세계의 반도체 제조 장비 시장(2024-2028년)

The semiconductor manufacturing equipment market is forecasted to grow by USD 46.68 bn during 2023-2028, accelerating at a CAGR of 7.74% during the forecast period. The report on the semiconductor manufacturing equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by increasing investment in semiconductor fabrication, expansion of 5G networks requiring advanced semiconductor fabrication capabilities, and growing number of outsourced semiconductor assembly and test (OSAT) vendors in APAC.

Technavio's semiconductor manufacturing equipment market is segmented as below:

By Application

• Semiconductor fabrication plant or foundry
• Testing and inspection
• Semiconductor electronics manufacturing

By Type

• Front end
• Back end

By Geography

• APAC
• Europe
• North America
• Middle East and Africa
• South America

This study identifies the developments in semiconductor manufacturing equipment industry as one of the prime reasons driving the semiconductor manufacturing equipment market growth during the next few years. Also, adoption of advanced lithography technologies for smaller node sizes and increasing focus on wafer-level packaging and heterogeneous integration will lead to sizable demand in the market.

The report on the semiconductor manufacturing equipment market covers the following areas:

• Semiconductor manufacturing equipment market sizing
• Semiconductor manufacturing equipment market forecast
• Semiconductor manufacturing equipment market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor manufacturing equipment market vendors that include Applied Materials Inc., ASM International NV, ASML, Axcelis Technologies Inc, EV Group, Hitachi Ltd., KLA Corp., Lam Research Corp., Nikon Corp., Nova Measuring Instruments Ltd., Onto Innovation Inc., PLASMA THERM, Screen Holdings Co. Ltd., Teradyne Inc., Tokyo Electron Ltd., and Veeco Instruments Inc.. Also, the semiconductor manufacturing equipment market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.

Table of Contents

1 Executive Summary

• 1.1 Market overview

2 Market Landscape

• 2.1 Market ecosystem

3 Market Sizing

• 3.1 Market definition
• 3.2 Market segment analysis
• 3.3 Market size 2023
• 3.4 Market outlook: Forecast for 2023-2028

4 Historic Market Size

• 4.1 Global semiconductor manufacturing equipment market 2018 - 2022
• 4.2 Application Segment Analysis 2018 - 2022
• 4.3 Type Segment Analysis 2018 - 2022
• 4.4 Geography Segment Analysis 2018 - 2022
• 4.5 Country Segment Analysis 2018 - 2022

5 Five Forces Analysis

• 5.1 Five forces summary
• 5.2 Bargaining power of buyers
• 5.3 Bargaining power of suppliers
• 5.4 Threat of new entrants
• 5.5 Threat of substitutes
• 5.6 Threat of rivalry
• 5.7 Market condition

6 Market Segmentation by Application

• 6.1 Market segments
• 6.2 Comparison by Application
• 6.3 Semiconductor fabrication plant or foundry - Market size and forecast 2023-2028
• 6.4 Testing and inspection - Market size and forecast 2023-2028
• 6.5 Semiconductor electronics manufacturing - Market size and forecast 2023-2028
• 6.6 Market opportunity by Application

7 Market Segmentation by Type

• 7.1 Market segments
• 7.2 Comparison by Type
• 7.3 Front end - Market size and forecast 2023-2028
• 7.4 Back end - Market size and forecast 2023-2028
• 7.5 Market opportunity by Type

8 Customer Landscape

• 8.1 Customer landscape overview

9 Geographic Landscape

• 9.1 Geographic segmentation
• 9.2 Geographic comparison
• 9.3 APAC - Market size and forecast 2023-2028
• 9.4 Europe - Market size and forecast 2023-2028
• 9.5 North America - Market size and forecast 2023-2028
• 9.6 Middle East and Africa - Market size and forecast 2023-2028
• 9.7 South America - Market size and forecast 2023-2028
• 9.8 China - Market size and forecast 2023-2028
• 9.9 India - Market size and forecast 2023-2028
• 9.10 Taiwan - Market size and forecast 2023-2028
• 9.11 Germany - Market size and forecast 2023-2028
• 9.12 US - Market size and forecast 2023-2028
• 9.13 Market opportunity by geography

10 Drivers, Challenges, and Trends

• 10.1 Market drivers
• 10.2 Market challenges
• 10.3 Impact of drivers and challenges
• 10.4 Market trends

11 Vendor Landscape

• 11.1 Overview
• 11.2 Vendor landscape
• 11.3 Landscape disruption
• 11.4 Industry risks

12 Vendor Analysis

• 12.1 Vendors covered
• 12.2 Market positioning of vendors
• 12.3 Applied Materials Inc.
• 12.4 ASM International NV
• 12.5 ASML
• 12.6 Axcelis Technologies Inc
• 12.7 EV Group
• 12.8 Hitachi Ltd.
• 12.9 KLA Corp.
• 12.10 Lam Research Corp.
• 12.11 Nikon Corp.
• 12.12 Nova Measuring Instruments Ltd.
• 12.13 Onto Innovation Inc.
• 12.14 PLASMA THERM
• 12.15 Teradyne Inc.
• 12.16 Tokyo Electron Ltd.
• 12.17 Veeco Instruments Inc.

13 Appendix

• 13.1 Scope of the report
• 13.2 Inclusions and exclusions checklist
• 13.3 Currency conversion rates for US$
• 13.4 Research methodology
• 13.5 List of abbreviations