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시장보고서
상품코드
2024567
파워 반도체 시장 보고서 : 구성부품별, 재료별, 최종 용도 산업별, 지역별(2026-2034년)Power Semiconductor Market Report by Component, Material (Silicon/Germanium, Silicon Carbide, Gallium Nitride ), End Use Industry, and Region 2026-2034 |
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세계의 파워 반도체 시장 규모는 2025년에 461억 달러에 달했습니다. 향후에 대해 IMARC Group은 2026-2034년에 CAGR 3.00%로 추이하며, 2034년까지 시장 규모가 606억 달러에 달할 것으로 예측하고 있습니다.
전력 반도체는 다양한 단계에서 에너지를 한 형태에서 다른 형태로 변환하는 현대 전력 전자 회로 기기의 기초가 되는 부품입니다. 이들은 탄화규소(SiC), 게르마늄, 질화갈륨(GaN)을 사용하여 제조됩니다. 이러한 장치는 무선통신, 모션 제어, 컴퓨터 시스템, 전기 구동 장치의 고급 제어, 안테나, 광대역 무선 기술, 위성 시스템 등에 널리 활용되고 있습니다. 전력반도체는 전기기기, 기계 및 시스템에서 필수적인 요소를 형성하고 있으며, 손상 없이 고전압 및 고전류 변환이 필요한 용도에 주로 사용되고 있습니다. 전기 기계식 변환 시스템에 비해 전력 반도체는 더 빠른 동적 응답, 낮은 설치 비용 및 열 방출 감소를 실현할 수 있습니다. 그 결과 자동차, 군사, 항공우주, 소비자용 전자기기, 정보기술, 통신 등 다양한 산업 분야에서 폭넓게 활용되고 있습니다.
전력반도체 시장 동향:
세계 자동차 산업의 급속한 성장은 시장 성장에 대한 긍정적인 전망을 만드는 주요 요인 중 하나입니다. 파워반도체는 조향시스템, 브레이크, 연료공급, 안전시스템 등 자동차 부품에 전자부품 및 집적칩으로 광범위하게 탑재되고 있습니다. 이에 따라 컨버터 효율 향상 및 배터리 관리 시스템, 파워 일렉트로닉스 스위치 강화를 위해 전기자동차(EV), 플러그인하이브리드차(PHEV), 하이브리드차(HEV)에 대한 제품 보급이 확대되고 있으며, 이는 시장 성장을 촉진하고 있습니다. 또한 차량 경량화, 연비 효율 향상, 배기가스 저감에 기여하는 'X-by-wire'와 'Drive-by-wire' 기술 활용 등 다양한 기술 발전이 시장 성장의 원동력이 되고 있습니다. 또한 스마트폰, 태블릿, 스마트워치, 피트니스 밴드, 통신기기 등 가볍고 작고 휴대성이 높은 CE(Consumer Electronics)에 광범위하게 활용되고 있는 것도 시장 성장에 긍정적인 영향을 미치고 있습니다. 재생에너지원에 대한 수요 증가, 절전기기 활성화를 위한 다양한 정부 정책 시행 등 다른 요인들도 시장을 더욱 견인할 것으로 예상됩니다.
이 보고서에서 답변하는 주요 질문
- 지금까지의 세계 전력반도체 시장 동향은 어떠했으며, 향후 수년간 어떻게 변화할 것으로 예상하는가?
- COVID-19는 세계 전력 반도체 시장에 어떤 영향을 미쳤는가?
- 주요 지역 시장은 어디인가?
- 부품별로 보면 시장 내역은?
- 재료별 시장 현황은?
- 최종 사용 산업별 시장 분석은?
- 이 산업의 밸류체인에서 각 단계는 어떤 역할을 하는가?
- 이 산업의 주요 촉진요인과 과제는 무엇인가?
- 세계 전력 반도체 시장의 구조는 어떻게 되어 있으며, 주요 기업은 어디인가?
- 업계의 경쟁은 어느 정도 치열한가?
