Performance
    • 8.4.3.3. Product Benchmarking
    • 8.4.3.4. Strategic Initiatives
  • 8.4.4. IBIDEN
    • 8.4.4.1. Participant's Overview
    • 8.4.4.2. Financial Performance
    • 8.4.4.3. Product Benchmarking
    • 8.4.4.4. Strategic Initiatives
  • 8.4.5. KINSUS INTERCONNECT TECHNOLOGY CORP
    • 8.4.5.1. Participant's Overview
    • 8.4.5.2. Financial Performance
    • 8.4.5.3. Product Benchmarking
    • 8.4.5.4. Strategic Initiatives
  • 8.4.6. KYOCERA Corporation
    • 8.4.6.1. Participant's Overview
    • 8.4.6.2. Financial Performance
    • 8.4.6.3. Product Benchmarking
    • 8.4.6.4. Strategic Initiatives
  • 8.4.7. LG Innotek
    • 8.4.7.1. Participant's Overview
    • 8.4.7.2. Financial Performance
    • 8.4.7.3. Product Benchmarking
    • 8.4.7.4. Strategic Initiatives
  • 8.4.8. NAN YA PLASTICS CORPORATION
    • 8.4.8.1. Participant's Overview
    • 8.4.8.2. Financial Performance
    • 8.4.8.3. Product Benchmarking
    • 8.4.8.4. Strategic Initiatives
  • 8.4.9. SAMSUNG ELECTRO-MECHANICS
    • 8.4.9.1. Participant's Overview
    • 8.4.9.2. Financial Performance
    • 8.4.9.3. Product Benchmarking
    • 8.4.9.4. Strategic Initiatives
  • 8.4.10. Unimicron
    • 8.4.10.1. Participant's Overview
    • 8.4.10.2. Financial Performance
    • 8.4.10.3. Product Benchmarking
    • 8.4.10.4. Strategic Initiatives