목차
제1장 서문
제2장 조사 범위와 조사 방법
제3장 개요
제4장 서론
제5장 세계의 파워 반도체 시장
제6장 시장 내역 : 컴포넌트별
제7장 시장 내역 : 소재별
제8장 시장 내역 : 최종 사용 산업별
제9장 시장 내역 : 지역별
제10장 SWOT 분석
제11장 밸류체인 분석
제12장 Porters Five Forces 분석
제13장 가격 분석
제14장 경쟁 구도
KSA 26.05.18The global power semiconductor market size reached USD 46.1 Billion in 2025. Looking forward, IMARC Group expects the market to reach USD 60.6 Billion by 2034, exhibiting a growth rate (CAGR) of 3.00% during 2026-2034.
Power semiconductors are fundamental components of modern power electronic circuitry machines that convert energy from one form to another at various stages. They are manufactured using silicon carbide (Sic), germanium and gallium nitride (GaN). These devices are widely being used for wireless communication, motion control, computer systems, advanced control of electric drives, antennas, broadband wireless techniques and satellite systems. Power semiconductors form an indispensable part of electrical appliances, machines, and systems and are majorly used in applications requiring conversion of large voltages and currents without damages. As compared to electro-mechanical converter systems, power semiconductors offer a faster dynamic response, lower installation cost and reduced thermal dissipation. Consequently, they are widely used across various industries, such as automotive, military, aerospace, consumer electronics, information technology and telecommunications.
POWER SEMICONDUCTOR MARKET TRENDS:
Rapid expansion in the automotive industry across the globe is one of the key factors creating a positive outlook for the market growth. Power semiconductors are widely fitted with electronic components and integrated chips in automobile parts, such as steering systems, braking, fuel delivery and safety systems. In line with this, the widespread product adoption in electric vehicles, plug-in electric vehicles, and hybrid electric vehicles (EVs/HEVs) for providing higher efficiency in converters and enhancing battery management systems and power electronic switches are favoring the market growth. Moreover, various technological advancements, such as the utilization of x-by-wire or drive-by-wire technologies that assist in decreasing the weight of the vehicle, enhancing fuel efficiency and reducing emission, are providing an impetus to the market growth. Additionally, the widespread product utilization in lightweight, small and portable consumer electronics, such as smartphones, tablets, smartwatches, fitness bands and communication devices, is positively impacting the market growth. Other factors, including increasing demand for renewable energy sources and the implementation of various government initiatives to promote power-efficient devices, are anticipated to drive the market further.
KEY MARKET SEGMENTATION:
Breakup by Component:
- Discrete
- Module
- Power Integrated Circuits
Breakup by Material:
- Silicon/Germanium
- Silicon Carbide (SiC)
- Gallium Nitride (GaN)
Breakup by End Use Industry:
- Automotive
- Consumer Electronics
- Industrial
- Power and Energy
- IT and Telecommunication
- Military and Aerospace
- Others
Breakup by Region:
- North America
- United States
- Canada
- Asia-Pacific
- China
- Japan
- India
- South Korea
- Australia
- Indonesia
- Others
- Europe
- Germany
- France
- United Kingdom
- Italy
- Spain
- Russia
- Others
- Latin America
- Brazil
- Mexico
- Others
- Middle East and Africa
COMPETITIVE LANDSCAPE:
The competitive landscape of the industry has also been examined along with the profiles of the key players being ABB Ltd., Broadcom Inc., Fuji Electric Co. Ltd., Hitachi Ltd., Infineon Technologies AG, Microchip Technology Inc., Mitsubishi Electric Corporation, NXP Semiconductor Inc., Onsemi, Renesas Electronics Corporation, ROHM Co. Ltd., STMicroelectronics, Texas Instruments Incorporated, Toshiba Corporation and Vishay Intertechnology Inc.
KEY QUESTIONS ANSWERED IN THIS REPORT
- How has the global power semiconductor market performed so far and how will it perform in the coming years?
- What has been the impact of COVID-19 on the global power semiconductor market?
- What are the key regional markets?
- What is the breakup of the market based on the component?
- What is the breakup of the market based on the material?
- What is the breakup of the market based on the end use industry?
- What are the various stages in the value chain of the industry?
- What are the key driving factors and challenges in the industry?
- What is the structure of the global power semiconductor market and who are the key players?
- What is the degree of competition in the industry?
Table of Contents
1 Preface
2 Scope and Methodology
- 2.1 Objectives of the Study
- 2.2 Stakeholders
- 2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
- 2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
- 2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
- 4.1 Overview
- 4.2 Key Industry Trends
5 Global Power Semiconductor Market
- 5.1 Market Overview
- 5.2 Market Performance
- 5.3 Impact of COVID-19
- 5.4 Market Forecast
6 Market Breakup by Component
- 6.1 Discrete
- 6.1.1 Market Trends
- 6.1.2 Market Forecast
- 6.2 Module
- 6.2.1 Market Trends
- 6.2.2 Market Forecast
- 6.3 Power Integrated Circuits
- 6.3.1 Market Trends
- 6.3.2 Market Forecast
7 Market Breakup by Material
- 7.1 Silicon/Germanium
- 7.1.1 Market Trends
- 7.1.2 Market Forecast
- 7.2 Silicon Carbide (SiC)
- 7.2.1 Market Trends
- 7.2.2 Market Forecast
- 7.3 Gallium Nitride (GaN)
- 7.3.1 Market Trends
- 7.3.2 Market Forecast
8 Market Breakup by End Use Industry
- 8.1 Automotive
- 8.1.1 Market Trends
- 8.1.2 Market Forecast
- 8.2 Consumer Electronics
- 8.2.1 Market Trends
- 8.2.2 Market Forecast
- 8.3 Industrial
- 8.3.1 Market Trends
- 8.3.2 Market Forecast
- 8.4 Power and Energy
- 8.4.1 Market Trends
- 8.4.2 Market Forecast
- 8.5 IT and Telecommunication
- 8.5.1 Market Trends
- 8.5.2 Market Forecast
- 8.6 Military and Aerospace
- 8.6.1 Market Trends
- 8.6.2 Market Forecast
- 8.7 Others
- 8.7.1 Market Trends
- 8.7.2 Market Forecast
9 Market Breakup by Region
- 9.1 North America
- 9.1.1 United States
- 9.1.1.1 Market Trends
- 9.1.1.2 Market Forecast
- 9.1.2 Canada
- 9.1.2.1 Market Trends
- 9.1.2.2 Market Forecast
- 9.1.1 United States
- 9.2 Asia-Pacific
- 9.2.1 China
- 9.2.1.1 Market Trends
- 9.2.1.2 Market Forecast
- 9.2.2 Japan
- 9.2.2.1 Market Trends
- 9.2.2.2 Market Forecast
- 9.2.3 India
- 9.2.3.1 Market Trends
- 9.2.3.2 Market Forecast
- 9.2.4 South Korea
- 9.2.4.1 Market Trends
- 9.2.4.2 Market Forecast
- 9.2.5 Australia
- 9.2.5.1 Market Trends
- 9.2.5.2 Market Forecast
- 9.2.6 Indonesia
- 9.2.6.1 Market Trends
- 9.2.6.2 Market Forecast
- 9.2.7 Others
- 9.2.7.1 Market Trends
- 9.2.7.2 Market Forecast
- 9.2.1 China
- 9.3 Europe
- 9.3.1 Germany
- 9.3.1.1 Market Trends
- 9.3.1.2 Market Forecast
- 9.3.2 France
- 9.3.2.1 Market Trends
- 9.3.2.2 Market Forecast
- 9.3.3 United Kingdom
- 9.3.3.1 Market Trends
- 9.3.3.2 Market Forecast
- 9.3.4 Italy
- 9.3.4.1 Market Trends
- 9.3.4.2 Market Forecast
- 9.3.5 Spain
- 9.3.5.1 Market Trends
- 9.3.5.2 Market Forecast
- 9.3.6 Russia
- 9.3.6.1 Market Trends
- 9.3.6.2 Market Forecast
- 9.3.7 Others
- 9.3.7.1 Market Trends
- 9.3.7.2 Market Forecast
- 9.3.1 Germany
- 9.4 Latin America
- 9.4.1 Brazil
- 9.4.1.1 Market Trends
- 9.4.1.2 Market Forecast
- 9.4.2 Mexico
- 9.4.2.1 Market Trends
- 9.4.2.2 Market Forecast
- 9.4.3 Others
- 9.4.3.1 Market Trends
- 9.4.3.2 Market Forecast
- 9.4.1 Brazil
- 9.5 Middle East and Africa
- 9.5.1 Market Trends
- 9.5.2 Market Breakup by Country
- 9.5.3 Market Forecast
10 SWOT Analysis
- 10.1 Overview
- 10.2 Strengths
- 10.3 Weaknesses
- 10.4 Opportunities
- 10.5 Threats
11 Value Chain Analysis
12 Porters Five Forces Analysis
- 12.1 Overview
- 12.2 Bargaining Power of Buyers
- 12.3 Bargaining Power of Suppliers
- 12.4 Degree of Competition
- 12.5 Threat of New Entrants
- 12.6 Threat of Substitutes
13 Price Analysis
14 Competitive Landscape
- 14.1 Market Structure
- 14.2 Key Players
- 14.3 Profiles of Key Players
- 14.3.1 ABB Ltd.
- 14.3.1.1 Company Overview
- 14.3.1.2 Product Portfolio
- 14.3.1.3 Financials
- 14.3.1.4 SWOT Analysis
- 14.3.2 Broadcom Inc.
- 14.3.2.1 Company Overview
- 14.3.2.2 Product Portfolio
- 14.3.2.3 Financials
- 14.3.2.4 SWOT Analysis
- 14.3.3 Fuji Electric Co. Ltd.
- 14.3.3.1 Company Overview
- 14.3.3.2 Product Portfolio
- 14.3.3.3 Financials
- 14.3.3.4 SWOT Analysis
- 14.3.4 Hitachi Ltd.
- 14.3.4.1 Company Overview
- 14.3.4.2 Product Portfolio
- 14.3.4.3 Financials
- 14.3.4.4 SWOT Analysis
- 14.3.5 Infineon Technologies AG
- 14.3.5.1 Company Overview
- 14.3.5.2 Product Portfolio
- 14.3.5.3 Financials
- 14.3.5.4 SWOT Analysis
- 14.3.6 Microchip Technology Inc.
- 14.3.6.1 Company Overview
- 14.3.6.2 Product Portfolio
- 14.3.6.3 Financials
- 14.3.6.4 SWOT Analysis
- 14.3.7 Mitsubishi Electric Corporation
- 14.3.7.1 Company Overview
- 14.3.7.2 Product Portfolio
- 14.3.7.3 Financials
- 14.3.7.4 SWOT Analysis
- 14.3.8 NXP Semiconductor Inc.
- 14.3.8.1 Company Overview
- 14.3.8.2 Product Portfolio
- 14.3.8.3 Financials
- 14.3.8.4 SWOT Analysis
- 14.3.9 Onsemi
- 14.3.9.1 Company Overview
- 14.3.9.2 Product Portfolio
- 14.3.9.3 Financials
- 14.3.9.4 SWOT Analysis
- 14.3.10 Renesas Electronics Corporation
- 14.3.10.1 Company Overview
- 14.3.10.2 Product Portfolio
- 14.3.10.3 Financials
- 14.3.10.4 SWOT Analysis
- 14.3.11 ROHM Co. Ltd.
- 14.3.11.1 Company Overview
- 14.3.11.2 Product Portfolio
- 14.3.11.3 Financials
- 14.3.11.4 SWOT Analysis
- 14.3.12 STMicroelectronics
- 14.3.12.1 Company Overview
- 14.3.12.2 Product Portfolio
- 14.3.13 Texas Instruments Incorporated
- 14.3.13.1 Company Overview
- 14.3.13.2 Product Portfolio
- 14.3.13.3 Financials
- 14.3.13.4 SWOT Analysis
- 14.3.14 Toshiba Corporation
- 14.3.14.1 Company Overview
- 14.3.14.2 Product Portfolio
- 14.3.14.3 Financials
- 14.3.14.4 SWOT Analysis
- 14.3.15 Vishay Intertechnology Inc.
- 14.3.15.1 Company Overview
- 14.3.15.2 Product Portfolio
- 14.3.15.3 Financials
- 14.3.15.4 SWOT Analysis
- 14.3.1 ABB Ltd.
